uPC8182TB DS

BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8182TB
3 V, 2.9 GHz SILICON MMIC
MEDIUM OUTPUT POWER AMPLIFIER
FOR MOBILE COMMUNICATIONS
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DESCRIPTION
The PC8182TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This
IC operates at 3 V. The medium output power is suitable for RF-TX of mobile communications system.
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This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This
process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface
from pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• Supply voltage: VCC = 2.7 to 3.3 V
• Circuit current: ICC = 30 mA TYP. @ VCC = 3.0 V
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• Medium output power: PO (1dB) = +9.5 dBm TYP. @ f = 0.9 GHz
PO (1dB) = +9.0 dBm TYP. @ f = 1.9 GHz
PO (1dB) = +8.0 dBm TYP. @ f = 2.4 GHz
• Power gain: GP = 21.5 dB TYP. @ f = 0.9 GHz
GP = 20.5 dB TYP. @ f = 1.9 GHz
GP = 20.5 dB TYP. @ f = 2.4 GHz
• Upper limit operating frequency: fu = 2.9 GHz TYP. @ 3 dB bandwidth
• High-density surface mounting: 6-pin super minimold package (2.0  1.25  0.9 mm)
APPLICAION
• Buffer amplifiers on 1.9 to 2.4 GHz mobile communications system
ORDERING INFORMATION (Solder Contains Lead)
Part Number
6-pin super minimold
Marking
C3F
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 2, 3 face the perforation side of the tape
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 PC8182TB-E3
Package
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact you’re nearby sales office. Part number for sample order:
PC8182TB-AZ
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ORDERING INFORMATION (Pb-Free)
Part Number
 PC8182TB-E3-AZ*
Package
6-pin super minimold
Marking
C3F
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 2, 3 face the perforation side of the tape
• Qty 3 kpcs/reel
*NOTE: Please refer to the last page of this data sheet, “Compliance with EU Directives” for Pb-Free RoHS
Compliance Information.
Document No. PU10206EJ01V0DS (1st edition)
(Previous No. P14543EJ2V0DS00)
Date Published December 2002 CP (K)
PC8182TB
PIN CONNECTIONS
Pin Name
1
INPUT
2
GND
3
GND
4
OUTPUT
5
GND
6
VCC
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Pin No.
PRODUCT LINE-UP (T A = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 )
PC8182TB
PC2762T
PC2762TB
PC2763T
PC2763TB
PC2771T
PC2771TB
PC8181TB
fu
PO (1 dB)
GP
(GHz)
(dBm)
(dB)
2.9
+9.5 @ f = 0.9 GHz
21.5 @ f = 0.9 GHz
+9.0 @ f = 1.9 GHz
20.5 @ f = 1.9 GHz
+8.0 @ f = 2.4 GHz
20.5 @ f = 2.4 GHz
+8.0 @ f = 0.9 GHz
13.0 @ f = 0.9 GHz
+7.0 @ f = 1.9 GHz
15.5 @ f = 1.9 GHz
+9.5 @ f = 0.9 GHz
20.0 @ f = 0.9 GHz
+6.5 @ f = 1.9 GHz
21.0 @ f = 1.9 GHz
+11.5 @ f = 0.9 GHz
21.0 @ f = 0.9 GHz
+9.5 @ f = 1.5 GHz
21.0 @ f = 1.5 GHz
+8.0 @ f = 0.9 GHz
19.0 @ f = 0.9 GHz
+7.0 @ f = 1.9 GHz
21.0 @ f = 1.9 GHz
+7.0 @ f = 2.4 GHz
22.0 @ f = 2.4 GHz
ICC
Package
(mA)
30.0
6-pin super minimold
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Part No.
2.9
2.7
2.2
4.0
26.5
6-pin minimold
27.0
6-pin minimold
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C1Z
C2A
6-pin super minimold
36.0
6-pin minimold
C2H
6-pin super minimold
23.0
6-pin super minimold
Caution The package size distinguishes between minimold and super minimold.
Data Sheet PU10206EJ01V0DS
C3F
6-pin super minimold
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
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Marking
C3E
PC8182TB
SYSTEM APPLICATION EXAMPLE
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Digital cellular telephone
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Caution The insertion point is different due to the specifications of conjunct devices.
Data Sheet PU10206EJ01V0DS
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PC8182TB
PIN EXPLANATION
Applied
Pin
Voltage
Voltage
(V)
1
INPUT
–
(V)
Function and Applications
Internal Equivalent Circuit
Note
0.99
Signal input pin. A internal
matching circuit, configured with
resistors, enables 50  connection
over a wide band.
A multi-feedback circuit is designed
resistance.
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to cancel the deviations of hFE and
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Pin No. Pin Name
This pin must be coupled to signal
source with capacitor for DC cut.
4
OUTPUT Voltage
–
Signal output pin. The inductor
as same as
must be attached between VCC and
VCC through
output pins to supply current to the
external
internal output transistors.
6
VCC
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inductor
2.7 to 3.3
–
Power supply pin, which biases the
internal input transistor.
This pin should be externally
equipped with bypass capacitor to
minimize its impedance.
2
3
5
GND
0
–
Ground pin. This pin should be
connected to system ground with
minimum inductance. Ground
pattern on the board should be
formed as wide as possible.
All the ground pins must be
connected together with wide
ground pattern to decrease
impedance difference.
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Note Pin voltage is measured at VCC = 3.0 V.
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Data Sheet PU10206EJ01V0DS
PC8182TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Test Conditions
Ratings
Unit
VCC
TA = +25C, pin 4 and pin 6
3.6
V
Total Circuit Current
ICC
TA = +25C
60
mA
Power Dissipation
PD
TA = +85°C
270
mW
Operating Ambient Temperature
TA
40 to +85
C
Storage Temperature
Tstg
55 to +150
C
Input Power
Pin
+10
dBm
TA = +25C
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Note
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Supply Voltage
Note Mounted on double-sided copper-clad 50  50  1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
MIN.
TYP.
VCC
2.7
3.0
MAX.
Unit
3.3
V
Remarks
Same voltage should be applied
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Supply Voltage
Symbol
to pin 4 and pin 6.
TA
40
+25
+85
C

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Operating Ambient Temperature
Data Sheet PU10206EJ01V0DS
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PC8182TB
ELECTRICAL CHARACTERISTICS
(T A = +25C, VCC = Vout = 3.0 V, ZS = ZL = 50 , unless otherwise specified)
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit

30.0
38.0
mA
21.5
25.0
dB
ICC
No signal
Power Gain
GP
f = 0.9 GHz
19.0
f = 1.9 GHz
18.0
f = 2.4 GHz
18.0
f = 0.9 GHz

Noise Figure
NF
Isolation
ISL
Gain 1 dB Compression Output
Power
PO(1dB)
PO(sat)
3 dB down below from gain at f = 0.1 GHz
2.6
2.9

GHz
f = 0.9 GHz
28
33

dB
27
32

26
31

f = 0.9 GHz
5
8

f = 1.9 GHz
7
10

f = 2.4 GHz
9
12

f = 0.9 GHz
7
10

f = 1.9 GHz
8
11

f = 2.4 GHz
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
f = 0.9 GHz
+7.0
+9.5

f = 1.9 GHz
+6.5
+9.0

f = 2.4 GHz
+5.5
+8.0

f = 0.9 GHz, Pin = 5 dBm

+11.0

f = 1.9 GHz, Pin = 5 dBm

+10.5

f = 2.4 GHz, Pin = 5 dBm

+10.0

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6
dB
6.5
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Saturated Output Power
RLout
6.0
5.0
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Output Return Loss
4.5

f = 2.4 GHz
RLin
24.0
6.0
f = 1.9 GHz
Input Return Loss
20.5
4.5
f = 2.4 GHz
fu
24.0

f = 1.9 GHz
Upper Limit Operating Frequency
20.5
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Circuit Current
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Parameter
Data Sheet PU10206EJ01V0DS
dB
dB
dBm
dBm
PC8182TB
COMPONENTS OF TEST CIRCUIT
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TEST CIRCUITS
EXAMPLE OF ACTUAL APPLICATION COMPONENTS
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FOR MEASURING ELECTRICAL
CHARACTERISTICS
Type
Value
C1 , C 2
Bias Tee
1 000 pF
C3
Capacitor
1 000 pF
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Bias Tee
1 000 nH
Type
Value
Operating Frequency
C1 to C3
Chip capacitor
1 000 pF
100 MHz or higher
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Chip inductor
100 nH
100 MHz or higher
10 nH
2.0 GHz or higher
INDUCTOR FOR THE OUTPUT PIN
The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output
transistor, connect an inductor between the Vcc pin (pin 6) and output pin (pin 4). Select large value inductance, as
listed above.
The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum
voltage drop to output enable high level. In terms of AC, the inductor makes output-port-impedance higher to get
enough gain. In this case, large inductance and Q is suitable.
For above reason, select an inductance of 100  or over impedance in the operating frequency. The gain is a
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peak in the operating frequency band, and suppressed at lower frequencies.
The recommendable inductance can be chosen from example of actual application components list as shown
above.
CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS
Capacitors of 1 000 pF are recommendable as the bypass capacitor for the Vcc pin and the coupling capacitors
for the input and output pins.
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The bypass capacitor connected to the Vcc pin is used to minimize ground impedance of Vcc pin. So, stable bias
can be supplied against Vcc fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitance are therefore selected as lower impedance against a 50  load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.
To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under
10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are
determined by equation, C = 1/(2Rfc).
Data Sheet PU10206EJ01V0DS
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PC8182TB
COMPONENT LIST
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ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Value
1 000 pF
L
Example: 10 nH
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C
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Data Sheet PU10206EJ01V0DS
PC8182TB
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TYPICAL CHARACTERISTICS (T A = +25C, unless otherwise specified)
Data Sheet PU10206EJ01V0DS
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PC8182TB
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Data Sheet PU10206EJ01V0DS
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PC8182TB
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Remark The graphs indicate nominal characteristics.
Data Sheet PU10206EJ01V0DS
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PC8182TB
SMITH CHART (VCC = Vout = 3.0 V)
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S22-FREQUENCY
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S11-FREQUENCY
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Data Sheet PU10206EJ01V0DS
PC8182TB
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S-PARAMETERS
Data Sheet PU10206EJ01V0DS
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PC8182TB
PACKAGE DIMENSIONS
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6-PIN SUPER MINIMOLD (UNIT: mm)
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Data Sheet PU10206EJ01V0DS
PC8182TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired
oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
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(3) The bypass capacitor should be attached to the VCC pin.
(4) The inductor must be attached between VCC and output pins. The inductance value should be determined in
accordance with desired frequency.
RECOMMENDED SOLDERING CONDITIONS
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(5) The DC cut capacitor must be attached to input and output pin.
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
VPS
Wave Soldering
Peak temperature (package surface temperature)
: 260C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220C or higher
: 60 seconds or less
Preheating time at 120 to 180C
: 12030 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (package surface temperature)
: 215C or below
Time at temperature of 200C or higher
: 25 to 40 seconds
Preheating time at 120 to 150C
: 30 to 60 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260C or below
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature)
: 120C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (pin temperature)
: 350C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
IR260
VP215
WS260
HS350
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Partial Heating
Condition Symbol
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Infrared Reflow
Soldering Conditions
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Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10206EJ01V0DS
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