CEL UPG2155TB-E4-A

GaAs INTEGRATED CIRCUIT
UPG2155TB
NEC’s L-BAND 4 W HIGH POWER SPDT SWITCH
DESCRIPTION
The µPG2155TB is an L-band SPDT GaAs FET switch developed for digital cellular or cordless telephone
applications. The device can operate from 500 MHz to 2.5 GHz, with low insertion loss and high linearity.
FEATURES
• Low insertion loss
: LINS = 0.35 dB TYP. @ Vcont = +2.6 V/0 V, f = 1.0 GHz
: LINS = 0.40 dB TYP. @ Vcont = +2.6 V/0 V, f = 2.0 GHz
: LINS = 0.45 dB TYP. @ Vcont = +2.6 V/0 V, f = 2.5 GHz
• High linearity
: 2f0 = 70 dBc TYP. @ Vcont = +2.6 V/0 V, f = 0.9 GHz, Pin = +34.5 dBm
: 3f0 = 75 dBc TYP. @ Vcont = +2.6 V/0 V, f = 0.9 GHz, Pin = +34.5 dBm
• 6-pin super minimold package (2.1 × 2.0 × 0.9 mm)
APPLICATION
• GSM Triple/Quad band digital cellular
ORDERING INFORMATION
Part Number
µPG2155TB-E4
Order Number
Package
µPG2155TB-E4-A 6-pin super minimold
(Pb-Free)
Marking
G4R
Supplying Form
• Embossed tape 8 mm wide
• Pin 4, 5, 6 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: µPG2155TB-A
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
Document No. PG10583EJ01V0DS (1st edition)
Date Published November 2005 CP(K)
© NEC Compound Semiconductor Devices, Ltd. 2005
UPG2155TB
PIN CONNECTIONS
(Top View)
2
3
G4R
1
(Bottom View)
6
6
1
5
5
2
4
4
3
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)
Parameter
Symbol
Ratings
Unit
Vcont
+6.0
V
Input Power
Pin
+38
dBm
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Control Voltage
RECOMMENDED OPERATING RANGE (TA = +25°C)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Control Voltage (High)
Vcont (H)
+2.4
+2.6
+5.0
V
Control Voltage (Low)
Vcont (L)
−0.2
0
+0.2
V
2
Data Sheet PG10583EJ01V0DS
Pin No.
Pin Name
1
OUT1
2
GND
3
OUT2
4
Vcont2
5
IN
6
Vcont1
UPG2155TB
ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont = +2.6 V/0 V, ZO = 50 Ω, off chip DC blocking
capacitors value: 56 pF, unless otherwise specified)
Parameter
Insertion Loss
Isolation
Symbol
LINS
ISL
Test Conditions
MIN.
TYP.
MAX.
Unit
f = 0.5 to 1.0 GHz
−
0.35
0.45
dB
f = 1.0 to 2.0 GHz
−
0.40
0.50
dB
f = 2.0 to 2.5 GHz
−
0.45
0.55
dB
f = 0.5 to 1.0 GHz
22
24
−
dB
f = 1.0 to 2.0 GHz
17
19
−
dB
f = 2.0 to 2.5 GHz
15
17
−
dB
Input Return Loss
RLin
f = 0.5 to 2.5 GHz
15
20
−
dB
Output Return Loss
RLout
f = 0.5 to 2.5 GHz
15
20
−
dB
f = 0.9 GHz
−
37.5<
−
dBm
f = 1.8 GHz
−
37.5<
−
dBm
f = 0.9 GHz, Pin = +34.5 dBm
67
70
−
dBc
f = 1.8 GHz, Pin = +31.5 dBm
64
70
−
dBc
f = 0.9 GHz, Pin = +34.5 dBm
67
75
−
dBc
f = 1.8 GHz, Pin = +31.5 dBm
64
75
−
dBc
−
1
5
µs
−
0.5
5.0
µA
0.1 dB Loss Compression
Pin (0.1 dB)
Input Power
2nd Harmonics
3rd Harmonics
2f0
3f0
Switching Speed
tsw
Control Current
Icont
RF Non
Data Sheet PG10583EJ01V0DS
3
UPG2155TB
EVALUATION CIRCUIT
Off chip DC blocking capacitors value C1 = 56 pF, C2 = 1 000 pF (Bypass), using NEC standard evaluation board.
C2
C1
Vcont2
G4R
OUT2
C1
IN
Vcont1
OUT1
C2
C1
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
TRUTH TABLE
Vcont2
OUT2
IN
GND
Vcont1
4
OUT1
Vcont1
Vcont2
IN-OUT1
IN-OUT2
High
Low
ON
OFF
Low
High
OFF
ON
Data Sheet PG10583EJ01V0DS
UPG2155TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1±0.1
0.2+0.1
–0.05
0.65
0.65
1.3
Data Sheet PG10583EJ01V0DS
0.15+0.1
–0.05
0 to 0.1
0.7
0.1 MIN.
0.9±0.1
2.0±0.2
1.25±0.1
5
UPG2155TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120°C or below
Partial Heating
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Caution Do not use different soldering methods together (except for partial heating).
6
Data Sheet PG10583EJ01V0DS
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Facsimile: (408) 988-0279
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CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
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per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A
Not Detected
Lead (Pb)
< 1000 PPM
Mercury
< 1000 PPM
Not Detected
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< 100 PPM
Not Detected
Hexavalent Chromium
< 1000 PPM
Not Detected
PBB
< 1000 PPM
Not Detected
PBDE
< 1000 PPM
Not Detected
-AZ
(*)
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