NSC 74F521MSA

54F/74F521
8-Bit Identity Comparator
General Description
Features
The ’F521 is an expandable 8-bit comparator. It compares
two words of up to eight bits each and provides a LOW
output when the two words match bit for bit. The expansion
input IA e B also serves as an active LOW enable input.
Y
Commercial
Military
74F521PC
54F521DM (Note 2)
Y
Y
Compares two 8-bit words in 6.5 ns typ
Expandable to any word length
20-pin package
Package
Number
Package Description
N20A
20-Lead (0.300× Wide) Molded Dual-In-Line
J20A
20-Lead Ceramic Dual-In-Line
74F521SC (Note 1)
M20B
20-Lead (0.300× Wide) Molded Small Outline, JEDEC
74F521SJ (Note 1)
M20D
20-Lead (0.300× Wide) Molded Small Outline, EIAJ
74F521MSA (Note 1)
MSA20
20-Lead Molded Shrink Small Outline, EIAJ type II
Note 1: Devices also available in 13× reel. Use suffix e SCX, SJX and MSAX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB.
Logic Symbols
IEEE/IEC
TL/F/9545 – 1
TL/F/9545 – 4
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
C1995 National Semiconductor Corporation
TL/F/9545
RRD-B30M75/Printed in U. S. A.
54F/74F521 8-Bit Identity Comparator
May 1995
Unit Loading/Fan Out
54F/74F
Pin Names
A 0 – A7
B 0 – B7
IA e B
OA e B
Description
U.L.
HIGH/LOW
Input IIH/IIL
Output IOH/IOL
Word A Inputs
Word B Inputs
Expansion or Enable Input (Active LOW)
Identity Output (Active LOW)
1.0/1.0
1.0/1.0
1.0/1.0
50/33.3
20 mA/b0.6 mA
20 mA/b0.6 mA
20 mA/b0.6 mA
b 1 mA/20 mA
Truth Table
Inputs
Output
IA e B
A, B
OA e B
L
L
H
H
A e B*
L
H
H
H
AiB
A e B*
AiB
Connection Diagrams
H e HIGH Voltage Level
L e LOW Voltage Level
*A0 e B0, A1 e B1, A2 e B2, etc.
Logic Diagram
Pin Assignment for DIP,
SOIC, SSOP and Flatpak
TL/F/9545–2
Pin Assignment
for LCC
TL/F/9545 – 5
Please note that this diagram is provided only for the understanding of logic operations and should not be
used to estimate propagation delays.
TL/F/9545–3
2
Absolute Maximum Ratings (Note 1)
Recommended Operating
Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Storage Temperature
b 65§ C to a 150§ C
Ambient Temperature under Bias
Junction Temperature under Bias
Plastic
b 55§ C to a 125§ C
Free Air Ambient Temperature
Military
Commercial
b 55§ C to a 125§ C
0§ C to a 70§ C
Supply Voltage
Military
Commercial
b 55§ C to a 175§ C
b 55§ C to a 150§ C
a 4.5V to a 5.5V
a 4.5V to a 5.5V
VCC Pin Potential to
Ground Pin
b 0.5V to a 7.0V
b 0.5V to a 7.0V
Input Voltage (Note 2)
b 30 mA to a 5.0 mA
Input Current (Note 2)
Voltage Applied to Output
in HIGH State (with VCC e 0V)
b 0.5V to VCC
Standard Output
b 0.5V to a 5.5V
TRI-STATEÉ Output
Current Applied to Output
in LOW State (Max)
twice the rated IOL (mA)
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
Symbol
54F/74F
Parameter
Min
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
Typ
Units
VCC
Conditions
Max
2.0
V
Recognized as a HIGH Signal
0.8
V
Recognized as a LOW Signal
b 1.2
V
Min
IIN e b18 mA
V
Min
IOH e b1 mA
IOH e b1 mA
IOH e b1 mA
VCD
Input Clamp Diode Voltage
VOH
Output HIGH
Voltage
54F 10% VCC
74F 10% VCC
74F 5% VCC
VOL
Output LOW
Voltage
54F 10% VCC
74F 10% VCC
0.5
0.5
V
Min
IOL e 20 mA
IOL e 20 mA
IIH
Input HIGH
Current
54F
74F
20.0
5.0
mA
Max
VIN e 2.7V
IBVI
Input HIGH Current
Breakdown Test
54F
74F
100
7.0
mA
Max
VIN e 7.0V
ICEX
Output HIGH
Leakage Current
54F
74F
250
50
mA
Max
VOUT e VCC
VID
Input Leakage
Test
74F
V
0.0
IID e 1.9 mA
All Other Pins Grounded
IOD
Output Leakage
Circuit Current
74F
3.75
mA
0.0
VIOD e 150 mV
All Other Pins Grounded
IIL
Input LOW Current
IOS
Output Short-Circuit Current
ICCH
Power Supply Current
2.5
2.5
2.7
4.75
b 60
21
3
b 0.6
mA
Max
VIN e 0.5V
b 150
mA
Max
VOUT e 0V
32
mA
Max
VO e HIGH
AC Electrical Characteristics
Symbol
Parameter
74F
54F
74F
TA e a 25§ C
VCC e a 5.0V
CL e 50 pF
TA, VCC e Mil
CL e 50 pF
TA, VCC e Com
CL e 50 pF
Units
Min
Typ
Max
Min
Max
Min
Max
tPLH
tPHL
Propagation Delay
An or Bn to OA e B
3.0
4.5
7.0
7.0
10.0
10.0
3.0
4.0
14.0
15.0
3.0
4.0
11.0
11.0
ns
tPLH
tPHL
Propagation Delay
IA e B to OA e B
3.0
3.5
5.0
6.5
6.5
9.0
3.0
3.5
8.5
13.5
3.0
3.5
7.5
10.0
ns
Applications
Ripple Expansion
TL/F/9545 – 6
Parallel Expansion
TL/F/9545 – 7
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F
521
S
Temperature Range Family
74F e Commercial
54F e Military
C
X
Special Variations
QB e Military grade device with
environmental and burn-in
processing
X e Devices shipped in 13× reel
Device Type
Package Code
P e Plastic DIP
D e Ceramic DIP
F e Flatpak
S e Small Outline SOIC JEDEC
SJ e Small Outline SOIC EIAJ
MSA e Shrink Small Outline (EIAJ SSOP)
Temperature Range
C e Commercial (0§ C to a 70§ C)
M e Military (b55§ C to a 125§ C)
NOTE:
Not required for MSA package code
4
Physical Dimensions inches (millimeters)
20-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J20A
20-Lead (0.300× Wide) Molded Small Outline Package, JEDEC (S)
NS Package Number M20B
5
Physical Dimensions inches (millimeters) (Continued)
20-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ)
NS Package Number M20D
20-Lead (0.300× Wide) Molded Dual-In-Line Package (P)
NS Package Number N20A
6
Physical Dimensions inches (millimeters) (Continued)
20-Lead (0.300× Wide) Molded Shrink Outline Package, EIAJ, Type II (MSA)
NS Package Number MSA20
7
54F/74F521 8-Bit Identity Comparator
Physical Dimensions inches (millimeters) (Continued)
20-Lead Ceramic Flatpak (F)
NS Package Number W20A
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