TI SN74LV595AIPWRG4Q1

SN74LV595A-Q1
www.ti.com
SCLS539D – AUGUST 2003 – REVISED OCTOBER 2009
8-BIT SHIFT REGISTER WITH 3-STATE OUTPUT REGISTERS
Check for Samples: SN74LV595A-Q1
FEATURES
1
•
•
•
•
•
•
•
•
•
Qualified for Automotive Applications
Customer-Specific Configuration Control Can
Be Supported Along With Major-Change
Approval
2-V to 5.5-V VCC Operation
Typical VOLP (Output Ground Bounce) < 0.8 V
at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot) > 2.3 V
at VCC = 3.3 V, TA = 25°C
Supports Mixed-Mode Voltage Operation on
All Ports
8-Bit Serial-In, Parallel-Out Shift
Ioff Supports Partial-Power-Down Mode
Operation
Shift Register Has Direct Clear
QB
QC
QD
QE
QF
QG
QH
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
QA
SER
OE
RCLK
SRCLK
SRCLR
QH′
DESCRIPTION
The SN74LV595A is an 8-bit shift register designed for 2-V to 5.5-V VCC operation.
This device contains an 8-bit serial-in, parallel-out shift register that feeds an 8-bit D-type storage register. The
storage register has parallel 3-state outputs. Separate clocks are provided for both the shift and storage register.
The shift register has a direct overriding clear (SRCLR) input, serial (SER) input, and a serial output for
cascading. When the output-enable (OE) input is high, all outputs except QH' are in the high-impedance state.
Both the shift register clock (SRCLK) and storage register clock (RCLK) are positive-edge triggered. If both
clocks are connected together, the shift register always is one clock pulse ahead of the storage register.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION (1)
TA
(1)
(2)
PACKAGE
(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 85°C
TSSOP − PW
Reel of 2000
SN74LV595AIPWRQ1
LV595AI
–40°C to 125°C
TSSOP − PW
Reel of 2000
SN74LV595AQPWRQ1
LV595AQ
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2009, Texas Instruments Incorporated
SN74LV595A-Q1
SCLS539D – AUGUST 2003 – REVISED OCTOBER 2009
www.ti.com
Table 1. FUNCTION TABLE
INPUTS
2
FUNCTION
SER
SRCLK
SRCLR
RCLK
OE
X
X
X
X
H
Outputs QA−QH are disabled.
X
X
X
X
L
Outputs QA−QH are enabled.
X
X
L
X
X
Shift register is cleared.
L
↑
H
X
X
First stage of the shift register goes low.
Other stages store the data of previous stage, respectively.
H
↑
H
X
X
First stage of the shift register goes high.
Other stages store the data of previous stage, respectively.
X
X
X
↑
X
Shift-register data is stored in the storage register.
Submit Documentation Feedback
Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): SN74LV595A-Q1
SN74LV595A-Q1
www.ti.com
SCLS539D – AUGUST 2003 – REVISED OCTOBER 2009
LOGIC DIAGRAM (POSITIVE LOGIC)
OE
RCLK
SRCLR
SRCLK
SER
13
12
10
11
14
1D Q
C1
R
3D
C3 Q
15
2D Q
C2
R
3D
C3 Q
1
2D Q
C2
R
3D
C3 Q
2
2D Q
C2
R
3D
C3 Q
3
2D Q
C2
R
3D
C3 Q
4
2D Q
C2
R
3D
C3 Q
5
2D Q
C2
R
3D
C3 Q
6
2D Q
C2
R
3D
C3 Q
7
QA
QB
QC
9
QD
QE
QF
QG
QH
QH′
Submit Documentation Feedback
Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): SN74LV595A-Q1
3
SN74LV595A-Q1
