TI SN54LVTZ240

SCBS301B − SEPTEMBER 1993 − REVISED JULY 1995
D State-of-the-Art Advanced BiCMOS
D
D
D
D
D
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
SN54LVTZ240 . . . FK PACKAGE
(TOP VIEW)
1A2
2Y3
1A3
2Y2
1A4
description
4
3 2 1 20 19
18
5
17
6
16
7
15
8
9 10 11 12 13
14
1Y1
2A4
1Y2
2A3
1Y3
2Y1
GND
2A1
1Y4
2A2
These octal buffers and line drivers are designed
specifically for low-voltage (3.3-V) VCC operation,
but with the capability to provide a TTL interface
to a 5-V system environment.
2OE
D
Technology (ABT) Design for 3.3-V
Operation and Low-Static Power
Dissipation
High-Impedance State During Power Up
and Power Down
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V VCC)
Support Unregulated Battery Operation
Down to 2.7 V
Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
Latch-Up Performance Exceeds 500 mA
Per JEDEC Standard JESD-17
Bus-Hold Data Inputs Eliminate the Need
for External Pullup Resistors
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK), and
Ceramic (J) DIPs
2Y4
1A1
1OE
VCC
D
SN54LVTZ240 . . . J PACKAGE
SN74LVTZ240 . . . DB, DW, OR PW PACKAGE
(TOP VIEW)
These devices are organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is low,
the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN74LVTZ240 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count
and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54LVTZ240 is characterized for operation over the full military temperature range of − 55°C to 125°C.
The SN74LVTZ240 is characterized for operation from − 40°C to 85°C.
FUNCTION TABLE
(each buffer)
INPUTS
OUTPUT
Y
OE
A
L
H
L
L
L
H
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1995, Texas Instruments Incorporated
!" #$%&'() %$)*!)" !)+$,'*!$) %&,,() *" $+ -&./!%*!$) #*( ,$#&%" %$)+$,' $
"-(%!+!%*!$)" -(, ( (,'" $+ (0*" )",&'()" "*)#*,# 1*,,*)2
,$#&%!$) -,$%(""!)3 #$(" )$ )(%(""*,!/2 !)%/&#( ("!)3 $+ *//
-*,*'((,"
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
1
SCBS301B − SEPTEMBER 1993 − REVISED JULY 1995
logic symbol†
1OE
1A1
1A2
1A3
1A4
1
logic diagram (positive logic)
1OE
EN
2
18
4
16
6
14
8
12
1A1
1Y1
2OE
2A1
2A2
2A3
2A4
1Y3
1A2
18
4
16
6
14
8
12
1Y1
1Y2
1Y4
1Y3
EN
11
9
13
7
15
5
17
3
1A4
1Y4
2Y1
2Y2
2OE
2Y3
19
2Y4
2A1
† This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
2A2
2A3
2A4
2
2
1Y2
1A3
19
1
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
SCBS301B − SEPTEMBER 1993 − REVISED JULY 1995
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high state or power-off state, VO (see Note 1) . . . . −0.5 V to 7 V
Current into any output in the low state, IO: SN54LVTZ240 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74LVTZ240 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Current into any output in the high state, IO (see Note 2): SN54LVTZ240 . . . . . . . . . . . . . . . . . . . . . . . . 48 mA
SN74LVTZ240 . . . . . . . . . . . . . . . . . . . . . . . . 64 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . 0.6 W
DW package . . . . . . . . . . . . . . . . . . . 1.6 W
PW package . . . . . . . . . . . . . . . . . . . 0.7 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
For more information, refer to the Package Thermal Considerations application note in the 1994 ABT Advanced BiCMOS Technology
Data Book, literature number SCBD002B.
recommended operating conditions (see Note 4)
SN54LVTZ240
SN74LVTZ240
MIN
MAX
MIN
MAX
2.7
3.6
2.7
3.6
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
5.5
5.5
V
IOH
IOL
High-level output current
−24
−32
mA
Low-level output current
48
64
mA
∆t /∆v
Input transition rise or fall rate
∆t /∆VCC
Power-up ramp rate
High-level input voltage
2
2
0.8
Outputs enabled
TA
Operating free-air temperature
NOTE 4: Unused control inputs must be held high or low to prevent them from floating.
