No. STSE-CB7115A <Cat.No.070626> SPECIFICATIONS FOR NICHIA BLUE LED MODEL : NGPBR70ASS NICHIA CORPORATION -0- Nichia STSE-CB7115A <Cat.No.070626> 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Dice Temperature Soldering Temperature Symbol IF IFP IR PD Topr Tstg Tj Tsld Absolute Maximum Rating 120 250 85 432 -30 ~ + 85 -40 ~ +100 110 265°C for 5sec. (Ta=25°C) Unit mA mA mA mW °C °C °C IFP Conditions : Pulse Width < = 10msec. and Duty < = 1/10 (2) Initial Electrical/Optical Characteristics Item Symbol Condition Forward Voltage VF IF=100[mA] IF=100[mA] Luminous Flux φV ½ x IF=100mA] Chromaticity Coordinate y IF=100[mA] Typ. (3.3) (5) 0.133 0.075 (Ta=25°C) Max. Unit 3.6 V lm - Min. 5.4 4.5 3.8 3.2 (Ta=25°C) Max. Unit 6.4 5.4 lm 4.5 3.8 ½ Please refer to CIE 1931 chromaticity diagram. (3) Ranking Item Luminous Flux Rank P1 Rank P0 Rank Pz Rank Py Symbol Condition φV IF=100[mA] ½ Luminous Flux Measurement allowance is ± 10%. Color Rank x y 0.11 0.04 (IF=100mA,Ta=25°C) Rank W 0.11 0.15 0.15 0.10 0.10 0.04 ½ Color Coordinates Measurement allowance is ± 0.01. 2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to figure’s page. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to figure’s page. Material as follows ; Resin(Mold) : Leadframe : Epoxy Resin (over Diffused) Ag plating Copper Alloy -1- Nichia STSE-CB7115A <Cat.No.070626> 4.PACKAGING · The LEDs are packed in cardboard boxes after packaging in stick. Please refer to figure’s page. The label on the packing unit shows ; Part Number, Lot Number, Ranking, Quantity · In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. · The boxes are not water resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; -U - Year ( 6 for 2006, 7 for 2007 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number U - Ranking by Color Coordinates - Ranking by Luminous Flux -2- B for Nov. ) Nichia STSE-CB7115A <Cat.No.070626> 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Standard Test Method Test Conditions Note Number of Damaged 1 time 0/22 1 time over 95% 0/22 Resistance to Soldering Heat JEITA ED-4701 300 302 Tsld=260 ± 5°C, 5sec. 1.6mm from the base of the stopper (Pre treatment 30°C,70%,168hrs.) Solderability JEITA ED-4701 300 303 Tsld=235 ± 5°C, (using flux) Temperature Cycle JEITA ED-4701 100 105 -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min. 100 cycles 0/50 Moisture Resistance Cyclic JEITA ED-4701 200 203 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle 10 cycles 0/50 Terminal Strength (bending test) JEITA ED-4701 400 401 Load 5N (0.5kgf) 0° ~ 90° ~ 0° bend 2 times No noticeable damage 0/50 Terminal Strength (pull test) JEITA ED-4701 400 401 Load 10N (1kgf) 10 ± 1 sec. No noticeable damage 0/50 High Temperature Storage JEITA ED-4701 200 201 Ta=100°C 1000hrs. 0/50 Temperature Humidity Storage JEITA ED-4701 100 103 Ta=60°C, RH=90% 1000hrs. 0/50 Low Temperature Storage JEITA ED-4701 200 202 Ta=-40°C 1000hrs. 0/50 1000 hrs. 0/50 500 hrs. 0/50 1000 hrs. 0/50 3 times 0/22 Steady State Operating Life 5sec. Ta=25°C, IF=120mA ½ Tested with Nichia standard circuit board. Steady State Operating Life of High Humidity Heat 60°C, RH=90%, IF=100mA ½ Tested with Nichia standard circuit board. Steady State Operating Life of Low Temperature Electrostatic Discharges Ta=-30°C, IF=100mA ½ Tested with Nichia standard circuit board. JEITA ED-4701 300 304 R=1.5kΩ, C=100pF Test Voltage=2kV Negative/Positive ½ Thermal resistance of LED with Nichia standard circuit board : Rja ≒ 125°C/W Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm (2) CRITERIA FOR JUDGING DAMAGE Criteria for Judgement Min. Max. Item Symbol Test Conditions Forward Voltage VF IF=100mA Initial Level ¯ 1.1 Luminous Flux φv IF=100mA Initial Level ¯ 0.7 ½ The test is performed after the board is cooled down to the room temperature. -3- Nichia STSE-CB7115A <Cat.No.070626> 7.CAUTIONS (1) Storage · Storage Conditions Before opening the package : The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. · If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 85°C · Nichia LED leadframes are silver plated copper alloy. The silver surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the LEDs be used as soon as possible. · Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. (2) Static Electricity · Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. · When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). · Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) -4- Nichia STSE-CB7115A <Cat.No.070626> (3) Soldering Conditions · Nichia LEDs uses a copper alloy lead frame which provides a high thermal conductivity. Thermal stress such as soldering heat may reduce the reliability of the product; particular caution should be used to avoid damage prior to and during soldering. The recommended soldering conditions are listed in the following table. · Solder the LED no closer than 1.6mm from the base of the stopper. · The mechanical stress by clinching will cause degradation of the reliability on the LEDs. It is important to minimize the mechanical stress on the LEDs. It should be confirmed beforehand that it will not cause any problem when using it. · Recommended soldering conditions Pre-Heat Pre-Heat Time Solder Bath Temperature Dipping Time Dipping Position Dip Soldering 120°C Max. 60 seconds Max. 260°C Max. Hand Soldering 350°C Max. Temperature 3 seconds Max. Soldering Time No closer than 1.6 mm from the Position base of the stopper. 5 seconds Max. No lower than 1.6 mm from the base of the stopper. · Although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest possible temperature is desirable for the LEDs. · A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. · Dip soldering should not be done more than one time. · Hand soldering should not be done more than one time. · Do not apply any stress to the lead particularly when heated. · The LEDs must not be repositioned after soldering. · After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. · Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be caused from warping of the PC board or from the clinching and cutting of the leadframes. When it is absolutely necessary, the LEDs may be mounted in this fashion but the User will assume responsibility for any problems. Direct soldering should only be done after testing has confirmed that no damage, such as wire bond failure or resin deterioration, will occur. Nichia’s LEDs should not be soldered directly to double sided PC boards because the heat will deteriorate the epoxy resin. · When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. · Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs. (4) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. -5- Nichia STSE-CB7115A <Cat.No.070626> (5) Heat Generation · Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. · Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS in this specifications. Please also take measures to remove heat from the area near the LED to improve the operational characteristics of the LED. · The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation between Tj and Ts. Tj=Ta + Rja W 1 Tj=Ts + Rjs W 2 Tj = Dice Temperature : °C, Ta = Ambient Temperature : °C, Ts = Solder Temperature (Cathode Side) : °C, Rja = Heat resistance from Dice to Ambient temperature : °C /W, Rjs = Heat resistance from Dice to Ts measuring point ≒ 60°C /W, W = Inputting Power (IF VF) : W (6) Safety Guideline for Human Eyes · In 1993, the International Electric Committee (IEC) issued a standard concerning laser product safety (IEC 825-1). Since then, this standard has been applied for diffused light sources (LEDs) as well as lasers. In 1998 IEC 60825-1 Edition 1.1 evaluated the magnitude of the light source. In 2001 IEC 60825-1 Amendment 2 converted the laser class into 7 classes for end products. Components are excluded from this system. Products which contain visible LEDs are now classified as class 1. Products containing UV LEDs are class 1M. Products containing LEDs can be classified as class 2 in cases where viewing angles are narrow, optical manipulation intensifies the light, and/or the energy emitted is high. For these systems it is recommended to avoid long term exposure. It is also recommended to follow the IEC regulations regarding safety and labeling of products. (7) Others · NGPBR70AS complies with RoHS Directive. · Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. · The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). · User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. · The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice. -6- Nichia