CRYSTEKCRYSTAL CVHD-930

CVHD-930 Model
9X14 mm SMD, 3.3V, CMOS
Frequency Range:
10MHz to 49.152MHz
Temperature Range:
(Option X)
0°C to 70°C
-40°C to 85°C
Storage:
-55°C to 120°C
Input Voltage:
Control Voltage:
Settability At Nominal:
Input Current:
3.3V ± 0.3V
1.65V ± 1.65V
1.65V ± 0.25V
25mA Max
Output:
Symmetry:
Rise/Fall Time:
Pullability APR:
Linearity:
Load:
Logic "1" Level:
Logic "0" Level:
Start-up time:
CMOS
47.5/52.5 Typical, 45/55% Max
5ns Max @ 20% to 80% Vcc
±50ppm Min.
± 10% Max
30pF Max
90% Vdd Max
10% Vdd Min.
2ms Typ., 5ms Max
Modulation BW:
Sub-harmonics:
>10KHz @ -3dB
none
Period Jitter:
Phase Jitter:
<5ps RMS (1-sigma) Max
<1ps RMS (1-sigma) Max,
<1ps RMS (1-sigma) Max,
(20,000 periods)
12KHz~20MHz
50KHz~80MHz
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Phase Noise Typical: 10Hz
100Hz
1KHz
10KHz
100KHz
-80 dBc/Hz
-110 dBc/Hz
-140 dBc/Hz
-152 dBc/Hz
-155 dBc/Hz
Aging:
<3ppm 1st/yr, <1ppm every year thereafter
Applications:
Broadband Networks
SONET/SDH/DWD
ATM
Network/switch
Telecom
Designed using FR5 PCB & Fundamental AT crystal
technology to provide a Low Noise, Low Jitter Voltage
Controlled Crystal Oscillator solution at a competitive
price.
Specifications subject to change without notice.
TD-040101 Rev. D
Page 1 of 2
CVHD-930 Model
9X14 mm SMD, 3.3V, CMOS
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0.560
(14.2)
Crystek Part Number Guide
CVHD-930 X-49.152
#1
#2
#3
CRYSTEK
P/N
Frequency
Date Code
0.360
(9.14)
#4
#1 Crystek 9x14 SMD CMOS VCXO
#2 Model 930 = High Performance 3.3V
#3 Temp. Range: Blank = 0/70°C, X=-40/85°C
#4 Frequency in MHz: 3 or 6 decimal places
Bottom View
0.040
(1.01)
0.560
(14.2)
1
0.070
(1.77)
0.210
(5.3)
0.200
(5.08)
Pad
Connection
1
2
3
4
Volt Cont.
GND
OUT
Vdd
SUGGESTED PAD LAYOUT
RECOMMENDED REFLOW SOLDERING PROFILE
TEMPERATURE
260°C
Critical Temperature
Zone
Ramp-Down
6°C/Sec.
217°C
200°C
3
4
Example:
CVHD-930X-49.152 = 3.3V, -40/85°C, 49.152 MHz
Ramp-Up
3°C/Sec Max.
2
0.050
(1.27)
0.090
(2.28)
0.280
(7.11)
150°C
Preheat
180 Secs. Max.
8 Minutes Max.
90 Secs. Max.
0.200
(5.08)
260°C for
10 Secs. Max.
NOTE: Reflow Profile with 240°C peak also acceptable.
Mechanical:
Shock:
Solderability:
Vibration:
Solvent Resistance:
Resistance to Soldering Heat:
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2003
MIL-STD-883, Method 2007, Condition A
MIL-STD-202, Method 215
MIL-STD-202, Method 210, Condition I or J
Environmental:
Thermal Shock:
Moisture Resistance:
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
Packaging:
Tape/Reel:
100ea, 250ea,500ea 24mm Tape
Specifications subject to change without notice.
TD-040101 Rev. D
Page 2 of 2