S Re w it gu chi lat ng ors Sanken Power Devices from Allegro MicroSystems Package DIP-8 Approximate Scale 1:1 FEATURES AND BENEFITS 100 kHz PWM with ±5% frequency jittering for EMI noise filtering cost reduction Rugged 650 V avalanche-rated MOSFET: • Simplified surge absorption • No VDSS derating required Low RDS(on) : 6 Ω maximum Auto-burst mode for stand-by operation or light loads; less transformer audible noise Built-in leading edge blanking STR-A6259H Universal-Input 13 W 100 kHz Flyback Switching Regulators The STR-A6259H is a 100 kHz PWM topology (with ±5% frequency jittering for minimum EMI) regulator specifically designed to satisfy the requirements for increased integration and reliability in flyback converters. It incorporates a primary control and drive circuit with an avalanche-rated power MOSFET. Covering the power range from below 17 watts for a 230 VAC input, or to 13 watts for a universal (85 to 264 VAC) input, this device can be used in a wide range of applications, from DVD players and VCR player/recorders to ac adapters for cellular phones and digital cameras. An auto-burst standby function reduces power consumption at light load, while multiple protections, including the avalanche-energy guaranteed MOSFET, provide high reliability of system design. Cycle-by-cycle current limiting, undervoltage lockout with hysteresis, overvoltage protection, and thermal shutdown protect the power supply during the normal overload and fault conditions. Overvoltage protection and thermal shutdown are latched after a short delay. The latch may be reset by cycling the input supply. Low start-up current and a low-power standby mode selected from the secondary circuit completes a comprehensive suite of features. It is provided in an 8-pin mini-DIP plastic package with pin 6 removed. The leadframe plating is pure Sb, and the package complies with RoHS. Soft start and low start-up current; start-up circuit disabled in operation Auto-burst stand-by (intermittent operation) input power <0.1 W at no load Built-in constant-voltage/constant current (CV/CC) Multiple protections: • Pulse-by-pulse overcurrent protection (OCP) • Overload protection (OLP) with auto restart • Latching overvoltage protection (OVP) • Undervoltage lockout (UVLO) with hysteresis • Latching thermal shutdown (TSD) All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature of +25°C, unless otherwise stated. Datasheet 28103.44-6b Always order by complete part number, e.g.: STR-A6259H S Re w it gu chi lat ng ors STR-A6259H Universal Input 13 W 100 kHz Flyback Switching Regulators FUNCTIONAL BLOCK DIAGRAM AND TERMINAL ASSIGNMENTS Vcc 5 RESET OVP Internal BIAS 7.2V R 32V Delay TSD Istartup =1.1mA UVLO 8 D 7 D 1 S/OCP 4 FB/CC /OLP 3 GND 13.4V/10V S Q 10 µs 125°C Drive RQ PWM OSC S CV/CC Feedback Control Soft Start FM/SS 2 OLP OCP LEB Frequency Modulation Number Name 1 S/OCP Source/OCP terminal MOSFET Source/Overcurrent protection 2 FM/SS FM/Soft start terminal Capacitor connection terminal for frequency jitter and soft start. 3 GND Ground terminal Ground 4 FB /CC/OLP FB/CC/OLP terminal Input of constant voltage control signal / constant current operation control signal / over load protection signal 5 VCC Power supply terminal Input of power supply for control circuit Drain terminals MOSFET drain / Input of startup current 7 8 D Description Functions 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 2 S Re w it gu chi lat ng ors STR-A6259H Universal Input 13 W 100 kHz Flyback Switching Regulators ABSOLUTE MAXIMUM RATINGS at TA = 25°C Characteristic Symbol Terminal Max. Unit IDpeak 8-1 Single Pulse 1.8 A IDMAX 8-1 VS/OCP = 0.83 V with reference to GND, TA = –20 to 125°C 1.8 A Single Pulse Avalanche Energy2 EAS 8-1 Single Pulse 24 mJ VDD = 99 V, L = 20 mH, IL = 1.8 A 24 mJ S/OCP Terminal Voltage VOCP 1-3 –0.3 to 6 V Controller (MIC) Input Voltage Vcc 5-3 36 V FB/CC/OLP Terminal Voltage VFB 4-3 –0.3 to 11 V FM Terminal Voltage VFM 2-3 –0.3 to 6 V MOSFET Power Dissipation3,4 PD1 8-1 1.35 W Controller (MIC) Power Dissipation5 PD2 5-3 For Vcc×Icc 0.15 W Refer to TOP Drain Current1 Maximum Switching Current Operating Internal Frame Temperature6 TF Note –20 to 125 °C Operating Ambient Temperature Top –20 to 125 °C Storage Temperature Tstg –40 to 125 °C Channel Junction Temperature TJ 150 °C 1Refer to figure 1 2Refer to figure 3 3Refer to figure 5 4Mounted on 15 x 15 mm printed circuit board 5Refer to figure 6 6Measured at the root of terminal 3 Figure 1 – MOSFET Safe Operating Area Derating Curve 10.00 100 m s it lim (on) t S n re R D ur to C ue d s m 40 1.00 1 60 1 Drain Current, ID (A) 80 0. Safe Operating Area Temperature Derating Coefficient (%) Figure 2 – MOSFET Safe Operating Area Drain Current versus Voltage 0.10 20 Refer to figure 1 for MOSFET SOA temperature derating coefficient 0.01 0 0 25 50 75 100 125 150 1 10 100 1000 Drain-to-Source Voltage, VDS (V) Temperature, TF (°C) 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 3 S Re w it gu chi lat ng ors STR-A6259H Universal Input 13 W 100 kHz Flyback Switching Regulators Figure 3 – MOSFET Avalanche Energy Derating Curve Transient Thermal Resistance, RθJC (°C/W) 80 EAS Derating Coefficient (%) Figure 4 – Transient Thermal Resistance 10.00 100 60 40 20 1.00 0.10 0.01 0 25 50 75 100 125 150 1µ 10µ 100µ Channel Junction Temperature, TJ (°C) Figure 5 – MOSFET Power Dissipation versus Temperature 10m 100m Figure 6 – MIC Power Dissipation versus Temperature 1.6 1.6 1.4 1.4 1.2 Power Dissipation, PD2 (W) Power Dissipation, PD1 (W) 1m t (s) PD1 = 1.35 W at TA & 1.0 0.8 0.6 0.4 1.2 1.0 0.8 0.6 0.4 PD2 = 0.15 W at TA & 0.2 0.2 0 0 0 20 40 60 80 100 120 140 160 0 20 Ambient Temperature, TA (°C) 40 60 80 100 120 140 160 Internal Frame Temperature, TF (°C) 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 4 S Re w it gu chi lat ng ors STR-A6259H Universal Input 13 W 100 kHz Flyback Switching Regulators ELECTRICAL CHARACTERISTICS for Controller (MIC), valid at TA = 25°C, VCC = 18 V, unless otherwise specified Characteristic Symbol Terminal Test Conditions Min. Typ. Max. Unit 12.9 14.3 15.7 V Operation Start Voltage VCC(ON) 5-3 (Power supply voltage at which device starts operating) Measurement circuit 1, VCC = 0 though 13.1 to 16.1 V Operation Stop Voltage VCC(OFF) 5-3 (Power supply voltage at which device stops operating) Measurement circuit 1, VCC = 16.1 through 9 to 11 V 9 10 11 V Circuit Current In Operation ICC(ON) 5-3 (Inflow current into power supply terminal, in operation) Measurement circuit 1 – – 4 mA Initialization Circuit Current ICC(OFF) 5-3 (Inflow current into power supply terminal, while subject to UVLO prior to operation) Measurement circuit 1, VCC = 13 V – – 25 μA Center Switching Frequency fosc(av) 8-3 (Center oscillation frequency of D terminal) Measurement circuit 2 90 100 110 KHz Δf 8-3 Maximum frequency – minimum frequency Measurement circuit 2 6 10 14 kHz Maximum Duty Cycle DMAX 8-3 (Maximum width of the low portion of the D terminal waveform) Measurement circuit 2 70 76 82 % FM High Voltage VHFM 2-3 (VFM at which the FM current is changed from 10 μA to –10 μA) Measurement circuit 2 4.0 4.5 5.0 V FM Low Voltage VLFM 2-3 (VFM at which the FM current is changed from –10 μA to 10 μA) Measurement circuit 2 3.2 3.6 4.0 V FM Outflow Current IsorcFM 2-3 Outflow current from FM terminal at VFM = VLFM (3.7 V typ.) Measurement circuit 2 7.7 11 15.4 μA FM Inflow Current IsinkFM 2-3 Inflow current into FM terminal at VFM = VHFM (4.4 V typ.) Measurement circuit 2 –15.4 –11 –7.7 μA VOCP(th) 1-3 (The drain current at which the low portion of the D terminal waveform becomes shorter than the high portion, with VOCP increasing) Measurement circuit 3 0.67 0.74 0.81 V twb 8-3 (The low portion of the D terminal waveform with VOCP = 1 V) Measurement circuit 3 240 350 460 ns Burst Threshold Voltage Vburst(th) 4-3 (FB/CC/OLP terminal voltage at which D terminal waveform oscillation stops due to VFB decreasing from 5 V) Measurement circuit 4 1.0 1.12 1.24 V OLP Threshold Voltage VOLP(th) 4-3 (FB/CC/OLP terminal voltage at which D terminal waveform oscillation stops due to VFB increasing from 5 V) Measurement circuit 4 7.3 8.6 9.9 V Output Current at OLP Operation IOLP 4-3 (Outflow current from FB/CC/OLP terminal at VFB = 8 V) Measurement circuit 4 12 18 25 μA OLP Delay Time TOLP 4-3 (Time between surpassing VOLP(th) and stop of oscillation) Measurement circuit 4 0.84 1.2 1.56 s IFB(MAX) 4-3 (Outflow current from