SCLS539D – AUGUST 2003 – REVISED OCTOBER 2009
www.ti.com
TIMING DIAGRAM
SRCLK
SER
RCLK
SRCLR
OE
QA
QB
QC
QD
QE
QF
QG
QH
QH′
4
Submit Documentation Feedback
Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): SN74LV595A-Q1
SN74LV595A-Q1
www.ti.com
SCLS539D – AUGUST 2003 – REVISED OCTOBER 2009
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage range
VI
Input voltage range (2)
−0.5 V to 7 V
−0.5 V to 7 V
(2)
−0.5 V to 7 V
VO
Voltage range applied to any output in the high-impedance or power-off state
VO
Output voltage range applied in the high or low state (2)
IIK
Input clamp current (2)
VI < 0
–20 mA
IOK
Output clamp current (2)
VO < 0
–50 mA
IO
Continuous output current
VO = 0 to VCC
±35 mA
(3)
−0.5 V to VCC + 0.5 V
Continuous current through VCC or GND
±70 mA
θJA
Package thermal impedance (4)
108°C/W
Tstg
Storage temperature range
ESD
(1)
(2)
(3)
(4)
−65°C to 150°C
Electrostatic discharge rating
Human-body model (HBM)
2000 V
Machine model (MM)
200 V
Charged-device model (CDM)
1000 V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited to 5.5 V maximum.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
VCC
Supply voltage
VCC = 2 V
VIH
High-level input voltage
MIN
MAX
2
5.5
Low-level input voltage
VI
VCC = 2.3 V to 2.7 V
VCC × 0.7
VCC = 3 V to 3.6 V
VCC × 0.7
VCC = 4.5 V to 5.5 V
VCC × 0.7
VO
Output voltage
0.5
VCC × 0.3
VCC = 3 V to 3.6 V
VCC × 0.3
VCC = 4.5 V to 5.5 V
VCC × 0.3
0
5.5
High or low state
0
VCC
3-state
0
5.5
VCC = 2 V
IOH
High level output current
–50
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
Δt/Δv
Input transition rise/fall time
–8
50
VCC = 2.3 V to 2.7 V
2
VCC = 3 V to 3.6 V
8
VCC = 4.5 V to 5.5 V
16
VCC = 2.3 V to 2.7 V
200
VCC = 3 V to 3.6 V
100
VCC = 4.5 V to 5.5 V
TA
(1)
Operating free-air temperature
V
V
µA
mA
–16
VCC = 2 V
Low level output current
V
–2
VCC = 4.5 V to 5.5 V
IOL
V
VCC = 2.3 V to 2.7 V
Input voltage
V
1.5
VCC = 2 V
VIL
UNIT
µA
mA
ns/V
20
SN74LV595AIPWRQ1
–40
85
SN74LV595AQPWRQ1
–40
125
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Submit Documentation Feedback
Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): SN74LV595A-Q1
5
SN74LV595A-Q1
SCLS539D – AUGUST 2003 – REVISED OCTOBER 2009
www.ti.com
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VOH
VOL
TEST CONDITIONS
IOH = −50 μA
2 V to 5.5 V
IOH = −2 mA
2.3 V
QH′
IOH = −6 mA
QA−QH
IOH = −8 mA
QH′
IOH = −12 mA
QA−QH
IOH = −16 mA
3V
4.5 V
IOL = 50 μA
2 V to 5.5 V
IOH = 2 mA
2.3 V
QH′
IOH = 6 mA
QA−QH
IOH = 8 mA
QH′
IOH = 12 mA
QA−QH
IOH = 16 mA
II
VCC
TA = −40°C TO 85°C
MIN
TYP
TA = −40°C TO 125°C
MAX
VCC – 0.1
MIN
TYP
MAX
UNIT
VCC – 0.1
2
2
2.48
2.45
2.48
2.45
3.8
3.7
3.8
V
3.7
3V
4.5 V
0.1
0.1
0.4
0.45
0.44
0.5
0.44
0.5
0.55
0.65
0.55
0.65
V
VI = 5.5 V or GND
0 V to 5.5 V
±1
±1
nA
VO = VCC or GND
5.5 V
±5
±10
µA
ICC
VI = VCC or GND, IO = 0
5.5 V
20
40
µA
Ioff
VI or VO = 0 to 5.5 V
0
5 (1)
10
µA
Ci
VI = VCC or GND
IOZ
(1)
6
QA−QH
3.3 V
3.5
3.5
pF
Ioff does not apply to pin 9.
