CEL UPG2009TB

NEC's L, S-Band HIGH POWER UPG2009TB
SPDT Switch
FEATURES
DESCRIPTION
•
•
•
•
NEC's UPG2009TB is a L, S-band SPDT (Single
Pole Double Throw) GaAs FET switch for digital cellular or cordless telephone application. The device can
operate from 500 MHz to 2.5 GHz, with low insertion
loss and high isolation.
Low insertion loss: 0.25 dB TYP. @ Vcont1/2 = 2.8 V/0 V, f = 1.0 GHz
0.30 dB TYP. @ Vcont1/2 = 2.8 V/0 V, f = 2.0 GHz
High isolation: 28 dB TYP. @ Vcont1/2 = 2.8 V/0 V, f = 2.0 GHz
power HANDLING:
Pin (0.1dB) = 34 dBm TYP. @ Vcont1/2 = 2.8 V/0 V, f = 1.0 GHz
BIDIRECTIONAL, SYMMETRICAL
• 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
APPLICATIONS
• L-band digital cellular or cordless telephone
• BluetoothTM , W-LAN and WLL
• Short Range Wireless
ORDERING INFORMATION
Part Number
UPG2009TB-E3-A
Package
6-pin super minimold
Marking
G2U
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 2, 3 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: UPG2009TB-A
Caution
Observe precautions when handling because these devices are sensitive to electrostatic discharge.
California Eastern Laboratories
UPG2009TB
PIN CONNECTIONS
3
2
1
G2U
(Top View)
(Bottom View)
4
4
3
5
5
2
6
6
1
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Control Voltage 1, 2
Symbol
Vcont1, 2
Ratings
−6.0 to
Unit
+6.0 Note1
V
Input Power
Pin
+36
dBm
Total Power Dissipation
Ptot
0.15
W
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Note | Vcont1 - Vcont2 | ≤ 6.0 V
RECOMMENDED OPERATING RANGE (TA = 25°C)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Control Voltage (High)
Vcont (H)
+2.7
+2.8
+3.0
V
Control Voltage (Low)
Vcont (L)
−0.2
0
+0.2
V
Pin No.
Pin Name
1
OUT1
2
GND
3
OUT2
4
VCont2
5
IN
6
VCont1
UPG2009TB
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont1 = 2.8 V, Vcont2 = 0 V or Vcont1 = 0 V, Vcont2 = 2.8, Zo = 50 Ω, off chip DC blocking capacitors value;
56 pF, unless otherwise specified)
Parameter
Insertion Loss
Isolation
Symbol
LINS
ISL
Test Conditions
MIN.
TYP.
MAX.
Unit
f = 0.5 to 1.0 GHz
−
0.25
0.45
dB
f = 2.0 GHz
−
0.30
0.50
dB
f = 2.5 GHz
−
0.40
−
dB
f = 0.5 to 2.0 GHz
24
28
−
dB
f = 2.5 GHz
−
25
−
dB
dB
Input Return Loss
RLin
f = 0.5 to 2.5 GHz
15
20
−
Output Return Loss
RLout
f = 0.5 to 2.5 GHz
15
20
−
dB
32.5
34
−
dBm
65
75
−
dBc
65
75
−
dBc
−
150
−
ns
−
1
50
μA
Input Power at 0.1 dB
Pin(0.1 dB)
Compression Point Note
2nd Harmonics
f = 1.0 GHz,
Vcont = 2.8 V/0 V
2f0
f = 1.0 GHz, Vcont = 2.8 V/0 V,
Pin = 30.5 dBm
3rd Harmonics
3f0
f = 1.0 GHz, Vcont = 2.8 V/0 V,
Pin = 30.5 dBm
Switching Speed
tSW
Control Current
Icont
Vcont = 2.8 V/0 V, RF Non
Note Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear
range. All other characteristics are measured in linear range.
Caution It is necessary to use DC blocking capacitors with the device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is
less than 100 pF.
EVALUATION CIRCUIT (Vcont1 = 2.8 V, Vcont2 = 0 V or Vcont2 = 0 V, Vcont1 = 2.8 V, off chip DC blocking capacitors
value C1 = 56 pF, C2 = 1 000 pF (Bypass), using NEC standard evaluation board)
C2
6
IN
5
C1
4
Vcont2
G2U
Vcont1
C1
1
OUT1
2
3
OUT2
C1
C2
EVALUATION BOARD
Vcont1
6pin SMM SPDT SW
OUT1
C2
C1
G2U
IN
C1
C1
C2
OUT2
NEC
Vcont2
TRUTH TABLE
Vcont1
Vcont2
IN−OUT1
IN−OUT2
Low
High
OFF
ON
High
Low
ON
OFF
TYPICAL CHARACTERISTICS (TA = +25°C Vcont1/2 = 2.8 V/0 V, Pin = 0 dBm, OUT2 side is 50 Ω termination)
ISOLATION vs. FEQUENCY
INPUT RETURN LOSS vs. FREQUENCY
log MAG
10 dB/ REF 0 dB
0
CH1 S21
1: -25.43 dB
1.0 GHz
2: -30.339 dB
1.5 GHz
3: -30.025 dB
2.0 GHz
4: -23.812 dB
2.5 GHz
5: -17.85 dB
3.0 GHz
1
-20
2
-40
START 0.500 000 000 GHz
3
4
5
Isolation ISL (dB)
Input Return Loss RLin (dB)
CH1 S11
log MAG
0
-20
2
-40
START 0.500 000 000 GHz
STOP 3.000 000 000 GHz
-2.0
1
2
3
1: -0.620 dB
1.0 GHz
2: -0.744 dB
1.5 GHz
3: -0.881 dB
2.0 GHz
4: -1.057 dB
2.5 GHz
5: -1.302 dB
3.0 GHz
4
5
-4.0
START 0.500 000 000 GHz
4
5
STOP 3.000 000 000 GHz
OUTPUT RETERN LOSS vs. FREQUENCY
CH1 S22
STOP 3.000 000 000 GHz
Output Return Loss RLout (dB)
Insertion Loss LINS (dB)
0
1 dB/ REF 0 dB
3
Frequency f (GHz)
INSERTION LOSS vs. FREQUENCY
log MAG
1: -28.787 dB
1.0 GHz
2: -28.871 dB
1.5 GHz
3: -27.75 dB
2.0 GHz
4: -24.902 dB
2.5 GHz
5: -21.582 dB
3.0 GHz
1
Frequency f (GHz)
CH1 S21
10 dB/ REF 0 dB
log MAG
0
1: -25.992 dB
1.0 GHz
2: -31.882 dB
1.5 GHz
3: -32.46 dB
2.0 GHz
4: -25.087 dB
2.5 GHz
5: -18.145 dB
3.0 GHz
1
-20
2
-40
START 0.500 000 000 GHz
Frequency f (GHz)
Caution These characteristics values include the losses of the NEC evaluation board.
Remark The graphs indicate nominal characteristics.
10 dB/ REF 0 dB
3
4
5
STOP 3.000 000 000 GHz
Frequency f (GHz)
UPG2009TB
TYPICAL CHARACTERISTICS (f = 2 GHz, OUT2 side is 50 Ω termination)
RELATION BETWEEN CONTROL
VOLTAGE OF INSERSION LOSS
0
Insersion Loss LINS (dB)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Vcont = 2.4 V
Vcont = 2.8 V
Vcont = 3.2 V
0.9
25 26 27 28 29 30 31 32 33 34 35 36 37
0.8
Input Power Pin (dBm)
RELATION BETWEEN CONTROL
VOLTAGE OF 2nd HARMONICS
Vcont = 2.4 V
Vcont = 2.8 V
Vcont = 3.2 V
2nd Harmonics 2f0 (dBc)
10
20
30
40
50
60
70
0
10
3rd Harmonics 3f0 (dBc)
0
RELATION BETWEEN CONTROL
VOLTAGE OF 3rd HARMONICS
20
Vcont = 2.4 V
Vcont = 2.8 V
Vcont = 3.2 V
30
40
50
60
70
80
80
90
25 26 27 28 29 30 31 32 33 34 35 36 37
90
25 26 27 28 29 30 31 32 33 34 35 36 37
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
Input Power Pin (dBm)
UPG2009TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1±0.1
0.2+0.1
-0.05
0.65
0.65
1.3
0.15+0.1
-0.05
0 to 0.1
0.7
0.1 MIN.
0.9±0.1
2.0±0.2
1.25±0.1
UPG2009TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
IR260
VPS
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
VP215
Wave Soldering
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
HS350
Caution : 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Do not use different soldering methods together (except for partial heating).
02/14/2007
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A
Not Detected
Lead (Pb)
< 1000 PPM
Mercury
< 1000 PPM
Not Detected
Cadmium
< 100 PPM
Not Detected
Hexavalent Chromium
< 1000 PPM
Not Detected
PBB
< 1000 PPM
Not Detected
PBDE
< 1000 PPM
Not Detected
-AZ
(*)
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
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