FB/CC/OLP terminal at VFB = 0 V) Measurement circuit 4 220 310 430 μA Frequency Jitter Deviation OCP Threshold Voltage Leading Edge Blanking Time Maximum Feedback Current Continued on next page… 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 5 S Re w it gu chi lat ng ors STR-A6259H Universal Input 13 W 100 kHz Flyback Switching Regulators ELECTRICAL CHARACTERISTICS for Controller (MIC) continued, valid at TA = 25°C, VCC = 18 V, unless otherwise specified Constant Current Set Voltage VSET(CC) 4-3 (FB/CC/OLP terminal voltage at which IFB changes from 280 μA to 16 μA due to VFB increasing from 5 V) Measurement circuit 4 4.9 5.8 6.7 V Constant Current Reset Voltage VRES(CC) 4-3 (FB/CC/OLP terminal voltage at which IFB changes from 16 μA to 280 μA due to VFB decreasing from 8 V) VRES(CC) × VCC = 25 V, Measurement circuit 4, VCC = 25 V 3.5 3.9 4.3 V Istartup 6-3 (Outflow current from VCC terminal at VDD = 600 V) Measurement circuit 5, VCC = 13 V 0.77 1.1 1.43 mA OVP Threshold Voltage VCC(OVPth) 5-3 (VCC at which the oscillation of the D terminal waveform stops due to VCC increasing from 18 V) Measurement circuit 1, VCC = 18 through 31 to 35.2 V 28.8 32 35.2 V Latch Circuit Sustaining Current1 ICC(H) 5-3 (Inflow current into VCC at VCC = 8.4 V, after OVP operation) Measurement circuit 1, VCC = 35.2 to 8.6 V – – 270 μA VCC(LaOFF) 5-3 (VCC at which ICC drops below 20 μA due to decreasing VCC after OVP operation) Measurement circuit 1, VCC = 35.2 through 5.9 to 8.6 V 5.9 7.2 8.6 V 125 140 – °C 650 – – V – – 300 μA Start-Up Current Latch Circuit Release Voltage1 Thermal Shutdown Operating Temperature TJ(TSD) ELECTRICAL CHARACTERISTICS for MOSFET, valid at TA = 25°C, VCC = 18 V, unless otherwise specified Drain-to-Source Breakdown Voltage VDSS 8-1 Measurement circuit 6, ID = 300 μA Drain Leakage Current IDSS 8-1 (Inflow current into D terminal at VDD = 650 V) Measurement circuit 5 On-Resistance RDS(ON) 8-1 Measurement circuit 3, ID = 0.4 A – – 6 Ω Switching Time tf 8-1 Measurement circuit 2 – – 250 ns Between channel and internal frame; measured at the root of terminal 3 – – 52 °C/W Thermal Resistance 1Latch Rθch-F circuit enabled when OVP and TSD in operation 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 6 S Re w it gu chi lat ng ors STR-A6259H Universal Input 13 W 100 kHz Flyback Switching Regulators Measurement Circuit 1 VD 100 Ω 8 7 5 D D VCC 13V 10V 1 2 18V 36V 8.4V Vcc(La.OFF) 18V 0V FB/CC /OLP 3 Vcc(OVP) Vcc Vcc(OFF) Vcc STR-A6259H S/OCP FM/SS GND Vcc(ON) VD VD 4 A V DD + Icc 47nF 5.1V Icc 1µF Icc Icc(OFF) Vcc 4µA typ. 140µA typ. Icc Icc(H) Measurement Circuit 2 VD 100 Ω 18V 8 7 5 D D VCC V CC V H FM STR-A6259H S/OCP FM/SS GND 10V V DD 1 2 V FM FB/CC /OLP 3 4 18V V FM 5.1V 1µF 10V 90% ·Δf =fosc(Hi)-fosc(Lo) IsorcFM + Vcc V L FM+(V H FM -V L FM )/2 IsinkFM IFM 0µA IFM A V L FM ·Dmax=T2/T1 100 T2 VD 0V fosc(Hi) 10% VD tf fosc(av) T1 fosc(Lo) Measurement Circuit 3 VD 8 7 5 D D VCC ID 18V Vcc Vocp STR-A6259H 0.4A S/OCPFM/SS GND 1 2 V OCP FB/CC /OLP 3 1V 0V 4 VD V OCP 47nF 5.1V 18V + Vcc 1µF V D(Lo) Tbw ·RDS(ON) =V D(Lo) / 0.4 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 7 S Re w it gu chi lat ng ors STR-A6259H Universal Input 13 W 100 kHz Flyback Switching Regulators Measurement Circuit 4 25V 18V 100 Ω Vcc 8 7 5 D D VCC 1 10V 2 V FB FB/CC /OLP 3 Vburst V RST(CC) 8V V (HYS) STR-A6259H S/OCP FM/SS GND V OLP V SET(CC) 0V 4 TOLP IFB Vcc A V DD 47nF VD + 1µF V FB 280µA typ. IFB 20µA typ. IOLP IFB(MAX) Measurement Circuit 5 A 8 7 5 8 7 5 D VCC D D VCC ID S/OCP FM/SS GND V DD Measurement Circuit 6 D A STR-A6259H 1 2 3 STR-A6259H VD Icc FB/CC /OLP V ID S/OCP FM/SS GND 4 1 Vcc 280µA typ. 2 3 Icc FB/CC /OLP 4 300 µA + 1µF Vcc + 18V 1µF Measurement Circuit 7 L 8 7 5 D D VCC Vcc STR-A6259H V DS V DD S/OCP FM/SS GND 1 V GS 2 3 18V 8V V GS Icc FB/CC /OLP 4 V DSpeak Vcc + 18V 1µF IL V DD V DS T VDS peak 2 EAS = L (ILpeak ) 2 VDS peak − VDD Adjust T such that ILpeak = 1.8 A 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 8 S Re w it gu chi lat ng ors STR-A6259H Universal Input 13 W 100 kHz Flyback Switching Regulators TYPICAL APPLICATION CIRCUIT For improved thermal dissipation, connect terminals 7 and 8 to as large an area of exposed copper as possible OUT 85~ 265VAC PC 8 7 5 D D VCC GND STR-A6259H S/OCP FM/SS GND 1 2 3 R4 FB/CC /OLP 4 Function of External Parts PC R5 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 Mode R4 R5 CV/CC 1 to 1.8 MΩ 82 to 150 kΩ OLP None None 9 S Re w it gu chi lat ng ors STR-A6259H Universal Input 13 W 100 kHz Flyback Switching Regulators PACKAGE DIMENSIONS, DIP-8 Dimens ions in Inc hes (for reference only) Dimens ions in Millimeters (controlling dimens ions ) 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 10 S Re w it gu chi lat ng ors STR-A6259H Universal Input 13 W 100 kHz Flyback Switching Regulators PACKING SPECIFICATIONS Minimum packing option: Tubes Stopper, with attached tab Stopper, with no tab Orientation of Devices in Shipping Tubes 50 pieces Type A Type B 0 51 130 135 140 145 Outer Carton Dimensions Capacity: 4 inner cartons per outer carton; 10,000 devices maximum per outer carton 4 52 63 Inner Carton Dimensions Capacity: 50 tubes per inner carton 69 Shipping Tube Dimensions 5 53 0 52 290 265 All dimensions: mm 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 11 S Re w it gu chi lat ng ors STR-A6259H Universal Input 13 W 100 kHz Flyback Switching Regulators WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs that embody these components must conform with applicable safety requirements. Precautions must be taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment. The use of an isolation transformer is recommended during circuit development and breadboarding. Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage • Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. • Avoid locations where dust or harmful gases are present and avoid direct sunlight. • Reinspect for rust in leads and solderability of products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between adjacent products, and shorts to the heatsink. Remarks About Using Silicone Grease with a Heatsink • When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce stress. • Volatile-type silicone greases may produce cracks after long periods of time, resulting in reduced heat radiation effect. Silicone grease with low consistency (hard grease) may cause cracks in the mold resin when screwing the product to a heatsink. • Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 Toshiba Silicone Co., Ltd. SC102 Dow Corning Toray Silicone Co., Ltd. Soldering • When soldering the products, please be sure to minimize the working time, within the following limits: 260±5°C 10 s 350±5°C 3 s • Soldering iron should be at a distance of at least 1.5 mm from the body of the products Electrostatic Discharge • When handling the products, operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ of resistance to ground to prevent shock hazard. • Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. • When using measuring equipment such as a curve tracer, the equipment should be grounded. • When soldering the products, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the products. • The products should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 12 S Re w it gu chi lat ng ors STR-A6259H Universal Input 13 W 100 kHz Flyback Switching Regulators The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc. Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this publication is current before placing any order. When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users responsibility. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to society due to device failure or malfunction. Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation hardness assurance (e.g., aerospace equipment) is not supported. When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written confirmation of your specifications. The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equipment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited. The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are given for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property rights, or any other rights of Sanken or Allegro or any third party that may result from its use. Copyright © 2006 Allegro MicroSystems, Inc. This datasheet is based on Sanken datasheet SSE2366-2 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 13