CEL UPC2711TB

BIPOLAR ANALOG INTEGRATED CIRCUIT
UPC3224TB
5 V, SILICON MMIC
WIDEBAND AMPLIFIER
DESCRIPTION
The µPC3224TB is a silicon monolithic IC designed as IF amplifier for DBS tuners. This IC is manufactured using
our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process.
FEATURES
• Wideband response : fu = 3.2 GHz TYP. @ 3 dB bandwidth
• Low current
: ICC = 9.0 mA TYP.
• Power gain
: GP = 21.5 dB TYP. @ f = 1.0 GHz
: GP = 21.5 dB TYP. @ f = 2.2 GHz
• Supply voltage
: VCC = 4.5 to 5.5 V
• Port impedance
: input/output 50 Ω
APPLICATION
• IF amplifiers in DBS converters etc.
ORDERING INFORMATION (Solder Contains Lead)
Part Number
µPC3224TB-E3
Package
6-pin super minimold
Marking
C3K
Supplying Form
• Embossed tape 8 mm wide
• 1, 2, 3 pins face the perforation side of tape
• Qty 3 kpcs/reel
ORDERING INFORMATION (Pb-Free)
Part Number
µPC3224TB-E3-A
Package
6-pin super minimold
Marking
C3K
Supplying Form
• Embossed tape 8 mm wide
• 1, 2, 3 pins face the perforation side of tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: µPC3224TB
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
Document No. PU10490EJ01V0DS (1st edition)
Date Published May 2004 CP(K)
© NEC Compound Semiconductor Devices 2004
UPC3224TB
PIN CONNECTIONS
C3K
(Top View)
3
2
1
(Bottom View)
Pin No.
Pin Name
1
INPUT
4
4
3
2
GND
5
5
2
3
GND
6
6
1
4
OUTPUT
5
GND
6
VCC
PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC MEDIUM WIDEBAND AMPLIFIER
(TA = +25°C, f = 1 GHz, VCC = Vout = 5.0 V, ZS = ZL = 50 Ω)
Part No.
µPC2711TB
µPC2712TB
µPC3215TB
µPC3224TB
Note
fu
PO (sat)
GP
NF
ICC
(GHz)
(dBm)
(dB)
(dB)
(mA)
2.9
+1.0
13
5.0
12
2.6
+3.0
20
4.5
12
C1H
2.9
+3.5
20.5
2.3
14
C3H
3.2
+4.0
21.5
4.3
9.0
C3K
Package
6-pin super minimold
Note µPC3215TB is f = 1.5 GHz
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
2
Data Sheet PU10490EJ01V0DS
Marking
C1G
UPC3224TB
PIN EXPLANATIONS
PIN
No.
1
Pin Name
INPUT
Voltage (V)
Applied
Pin Voltage
Note
(V)
–
0.91
Function and Applications
Signal input pin.
A internal matching circuit, configured with resistors, enables 50 Ω
connection over a wide band.
A multi-feedback circuits is designed to cancel the deviations of hFE and
resistance.
This pin must be coupled to signal source with capacitor for DC cut.
4
OUTPUT
–
4.42
Signal output pin.
A internal matching circuit, configured with resistors, enables 50 Ω
connection over a wide band.
This pin must be coupled to next stage with capacitor for DC cut.
6
VCC
4.5 to 5.5
–
Power suplly pin.
This pin should be externally equipped with bypass capacitor to
minimize its impedance.
2
GND
0
–
Ground pin.
3
This pin should be connected to system ground with minimum
5
inductance. Ground pattern on the board should be formed as wide as
possible.
All the ground pins must be connected together with wide ground pattern
to decrease impedance difference.
Note Pin Voltage is measured at VCC = 5.0 V
Data Sheet PU10490EJ01V0DS
3
UPC3224TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25°C
6.0
V
Total Circuit Current
ICC
TA = +25°C
25
mA
Power Dissipation
PD
TA = +85°C
270
mW
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Input Power
Pin
+10
dBm
Note
TA = +25°C
Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
4.5
5.0
5.5
V
Operating Ambient Temperature
TA
−40
+25
+85
°C
MIN.
TYP.
MAX.
Unit
ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 Ω)
Parameter
Symbol
Test Conditions
Circuit Current
ICC
No input signal
7.0
9.0
12.0
mA
Power Gain
GP
f = 1.0 GHz, Pin = −30 dBm
19.0
21.5
24.0
dB
f = 2.2 GHz, Pin = −30 dBm
18.5
21.5
24.5
f = 1.0 GHz, Pin = −5 dBm
+1.5
+4.0
−
f = 2.2 GHz, Pin = −5 dBm
−1.5
+1.5
−
f = 1.0 GHz
−6.5
−3.5
−
f = 2.2 GHz
−8.5
−5.5
−
f = 1.0 GHz
−
4.3
5.8
f = 2.2 GHz
−
4.3
5.8
3 dB down below flat gain at f = 0.1 GHz
2.8
3.2
−
GHz
f = 1.0 GHz, Pin = −30 dBm
35.0
40.0
−
dB
f = 2.2 GHz, Pin = −30 dBm
37.0
42.0
−
f = 1.0 GHz, Pin = −30 dBm
9.0
12.0
−
f = 2.2 GHz, Pin = −30 dBm
10.0
14.0
−
f = 1.0 GHz, Pin = −30 dBm
11.0
17.0
−
f = 2.2 GHz, Pin = −30 dBm
8.0
12.0
−
−
±0.8
−
Saturated Output Power
Gain 1 dB Compression Output
PO (sat)
PO (1 dB)
Power
Noise Figure
Upper Limit Operating Frequency
Isolation
Input Return Loss
Output Return Loss
Gain Flatness
4
NF
fu
ISL
RLin
RLout
∆GP
f = 0.1 to 2.2 GHz
Data Sheet PU10490EJ01V0DS
dBm
dBm
dB
dB
dB
dB
UPC3224TB
OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY
(TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 Ω)
Parameter
Output Intercept Point
Symbol
OIP3
Test Conditions
Reference Value
Unit
f = 1.0 GHz
+7.0
dBm
f = 2.2 GHz
+5.5
Data Sheet PU10490EJ01V0DS
5
UPC3224TB
TEST CIRCUIT
VCC
C4
1 000 pF
1 000 pF
C3
6
50 Ω
C1
C2
4
1
IN
50 Ω
OUT
100 pF
100 pF
2, 3, 5
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
COMPONENTS OF TEST CIRCUIT FOR
MEASURING ELECTRICAL CHARACTERISTICS
Type
Value
C1, C2
Chip Capacitor
100 pF
C3
Chip Capacitor
1 000 pF
C4
Feed-through Capacitor
1 000 pF
CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS
Capacitors of 1000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for
the input and output pins.
The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias
can be supplied against VCC fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitances are therefore selected as lower impedance against a 50 Ω load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.
To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under
10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are
determined by equation, C = 1/(2 πRfc).
6
Data Sheet PU10490EJ01V0DS
UPC3224TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-2
IN
OUT
C1
C2
C3
VCC
C4
COMPONENT LIST
Value
C1, C2
100 pF
C3, C4
1 000 pF
Notes
1.
30 × 30 × 0.4 mm double sided copper clad polyimide board.
2.
Back side: GND pattern
3.
Solder plated on pattern
4.
: Through holes
Data Sheet PU10490EJ01V0DS
7
UPC3224TB
TYPICAL CHARACTERISTICS (TA = +25°C , unless otherwise specified)
CIRCUIT CURRENT vs.
OPERATING AMBIENT TEMPERATURE
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
16
12
No input signal
12
TA = +85˚C
10
8
TA = +25˚C
6
4
2
0
No input signal
VCC = 5.0 V
11
Circuit Current ICC (mA)
Circuit Current ICC (mA)
14
TA = − 40˚C
0
1
2
3
4
5
10
9
8
7
6
− 60 − 40 − 20
6
Supply Voltage VCC (V)
TA = +25˚C
10
Input Return Loss RLin (dB)
Power Gain GP (dB)
VCC = 5.5 V
21
VCC = 5.0 V
19
VCC = 4.5 V
17
TA = +25˚C
0
− 10
− 20
VCC = 5.5 V
VCC = 5.0 V
VCC = 4.5 V
− 30
1.1
2.1
3.1
4.1
5.1
0.1
1.1
Frequency f (GHz)
Output Return Loss RLout (dB)
TA = +25˚C
Isolation ISL (dB)
− 40
− 60
VCC = 4.5 to 5.5 V
− 80
1.1
2.1
3.1
4.1
5.1
10
4.1
5.1
TA = +25˚C
0
− 10
VCC = 4.5 V
− 20
VCC = 5.0 to 5.5 V
− 30
0.1
Frequency f (GHz)
1.1
2.1
3.1
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
8
3.1
OUTPUT RETURN LOSS vs. FREQUENCY
− 20
− 100
0.1
2.1
Frequency f (GHz)
ISOLATION vs. FREQUENCY
0
+60 +80 +100
INPUT RETURN LOSS vs. FREQUENCY
23
15
0.1
+20 +40
Operating Ambient Temperature TA (°C)
POWER GAIN vs. FREQUENCY
25
0
Data Sheet PU10490EJ01V0DS
4.1
5.1
UPC3224TB
POWER GAIN vs. FREQUENCY
INPUT RETURN LOSS vs. FREQUENCY
25
VCC = 5.0 V
Input Return Loss RLin (dB)
10
Power Gain GP (dB)
23
TA = − 40˚C
21
19
TA = +85˚C
17
15
0.1
2.1
3.1
0
TA = +25 to +85˚C
− 10
− 20
TA = − 40˚C
− 30
TA = +25˚C
1.1
VCC = 5.0 V
4.1
5.1
0.1
1.1
Output Return Loss RLout (dB)
VCC = 5.0 V
Isolation ISL (dB)
− 20
− 40
TA = − 40 to +85˚C
− 80
− 100
0.1
1.1
2.1
3.1
4.1
5.1
OUTPUT RETURN LOSS vs. FREQUENCY
ISOLATION vs. FREQUENCY
− 60
3.1
Frequency f (GHz)
Frequency f (GHz)
0
2.1
4.1
5.1
10
VCC = 5.0 V
0
− 10
TA = +85˚C
− 20
TA = +25˚C
− 30
0.1
TA = − 40˚C
1.1
2.1
3.1
4.1
5.1
Frequency f (GHz)
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10490EJ01V0DS
9
UPC3224TB
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
10
f = 1.0 GHz
TA = +25˚C
5
Output Power Pout (dBm)
Output Power Pout (dBm)
10
VCC = 5.5 V
0
VCC = 5.0 V
−5
VCC = 4.5 V
− 10
− 15
− 20
− 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5
0
5
5
0
TA = − 40˚C
−5
− 10
− 15
− 20
− 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5
10
OUTPUT POWER vs. INPUT POWER
f = 2.2 GHz
TA = +25˚C
5
VCC = 5.5 V
VCC = 5.0 V
−5
VCC = 4.5 V
− 10
− 15
Output Power (2 tones) Pout (dBm)
3rd Order Intermodulation Distortion IM3 (dBm)
− 20
− 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5
0
5
0
−5
TA = − 40˚C
− 10
− 15
− 20
− 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5
10
0
5
OUTPUT POWER (2 tones), IM3
vs. INPUT POWER
OUTPUT POWER (2 tones), IM3
vs. INPUT POWER
f1 = 1 000 MHz
0 f2 = 1 001 MHz
Pout
5.5 V
− 20
VCC = 5.5 V
5.0 V
4.5 V
5.0 V
4.5 V
− 30
− 40
IM3
− 50 VCC = 4.5 V
− 60
VCC = 5.5 V
VCC = 5.0 V
− 80
− 50 − 45 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5
0
10
10
f1 = 2 200 MHz
0 f2 = 2 201 MHz
VCC = 5.5 V
5.0 V
4.5 V
Pout
− 10
− 20
− 30
− 40
IM3
5.5 V
5.0 V
4.5 V
− 50
− 60
− 70
− 80
− 50 − 45 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5
Input Power Pin (dBm)
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
10
TA = +25 to +85˚C
Input Power Pin (dBm)
10
− 70
f = 2.2 GHz
VCC = 5.0 V
Input Power Pin (dBm)
− 10
10
OUTPUT POWER vs. INPUT POWER
Output Power Pout (dBm)
0
5
10
Output Power (2 tones) Pout (dBm)
3rd Order Intermodulation Distortion IM3 (dBm)
Output Power Pout (dBm)
5
0
Input Power Pin (dBm)
Input Power Pin (dBm)
10
TA = +25 to +85˚C
f = 1.0 GHz
VCC = 5.0 V
Data Sheet PU10490EJ01V0DS
0
UPC3224TB
S-PARAMETERS (TA = +25°C, VCC = 5.0 V)
S11−FREQUENCY
2.2 GHz
1.0 GHz
S22−FREQUENCY
1.0 GHz
2.2 GHz
Data Sheet PU10490EJ01V0DS
11
UPC3224TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1±0.1
0.2+0.1
–0.05
0.65
0.65
1.3
2.0±0.2
1.25±0.1
12
Data Sheet PU10490EJ01V0DS
0.15+0.1
–0.05
0 to 0.1
0.7
0.9±0.1
0.1 MIN.
UPC3224TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
(4) The DC cut capacitor must be each attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120°C or below
Partial Heating
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (pin temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10490EJ01V0DS
13
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A
Not Detected
Lead (Pb)
< 1000 PPM
Mercury
< 1000 PPM
Not Detected
Cadmium
< 100 PPM
Not Detected
Hexavalent Chromium
< 1000 PPM
Not Detected
PBB
< 1000 PPM
Not Detected
PBDE
< 1000 PPM
Not Detected
-AZ
(*)
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
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release.
In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to
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See CEL Terms and Conditions for additional clarification of warranties and liability.