INFRA-RED EMITTING DIODES KA-3528F3C KA-3528SF4C Features Description !SUITABLE FOR ALL SMT ASSEMBLY AND SOLDER PROCESS. F3 Made with Gallium Arsenide Infrared Emitting diodes. !AVAILABLE ON TAPE AND REEL. SF4 Made with Gallium Aluminum Arsenide Infrared !COMPATIBLE Emitting diodes. WITH AUTOMATIC PLACEMENT EQUIPMENT. !HIGH RELIABILITY AND LONG LIFETME. !PACKAGE : 1500PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: KDA0434 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/21/2001 DRAWN: J.X.FU PAGE: 1 OF 5 Selection Guide Par t No . Dic e KA-3528F3C GaAs KA-3528SF4C Po = (m W/s r ) @20m A *50m A L en s Ty p e V i ew i n g An g l e Min . Ty p . 2θ1/2 1 3 120° *3 *8 120° 0.8 1.5 12 0 ° *2 *4 12 0 ° WATER CLEAR GaAlAs WATER CLEAR Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C It em P/N Sy m b o l Ty p . Max . Un it Co n d it io n Forward Voltage F3 S F4 VF 1.2 1.3 1.5 1.7 V IF=20mA Reverse Current F3 S F4 IR - 10 10 uA VR=5V Capacitance F3 S F4 C 90 90 - pF VF=0 f=1MHz Peak Spectral Wavelength F3 S F4 λP 940 880 - nm IF=20mA Spectral Bandwidth F3 S F4 ∆λ1/2 50 50 - nm IF=20mA Absolute Maximum Ratings at T)=25°°C It em Power Dissipation Sy m b o l F3& SF4 Un it s PT 100 mW Forward Current IF 50 mA 1.2 A VR 5 V TA -40~ +85 °C TSTG -40~ +85 °C Peak Forward Current[1] i Reverse Voltage Operating Temperature Storage Temperature FS Note: 1. 1/100 Duty Cycle, 10us Pluse Width. SPEC NO: KDA0434 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/21/2001 DRAWN: J.X.FU PAGE: 2 OF 5 KA-3528F3C SPEC NO: KDA0434 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/21/2001 DRAWN: J.X.FU PAGE: 3 OF 5 KA-3528SF4C KA-3528F3C,KA-3528SF4C SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. SPEC NO: KDA0434 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/21/2001 DRAWN: J.X.FU PAGE: 4 OF 5 Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: KDA0434 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/21/2001 DRAWN: J.X.FU PAGE: 5 OF 5