CEL UPG2162T5N

GaAs INTEGRATED CIRCUIT
µPG2162T5N
DPDT SWITCH FOR 2.4 GHz AND 6 GHz DUAL-BAND WIRELESS LAN
DESCRIPTION
The µPG2162T5N is a GaAs MMIC DPDT (Double Pole Double Throw) switch which was developed for 2.4 GHz
and 6 GHz dual-band wireless LAN. This device can operate frequency from 2.4 GHz band and 6 GHz band, having
the low insertion loss and high isolation.
This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package. And this package is able
to high-density surface mounting.
FEATURES
• Operating frequency
• Switch control voltage
: f = 2.4 to 2.5 GHz and 4.9 to 6.0 GHz
: Vcont (H) = 2.8 to 5.0 V (3.0 V TYP.)
: Vcont (L) = −0.3 to 0.3 V (0 V TYP.)
• Low insertion loss
: Lins1 = 0.60 dB TYP. @ f = 2.4 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Lins2 = 0.85 dB TYP. @ f = 4.9 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• High isolation
: ISL3 = 30 dB TYP. @ f = 2.4 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: ISL4 = 27 dB TYP. @ f = 4.9 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• Handling power
: Pin (1 dB) = +31.0 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Pin (1 dB) = +29.0 dBm TYP. @ f = 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• High-density surface mounting : 6-pin plastic TSON package (1.5 × 1.5 × 0.37 mm)
APPLICATIONS
• Dual-band wireless LAN (IEEE802.11a + b/g)
ORDERING INFORMATION
Part Number
Order Number
µPG2162T5N-E2
µPG2162T5N-E2-A
Package
6-pin plastic TSON
(Pb-Free)
Marking
G5A
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: µPG2162T5N-A
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
Document No. PG10632EJ01V0DS (1st edition)
Date Published August 2006 NS CP(K)
µPG2162T5N
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
G5A
1
2
(Bottom View)
(Top View)
3
6
1
6
6
1
5
2
5
5
2
4
4
3
3
4
Pin No.
Pin Name
1
ANT2
2
Vcont2
3
OUT2 (RX)
4
OUT1 (TX)
5
Vcont1
6
ANT1
Remark Exposed pad : GND
TRUTH TABLE
Vcont1
Vcont2
ANT1−OUT1 (TX)
ANT1−OUT2 (RX)
ANT2−OUT1 (TX)
ANT2−OUT2 (RX)
High
Low
OFF
ON
ON
OFF
Low
High
ON
OFF
OFF
ON
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Vcont
−6.0 to +6.0
V
Input Power
Pin
+32
dBm
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +135
°C
Switch Control Voltage
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Switch Control Voltage (H)
Vcont (H)
2.8
3.0
5.0
V
Switch Control Voltage (L)
Vcont (L)
−0.3
0
0.3
V
Operating Frequency 1
f1
2.4
−
2.5
GHz
Operating Frequency 2
f2
4.9
−
6.0
GHz
2
Data Sheet PG10632EJ01V0DS
µPG2162T5N
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont
otherwise specified)
Parameter
Symbol
(L)
= 0 V, Z0 = 50 Ω, DC blocking capacitors = 4 pF, unless
Test Conditions
MIN.
TYP.
MAX.
Unit
Insertion Loss 1
Lins1
f = 2.4 to 2.5 GHz
−
0.60
0.85
dB
Insertion Loss 2
Lins2
f = 4.9 to 6.0 GHz
−
0.85
1.10
dB
Isolation 1 (ANT to OUT)
ISL1
f = 2.4 to 2.5 GHz
30
35
−
dB
Isolation 2 (ANT to OUT)
ISL2
f = 4.9 to 6.0 GHz
30
34
−
dB
Isolation 3 (ANT1 to ANT2, TX to RX)
ISL3
f = 2.4 to 2.5 GHz
27
30
−
dB
Isolation 4 (ANT1 to ANT2, TX to RX)
ISL4
f = 4.9 to 6.0 GHz
24
27
−
dB
Input Return Loss 1
RLin1
f = 2.4 to 2.5 GHz
−
15
−
dB
Input Return Loss 2
RLin2
f = 4.9 to 6.0 GHz
−
15
−
dB
Output Return Loss 1
RLout1
f = 2.4 to 2.5 GHz
−
15
−
dB
Output Return Loss 2
RLout2
f = 4.9 to 6.0 GHz
−
15
−
dB
1 dB Loss Compression
Note
Input Power 1
Pin (1 dB) 1 f = 2.4 to 2.5 GHz
−
+31.0
−
dBm
1 dB Loss Compression
Note
Input Power 2
Pin (1 dB) 2 f = 4.9 to 6.0 GHz
−
+29.0
−
dBm
−
+50
−
dBm
−
0.1
1.0
µA
−
150
−
ns
Input 3rd Order Distortion Intercept
IIP3
f1 = 2 500 MHz, f2 = 2 501 MHz,
Pin (1 tone) = +20 dBm
Point
Switch Control Current
Icont
Switch Control Speed
tSW
50% CTL to 90/10%
Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
Caution This device is used it is necessary to use DC blocking capacitors.
Data Sheet PG10632EJ01V0DS
3
µPG2162T5N
EVALUATION CIRCUIT
4 pF
ANT2
Vcont2
4 pF
1
6
2
5
1 000 pF
Vcont1
1 000 pF
4
3
OUT2 (RX)
ANT1
OUT1 (TX)
4 pF
4 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
4
Data Sheet PG10632EJ01V0DS
µPG2162T5N
MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS
6-PIN PLASTIC TSON (UNIT: mm)
MOUNTING PAD
0.3
0.2
0.5
1.0
0.5
0.3
0.5
0.3
0.3
SOLDER PAD
0.475
0.15
0.5
0.55
0.5
0.25
0.35
0.475
0.25
Solder thickness : 0.08 mm
Remark The mounting pad and solder mask layouts in this document are for reference only.
Data Sheet PG10632EJ01V0DS
5
µPG2162T5N
PACKAGE DIMENSIONS
6-PIN PLASTIC TSON (UNIT: mm)
(Bottom View)
(Side View)
0.3±0.07
0.2+0.07
–0.05
1.5±0.1
0.5±0.06
1.5±0.1
1.2±0.1
(Top View)
0.37+0.03
–0.05
6
0.2±0.1
Data Sheet PG10632EJ01V0DS
0.7±0.1
µPG2162T5N
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120°C or below
Partial Heating
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10632EJ01V0DS
7
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A
Not Detected
Lead (Pb)
< 1000 PPM
Mercury
< 1000 PPM
Not Detected
Cadmium
< 100 PPM
Not Detected
Hexavalent Chromium
< 1000 PPM
Not Detected
PBB
< 1000 PPM
Not Detected
PBDE
< 1000 PPM
Not Detected
-AZ
(*)
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
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