NEC UPC1676B

UPC1676B
UPC1676G
UPC1676P
1.2 GHz BANDWIDTH LOW
NOISE SILICON MMIC AMPLIFIER
FEATURES
UPC1676G
NOISE FIGURE AND GAIN
vs. FREQUENCY AND VOLTAGE
• WIDE BANDWIDTH:
1200 MHz at 3 dB Point for UPC1676G
1300 MHz at 3 dB Point for UPC1676B, UPC1676P
30
5.0 V
• HIGH ISOLATION
4.5 V
Gain, GS (dB)
• HIGH POWER GAIN: 22 dB TYP AT f = 500 MHz
• SINGLE POWER SUPPLY: VCC = 5 V
• INPUT/OUTPUT MATCHED TO 50 Ω
• AVAILABLE IN TAPE AND REEL (UPC1676G)
GP
20
10
VCC = 5.5 V
10
5
NF
5.0 V
Noise Figure, NF (dB)
VCC = 5.5 V
4.5 V
0
2000
0
60
100
500
200
DESCRIPTION
1000
Frequency, f (MHz)
The UPC1676 is a silicon monolithic integrated circuit designed for wide-band amplifiers covering the VHF to UHF
bands. The series is available in two package styles: a surface
mount package (UPC1676G), and an 8 lead ceramic flat
package (UPC1676B). Also available in chip form (UPC1676P).
NEC's stringent quality assurance and test procedures ensure the highest reliability and performance.
ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 5 V, f = 500 MHz)
UPC1676B1
B08
PART NUMBER
PACKAGE OUTLINE
SYMBOLS
PARAMETERS AND CONDITIONS
UNITS
MIN
UPC1676G
39
TYP MAX
MIN
UPC1676P
CHIP
TYP MAX
MIN
TYP MAX
ICC
Supply Current
mA
14
19
24
14
19
24
14
19
24
GS
Small Signal Gain
dB
18
20
22
19
22
24
19
22
24
3.5
5.5
3
5
3
5
PSAT
Saturated Output Power
dBm
BW
Bandwidth 3 dB down from gain at 100 MHz
MHz
NF
Noise Figure
dB
Input Return Loss
dB
18
21
9
12
21
RLOUT
Output Return Loss
dB
10
13
6
9
13
ISOL
Isolation
dB
24
28
24
28
RLIN
RTH(J-C)
Thermal Resistance (Junction to Case)
1000 1300
4.5
°C/W
1000 1200
6
4.5
1000 1300
6
4.5
24
6
28
50
Note:
1. Case must be connected to GND for stable RF operation and optimum thermal dissipation.
California Eastern Laboratories
UPC1676B, UPC1676G, UPC1676P
ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C)
SYMBOLS
PARAMETERS
VCC
UNITS
RATINGS
V
6
Total Power Dissipation
UPC1676B/P
UPC1676G
W
mW
1.5 (TC = +125°C)
200 (TA = +85°C)
Operating Temperature
UPC1676B/P
UPC1676G
°C
°C
-55 to +125
-40 to +85
Storage Temperature
UPC1676B/P
UPC1676G
°C
°C
-65 to +200
-55 to +150
Power Supply Voltage
PT
TOP
TSTG
EQUIVALENT CIRCUIT
VCC
OUT
IN
Note:
1. Operation in excess of any one of these parameters may result in
permanent damage.
