3.0x1.5mm SMD CHIP LED LAMP APL3015SURC HYPER RED Features Description !3.0mmx1.5mm SMT LED, 1.4mm THICKNESS. The Hyper Red source color devices are made with DH !LOW POWER CONSUMPTION. InGaAlP on GaAs substrate Light Emitting Diode. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS COLORS AND LENS TYPES AVAILABLE. !INNER LENS TYPE. !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: CDA0324 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/25/2001 DRAWN: M.F.CAI PAGE: 1 OF4 Selection Guide Par t No . Dic e APL3015SURC Iv (mc d ) @ 20 mA L en s Ty p e HY PER RED ( InGaAlP ) WATER CLEAR Viewin g An g le Mi n . Ty p . 2θ1/2 100 250 70° Un its Tes t Co n d it io n s Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25°°C Sy m b o l P ar am et er D ev i c e Ty p . Max . λpeak Peak Wavelength Hyper Red 640 nm IF=20mA λD Dominate Wavelength Hyper Red 628 nm IF=20mA ∆λ1/2 Spectral Line Halfwidth Hyper Red 27 nm IF=20mA C Capacitance Hyper Red 45 pF VF=0V;f=1MHz VF Forward Voltage Hyper Red 1.9 2.5 V IF=20mA IR Reverse Current Hyper Red 10 uA V R = 5V Absolute Maximum Ratings at TA=25°°C P ar am et er H y p er R ed Un its Power dissipation 170 mW DC Forward Current 30 mA Peak Forward Current [1] 185 mA Reverse Voltage 5 V Operating Temperature -40°C To +85°C Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: CDA0324 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/25/2001 DRAWN: M.F.CAI PAGE: 2 OF4 Hyper Red APL3015SURC SPEC NO: CDA0324 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/25/2001 DRAWN: M.F.CAI PAGE: 3 OF4 APL3015SURC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: CDA0324 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/25/2001 DRAWN: M.F.CAI PAGE: 4 OF4