Submit Documentation Feedback
Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): SN74LV595A-Q1
SN74LV595A-Q1
www.ti.com
SCLS539D – AUGUST 2003 – REVISED OCTOBER 2009
TIMING REQUIREMENTS
over operating free-air temperature range, VCC = 2.5 V ± 0.2 V (unless otherwise noted)
TA = 25°C
MIN
tw
Pulse duration
Setup time
th
Hold time
MAX
MIN
7
7.5
8.5
RCLK high or low
7
7.5
8.5
SRCLR low
6
6.5
7.5
5.5
5.5
6.5
8
9
10
8.5
9.5
10.5
SRCLK↑ before RCLK↑ (1)
SRCLR low before RCLK↑
SRCLR high (inactive) before SRCLK↑
(1)
MIN
TA = −40°C
TO 125°C
SRCLK high or low
SER before SRCLK↑
tsu
MAX
TA = −40°C
TO 85°C
SER after SRCLK↑
4
4
5
1.5
1.5
2.5
UNIT
MAX
ns
ns
ns
This setup time allows the storage register to receive stable data from the shift register. The clocks can be tied together, in which case
the shift register is one clock pulse ahead of the storage register.
TIMING REQUIREMENTS
over operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted)
TA = 25°C
MIN
tw
Pulse duration
th
Hold time
MIN
5.5
6.5
RCLK high or low
5.5
5.5
6.5
5
5
6
3.5
3.5
4.5
SRCLK↑ before RCLK↑ (1)
8
8.5
9.5
SRCLR low before RCLK↑
8
9
10
SRCLR high (inactive) before SRCLK↑
(1)
MAX
5.5
SER before SRCLK↑
Setup time
MIN
TA = −40°C
TO 125°C
SRCLK high or low
SRCLR low
tsu
MAX
TA = −40°C
TO 85°C
SER after SRCLK↑
3
3
4
1.5
1.5
2.5
UNIT
MAX
ns
ns
ns
This setup time allows the storage register to receive stable data from the shift register. The clocks can be tied together, in which case
the shift register is one clock pulse ahead of the storage register.
TIMING REQUIREMENTS
over operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted)
TA = 25°C
MIN
tw
Pulse duration
Setup time
(1)
Hold time
MAX
MIN
5
5
RCLK high or low
5
5
6
5.2
5.2
6.2
SER before SRCLK↑
3
3
4
SRCLK↑ before RCLK↑ (1)
5
5
6
SRCLR low before RCLK↑
5
5
6
2.5
2.5
3.5
2
2
3
SRCLR high (inactive) before SRCLK↑
th
MIN
TA = −40°C
TO 125°C
SRCLK high or low
SRCLR low
tsu
MAX
TA = −40°C
TO 85°C
SER after SRCLK↑
UNIT
MAX
6
ns
ns
ns
This setup time allows the storage register to receive stable data from the shift register. The clocks can be tied together, in which case
the shift register is one clock pulse ahead of the storage register.