GND
TYPICAL PERFORMANCE CURVES (TA = 25°C)
UPC1676G
CIRCUIT CURRENT
vs. OPERATING TEMPERATURE
CIRCUIT CURRENT vs. VOLTAGE
30
Circuit Current, ICC (mA)
Circuit Current, ICC (mA)
25
20
15
10
20
10
5
0
0
0
1
2
3
4
5
6
0
-50
Supply Voltage, VCC (V)
Operating Temperature, TOP (°C)
UPC1676B/P
ISOLATION vs. FREQUENCY
UPC1676B/P
INPUT POWER vs. OUTPUT POWER
15
0
VCC = 5 V
f = 500 MHz
Output Power, POUT (dBm)
VCC = 5 V
Isolation, (dB)
100
50
-10
-20
10
5
0
-5
-10
-30
-15
10
20
50
100
200
500
Frequency, f (MHz)
1000
2000
-35
-30
-25
-20
-15
Input Power, PIN (dBm)
-10
-5
UPC1676B, UPC1676G, UPC1676P
TYPICAL PERFORMANCE CURVES (TA = 25°C)
UPC1676B/P
NOISE FIGURE AND
GAIN vs. FREQUENCY
|S21| 2
8
NF
4
10
2
5
0
Input Return Loss, (dB)
Output Return Loss, (dB)
6
15
0
Noise Figure, NF (dB)
20
Gain, GS (dB)
UPC1676B/P
INPUT AND OUTPUT
RETURN LOSS vs. FREQUENCY
100
200
500
1000
-20
Input
-30
-40
0
50
Output
-10
2000
50
100
Frequency, f (MHz)
200
500
1000
UPC1676G
INPUT AND OUTPUT
RETURN LOSS vs. FREQUENCY
UPC1676G
INSERTION POWER GAIN
vs. FREQUENCY AND TEMPERATURE
30
VCC = 5 V
0
TA = -40˚C
Input Return Loss, (dB)
Output Return Loss, (dB)
Insertion Power Gain, GP (dB)
VCC = 5 V
20
+25˚C
+85˚C
10
-10
RL OUT
-20
RLIN
-30
0
60
100
200
1000
500
60
2000
100
200
500
1000
2000
Frequency, f (MHz)
UPC1676G
OUTPUT POWER vs. INPUT POWER
UPC1676G
THIRD ORDER INTERMODULATION DISTORTION
vs. OUTPUT POWER AND VOLTAGE
SSB 3rd Order Intermodulation Distortion
Power Out (dBm)
Frequency, f (MHz)
VCC = 5 V
f = 500 MHz
Output Power, POUT (dBm)
2000
Frequency, f (MHz)
10
0
-10
-20
-30
-20
-10
Input Power, PIN (dBm)
0
-10
f1 = 500 MHz
f2 = 504 MHz
-20
-30
VCC = 4.5
VCC = 5.0
-40
VCC = 5.5
-50
-20
-10
SSB Output Power of Signal (dBm)
0
UPC1676B, UPC1676G, UPC1676P
TYPICAL SCATTERING PARAMETERS (TA = 25°C)
UPC1676B
VCC = 5 V, ICC = 19 mA
FREQUENCY
MHz
50
100
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
S11
MAG
S21
ANG
0.064
0.064
0.074
0.095
0.100
0.105
0.069
0.030
0.017
0.045
0.072
0.081
0.087
0.083
-11
-18
-40
-86
-130
-174
148
98
-80
-121
-153
-175
158
129
MAG
10.153
10.131
10.209
10.646
11.076
11.035
10.053
8.525
6.795
5.407
4.372
3.566
2.984
2.537
S12
ANG
-4
-10
-23
-49
-78
-110
-145
-176
157
134
113
94
77
60
S22
MAG
ANG
MAG
ANG
0.040
0.039
0.038
0.037
0.036
0.035
0.031
0.027
0.030
0.032
0.035
0.041
0.047
0.051
0
-3
-3
-7
-11
-13
-16
-12
-6
2
2
1
-1
-4
0.216
0.219
0.213
0.211
0.210
0.209
0.209
0.198
0.169
0.135
0.107
0.088
0.096
0.111
175
165
147
107
60
9
-46
-95
-137
-176
143
98
52
16
ANG
MAG
K
S21
1.39
1.41
1.43
1.39
1.37
1.40
1.69
2.21
2.48
2.91
3.29
3.45
3.58
3.86
20.1
20.1
20.2
20.5
20.9
20.9
20.0
18.6
16.6
14.7
12.8
11.0
9.5
8.1
K
S21
1.43
1.35
1.03
0.62
0.51
0.85
1.68
2.42
2.92
3.28
3.65
3.79
3.89
19.9
20.2
21.3
23.4
25.0
21.7
17.3
13.8
11.1
8.9
7.2
5.8
4.6
K
S21
dB
UPC1676G
VCC = 5 V, ICC = 19 mA
FREQUENCY
S11
MHz
MAG
100