STSE-CB7115A <Cat.No.070626> ICI Chromaticity Diagram 0.9 520 530 0.8 540 510 550 0.7 560 0.6 570 500 580 y 0.5 590 0.4 600 610 0.3 620 630 490 0.2 480 0.1 W 470 460 0 0 0.1 0.2 0.3 0.4 x ½ Color Coordinates Measurement allowance is ± 0.01. -7- 0.5 0.6 0.7 0.8 Ta=25°C 2.0 1.5 1.0 0.5 0 2.5 3.0 3.5 4.0 4.5 Forward Voltage VF (V) 0 50 100 150 200 250 300 Forward Current IFP (mA) -8- Ambient Temperature vs. Forward Voltage Ambient Temperature vs. Relative Luminous Flux 4.6 2.0 4.2 IFP=100mA 3.8 3.4 3.0 2.6 2.2 1.8 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) IFP=100mA 1.0 0.5 0.2 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Allowable Forward Current IFP (mA) 10 2.5 500 Ta=25°C 400 250 200 120 100 1 5 10 20 50 100 Duty Ratio (%) Ambient Temperature vs. Allowable Forward Current Allowable Forward Current IF (mA) 100 1 2.0 Forward Voltage VF (V) Relative Luminous Flux (a.u.) Ta=25°C 250 Relative Luminous Flux (a.u.) Forward Current IFP (mA) 1000 Duty Ratio vs. Allowable Forward Current Forward Current vs. Relative Luminous Flux Forward Voltage vs. Forward Current 200 Thermal resistance Rja=125°C/W 150 120 100 55 0 0 20 40 60 80 100 Ambient Temperature Ta (°C) NICHIA CORPORATION NGPBR70AS Title CHARACTERISTICS No. 070614766911 Nichia STSE-CB7115A <Cat.No.070626> Model Forward Current vs. Chromaticity Coordinate (λD) y 0.09 0.08 50mA(471.5nm) 100mA(470.7nm) 120mA(470.5nm) 250mA(469.7nm) 0.07 0.06 0.10 0.11 0.12 0.13 0.14 0.15 478 Ta=25°C 476 474 472 470 468 466 1 5 10 20 50 100 300 Forward Current IFP (mA) Ta=25°C IFP=100mA 1.0 0.8 0.6 0.4 0.2 0 350 400 450 500 550 600 650 Wavelength λ (nm) Ambient Temperature vs. Dominant Wavelength Dominant Wavelength λ D (nm) -9- Dominant Wavelength λ D (nm) x Forward Current vs. Dominant Wavelength 1.2 Directivity 476 0° 1.0 478 Relative Illuminance (a.u.) Ta=25°C 0.10 1mA(474.8nm) Relative Emission Intensity (a.u.) 0.11 Spectrum IFP=100mA 474 472 470 468 466 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) 10° 20° 30° Ta=25°C IFP=100mA 40° 50° 60° 0.5 70° 80° 0 90° 60° 30° Radiation Angle NICHIA CORPORATION 0.5 90° 1.0 NGPBR70AS Title CHARACTERISTICS No. 070614766921 Nichia STSE-CB7115A <Cat.No.070626> Model 0° Internal Circuit 3 A 2 3 A 7.62 ± 0.5 φ3 7.5 ± 0.5 4.4 2 0.5 4 K 1 (C 1.25) 1 Pin Mark R 0.69 0.76 ± 0.1 1 1.55 K 4 5.08 7.62 ± 0.5 Protection device (5°) 1.4MAX. 0.4 ± 0.1 0.4 2.5 ± 0.5 -10- 0.4 1.1 Stopper 0.5 5.08 ± 0.3 MATERIALS Epoxy Resin (over Diffused) Ag Plating Copper Alloy Please note that the bare copper alloy showing at the cut end of the lead frame may be corroded under certain conditions. LEDs have some sharp edges and points, particularly lead frames. Please handle with care so as to avoid injuries. NGPBR70AS has a protection device built in as a protection circuit against static electricity. Model NICHIA CORPORATION Title No. NGPBR70AS OUTLINE DIMENSIONS 070618767051 Unit mm 5/1 Scale Allow ±0.2 Nichia STSE-CB7115A <Cat.No.070626> ITEM RESIN LEAD FRAME Cross Sectional image of stick 5.85 9 11.8 5.4 ½1 t = 0.6 ± 0.1mm ½2 Warp : 1mm Max. 3 9.6 -11- Whole image of stick 485 ± 1 Cap NICHIA >PC< CAUTION TO ELECTROSTATIC DAMAGE 静電気に注意 A 60pcs / stick K NICHIA CORPORATION Title No. NxPxR70xSS STICK DIMENSIONS 061117436073 Unit mm Scale Allow ±0.2 Nichia STSE-CB7115A <Cat.No.070626> Model Nichia STSE-CB7115A <Cat.No.070626> The stick and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Moisture absorbent material Moisture proof foil bag Stick Label NICHIA XXXX LED TYPE LOT QTY Seal NxPxR70xSS xxxxxx-U PCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Label NICHIA XXXX LED TYPE RANK QTY NxPxR70xSS U RoHS PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Empty space in the box is filled with cushion material. Packing unit Moisture proof foil bag Cardboard box Cardboard box M Cardboard box 1/2L Cardboard box L Stick/bag 10 stick Max. Quantity/bag (pcs) 600 MAX. Dimensions (mm) 590¯277¯120¯4t 613¯298¯268¯7t 613¯298¯518¯7t Stick/box 100 stick MAX. 200 stick MAX. 400 stick MAX. Model NICHIA CORPORATION -12- Quantity/box (pcs) 6,000 MAX. 12,000 MAX. 24,000 MAX. NxPxR70xSS Title PACKING No. 070601436085