Submit Documentation Feedback
Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): SN74LV595A-Q1
7
SN74LV595A-Q1
SCLS539D – AUGUST 2003 – REVISED OCTOBER 2009
www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V, CL = 50 pF (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tPLH
tPHL
tPLH
tPHL
tPHL
tPZH
tPZL
tPHZ
tPLZ
MIN
60
RCLK
QA−QH
SRCLK
QH'
SRCLR
QH'
OE
QA−QH
OE
TA = −40°C
TO 85°C
TA = 25°C
QA−QH
TYP
MAX
70
MIN
MAX
40
TA = −40°C
TO 125°C
MIN
UNIT
MAX
30
MHz
11.2
17.2
1
19.3
1
22.3
ns
11.2
17.2
1
19.3
1
22.3
ns
13.1
22.5
1
25.5
1
28.5
ns
13.1
22.5
1
25.5
1
28.5
ns
12.4
18.8
1
21.1
1
24.1
ns
10.8
17
1
18.3
1
21.3
ns
13.4
21
1
23
1
26
ns
12.2
18.3
1
19.5
1
22.5
ns
14
20.9
1
22.6
1
25.6
ns
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V, CL = 50 pF (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tPLH
tPHL
tPLH
tPHL
tPHL
tPZH
tPZL
tPHZ
tPLZ
RCLK
QA−QH
SRCLK
QH'
SRCLR
QH'
OE
QA−QH
OE
TA = −40°C
TO 85°C
TA = 25°C
MIN
TYP
55
105
QA−QH
MAX
MIN
MAX
50
TA = −40°C
TO 125°C
MIN
UNIT
MAX
40
MHz
7.9
15.4
1
17
1
20
ns
7.9
15.4
1
17
1
20
ns
9.2
16.5
1
18.5
1
21.5
ns
9.2
16.5
1
18.5
1
21.5
ns
9
16.3
1
17.2
1
20.2
ns
7.8
15
1
17
1
20
ns
9.6
15
1
17
1
20
ns
8.1
15.7
1
16.2
1
19.2
ns
9.3
15.7
1
16.2
1
19.2
ns
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V, CL = 50 pF (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tPLH
tPHL
tPLH
tPHL
tPHL
tPZH
tPZL
tPHZ
tPLZ
8
RCLK
QA−QH
SRCLK
QH'
SRCLR
QH'
OE
QA−QH
OE
QA−QH
TA = −40°C
TO 85°C
TA = 25°C
MIN
TYP
95
140
MAX
MIN
MAX
85
TA = −40°C
TO 125°C
MIN
UNIT
MAX
75
MHz
5.6
9.4
1
10.5
1
13.5
ns
5.6
9.4
1
10.5
1
13.5
ns
6.4
10.2
1
11.4
1
14.4
ns
6.4
10.2
1
11.4
1
14.4
ns
6.4
10
1
11.1
1
14.1
ns
5.7
10.6
1
12
1
15
ns
6.8
10.6
1
12
1
15
ns
3.5
10.3
1
11
1
14
ns
3.4
10.3
1
11
1
14
ns
Submit Documentation Feedback
Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): SN74LV595A-Q1
SN74LV595A-Q1
www.ti.com
SCLS539D – AUGUST 2003 – REVISED OCTOBER 2009
NOISE CHARACTERISTICS (1)
VCC = 3.3 V, CL = 50 pF, TA = 25°C
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
Quiet output, maximum dynamic VOL
0.3
V
VOL(V)
Quiet output, minimum dynamic VOL
–0.2
V
VOH(V)
Quiet output, minimum dynamic VOH
2.8
V
VIH(D)
High-level dynamic input voltage
VIL(D)
Low-level dynamic input voltage
(1)
2.31
V
0.99
V
TYP
UNIT
Characteristics are for surface-mount packages only.
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF, f = 10 MHz
VCC = 3.3 V
111
VCC = 5 V
114
Submit Documentation Feedback
Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): SN74LV595A-Q1
pF
9
SN74LV595A-Q1
SCLS539D – AUGUST 2003 – REVISED OCTOBER 2009
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC
Test
Point
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
S1
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
50% VCC
Input
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
0V
VOH
50% VCC
VOL
VCC
Output
Control
50% VCC
0V
tPZL
Output
Waveform 1
S1 at VCC
(see Note B)
tPLH
50% VCC
VOH
50% VCC
VOL
50% VCC
tPLZ
≈VCC
50% VCC
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH
0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. t PZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
10
Submit Documentation Feedback
Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): SN74LV595A-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV595AIPWRG4Q1
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV595AIPWRQ1
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
SN74LV595AQPWRQ1
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LV595A-Q1 :
SN74LV595A
• Catalog:
• Enhanced Product: SN74LV595A-EP
NOTE: Qualified Version Definitions:
- TI's standard catalog product
• Catalog
Enhanced
Product - Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and
Automotive
www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
Wireless
www.ti.com/wireless-apps
RF/IF and ZigBee® Solutions
www.ti.com/lprf
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated