MARKTECH TB6718AFG

TB62718AFG
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB62718AFG
Controller and Driver for Full-color LED Modules and Panels
The TB62718AFG is an LED driver which is suitable for driving full-color
LED modules. This device has built-in 8 bit PWM grayscale and an output
current adjustment functions. It can turn on to 16 LEDs. This device has a
heat sink fitting side on the surface of the package. Then, a heat sink will
dissipate heat generated in the device. In addition, this device incorporates
built-in TSD (thermal Shutdown) and output-open detection functions to
protect the device.
Features
•
Output current capability and number of outputs: 90 mA × 16 outputs
•
Constant current range: 5 mA~75 mA
•
Application output voltage: 0.7 V (output current 5 mA~90 mA)
•
Adjustment function
Weight: 0.26 g (typ.)
1. Standard current adjustment (8-bit serial data input)
This function supports standard current adjustment using an external resistance connected to the REXT pin.
2 high-order bits
… Output current can be adjusted to any one of 4 levels in the range 25%~100%.
6 low-order bits
… Output current can be adjusted to any one of 64 levels in the range 40%~100%.
2. Each dot adjustment (128-bit serial data input)
This function allows adjustment of the current value for each output (dot).
… Output current can be adjusted to any one of 64 levels in the range 20%~100%.
3. All dot adjustment 1 (8-bit parallel data input)
This function allows adjustment of brightness for each LED module.
5 low-order bits
… Output current can be adjusted to any one of 32 levels in the range 50%~100%.
4. All dot adjustment 2 (8-bit parallel data input)
This function allows changes to the frequency of the PWM clock and allows major brightness adjustment for the display.
3 high-order bits
… PWM clock frequency can be adjusted to any one of 8 levels in the range 1/1~1/8.
5. 256-grayscale PWM function (8-bit parallel input)
This function controls the pulse width for each output, yielding 256 grayscales.
Maximum PWM clock frequency 10 MHz (for all temperature range), Minimum pulse width 2 ms
• Accuracy of bits in constant-current output levels prior to adjustment
±6.0% max (for output current of 40 mA~80 mA)
±7.0% max (for output current of 20 mA~40 mA)
±12.0% max (for output current of 5 mA~20 mA)
•
Protection functions
1. Thermal shutdown function (TSD)
This function monitors the rise in junction temperature.
Connect a pull-up resistor to the ALARM1 pin in order to monitor the temperature.
2. Output Pin Open Detection function
This function detect when an output pin is open.
Connect a pull-up resistor to the ALARM2 pin in order to monitor this.
Company Headquarters
3 Northway Lane North
Latham, New York 12110
Toll Free: 800.984.5337
Fax: 518.785.4725
Web: www.marktechopto.com | Email: [email protected]
California Sales Office:
950 South Coast Drive, Suite 265
Costa Mesa, California 92626
Toll Free: 800.984.5337
Fax: 714.850.9314
TB62718AFG
•
For anode-common LEDs
•
Input signal voltage level: CMOS level (Schmitt trigger input)
•
Power supply voltage range VDD = 4.5 V~5.5 V
•
Maximum output pin voltage: 26 V
•
Serial and parallel data transfer rate: 20 MHz (max, cascade connection)
•
Operating temperature range Topr = −40°C~85°C
•
Package: HQFP64-P-1010-0.50. A Heat sink can be fitted.
Warnings
Short-circuiting an output pin to GND or to the power supply pin may destroy the device.
Take care when wiring the output pins, the power supply pin and the GND pins (VSS, VSS2).
Do not apply either positive or negative voltages to the heat sink on the surface of the IC.
In addition, do not solder anything to the heat sink.
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TB62718AFG
Pin Assignment (top view) and Markings
48
DOE
33
49
32
TB62718AFG
SI DATA
OUT 01
OUT 02
SI CLK
OUT 03
SI LATCH
OUT 04
SI SEL
OUT 05
PWMCLK
OUT 06
BCEN
OUT 07
DCEN
VSS2
RESET
VSS2
LED TEST
OUT 08
BLANK
OUT 09
REXT
OUT 10
VSS
OUT 11
SO DATA
OUT 12
TSENA
OUT 13
5WWKA**
64
17
VSS2
NC
VDD
PO DATA 07
PO DATA 06
PO DATA 05
PO DATA 04
PO DATA 03
PO DATA 02
PO DATA 01
PO DATA 00
VSS
ALARM2
TEST1
16
ALARM1
1
OUT 14
OUT 15
TEST0
Note:
OUT 00
VSS2
NC
VDD
PI DATA 08
PI DATA 07
PI DATA 06
PI DATA 05
PI DATA 04
PI DATA 03
PI DATA 02
PI DATA 01
VSS
PI CLK
PI LATCH
PI SEL
Package type: HQFP64-P-1010-0.50
Indicates device name on the upper surface of the package.
Indicates weekly code on the lower surface of the package.
Details of weekly code on lower surface:
From left,
1st character = rightmost digit of year
0 for 2000, 1 for 2001
2nd and 3rd characters = week of manufacture during year: maximum value = 52.
4th characters = manufacturing factory (‘K’ means the Kita Kyushu factory.)
5th to 7th characters = lot number within week
1st lot is A11, 2nd lot is A1 and 3rd lot is A.
4th lot is B11, 5th lot is B1 and 6th lot is B.
64th lot is Z11, 65th lot is Z1 and 66th lot is Z.
The four characters of ‘I’, ‘M’, ‘O’ and ‘W’ are not used.
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2005-04-20
TSENA
ALARM1
ALARM2
BLANK
LED TEST
DOE
PO DATA 00
~PO DATA 07
OUT 00~OUT 15
DCEN
PI LATCH
BCEN
PI CLK
8
8
16
5
TSD1 circuit
PWMCLK
4
V/I conversion
circuit
generator circuit
(8 bits)
PWM pulse
8
8-bit clock
counter
3-bit
Clock counter
DAC4
8
3
Output-open
detection circuit
16 × 6 bit DACs and
16 constant-current outputs
TSD2 circuit
8
& latch
(16 × 8 bits)
8
data register
latch
(1 × 8 bits)
PI REG2
data register &
8
PWM
PI REG1
8
8
PI DATA 00
~PI DATA 07
All dot adjustment
PI SEL
Block Diagram (entire device)
For PI REG1, PI REG2,
SI REG1 and SI REG2
1 × 5-bit
DAC
DAC3
& latch
(1 × 128 bits)
1 × 6-bit
DAC
DAC2
1 × 2-bit
DAC
DAC1
register & latch
(1 × 8 bits)
register
128
current
adjustment data
adjustment data
Standard
SI REG1
Each dot
SI REG2
SI DATA
SI SEL
2005-04-20
RESET
REXT
SO DATA
SI LATCH
SI CLK
TB62718AFG
TB62718AFG
Constant Current Adjustment Range (graph)
This graph shows how current may be adjusted to a fraction of its full-scale value.
Note 1: In each case, the value input to each DAC is the value output from the previous DAC.
Reference: Current adjustment functions
DAC1 to DAC3 are the current adjustment functions for all outputs.
The adjustment width of DAC1 is large and approximate (1 LSB ∼
− 25%).
The adjustment width of DAC2 is the smallest and has a large error (1 LSB ∼
− 0.9%).
The adjustment width of DAC3 is small. DAC3 is a high-performance DAC with a small error
(1 LSB ∼
− 1.61%).
Therefore,
It is recommended that DAC1 and DAC2 be used for adjusting the REXT resistance.
It is recommended that DAC3 be used for adjusting brightness between module.
(after it was set and it had DAC4 adjusted to the dot.)
The beginning is set in about 75% of the middle value, after that, it is effective to use ±25% of set width.
DAC4 is the current adjustment function for all outputs.
The adjustment width of DAC4 is small. But it is a high-performance DAC with a small error
(1 LSB ∼
− 1.27%).
And also, DAC4 has a very wide setting range.
Therefore, DAC4 can be used to adjust the brightness of LEDs without a rank classification.
This method allows brightness to be adjusted with a degree of accuracy of 1.27% of full scale.
Note 2: Assuming precise linear correlation between output current and LED brightness
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2005-04-20
TB62718AFG
Equivalent Input and Output Circuits (resistance values are typical values.)
Input pins with pull-up resistor
Input pins with pull-down resistor.
TSENA, BLANK, BC/DCEN
VDD
IN
SI/PI LATCH, PI DATA 00~PI DATA 07, LED TEST
R (UP) = 300 kΩ
VDD
IN
1 kΩ
GND
GND
R (DOWN)
= 300 kΩ
Output terminals
Input terminals
PO DATA 00~PO DATA 07, SO DATA
(A) SI DATA, SI CLK, PI CLK, PWMCLK
(B) RESET , DOE , PI SEL, SI SEL
VDD
VDD
IN
1 kΩ
100 Ω
Rin
OUT
GND
GND
(A) Rin = 250 Ω
(B) Rin = 1 kΩ
Protection circuit monitor terminals
Constant-current output terminals
OUT 00~OUT 15
ALARM1 &
ALARM2
Parasitic diode
Parasitic diode
VSS2
VSS
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TB62718AFG
Explanation of Pin Functions Table
No.
Name
I/O
Function Explanation
4, 45
VSS
P
⎯
35, 14
NC
⎯
⎯
Logic ground pins. Be sure to use all.
Unused
This pin is used to reset the IC’s built-in temperature monitoring circuit (TSD).
Rising edge of input signal re-enables outputs which had been forced to OFF.
The latched data as the setting is not reset.
Either in case of H- or L-level of this terminals can be operated TSD circuit.
63
TSENA
I
Pullup
15, 24,
25, 34
VSS2
P
⎯
Ground pin for output. Be sure to use all.
13, 36
VDD
P
⎯
Logic power supply input pins. Be sure to use all.
16~23,
26~33
OUT 00~
OUT 15
O
⎯
LED drive output pins. Connect to cathode of LED.
50
SI DATA
I
⎯
Serial data input pin. Used for input of standard current adjustment data and dot
adjustment data
51
SI CLK
I
⎯
Serial data transfer clock input pin. Data is transferred positive edge.
52
SI LATCH
I
53
SI SEL
I
62
SO DATA
O
37~44
PI DATA 00~
PI DATA 07
I
46
PI CLK
I
PullSerial data latch signal input pin. Data is held on positive edge.
down
⎯
Serial data selection pin. Either standard current adjustment data or dot adjustment data
may be selected.
⎯
Serial data output pin. The output data type is selected using SI SEL.
PullInput pins for parallel data. Inputs for all output adjustment data and PWM data
down
⎯
Input pin for parallel data transfer clock. Data is transferred on positive edge.
PullInput pin for parallel data latch signal. Data is held on rising positive edge.
down
47
PI LATCH
I
48
PI SEL
I
⎯
Parallel data selection pin. Either all output adjustment data or PWM data may be
selected.
5~12
PO DATA 00~
PO DATA 07
O
⎯
Output pin for parallel data. The output data type is selected using PISEL.
49
DOE
I
⎯
Control pin for parallel data output PODATA. PIDATA is out on input of an H-level signal.
PIDATA is set to High-impedance by input of an L-level signal.
59
BLANK
I
Pullup
54
PWMCLK
I
⎯
55
BCEN
I
Pullup
Selection signal input pin for all output adjustment functions. All output adjustment is fixed
to 100% when this signal is Low. All bit adjustments become effective when it is High.
It isn’t influent anything to all output adjustment by PWMCLK.
56
DCEN
I
Pullup
Selection signal input pin for dot adjustment function. Dot adjustment value is fixed to
100% when this signal is Low. Dot adjustment becomes effective when it is High.
57
RESET
I
⎯
58
LED TEST
I
60
REXT
P
⎯
Connection pin of resistor for setting for the current.
2
ALARM1
O
⎯
Open-drain monitor pin for TSD circuit. When the TSD circuit detects an abnormal
temperature, this signal is turned ON. IO monitor the TSD circuit connect this pin to a
pull-up resistor. ALARM1 is independent of the RESET signal.
3
ALARM2
O
⎯
Open-drain monitor pin for output-open detection circuit. When an open output is detected,
this signal is turned ON.
1, 64
TEST 0,
TEST 1
I
⎯
Pins for the device testing. Connect all these pins to ground.
Pin attributes
PWM circuit control signal input pin. Output is turn OFF by input of an H-level signal. PWM
output is initiated by input of an L-level signal accordingly to the input data.
Standard clock input pin for PWM circuit. One clock cycle is equivalent to the minimum
pulse width of the PWM output.
Reset signal input pin. Setting and registered data are reset when it is Low.
A reset also releases TSD.
Connection confirmation signal input pin for an LED. When this signal is High, all outputs
Pullare ON.
down
This signal should normally be kept Low.
P: power supply/ground/other, I: input pin, O: output pin
Note 3: It is recommended that pins with pull-up or pull-down resistors not be left open.
Ambient noise may cause malfunction of the device.
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2005-04-20
TB62718AFG
Absolute Maximum Ratings (Topr = 25°C unless otherwise specified)
Characteristics
Supply voltage
Symbol
Rating
Unit
VDD
−0.3~7
V
VO
−0.3~26
V
Output current
IOUT
90
mA/bit
Logic output voltage
VOUT
−0.3~ VDD + 0.3
V
VIN
−0.3~VDD + 0.3
V
A
Constant-current output voltage
Logic input voltage
Total VSS2 current
Power dissipation
Saturation heat
resistance of
package
(Note 5)
IVSS2
1.44
(Note 6)
Pd
1.19
(Note 4)
5.0
(Note 6)
θ (j-a)
102
When device mounted on PCB of any size
θ (j-c)
25
When device mounted on PCB
When device mounted on PCB of any size
When device mounted on PCB
W
°C/W
Operating temperature
Topr
−40~85
°C
Storage temperature
Tstg
−55~150
°C
Note 4: If the operating temperature exceeds 25°C, derate the power dissipation rating by 0.95 mW/°C.
Note 5: All four VSS2 pins must be connected. If not, device characteristics cannot be guaranteed.
Note 6: When device mounted on PCB with dimensions 100 mm × 100 mm × 1.6 mm
Recommended Operating Conditions
(VDD = 4.5 V~5.5 V, Topr = −40°C~85°C unless otherwise specified)
Characteristics
Symbol
Conditions & Pins
Min
Typ.
Max
Unit
Supply voltage
VDD
⎯
4.5
5.0
5.5
V
High-level input voltage
VIH
PI DATA, PI CLK, PI SEL, PI LATCH,
SI DATA, SI CLK, SI SEL, SI LATCH,
PWM CLK
0.7
VDD
⎯
VDD
V
Low-level input voltage
VIL
BLANK, LED TEST, TSENA, DOE,
DCEN, BCEN
VSS
⎯
0.3
VDD
V
High-level output current
IOH
PO DATA 00~PO DATA 07, SO DATA
⎯
⎯
−1
mA
Low-level output current
IOL
VDD = 4.5 V, ALARM1, ALARM2
⎯
⎯
1
mA
Constant-current output
IOUT
OUT 00~OUT 15
5
⎯
80
mA/bit
VOUT
OUT 00~OUT 15 OFF
⎯
⎯
26
V
VOH
ALARM1, ALARM2 OFF
⎯
⎯
5
V
−40
⎯
85
°C
Output voltage
Operating temperature
⎯
Topr
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2005-04-20
TB62718AFG
Recommended Operating Conditions (continue)
(VDD = 4.5 V~5.5 V, Topr = −40°C~85°C unless otherwise specified)
Characteristics
Symbol
Min
Typ.
