DATA SHEET NEC's L, S-BAND SPDT SWITCH FEATURES DESCRIPTION NEC's UPG168TB is GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch which were developed for mobile phone and another L, S-band application. • SWITCH CONTROL VOLTAGE: Vcont (H) = 2.5 to 5.3 V (3.0 V TYP.) Vcont (L) = −0.2 to +0.2 V (0 V TYP.) • LOW INSERTION LOSS: LINS1 = 0.30 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont = 3.0 V/0 V LINS2 = 0.40 dB TYP. @ f = 2.0 GHz, Vcont = 3.0 V/0V LINS3 = 0.90 dB MAX. @ f = 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V • UPG168TB HIGH ISOLATION: ISL1 = 27 dB TYP. @ f = 0.5 to 2.0 GHz, Vcont = 3.0 V/0 V This device can operate frequency from 0.5 to 2.5 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin super minimold package. And this package is able to high-density surface mounting. ISL2 = 18 dB MIN. @ f = 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V • MIDDLE POWER: Pin (1 dB) = +26.5 dBm TYP. @ f = 1.0 GHz, Vcont = 3.0 V/0 V • HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) APPLICATION • L-band digital cellular or cordless telephone • PCS, W-LAN, WLL and BluetoothTM etc. ORDERING INFORMATION PART NUMBER UPG168TB-E4 PACKAGE 6-pin super minimold MARKING G2T SUPPLYING FORM • Embossed tape 8 mm wide • Pin 4, 5, 6 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPG168TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. California Eastern Laboratories UPG168TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 2 3 6 1 G2T 1 (Top View) (Bottom View) 6 6 5 2 PIN NAME 1 OUTPUT2 1 5 5 4 3 PIN NO. 2 4 4 3 2 GND 3 OUTPUT1 4 Vcont1 5 INPUT 6 V cont2 TRUTH TABLE Vcont1 Vcont2 INPUT-OUTPUT1 INPUT-OUTPUT2 Low High High ON OFF Low OFF ON ABSOLUTE MAXIMUM RATINGS (TA =+25ºC, unless otherwise specified) PARAMETER Switch Control Voltage SYMBOL RATINGS UNIT Vcont −6.0 to +6.0 Note 1 V Input Power Pin +28 dBm Power Dissipation PD 150 Note 2 mW Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Notes 1. Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C 2. | Vcont1 − Vcont2 | ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA =+25ºC, unless otherwise specified) SYMBOL MIN. TYP. MAX. UNIT Switch Control Voltage (H) PARAMETER Vcont (H) 2.5 3.0 5.3 V Switch Control Voltage (L) Vcont (L) −0.2 0 0.2 V UPG168TB ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont = 3.0 V/0 V, DC blocking capacitors = 51 pF, unless otherwise specified) MIN. TYP. MAX. UNIT Insertion Loss 1 PARAMETER SYMBOL LINS1 f = 0.5 to 1.0 GHz TEST CONDITIONS − 0.30 0.55 dB Insertion Loss 2 LINS2 f = 2.0 GHz − 0.40 0.65 dB Insertion Loss 3 LINS3 f = 2.0 to 2.5 GHz − − 0.90 dB Isolation 1 ISL1 f = 0.5 to 2.0 GHz 22 27 − dB Isolation 2 ISL2 f = 2.0 to 2.5 GHz 18 − − dB Input Return Loss 1 RLin1 f = 0.5 to 2.0 GHz 13 19 − dB Input Return Loss 2 RLin2 f = 2.0 to 2.5 GHz 11 − − dB Output Return Loss 1 RLout1 f = 0.5 to 2.0 GHz 13 19 − dB Output Return Loss 2 RLout2 f = 2.0 to 2.5 GHz 1 dB Gain Compression Input Power Note Pin (1 dB) f = 1.0 GHz 11 − − dB +22.0 +26.5 − dBm Switch Control Speed tSW − 50 200 ns Switch Control Current Icont − 0.5 10 μA Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, Vcont = 3.0 V/0 V, DC cut capacitors = 51 pF, unless otherwise specified) PARAMETER 0.1 dB Gain Compression Input Power Note SYMBOL Pin (0.1 dB) TEST CONDITIONS f = 1.0 GHz MIN. TYP. MAX. UNIT − +23.0 − dBm Note Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. Caution This device is used it is necessary to use DC cut capacitors. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC cut capacitor value is less than 100 pF. UPG168TB EVALUATION CIRCUIT (Vcont = 3.0 V/0 V, DC blocking capacitors = 51 pF) Vcont2 INPUT Vcont1 51 pF 1000 pF 6 1 4 5 2 3 51 pF OUTPUT2 1000 pF 51 pF OUTPUT1 This application circuit and its parameters are for reference only. UPG168TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD VDD 6Pin SMM SPDT SW VC 1 OUTPUT1 OUT 1 C 1 C 5 C2 C1 G2T INPUT C3 C1 C1 IN C 2 C 4 C2 OUT 2 OUTPUT2 VC 2 Vcont USING THE NEC EVALUATION BOARD SYMBOL C1, C2, C3 C4, C5 VALUES 51 pF 1000 pF UPG168TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT:mm) 2.1±0.1 0.2+0.1 -0.05 0.65 0.65 1.3 0.15+0.1 -0.05 0 to 0.1 0.7 0.1 MIN. 0.9±0.1 2.0±0.2 1.25±0.1 UPG168TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) Time at temperature of 200°C or higher Preheating time at 120 to 150°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 215°C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 120°C or below : 1 time : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 03/15/2005 A Business Partner of NEC Compound Semiconductor Devices, Ltd.