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
0.110
0.128
0.250
0.484
0.813
0.728
0.530
0.400
0.319
0.254
0.200
0.156
0.112
S21
ANG
-52.7
-82.7
-141.3
160.9
87.1
15.2
-32.1
-66.8
-94.6
-124.5
-150.3
-174.9
164.1
MAG
9.91
10.22
11.61
14.84
17.69
12.19
7.34
4.91
3.59
2.79
2.28
1.95
1.70
S12
ANG
-12.0
-28.0
-60.7
-101.1
-162.9
134.2
93.6
64.2
38.8
15.1
-8.2
-30.5
-52.6
MAG
0.039
0.040
0.045
0.057
0.061
0.039
0.032
0.036
0.043
0.051
0.057
0.065
0.073
S22
0.3
-2.7
-7.7
-20.7
-50.3
-69.4
-58.0
-54.3
-57.6
-67.0
-77.7
-87.3
-98.7
ANG
0.218
0.226
0.286
0.392
0.483
0.299
0.151
0.101
0.110
0.132
0.157
0.178
0.199
172.0
154.1
111.3
63.6
-8.0
-86.6
-152.2
133.5
69.4
25.0
-9.5
-40.7
-69.1
dB
UPC1676P
VCC = 5 V, ICC = 19 mA
FREQUENCY
MHz
50
100
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
S11
MAG
0.116
0.105
0.122
0.131
0.146
0.152
0.167
0.140
0.136
0.149
0.166
0.161
0.182
0.196
S21
ANG
-11.5
-19.5
-23.0
-48.5
-74.0
-97.8
-120.4
-134.8
-141.6
-139.8
-149.8
-156.3
-158.4
-165.4
S12
MAG
ANG
9.90
9.77
10.00
10.27
10.44
10.35
9.82
8.65
7.33
6.12
5.20
4.29
3.66
3.10
-4.0
-9.0
-19.0
-39.5
-61.5
-85.5
-111.5
-136.0
-158.0
-176.0
167.5
151.0
137.5
124.5
S22
MAG
ANG
MAG
ANG
0.046
0.045
0.046
0.046
0.046
0.049
0.051
0.049
0.052
0.060
0.068
0.069
0.075
0.080
-1.0
-2.0
4.5
9.5
13.5
16.5
13.0
19.5
23.5
31.6
29.5
25.0
27.5
25.0
0.240
0.229
0.242
0.246
0.244
0.233
0.231
0.182
0.152
0.092
0.097
0.127
0.101
0.111
174.0
168.0
154.5
128.0
98.5
65.9
27.4
-10.5
-44.5
-64.8
-62.7
-93.2
-104.5
-110.4
dB
1.28
1.31
1.26
1.22
1.19
1.14
1.13
1.31
1.44
1.50
1.53
1.76
1.87
2.03
19.9
19.8
20.0
20.2
20.4
20.3
19.8
18.7
17.3
15.7
14.3
12.6
11.3
9.8
UPC1676B, UPC1676G, UPC1676P
OUTLINE DIMENSIONS
UPC1676B
PACKAGE OUTLINE B08
(Units in mm)
UPC1676P (CHIP)
(Units in µm)
4
1.27±0.1 1.27±0.1
(LEADS 2, 4, 6, 8) 0.6
0.4 (LEADS 1, 3, 5, 7)
4
5
3
2
10.6 MAX
5
1
3.8±0.2
6
7
8
3.8±0.2
10.6 MAX
2
1
LEAD
CONNECTIONS
1. Input 5. Output
2. GND 6. GND
3. GND 7. VCC
4. GND 8. GND
3
CHIP FEATURES
•
•
•
•
1.7 MAX
0.2
Die Size: 0.60 mm x 0.65 mm
Thickness: 170 ± 30 µm
Pad Size: 100 µm x 100 µm
Ti/Pt/Au Metallization
UPC1676G
PACKAGE OUTLINE 39
(Units in mm)
+0.2
2.8 -0.3
+0.2
1.5 -0.1
BONDING PAD (mm)
BONDING
PAD NO.
X AXIS
Y AXIS
PAD
CONNECTION
1
-185
210
INPUT
2
-5
-210
GND
3
+185
-210
GND
4
+185
-210
OUTPUT
5
-175
+210
VCC
Note:
All dimensions are typical unless otherwise specified.
ORDERING INFORMATION
UPC1676G-T1
2
2.9 ± 0.2 0.95
0.85
C1B
BONDING INFORMATION
PART NUMBER
+0.05
-0.02
+0.10
0.4 -0.05
(LEADS 2, 3, 4)
3
1.9
4
1
+0.10
0.6 -0.05
+0.2
1.1 -0.1
PIN
CONNECTIONS
1. GND
2. Output
3. VCC
4. Input
0.8
0.16 +0.10
-0.06
5˚
5˚
0 to 0.1
QTY
3000 / Reel
EXCLUSIVE NORTH AMERICAN AGENT FOR
RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
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PRINTED IN USA ON RECYCLED PAPER -3/97
DATA SUBJECT TO CHANGE WITHOUT NOTICE