Max
Ratio of High-level: Low level = 50%,
PWM CLK
⎯
⎯
10
fPI1
PI CLK,
⎯
⎯
15
fPI2
PI CLK, connected in cascade
⎯
⎯
10
fSI1
SI CLK
⎯
⎯
15
fPWM
Clock frequency
SI CLK, connected in cascade
⎯
⎯
10
PWM CLK
30
⎯
⎯
PI CLK, SI CLK
30
⎯
⎯
PI LATCH, SI LATCH
50
⎯
⎯
twrstH/twrstL
RESET
50
⎯
⎯
twblkH/twblkL
BLANK
400
⎯
⎯
twledH/twledL
LED TEST
400
⎯
⎯
PI DATA → PI CLK
10
⎯
⎯
PI LATCH → PI CLK
10
⎯
⎯
SI DATA → SI CLK
10
⎯
⎯
SI LATCH → SI CLK
10
⎯
⎯
fSI2
twH/twL
Minimum pulse width
Set-up time
Hold time
Condition & Terminals
twltH/twltL
tsetup
thold
SI LATCH → SI CEL
50
⎯
⎯
PI DATA → PI CLK
5
⎯
⎯
PI LATCH → PI CLK
5
⎯
⎯
SI DATA → SI CLK
5
⎯
⎯
SI LATCH → SI CLK
5
⎯
⎯
SI LATCH → SI CEL
50
⎯
⎯
9
Unit
MHz
ns
ns
ns
2005-04-20
TB62718AFG
Electrical Characteristics 1
(VDD = 4.5 V~5.5 V, Topr = −40°C~85°C, typ: VDD = 5.0 V, Topr = 25°C)
Parameter
Symbol
Test conditions & Terminals
Min
Typ.
Max
Unit
High-level output voltage
VOH
IOH = −1.0 mA,
PO DATA 00~PO DATA 07, SO DATA
VDD
−0.4
⎯
⎯
V
Low-level output voltage
VOL
IOL = 1.0 mA,
PO DATA 00~PO DATA 07, SO DATA
⎯
⎯
0.4
IOL = 1.0 mA, ALARM1, ALARM2
⎯
⎯
0.3
VOUT = VDD or VSS,
PO DATA 00~PO DATA 07
⎯
±0.5
±5
µA
All pins without pull-up/pull-down
resistors
⎯
⎯
±1
µA
IDD1
PI DATA = 1/2 PI CLK
SI DATA = 1/2 SI CLK
PI CLK = SI CLK = 20 MHz
PWMCLK = L, BLANK = H
Settings: *1
⎯
20
30
IDD2
PI DATA = SI DATA = L
PI CLK = SI CLK = L
PWMCLK = 20 MHz
Settings: *5a
⎯
75
105
IDD3
PI DATA = 1/2 PI CLK
SI DATA = 1/2 SI CLK
PI CLK = SI CLK = PWMCLK = 20 MHz
Settings: *5a
⎯
80
115
IDD4
PI DATA = SI DATA = L
PI CLK = SI CLK = L
PWMCLK = 20 MHz
Settings: *6a
⎯
90
140
IDD5
PI DATA = 1/2 PI CLK
SI DATA = 1/2 SI CLK
PI CLK = SI CLK = PWMCLK = 20 MHz
Settings: *6a
⎯
95
150
Tri-state output leakage current
Input current
Supply current
IOZ
II
V
mA
Electrical Characteristic Settings
(OUT 00~OUT 15 all on, VOUT = 0.7 V and REXT = 2.7 kΩ unless otherwise specified)
No.
Surface Brightness
Adjustment (DAC3)
DAC Settings
Constant Output Current
(typ.)
∗1
Outputs all OFF, VOUT = 26 V, DAC1, 2, 4 = MSB, BLANK = H
IOUT = 0 mA
∗2
DAC1 = 0, DAC2 = 0, DAC4 = 63, BLANK = L
IOUT = 7.10 mA
∗3a
DAC1 = 0, DAC2 = 17, DAC4 = 63, BLANK = L
IOUT = 10.0 mA
∗4a
DAC1 = 1, DAC2 = 17, DAC4 = 63, BLANK = L
∗5a
DAC1 = 2, DAC2 = 37, DAC4 = 63, BLANK = L
∗6a
DAC1 = 3, DAC2 = 51, DAC4 = 63, BLANK = L
IOUT = 60.2 mA
∗7
DAC1 = 3, DAC2 = 63, DAC4 = 63, BLANK = L
IOUT = 71.0 mA
∗3b
DAC1 = 0, DAC2 = 17, DAC4 = 63, BLANK = L
IOUT = 5.0 mA
∗4b
DAC1 = 1, DAC2 = 17, DAC4 = 63, BLANK = L
∗5b
DAC1 = 2, DAC2 = 37, DAC4 = 63, BLANK = L
∗6b
DAC1 = 3, DAC2 = 51, DAC4 = 63, BLANK = L
DAC3 = 31
IOUT = 19.9 mA
IOUT = 40.1 mA
DAC3 = 00
IOUT = 10.0 mA
IOUT = 20.0 mA
IOUT = 30.1 mA
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2005-04-20
TB62718AFG
Electrical Characteristics 2
(VDD = 4.5 V~5.5 V, Topr = −40°C~85°C, typ: VDD = 5.0 V, Topr = 25°C)
Parameter
Symbol
Constant-current output
Constant-current output Depends on
temperature
Leakage current for constant-current
output
Constant current accuracy between
bits
Dot adjustment deviation between
bits
(when DAC3 data were changed
from MSB to LSB.)
Test Conditions
Min
Typ.
Max
IOUT1
Settings *7
60.4
71.0
81.6
IOUT2
Settings *6a
51.2
60.2
69.2
IOUT3
Settings *5a
34.1
40.1
46.1
IOUT4
Settings *4a
16.5
19.9
23.2
IOUT5
Settings *3a
7.8
10.0
12.2
IOUT6
Settings *2
4.54
7.1
9.65
%TOPR1
Settings *6a, VOUT = 1.0 V, Topr is
varied in the range −40°C~85°C.
⎯
±50
±80
%TOPR2
Settings *4a, VOUT = 1.0 V, Topr is
varied in the range −40°C~85°C.
⎯
±25
±50
Settings *1, VOUT = 26 V
⎯
0.05
0.1
∆IOUT1
Settings *6a, VOUT = 0.7 V
⎯
±2.5
±6
∆IOUT2
Settings *5a, VOUT = 0.7 V
⎯
±3.5
±6
∆IOUT3
Settings *4a, VOUT = 0.7 V
⎯
±5.5
±7
IOLK
Unit
V
µA/°C
∆IOUT4
Settings *3a, VOUT = 0.7 V
⎯
±7
±12
%IOUT1
Settings is changed from *6a to *6b.
⎯
±1
±3
%IOUT2
Settings is changed from *5a to *5b.
⎯
±1.5
±3
%IOUT3
Settings is changed from *4a to *4b.
⎯
±3.5
±5
%IOUT4
Settings is changed from *3a to *3b.
⎯
±6
±12
Settings *6a, VOUT is varied in the
range 0.7 V~3 V.
⎯
±5
±8
Settings *4a, VOUT is varied in the
range 0.7 V~3 V.
⎯
±3
±6
µA
%
%
Constant-current output depends on
output voltage
%VOUT
Constant-current output depends on
supply voltage
%VDD
Settings *6a, VDD is varied in the range
4.5 V~5.5 V.
⎯
±1
±2
Tsd1
⎯
120
140
160
Tsd2
⎯
140
160
180
⎯
0.04
VDD
⎯
V
150
300
600
kΩ
TSD detection temperature
Output-open detection voltage
Pull-up/down resistor
VARL
ALARM2
⎯
Rup/Rdw
%
%
°C
Electrical Characteristic Settings
(OUT 00~OUT 15 all on, VOUT = 0.7 V and REXT = 2.7 kΩ unless otherwise specified)
No.
All Dot Adjustment
(DAC3)
DAC Settings
Constant Output Current
(typ.)
∗1
OUT00~15 OFF, VOUT = 26 V, DAC1~4 = MSB, BLANK = H
IOUT = 0 mA
IOUT = 7.10 mA
∗2
DAC1 = 0, DAC2 = 0, DAC4 = 63, BLANK = L
∗3a
DAC1 = 0, DAC2 = 17, DAC4 = 63, BLANK = L
∗4a
DAC1 = 1, DAC2 = 17, DAC4 = 63, BLANK = L
∗5a
DAC1 = 2, DAC2 = 37, DAC4 = 63, BLANK = L
IOUT = 40.1 mA
∗6a
DAC1 = 3, DAC2 = 51, DAC4 = 63, BLANK = L
IOUT = 60.2 mA
IOUT = 10.0 mA
DAC3 = 31
IOUT = 19.9 mA
∗7
DAC1 = 3, DAC2 = 63, DAC4 = 63, BLANK = L
IOUT = 71.0 mA
∗3b
DAC1 = 0, DAC2 = 17, DAC4 = 63, BLANK = L
IOUT = 5.0 mA
∗4b
DAC1 = 1, DAC2 = 17, DAC4 = 63, BLANK = L
∗5b
DAC1 = 2, DAC2 = 37, DAC4 = 63, BLANK = L
∗6b
DAC1 = 3, DAC2 = 51, DAC4 = 63, BLANK = L
DAC3 = 00
IOUT = 10.0 mA
IOUT = 20.0 mA
IOUT = 30.1 mA
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2005-04-20
TB62718AFG
Switching Characteristics
(VDD = 4.5 V~5.5 V, Topr = −40°C~85°C, CL = 50 pF unless otherwise specified,
typ: VDD = 5.0 V, Topr = 25°C, CL = 50 pF)
Parameter
Symbol
Test Conditions
Min
Typ.
Max
Unit
Tri-state output enable propagation
delay
tpZH/ZL
DOE → PO DATA0~ PO DATA 7
8
16
30
ns
Tri-state output disable propagation
delay
tpHZ/LZ
DOE → PO DATA0~ PO DATA 7
8
16
30
ns
OUT00~ OUT 15
10
17
30
µs
ALARM1, ALARM2
0.2
0.4
0.8
ns
Rise time
tr
Fall time
tf
OUT00~ OUT 15
20
40
70
ALARM1, ALARM2
2
4
8
tpHL
BLANK → OUT00~ OUT 15
30
60
120
tpLH
PWM CLK → OUT00~ OUT 15
70
120
200
tpHL
PWM CLK → OUT00~ OUT 15
40
70
140
60
110
190
30
60
130
RESET → OUT00~ OUT 15
30
60
130
PI CLK → PO DATA0~ PO DATA 7
20
30
70
PI SEL → PO DATA0~ PO DATA 7
20
30
70
SI SEL → SO DATA
10
18
40
SI SEL → SO DATA
10
20
40
tpLH
Propagation delay
tpHL
tpHL
tpd
LED TEST → OUT00~ OUT 15
12
ns
ns
2005-04-20
TB62718AFG
Explanation of Operation and Truth Tables
Serial data transfer: standard current adjustment using DAC1 and DAC2
(data register SI REG [7:0])
Process
SI DATA
SI CLK
SI LATCH
SI SEL
L
1
H or L
2
SO DATA
H
H or L
Selects standard current adjustment (8 bits, 2 bits and 6
bits) for input data when SI SEL is high. Data is
transferred to SI REG [1] on 8th positive edge of SI CLK
input.
H
No
change
Holds the data transferred to SI REG [1] on positive edge
of SI LATCH.
Set is reflected on standard current adjustment from the
moment when it is held.
(×8)
L
Operation and Function
(×1)
Serial data transfer timing
(standard current adjustment, SI SEL = H, single device)
RESET
SI SEL
SI DATA
Data held on positive edge of SI LATCH after the
data transfer by single device (after 8 clock cycles)
SI CLK
SI LATCH
SO DATA
(1st device)
Data reset by RESET = L
SODATA is synchronized with 8th clock cycle after
reset, and the first data is output.
Indicates undefined logic state
after reset and before input.
Serial data transfer timing
(standard current adjustment, SI SEL = H, two devices connected in cascade)
RESET
SI SEL
SI DATA
SI CLK
SI LATCH
SO DATA
(1st device)
Data reset by RESET = L
Indicates undefined logic state
after reset and before input.
Data held on positive edge of SI
LATCH after the data transfer by two
devices (after 16 clock cycles)
SODATA is synchronized with 8th clock
cycle after reset, and the first data is output.
13
2005-04-20
TB62718AFG
Serial data transfer: dot adjustment DAC4. (data register SI REG2 [127:0])
Process
SI DATA
SI CLK
1
H or L
2
SI LATCH
SI SEL
SO DATA
Operation and Function
L
L
H or L
Selects dot adjustment (128 bits) for input data. Data is
transferred to SI REG2 on 128th positive edge of SI CLK.
L
No
change
Holds the data transferred to SI REG2 on positive edge of
SILATCH.
Set is reflected on dot adjustment from the moment when
it is held.
(×128)
L
(×1)
Serial data transfer timing
(dot adjustment, SI SEL = L, single device)
RESET
SI SEL
There pairs of bits are Don’t care.
SI DATA
SI CLK
Dot adjustment data for
OUT 15 (1st device).
Dot adjustment data for
OUT 00 (1st device).
Data held on positive edge of SI LATCH after data
transfer by single device (after 128 clock cycles)
SI LATCH
SO DATA
(1st device)
Data reset by RESET = L
SODATA is synchronized with 128th clock
cycle after reset, and the first data is output.
Indicates undefined logic state
after reset and before input.
Serial data transfer timing
(dot adjustment, SI SEL = L, two devices connected in cascade)
RESET
SI SEL
There pairs of bits are Don’t care.
SI DATA
SI CLK
Dot adjustment data for
OUT 15 (1st device).
Dot adjustment data for
OUT 00 (1st device).
Dot adjustment data for
OUT 15 (2nd device).
Dot adjustment data for
OUT 00 (2nd device).
SI LATCH
SO DATA
(1st device)
Data reset by RESET = L
Indicates undefined logic state
after reset and before input.
SODATA is synchronized with 128th clock
cycle after reset, and the first data is output.
Data held on positive edge of SI LATCH after data
transfer by two devices (after 256 clock cycles)
14
2005-04-20
TB62718AFG
DAC1: Standard current adjustment settings for DAC1 (SI REG1 [7:6])
RESET
SI SEL
SI REG
(7:6)
SI REG
(5:0)
Current
Rate
H
H
HH
XXXXXX
100%
(1.0)
H
H
HL
XXXXXX
75%
(0.75)
H
H
LH
XXXXXX
50%
(0.5)
H
H
LL
XXXXXX
25%
(0.25)
X
LL
LLLLLL
25%
(0.25)
Operation and Function
Notes
100% of base current setting as determined by REXT
(Ω)
When SI SEL =
H, 2 bits on
75% of base current setting as determined by REXT MSB sides are
(Ω)
corresponding to
set of standard
50% of base current setting as determined by REXT current
(Ω)
adjustment
25% of base current setting as determined by REXT DAC1.