−55
V
0.8
10
200
10
−40
V
ns / V
µs / V
200
125
V
85
°C
!)+$,'*!$) %$)%(,)" -,$#&%" !) ( +$,'*!4( $,
#("!3) -*"( $+ #(4(/$-'() *,*%(,!"!% #** *)# $(,
"-(%!+!%*!$)" *,( #("!3) 3$*/" (0*" )",&'()" ,("(,4(" ( ,!3 $
%*)3( $, #!"%$)!)&( ("( -,$#&%" 1!$& )$!%(
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
3
SCBS301B − SEPTEMBER 1993 − REVISED JULY 1995
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
VCC = 2.7 V,
VCC = MIN to MAX‡,
II = −18 mA
IOH = −100 µA
VCC = 2.7 V,
IOH = − 8 mA
IOH = − 24 mA
VCC = 3 V
VCC = 2.7 V
VOL
VCC = 3 V
II
Ioff
IOZPU§
IOZPD§
SN54LVTZ240
TYP†
MAX
TEST CONDITIONS
2
IOL = 24 mA
IOL = 16 mA
0.5
0.5
0.4
0.4
IOL = 32 mA
IOL = 48 mA
0.5
0.5
VCC = 0 to 3.6 V
VI = VCC or GND
VI = VCC
VI = 0
VI or VO = 0 to 4.5 V
VO = 0.5 V to 3 V,
VO = 0.5 V to 3 V,
II(hold)
VCC = 3 V
IOZH
IOZL
VCC = 3.6 V,
VCC = 3.6 V,
VO = 3 V
VO = 0.5 V
ICC
VCC = 3.6 V,
VI = VCC or GND
IO = 0,
V
0.55
0.55
Control inputs
Data inputs
10
10
±1
±1
1
1
−5
A
µA
−5
± 100
µA
OE = X
± 50
µA
OE = X
± 50
µA
A inputs
75
75
−75
−75
A
µA
5
5
µA
−5
−5
µA
Outputs high
0.12
0.5
0.12
0.225
Outputs low
8.6
14
8.6
12
0.12
0.5
0.12
0.225
Outputs
disabled
∆ICC¶
VCC = 3 V to 3.6 V,
One input at VCC − 0.6 V,
Other inputs at VCC or GND
Ci
VI = 3 V or 0
VO = 3 V or 0
0.3
!)+$,'*!$) %$)%(,)" -,$#&%" !) ( +$,'*!4( $,
#("!3) -*"( $+ #(4(/$-'() *,*%(,!"!% #** *)# $(,
"-(%!+!%*!$)" *,( #("!3) 3$*/" (0*" )",&'()" ,("(,4(" ( ,!3 $
%*)3( $, #!"%$)!)&( ("( -,$#&%" 1!$& )$!%(
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
0.2
mA
mA
4
4
pF
8
8
pF
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
§ This parameter is specified by characterization.
¶ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
4
V
V
2
0.2
VI = 0.8 V
VI = 2 V
Co
−1.2
UNIT
VCC −0.2
2.4
0.2
VCC = 0 or MAX‡,
VCC = 1.5 V to 0,
SN74LVTZ240
TYP†
MAX
MIN
−1.2
VCC −0.2
2.4
IOH = − 32 mA
IOL = 100 µA
IOL = 64 mA
VI = 5.5 V
VCC = 0 V,
VCC = 0 to 1.5 V,
MIN
SCBS301B − SEPTEMBER 1993 − REVISED JULY 1995
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN54LVTZ240
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
VCC = 3.3 V
± 0.3 V
SN74LVTZ240
VCC = 2.7 V
MIN
MAX
VCC = 3.3 V
± 0.3 V
MIN TYP†
MAX
VCC = 2.7 V
MIN
MAX
MIN
1
4.5
5.4
1
2.5
4.3
5.2
1
4.5
5.2
1
2.5
4.3
5
1
5.4
6.5
1
2.7
5.2
6.3
1
5.4
7.4
1
3.1
5.2
6.7
2
5.8
6.5
2
3.9
5.6
6.3
1.6
5.3
5.8
1.6
3.2
5.1
5.6
UNIT
MAX
ns
ns
ns
† All typical values are at VCC = 3.3 V, TA = 25°C.
!)+$,'*!$) %$)%(,)" -,$#&%" !) ( +$,'*!4( $,
#("!3) -*"( $+ #(4(/$-'() *,*%(,!"!% #** *)# $(,
"-(%!+!%*!$)" *,( #("!3) 3$*/" (0*" )",&'()" ,("(,4(" ( ,!3 $
%*)3( $, #!"%$)!)&( ("( -,$#&%" 1!$& )$!%(
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
5
SCBS301B − SEPTEMBER 1993 − REVISED JULY 1995
PARAMETER MEASUREMENT INFORMATION
6V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
500 Ω
2.7 V
LOAD CIRCUIT FOR OUTPUTS
1.5 V
Timing Input
0V
tw
tsu
2.7 V
Input
1.5 V
th
2.7 V
1.5 V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
Input
1.5 V
0V
1.5 V
1.5 V
VOL
tPLH
tPHL
Output
Waveform 2
S1 at GND
(see Note B)
VOH
Output
1.5 V
1.5 V
0V
tPLZ
Output
Waveform 1
S1 at 6 V
(see Note B)
VOH
Output
1.5 V
tPZL
tPHL
tPLH
2.7 V
Output
Control
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
tPZH
3V
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH − 0.3 V
VOH
[0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated