NEC's HIGH POWER SINGLE CONTROL UPG2010TB L-BAND SPDT SWITCH FEATURES DESCRIPTION • SUPPLY VOLTAGE: VDD = 2.7 to 3.0 V (2.8 V TYP.) NEC's UPG2010TB is a single control GaAs MMIC L-band SPDT (Single Pole Double Throw) switch for mobile phone and L-band applications. This device can operate from 0.5 to 2.5 GHz, with low insertion loss and high isolation. • SWITCH CONTROL VOLTAGE: Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.) Vcont (L) = −0.2 to +0.2 V (0 V TYP.) • LOW INSERTION LOSS: LINS1 = 0.25 dB TYP. @ f = 0.5 to 1.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V LINS2 = 0.30 dB TYP. @ f = 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V LINS3 = 0.35 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V (Reference value) • HIGH ISOLATION: ISL1 = = 28 dB TYP. @ f = 0.5 to 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V ISL2 = 25 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V (Reference value) • POWER HANDLING: Pin (0.1 dB) = +33.0 dBm TYP. @ f = 1.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V This device is housed in a 6-pin super minimold package, suitable for high-density surface mounting. APPLICATIONS • L-band digital cellular or cordless handsets • PCS, W-LAN, WLL and BluetoothTM • Short Range Wireless • HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) ORDERING INFORMATION Part Number μPG2010TB-E3-A Package 6-pin super minimold Marking G2Y Supplying Form • Embossed tape 8 mm wide • Pin 1, 2, 3 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPG2010TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. California Eastern Laboratories UPG2010TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) G2Y 3 2 1 (Top View) (Bottom View) 4 3 4 4 3 5 2 5 5 2 6 1 6 6 1 Pin No. Pin Name 1 OUTPUT1 2 GND 3 OUTPUT2 4 VCont 5 INPUT 6 VDD TRUTH TABLE Vcont1 INPUT−OUTPUT1 INPUT−OUTPUT2 Low ON OFF High OFF ON ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit Supply Voltage VDD 6.0 V Switch Control Voltage Vcont 6.0 V Input Power Pin +36 dBm Power Dissipation PD 150 Note mW Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C RECOMMENDED OPERATING RANGE (TA = 25°C, unless otherwise specified) Parameter Switch Voltage Symbol MIN. TYP. MAX. Unit VDD 2.7 2.8 3.0 V Switch Control Voltage (H) Vcont (H) 2.7 2.8 3.0 V Switch Control Voltage (L) Vcont (L) −0.2 0 0.2 V UPG2010TB ELECTRICAL CHARACTERISTICS (TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss 1 LINS1 f = 0.5 to 1.0 GHz − 0.25 0.45 dB Insertion Loss 2 LINS2 f = 2.0 GHz − 0.30 0.50 dB Isolation 1 ISL1 f = 0.5 to 2.0 GHz 24 28 − dB Input Return Loss RLin f = 0.5 to 2.5 GHz 15 20 − dB RLout f = 0.5 to 2.5 GHz Output Return Loss 0.1 dB Gain Compression Input Power Note Pin (0.1 dB) f = 1.0 GHz 15 20 − dB +31.5 +33.0 − dBm 2nd Harmonics 2f0 f = 1.0 GHz, Pin = +30.5 dBm 65 75 − dBc 3rd Harmonics 3f0 f = 1.0 GHz, Pin = +30.5 dBm 65 75 − dBc Supply Current IDD − 50 100 μA Switch Control Current Icont − 4 20 μA Note Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 51 pF, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss 3 LINS3 f = 2.5 GHz − 0.35 − dB Isolation 2 ISL2 f = 2.5 GHz − 25 − dB − 1 − μs Switch Control Speed Caution tSW It is necessary to use DC blocking capacitors with the device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. UPG2010TB EVALUATION CIRCUIT (VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF) OUTPUT1 OUTPUT2 56 pF 56 pF 1 3 2 6 4 5 56 pF 1 000 pF VDD INPUT 1 000 pF Vcont The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4-277 UPG2010TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD VDD 6Pin SMM SPDT SW VC 1 OUTPUT1 OUT 1 C 1 C 5 C2 C1 G2Y INPUT C3 C1 C1 IN C 2 C 4 C2 OUT 2 OUTPUT2 VC 2 Vcont USING THE NEC EVALUATION BOARD Symbol C1, C2, C3 C4, C5 Values 56 pF 1 000 pF UPG2010TB TYPICAL CHARACTERISTICS (TA = 25ºC, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) INPUT–OUTPUT2 INSERTION LOSS vs. FREQUENCY 0.4 0.3 0.3 0.2 0.2 Insertion Loss LINS (dB) 0.4 0.1 0 –0.1 –0.2 –0.3 –0.4 0.1 0 –0.1 –0.2 –0.3 –0.4 –0.5 –0.5 –0.6 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 –0.6 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Frequency f (GHz) INPUT–OUTPUT1 ISOLATION vs. FREQUENCY INPUT–OUTPUT2 ISOLATION vs. FREQUENCY 50 40 40 30 30 20 20 Isolation ISL (dB) 50 10 0 –10 –20 10 0 –10 –20 –30 –30 –40 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Frequency f (GHz) INPUT–OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY INPUT–OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY 50 50 40 40 Input Return Loss RLin (dB) Input Return Loss RLin (dB) Isolation ISL (dB) Insertion Loss LINS (dB) INPUT–OUTPUT1 INSERTION LOSS vs. FREQUENCY 30 20 10 0 –10 –20 –30 30 20 10 0 –10 –20 –30 –40 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Remark The graphs indicate nominal characteristics. Frequency f (GHz) INPUT–OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY INPUT–OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY 50 50 40 40 Output Return Loss RLout (dB) Output Return Loss RLout (dB) UPG2010TB 30 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER 2ND HARMONICS, 3RD HARMONICS vs. INPUT POWER +40 f = 1.0 GHz +35 +30 +25 +20 +15 +10 +5 +10 +15 +20 +25 +30 +35 +40 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. 2nd Harmonics 2f0, 3rd Harmonics 3f0 (dBc) Frequency f (GHz) +45 Output Power Pout (dBm) 30 –50 –55 f = 1.0 GHz –60 –65 –70 –75 2f0 –80 3f0 –85 –90 +10 +15 +20 +25 +30 Input Power Pin (dBm) +35 +40 UPG2010TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 0.2+0.1 –0.05 0.65 0.65 1.3 0.15+0.1 –0.05 0 to 0.1 0.7 0.1 MIN. 0.9±0.1 2.0±0.2 1.25±0.1 UPG2010TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) Time at temperature of 200°C or higher Preheating time at 120 to 150°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 215°C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) : 260°C or below WS260 Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) : 10 seconds or less : 120°C or below : 1 time : 0.2%(Wt.) or below Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below Partial Heating Caution HS350 Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 02/19/2004 A Business Partner of NEC Compound Semiconductor Devices, Ltd. 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. 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Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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