The output
(Ω)
current can be
set to one of 4
Initial state after input of reset signal: 25% of base
levels.
current setting as determined by REXT (Ω) (as
described above)
DAC2: Standard current adjustment settings for DAC2 (SI REG1 [5:0])
RESET
SI SEL
SI REG
(7:6)
SI REG
(5:0)
Current
Rate
H
H
XX
XXXXXX
100%
(1.0)
HHHHHL
↑
(0.9905)
↑
H
H
XX
↓
LLLLLH
H
Operation and Function
Notes
100% of base current value as set using DAC1
base current adjustment
Any one or 64 levels in the range 40%~100% of the
current can be set. (1 LSB = 0.95%)
1LSB =
6-bit DAC performance
±0.95%
1LSB variation: ±0.95%
(±0.0095)
Non linearity error: ±1/2LSB
Differential non linearity error: ±3/4LSB
↓
(0.4095)
H
XX
LLLLLL
40%
(0.4)
40% of base current value as set using DAC1 base
current adjustment
X
LL
LLLLLL
40%
(0.4)
Initial state after input of reset signal: 40% of base
current value set as described above
When SI SEL =
H, 6 bits on
MSB sides are
corresponding to
set of standard
current
adjustment
DAC2.
The output
current can be
set to one of 64
levels.
DAC4: Set details of dot adjustment DAC4 (SI REG2 [127:0])
RESET
SI SEL
DCEN
About 8 bits
Unit of SI
REG2 [127:0]
Current
Rate
Operation and Function
Notes
H
L
H
XXHHHHHH
100%
(1.0)
Output current is 100% of base current
value as set using DAC1 and DAC2 base
current adjustment and DAC3 surface
brightness adjustment
When SI SEL = L
8 bits out of 128 bits are
corresponding to set of
each output, and the 6 bits
on MSB sides of 8 bits are
data on dot adjustment.
XXHHHHHL
↑
H
L
H
↓
XXLLLLLH
H
H
(0.9874)
↑
1LSB =
±1.269%
(±0.0126)
↓
(20.0126)
L
H
XXLLLLLL
20%
(0.2)
X
H
XXLLLLLL
20%
(0.2)
X
L
XXHHHHHH
100%
(1.0)
Any one of 64 levels in the range
20%~100% of the current can be set.
(1LSB ∼
− 1.27%)
6-bit DAC performance
1LSB variation: ±1.269%
Non linearity error: ±1/2LSB
Differential non linearity error: ±1/2LSB
The output current can be
set to one of 64 levels.
SI REG2 [7:0]
→ adjustment data for
OUT 00.
SI REG2 [15:8]
20% of base current value as set using
→ adjustment data for
DAC3 surface brightness adjustment
OUT 01.
Initial state after input of reset signal: 20% SI REG2 [127:120]
→ adjustment data for
of base current value set as described
OUT 15.
above
Output current is 100% of base current
value set as described above.
15
Data input is still enabled if
DCEN = L. If DCEN = H,
adjustment is performed at
the same time.
2005-04-20
TB62718AFG
Polarity of serial input data for standard current adjustment (SI REG1 [7:0]) and
dot adjustment (SI REG2 [127:0])
Serial data transfer timing
(SI SEL = H, input of standard current adjustment data for DAC1 and DAC2)
Standard current
adjustment data (6 bits)
Standard current
adjustment data (2 bits)
SO DATA
SI DATA
D-F/F D-F/F D-F/F D-F/F D-F/F D-F/F D-F/F D-F/F
SI REG1 (7)
SI REG1 (0)
MSB
LSB
SI LATCH
D-LAT D-LAT D-LAT D-LAT D-LAT D-LAT D-LAT D-LAT
Serial data transfer timing
(SI SEL = L, input of dot adjustment data for DAC4)
Dot adjustment
data (6 bits)
SI DATA
SI REG2 (0)
LSB
Not used
× ×
SI REG2 (7)
Dot adjustment
data (6 bits)
Not used
SO DATA
× ×
SI REG2 (120)
SI REG2 (127)
MSB
SI LATCH
DAC4 (6-bit DAC)
DAC4 (6-bit DAC)
OUT 00
OUT 15
16
2005-04-20
TB62718AFG
Parallel data transfer: All dot adjustment DAC3. (data register PI REG1 [7:0])
Process
PI DATA
[7:0]
PI CLK
PI LATCH
PI SEL
PO DATA
[7:0]
Operation and Function
L
H
H or L
Selects total dot adjustment (8-bit, 3-bit and 5-bit) for input
data. Data is transferred to PI REG1 on 128th positive
edge of PI CLK.
H
No
change
Holds the data transferred to PI REG1. Set is reflected on
all dot adjustment from the moment when it is held.
1
H or L
2
(×1)
L
(×1)
Parallel data transfer timing (all dot adjustment, PI SEL = H, single device)
RESET
PI SEL
PI DATA
[7:0]
111_11111
PI CLK
Data held on positive edge of PI LATCH after data
transfer by single device (after 1 clock cycle)
PI LATCH
PO DATA
[7:0]
000_00000
111_11111
Indicates undefined logic state
after reset and before input.
PO DATA is synchronized with 1st clock
cycle after reset, and the first data is output.
Parallel data transfer timing
(all dot adjustment, PI SEL = H, two devices connected in cascade)
RESET
PI SEL
PI DATA
[7:0]
111_11111
110_11110
PI CLK
PI LATCH
PO DATA [7:0]
(1st device)
000_00000
111_11111
Indicates undefined
logic state after reset
and before input.
101_11101
Data held on
positive edge of
PI LATCH after
the data
110_11110
transfer by two
devices
(2 clock cycles)
PO DATA is synchronized with 2nd clock
cycle after reset, and the second data is
output.
PO DATA is synchronized with 1st clock
cycle after reset, and the first data is output.
17
2005-04-20
TB62718AFG
Parallel data transfer PMW display data (data register PI REG2 [127:0])
Process
PI DATA
PI CLK
PI LATCH
PI SEL
PO DATA
Operation and Function
L
L
H or L
Selects for input data of PWM display data (8 bit × 16).
Data is transferred to PI REG2 on 16th positive edge of PI
CLK.
L
No
change
Holds the data transferred to PI REG2. Set is reflected on
PWM 256 grayscales from the next BLANK = L when it is
held.
1
(×16)
H or L
2
L
(×1)
Parallel data transfer timing (PWM data PI SEL = L, single device)
RESET
PWM data for OUT 15
PWM data for OUT 00
PI SEL
PI DATA
[7:0]
01H
02H
0EH
0FH
PI CLK
Data held on positive edge of PI LATCH after data
transfer by single device (after 1 clock cycle)
PI LATCH
PO DATA
[7:0]
00H
00H
Indicates undefined logic state
after reset and before input.
01H
PO DATA is synchronized with 16th clock
cycle after reset, and is output.
Parallel data transfer timing (PWM data PI SEL = L, two devices connected in cascade)
RESET
PI SEL
PI DATA
[7:0]
00H
01H
02H
0EH
0FH
10H
01H
02H
0EH
0FH
10H
PI CLK
PI LATCH
PO DATA [7:0]
(1st device)
PWM data for OUT 15
(1st device)
00H
PWM data for OUT 00
(1st device)
00H
Indicates undefined logic state
after reset and before input.
01H
02H
0FH
10H
01H
PO DATA is synchronized with 16th clock
cycle after reset, and the first data is output.
Data held on positive edge of PI
LATCH after data transfer by
two devices (32 clock cycles)
18
2005-04-20
TB62718AFG
Details all dot adjustment setting using PWMCLK division (PI REG1 [7:5])
RESET
PI SEL
BCEN
PI REG1
[7:5]
PWMCLK
Divisor
Operation and Function
H
H
H
LLL
PWM CLK =
8/8 PWMCLK
(Hz)
The period of PWMCLK is set to
equal the change in the PWM
pulse width data. 1LSB.
7/8 PWMCLK
to
2/8 PWMCLK
Variable does the frequency of
PWMCLK to 1/8 of the minimal. It
is set in 8 levels.
6-bit DAC performance
Maximum input: PWMCLK = 20
MHz
LLH
↑
H
H
H
↓
HHL
H
H
H
H
HHH
PWMCLK =
1/8 PWMCLK
(Hz)
The period of PWMCLK is set to
one-eighth the change in the
PWM pulse width data. 1 LSB.
X
H
LLL
PWMCLK =
8/8 PWMCLK
(Hz)
The period of PWMCLK is set to
equal the change in the PWM
pulse width data. 1 LSB.
H
L
XXX
Unchanged
BCEN signal does not affect
PWMCLK frequency dividing.
Notes
When PI SEL = H is selected, 3
bits on MSB sides are
corresponding to set of standard
current adjustment by PWM
frequency dividing.
PI REG [7:5] varies the pulse
width of PWM data
corresponding to 1 LSB for eight
levels and adjusts brightness.
This setting values affects pulse
widths on all outputs.
Data input is still enabled if
BCEN = L.
Output current level reflects input
settings.
DAC3: Details of all dot adjustment setting for DAC3 (PI REG2 [4:0])
RESET
PI SEL
PI REG1
[4:0]
BCEN
Current
Rate
Operation and Function
H
H
HHHHH
H
100%
(1.0)
100% of base current value as
set using DAC1 and DAC2
current adjustment and DAC4 dot
adjustment
H
H
HHHHL
↑
(0.9839)
↑
H
↓
LLLLH
H
H
Any one of 32 levels in the range
50%~100% of the current can be
set. (1 LSB = 1.61%)
1LSB = 5-bit DAC performance
±1.61% 1LSB variation: ±1.61%
(±0.0161) Non linearity error: ±1/2LSB
Differential non linearity error:
↓
±1/2LSB
(0.5161) (No guarantee for monotonicity)
Notes
H
LLLLL
H
50%
(0.5)
50% of base current value as set
using DAC1 and DAC2 current
adjustment and DAC4 dot
adjustment
X
HHHHH
H
100%
(1.0)
Initial state after input of reset
signal: 100% of base current
value set as described above
X
HHHHH
L
100%
(1.0)
Initial state after input of DCEN
signal: 100% of base current
value set as described above
19
When PI SEL = H is selected,
5 bits on LSB side are
corresponding to set of surface
brightness adjustment.
The output current can be set
to one of 32 levels.
Data input is still enabled if
BCEN = L.
If BCEN = H, adjustment is
performed at the same time.
2005-04-20
TB62718AFG
Detailed PWM 256 grayscales setting (PI REG2 [127:0], 16 × 8 bits)
RESET
PI SEL
1 word (8 bits)
of PI REG2
Output Pulse
Rate
H
L
HHHHHHHH
255/255
100%
HHHHHHHL
↑
H
⎯
L
↓
LLLLLLLH
H
L
LLLLLLLL
0/255
0%
X
LLLLLLLL
0/255
0%
Operation and Function
Output pulse width is at its
maximum value when input
data is FF.
Notes
When PI SEL = L, The PWM grayscale
controls the output pulse width.
16 × 8-bit words are transferred in
parallel.
The input data can be used to 1 word is the PWM data of each output
control the PWM pulse width
pulse width is set in 256 step.
and hence generate 256
PI REG2 [7:0]
grayscales.
→ PWM data for OUT 00.
PI REG2 [15:8]
→ PWM data for OUT 01.
Outputs are OFF when the
PI REG2 [127:120]
input data is 00.
→ PWM data for OUT 15.
Early condition after the reset
signal input is set in 0/256
(output off).
Minimum output pulse width is
1/PWMCLK.
Polarity of serial input data for all dot adjustment
(PI REG [7:0]) and PWM 256 grayscales (PI REG2 [127:0])
Parallel data transfer timing
(PI SEL = H, selects data input for all dot adjustment for DAC3.)
PI REG1 [7]
MSB
PI DATA [7]
All dot adjustment by
division by PWMCLK
PO DATA [7]
All dot adjustment
by DAC3
PI DATA [0]
PO DATA [0]
LSB
PI REG1 [0]
PI LATCH
(PI SEL = L, selects data input for PWM 256 grayscales.)
PI REG2 [7]
MSB
PO REG2 [127]
MSB
PO DATA [7]
PI DATA [7]
PWM pulse data
PWM pulse data
PO DATA [0]
PI DATA [0]
LSB
PI REG2 [120]
LSB
PI REG2 [0]
PI LATCH
PWM pulse
generator circuit
PWM pulse
generator circuit
OUT 00
OUT 15
20
2005-04-20
TB62718AFG
Reference table: output current setting vales (1)
DAC1 (2-bit)
DAC2 (6-bit)
DAC3 (5-bit)
DAC4 (6-bit)
No.
Input Data
Current
Rate1
No.
Input Data
Current
Rate2
No.
Input Data
Current
Rate3
No.
Input Data
Current
Rate4
3
11
1.00
63
111111
1.000
31
**11111
**1.000
63
111111
63
2
10
0.75
62
111110
0.990
30
11110
0.984
62
111110
62
1
01
0.50
61
111101
0.981
29
11101
0.968
61
111101
61
0
**00
**0.25
60
111100
0.971
28
11100
0.952
60
111100
60
⎯
⎯
⎯
59
111011
0.962
27
11011
0.936
59
111011
59
⎯
⎯
⎯
58
111010
0.952
26
11010
0.919
58
111010
58
⎯
⎯
⎯
57
111001
0.943
25
11001
0.903
57
111001
57
⎯
⎯
⎯
56
111000
0.933
24
11000
0.887
56
111000
56
⎯
⎯
⎯
55
110111
0.924
23
10111
0.871
55
110111
55
⎯
⎯
⎯
54
110110
0.914
22
10110
0.855
54
110110
54
⎯
⎯
⎯
53
110101
0.905
21
10101
0.839
53
110101
53
⎯
⎯
⎯
52
110100
0.895
20
10100
0.823
52
110100
52
⎯
⎯
⎯
51
110011
0.886
19
10011
0.807
51
110011
51
⎯
⎯
⎯
50
110010
0.876
18
10010
0.790
50
110010
50
⎯
⎯
⎯
49
110001
0.867
17
10001
0.774
49
110001
49
⎯
⎯
⎯
48
110000
0.857
16
10000
0.758
48
110000
48
⎯
⎯
⎯
47
101111
0.848
15
01111
0.742
47
101111
47
⎯
⎯
⎯
46
101110
0.838
14
01110
0.726
46
101110
46
⎯
⎯
⎯
45
101101
0.829
13
01101
0.710
45
101101
45
⎯
⎯
⎯
44
101100
0.819
12
01100
0.694
44
101100
44
⎯
⎯
⎯
43
101011
0.820
11
01011
0.677
43
101011
43
⎯
⎯
⎯
42
101010
0.800
10
01010
0.661
42
101010
42
⎯
⎯
⎯
41
101001
0.791
9
01001
0.645
41
101001
41
⎯
⎯
⎯
40
101000
0.781
8
01000
0.629
40
101000
40
⎯
⎯
⎯
39
100111
0.771
7
00111
0.613
39
100111
39
⎯
⎯
⎯
38
100110
0.762
6
00110
0.597
38
100110
38
⎯
⎯
⎯
37
100101
0.752
5
00101
0.581
37
100101
37
⎯
⎯
⎯
36
100100
0.743
4
00100
0.565
36
100100
36
⎯
⎯
⎯
35
100011
0.733
3
00011
0.549
35
100011
35
⎯
⎯
⎯
34
100010
0.724
2
00010
0.532
34
100010
34
⎯
⎯
⎯
33
100001
0.714
1
00001
0.516
33
100001
33
⎯
⎯
⎯
32
100000
0.705
0
00000
0.500
32
100000
32
⎯
⎯
⎯
31
011111
0.695
⎯
⎯
⎯
31
011111
31
⎯
⎯
⎯
30
011110
0.686
⎯
⎯
⎯
30
011110
30
⎯
⎯
⎯
29
011101
0.676
⎯
⎯
⎯
29
011101
29
⎯
⎯
⎯
28
011100
0.667
⎯
⎯
⎯
28
011100
28
⎯
⎯
⎯
27
011011
0.657
⎯
⎯
⎯
27
011011
27
⎯
⎯
⎯
26
011010
0.648
⎯
⎯
⎯
26
011010
26
⎯
⎯
⎯
25
011001
0.638
⎯
⎯
⎯
25
011001
25
⎯
⎯
⎯
24
011000
0.629
⎯
⎯
⎯
24
011000
24
⎯
⎯
⎯
23
010111
0.619
⎯
⎯
⎯
23
010111
23
⎯
⎯
⎯
22
010110
0.610
⎯
⎯
⎯
22
010110
22
⎯
⎯
⎯
21
010101
0.600
⎯
⎯
⎯
21
010101
21
⎯
⎯
⎯
20
010100
0.591
⎯
⎯
⎯
20
010100
20
⎯
⎯
⎯
19
010011
0.581
⎯
⎯
⎯
19
010011
19
⎯
⎯
⎯
18
010010
0.571
⎯
⎯
⎯
18
010010
18
⎯
⎯
⎯
17
010001
0.562
⎯
⎯
⎯
17
010001
17
⎯
⎯
⎯
16
010000
0.552
⎯
⎯
⎯
16
010000
16
⎯
⎯
⎯
15
001111
0.543
⎯
⎯
⎯
15
001111
15
⎯
⎯
⎯
14
001110
0.533
⎯
⎯
⎯
14
001110
14
⎯
⎯
⎯
13
001101
0.524
⎯
⎯
⎯
13
001101
13
⎯
⎯
⎯
12
001100
0.514
⎯
⎯
⎯
12
001100
12
⎯
⎯
⎯
11
001011
0.505
⎯
⎯
⎯
11
001011
11
⎯
⎯
⎯
10
001010
0.495
⎯
⎯
⎯
10
001010
10
⎯
⎯
⎯
9
001001
0.486
⎯
⎯
⎯
9
001001
9
⎯
⎯
⎯
8
001000
0.476
⎯
⎯
⎯
8
001000
8
⎯
⎯
⎯
7
000111
0.467
⎯
⎯
⎯
7
000111
7
⎯
⎯
⎯
6
000110
0.457
⎯
⎯
⎯
6
000110
6
⎯
⎯
⎯
5
000101
0.448
⎯
⎯
⎯
5
000101
5
⎯
⎯
⎯
4
000100
0.438
⎯
⎯
⎯
4
000100
4
⎯
⎯
⎯
3
000011
0.429
⎯
⎯
⎯
3
000011
3
⎯
⎯
⎯
2
000010
0.419
⎯
⎯
⎯
2
000010
2
⎯
⎯
⎯
1
000001
0.410
⎯
⎯
⎯
1
000001
1
⎯
⎯
⎯
0
**000000
**0.4
⎯
⎯
⎯
0
**000000
0
Note 7: **: Indicates post-reset initialization value ( RESET = L).
Note 8: The formula for calculating resistance settings is as follows: This value is theory value. Actual current value contains error and so on in this value.
REXT [kΩ] = (1.9 × current rate 1 × current rate 2 × current rate 3 / output current [mA]) × (1 + (7 × current rate 4 / 105)) × 19.4
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2005-04-20
TB62718AFG
Reference table: output current setting value (2)
Reference value for standard current adjustment under conditions:
REXT = 2.7 kΩ (fixed), all dot adjustment = MSB and dot adjustment = MSB
Unit: mA
DAC1
DAC2
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
7.1
7.3
7.4
7.6
7.8
7.9
8.1
8.3
8.5
8.6
8.8
9.0
9.1
9.3
9.5
9.6
1
14.2
14.5
14.9
15.2
15.6
15.9
16.2
16.6
16.9
17.2
17.6
17.9
18.3
18.6
18.9
19.3
2
21.3
21.8
22.3
22.8
23.3
23.8
24.3
24.9
25.4
25.9
26.4
26.9
27.4
27.9
28.4
28.9
3
28.4
29.1
29.6
30.4
31.1
31.8
32.5
33.1
33.8
34.5
35.2
35.8
36.5
37.2
37.9
38.6
DAC1
DAC2
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
0
9.8
10.0
10.1
10.3
10.5
10.7
10.8
11.0
11.2
11.3
11.5
11.7
11.8
12.0
12.2
12.3
1
19.6
19.9
20.3
20.6
21.0
21.3
21.6
22.0
22.3
22.7
23.0
23.3
23.7
24.0
24.3
24.7
2
29.4
29.9
30.4
30.9
31.4
32.0
32.5
33.0
33.5
34.0
34.5
35.0
35.5
36.0
36.5
37.0
3
39.2
39.9
40.6
41.2
41.9
42.6
43.3
44.0
44.6
45.3
46.0
46.7
47.3
48.0
48.7
49.4
DAC1
DAC2
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
0
12.5
12.7
12.9
13.0
13.2
13.4
13.5
13.7
13.9
14.0
14.2
14.4
14.5
14.7
14.9
15.0
1
25.0
25.4
25.7
26.0
26.4
26.7
27.0
27.4
27.7
28.1
28.4
28.7
29.1
29.4
29.8
30.1
2
37.5
38.0
38.6
39.0
39.6
40.1
40.6
41.1
41.6
42.1
42.6
43.1
43.6
44.1
44.6
45.1
3
50.0
50.7
51.4
52.1
52.7
53.4
54.1
54.8
55.4
56.1
56.8
57.5
58.1
58.8
59.5
60.2
DAC1
DAC2
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
0
15.2
15.4
15.6
15.7
15.9
16.1
16.2
16.4
16.6
16.7
16.9
17.1
17.2
17.4
17.6
17.8
1
30.4
30.8
31.1
31.4
31.8
32.1
32.5
32.8
33.1
33.5
33.8
34.1
34.5
34.8
35.2
35.5
2
45.6
46.1
46.7
47.2
47.7
48.2
48.7
49.2
49.7
50.2
50.7
51.2
51.7
52.2
52.7
53.2
3
60.9
61.5
62.2
62.9
63.6
64.2
64.9
65.6
66.3
66.9
67.6
68.3
69.0
69.6
70.3
71.0
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2005-04-20
TB62718AFG
Temperature detection function (can be monitored via the ALARM1 pin.)
Perform two-stage temperature detection as described in the table below (TSD1/TSD2).
Junction
Temperature
[°C]
ALARM1
OUT 00~OUT 15
Function
−40~120
OFF
Normal operation
⎯
120~
ON
Normal operation
When the chip temperature reaches the specified range the
ALARM1 signal goes Low (TSD1), Other functions are not
affected.
When the chip temperature reaches the specified range the
ALARM1 signal goes Low and all output pins are turned OFF
(TSD2).
140~
ON
OFF
Outputs are re-enabled on the positive edge of TSENA or when
the RESET signal goes Low. Neither of these causes the
internal data to be reset.
If RESET pin = L, all internal data is reset.
Output-open detection function (can be monitored via the ALARM2 pin.)
Reform output-open detection as described in the table below.
Output Voltage [V]
ALARM2
>
= VDD × 0.04
OFF
<
= VDD × 0.04
ON
Function
⎯
The output-open condition is detected when the ARARM2 pin signal is ON
and the specified voltage level is detected. (it is also detected when the
output voltage falls to near GND for some reason)
Pulse cancellation circuit
(when monitored using output-open detection pin ARARM2.)
PWMCLK
ALARM2
Input signal
Operating
No input
Always OFF
Function
The built-in pulse cancellation circuit is designed to prevent malfunction.
However, if there is no input on PWMCLK, ALARM2 output will not be
turned ON.
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2005-04-20
TB62718AFG
Block Diagram of Protection Circuit
RESET
Output-OFF condition is released and internal data is reset.
Output ON
LED TEST
Release of output OFF on positive edge
TSENA
Constantcurrent output
Output OFF
TSD2
ALARM1
TSD1
ALARM2
Pulse
cancel
Output-open
detection
16
Continue one, open condition is
detected.
OUT00~OUT15
Protection circuit function
Operating chart (terminal for TESNA, ALARM1 and outputs OUT 00~OUT 15)
Junction Temperature (unit: °C)
TSD1
TSD2
Tj <
120 <
140 <
= 120°C
= Tj
= Tj
<
<
= 160°C
= 180°C
ALARM1
OUT 00
~
OUT 15
ON
Function
TSENA
RESET
X
L
○
⎯
⎯
OFF
X
H
○
⎯
⎯
OFF
ON
Outputs operate normally.
X
L
⎯
○
⎯
ON
ON
Device reset
X
H
⎯
○
⎯
ON
Normal
operation
ALARM1 goes Low, indicating a
rise in temperature. Outputs
operate normally.
X
L
⎯
⎯
○
ON
OFF
Even after a reset, if the junction
temperature is high, outputs are
turned OFF.
X
H
⎯
⎯
○
ON
OFF
ALARM1 goes Low, indicating a
rise in temperature. Outputs
operate normally.
Device reset
Note 9: The internal operation of the TSD circuit is independent of the TSENA and RESET pin voltage levels.
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2005-04-20
TB62718AFG
Serial Data Input Timing Chart
BLANK
Output ON
Output OFF
RESET
SI DATA
SI CLK
Data of DAC3 for OUT 15
Data of DAC3 for OUT 00
×8
×8
Data of DAC1 to 2
×8
SI LATCH
SI SEL
Selects input of each dot adjustment data.
Selects input of standard current
adjustment data.
The data read with 1st time
SO DATA
The data read with 1st time
SO DATA outputs standard current
SO DATA outputs each dot adjustment data.
Note 10: Serial data input has no effect on the ON/OFF state of the outputs.
When the SI LATCH signal holds the serial data, the output current values and output pulse width are affected.
Parallel Data Input Timing Chart
Output OFF & data hold
BLANK
Output ON & data transfer
Output ON & data transfer
RESET
DOE
PWM data for OUT 15
PWM data for OUT 00
PI DATA 00~
PI DATA 07
for total dot adjustment
PI CLK
1 Time
16 Times
PI LATCH
Holds PWM data, output-ON data and total dot adjustment data.
Selects input of total dot adjustment
PI SEL
PO DATA 00~
PO DATA 07
Selects input of PWM data and output-ON data.
High-Impedance
Selects input of PWM data and
output-ON data.
High-Impedance
The data read with 1st time
The data read with 1st time
PO DATA 00~PODATA 07 output PWM data.
PO DATA 00~PODATA 07 output
PWM data.
PO DATA 00~PODATA 07 output all bit adjustment data.
OUT 00~
OUT 15
Output ON (output-OFF if PWM data = 0)
OFF
Starts output of PWM data after
synchronizing with rising edge of BLANK.
Note 11: The BLANK signal has not effect on parallel data input. The PWM pulse can be controlled using the BLANK signal.
It is recommended that, on completion of data transfer, BLANK be set to High and outputs be turned OFF.
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2005-04-20
TB62718AFG
PWM Operating Timing Chart and All Bit Adjustment Using Division by PWMCLK
Output OFF, data hold
Output OFF, data change & hold
Output can be turned ON.
BLANK
Output can be turned ON.
RESET
OUT 00~
OUT 15
ON
OFF
ON
tBLANK (8)
tBLANK (7)
tBLANK (6)
PWMCLK division
tBLANK (5)
tBLANK (4)
tBLANK (6) = (1/ (6/8PWMCLK) ) × 256
tBLANK (5) = (1/ (5/8PWMCLK) ) × 256
tBLANK (4) = (1/ (4/8PWMCLK) ) × 256
tBLANK (3) = (1/ (3/8PWMCLK) ) × 256
tBLANK (2)
tBLANK (2) = (1/ (2/8PWMCLK) ) × 256
tBLANK (1)
OUT 00~OUT 15
PWM data = 01 H
PWMCLK8
OUT 00~OUT 15
PWM data = 80 H
PWMCLK8
OUT 00~OUT 15
PWM data = FE H
PWMCLK8
Minimum PWM control time
tBLANK (8) = (1/ (8/8PWMCLK) ) × 256
tBLANK (7) = (1/ (7/8PWMCLK) ) × 256
tBLANK (3)
OUT 00~OUT 15
PWM data = 00 H
OFF
Maximum PWM control time
tBLANK (1) = (1/ (1/8PWMCLK) ) × 256
Output OFF because data is 00H though it can on.
Because data is 01 H output is ON with 1/255 of tBLANK.
Because data is 80 H output is ON with 128/255 of tBLANK.
Because data is 80 H output is ON with 254/255 of tBLANK.
Note 12: PWM operation timing:
PWM pulse output on the output pins is initiated when BLANK goes Low. (there is simultaneous output on all 16 pins)
Output pulse only once toward BLANK signal’s changing once in L from H.
Hence, if PWM data is to be re-used, BLANK must be pulled Low again.
PWMCLK division:
As shown in the central part of the upper figure, the brightness of the LED module can be set to any one of eight levels without adjusting the
current value, simply by dividing by PWMCLK.
For large-scale brightness adjustment, division by PWMCLK is recommended.
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2005-04-20
TB62718AFG
Logic Input and Output Timing Waveforms
1. PI CLK (SI CLK) vs. PI DATA [7:0] (SI DATA)
PI CLK (SI CLK) vs. PO DATA [7:0] (SO DATA)
twH
PI CLK
(SI CLK)
PI DATA [7:0]
(SI DATA)
50%
twL
50%
50%
50%
50%
thold
tsetup
PO DATA [7:0]
(SO DATA)
50%
50%
tpd
tpd
2. PI SEL (SI SEL) vs. PI CLK (SI CLK)
twH
PI CLK
(SI CLK)
twL
50%
50%
50%
PI DATA [7:0]
(SI DATA)
PI SEL
(SI SEL)
50%
tsetup
50%
thold
tsetup
27
50%
thold
2005-04-20
TB62718AFG
3. PI LATCH (SI LATCH) vs. PI CLK (SI CLK)
twH
PI CLK
(SI CLK)
twL
50%
50%
50%
PI DATA [7:0]
(SI DATA)
(Internal flip-flop data)
tsetup
PI LATCH
(SI LATCH)
thold
50%
50%
twltH
50%
twltL
4. PI SEL (SI SEL) vs. PO DATA 00~PO DATA 07 (SO DATA)
PI SEL
(SI SEL)
50%
50%
PO DATA [7:0]
(SO DATA)
50%
50%
tpd
tpd
5. DOE vs. PO DATA 00~PO DATA 07
DOE
50%
50%
PO DATA [7:0]
tpzH/zL
28
tpzH/zL
2005-04-20
TB62718AFG
Logic Input and Constant-current Output Timing Waveforms
1. BLANK vs. OUT 00~OUT 15 with PWMCLK
twblkL
BLANK
50%
twblkH
50%
50%
50%
PWMCLK
Maximum delay time is 1 PWMCLK cycle.
OUT 00~OUT 15
(current waveform)
Maximum delay time is 1 PMCLK cycle.
50%
50%
tpLH
tpHL
2. RESET vs. OUT 00~OUT 15
BLANK
twrstL
RESET
50%
50%
OUT [15:0]
(current waveform)
50%
tpHL
3. LED TEST vs. OUT 00~OUT 15
twledH
LED TEST
50%
50%
tpLH
OUT 00~OUT 15
(current waveform)
50%
50%
tpHL
29
2005-04-20
TB62718AFG
Package Dimensions
Weight: 0.26 g (typ.)
30
2005-04-20
TB62718AFG
About solderability, following conditions were confirmed
• Solderability
Use of Sn-63Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
RESTRICTIONS ON PRODUCT USE
000707EBA
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
• The information contained herein is subject to change without notice.
31
2005-04-20