Nichia STS-DA1-1207 <Cat.No.100831> SPECIFICATIONS FOR NICHIA CHIP TYPE UV MODEL : NSSU100DT NICHIA CORPORATION -0- LED Nichia STS-DA1-1207 <Cat.No.100831> 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Dice Temperature Soldering Temperature IFP Conditions : Symbol IF IFP IR PD Topr Tstg Tj Tsld Pulse Width ≤ 10msec. Absolute Maximum Rating 25 80 85 100 -30 ~ + 85 -40 ~ +100 100 Reflow Soldering : 260°C Hand Soldering : 350°C and (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Peak Wavelength Rank Ub λP Spectrum Half Width Uλ (Ta=25°C) Unit mA mA mA mW °C °C °C for 10sec. for 3sec. Duty ≤ 1/10 Condition IF=20[mA] IF=20[mA] IF=20[mA] (Ta=25°C) Max. Unit 4.0 V 380 nm nm Min. 370 - Typ. (3.6) (375) (15) Min. 13.6 9.60 6.80 (Ta=25°C) Max. Unit 19.2 mW 13.6 9.60 Forward Voltage Measurement allowance is ± 0.05V. Peak Wavelength Measurement allowance is ±3nm. (3) Ranking Item Radiant flux Symbol Condition φe IF=20[mA] Rank 10 Rank 9 Rank 8 Radiant flux Values are traceable to the CIE 127:2007-compliant national standards. Radiant flux Measurement allowance is ±10%. Basically, a shipment shall consist of the LEDs of a combination of the above ranks. The percentage of each rank in the shipment shall be determined by Nichia. 2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to “CHARACTERISTICS” on the following pages. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to “OUTLINE DIMENSIONS” on the following page. -1- Nichia STS-DA1-1207 <Cat.No.100831> 4.PACKAGING · The LEDs are packed in cardboard boxes after taping. Please refer to “TAPING DIMENSIONS” and “PACKING ”on the following pages. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity · In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. · The boxes are not water resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 9 for 2009, A for 2010 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., B for Nov. ) - Nichia's Product Number - Ranking by Wavelength, Ranking by Radiant flux -2- Nichia STS-DA1-1207 <Cat.No.100831> 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Standard Test Method Test Conditions Note Number of Damaged Resistance to Soldering Heat (Reflow Soldering) JEITA ED-4701 300 301 Tsld=260°C, 10sec. (Pre treatment 30°C,70%,168hrs.) 2 times 0/50 Solderability (Reflow Soldering) JEITA ED-4701 303 303A Tsld=245 ± 5°C, 5sec. using flux Lead-free Solder (Sn-3.0Ag-0.5Cu) 1 time over 95% 0/50 Temperature Cycle JEITA ED-4701 100 105 -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min. 100 cycles 0/50 Moisture Resistance Cyclic JEITA ED-4701 200 203 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle 10 cycles 0/50 High Temperature Storage JEITA ED-4701 200 201 Ta=100°C 1000 hrs. 0/50 Temperature Humidity Storage JEITA ED-4701 100 103 Ta=60°C, 1000 hrs. 0/50 Low Temperature Storage JEITA ED-4701 200 202 Ta=-40°C 1000 hrs. 0/50 Steady State Operating Life Ta=25°C, IF=25mA 1000 hrs. 0/50 Steady State Operating Life of High Temperature Ta=85°C, IF=7.5mA 1000 hrs. 0/50 Steady State Operating Life of High Humidity Heat 60°C, RH=90%, IF=20mA 500 hrs. 0/50 Steady State Operating Life of Low Temperature Ta=-30°C, IF=20mA 1000 hrs. 0/50 RH=90% Vibration JEITA ED-4701 400 403 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3directions, 4cycles 48min. 0/50 Substrate Bending JEITA ED-4702 3mm, 5 ± 1 sec. 1 time 0/50 Adhesion Strength JEITA ED-4702 5N, 10 ± 1 sec. 1 time 0/50 (2) CRITERIA FOR JUDGING DAMAGE Item Forward Voltage Symbol Test Conditions VF IF=20mA Radiant flux φe *) U.S.L. : Upper Standard Level Criteria for Judgement Min. Max. - IF=20mA L.S.L.**) 0.7 **) L.S.L. : Lower Standard Level -3- U.S.L.*) - 1.1 Nichia STS-DA1-1207 <Cat.No.100831> 7.CAUTIONS (1) Cautions · The devices are UV light LEDs. The LED during operation radiates intense UV light, which precautions must be taken to prevent looking directly at the UV light with unaided eyes. Do not look directly into the UV light or look through the optical system. When there is a possibility to receive the reflection of light, protect by using the UV light protective glasses so that light should not catch one’s eye directly. · The caution label is attached to cardboard box. UV LED LED放射 光学測定装置で 直接観察してはならない クラス1M LED製品 LED RADIATION DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS CLASS 1M LED PRODUCT (2) Moisture Proof Package · When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. · The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to red as it absorbs moisture. (3) Storage · Storage Conditions Before opening the package : The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. · If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 ± 5°C · Nichia LED electrodes are gold plated. The gold surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the customer use the LEDs as soon as possible. · Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. -4- Nichia STS-DA1-1207 <Cat.No.100831> (4) Recommended circuit · In designing a circuit, the current through each LED must not exceed the absolute maximum rating specified for each LED. It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case, some LED may be subjected to stresses in excess of the absolute maximum rating. (B) (A) ... ... · This product should be operated in forward bias. A driving circuit must be designed so that the product is not subjected to either forward or reverse voltage while it is off. In particular, if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. · For stabilizing the LED characteristics, it is recommended to operate at 10% of the rated current or higher. · Nichia makes the utmost efforts to improve the quality and reliability of its semiconductor products, however the failure and malfunction of a certain percentage is unavoidable due to their properties. As a responsibility of the Customer, sufficient measures should be given to ensuring safe design in Customer products, such as redundancy, fire-containment and anti-failure features to prevent accidents resulting in injury or death, fire or other social damage arising from these failure and malfunction. (5) Static Electricity · Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. · When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged The LEDs LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). should be used the light detector etc. when testing the light-on. Do not stare into the LEDs when testing. · Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) -5- Nichia STS-DA1-1207 <Cat.No.100831> (6) LED position and orientation · Warpage of circuit board with soldered LEDs may result in damage or package breakage of the LEDs. Please pay special attention to the orientation of the LEDs as to avoid LED failure caused by bow, twist and warpage of the board. 【Non-preferable】 【Preferable】 Cathode mark Cathode mark When mechanical stress from the board affects the soldered LED, place the LED in the preferable location and orientation as shown above. · Depending on the position and direction of LED, the mechanical stress on the LED package can be changed. Refer to the following figure. Ｅ Ｄ Ｃ Perforated line Ｂ Ａ Slit Stress : A > B = C > D > E · When separating the circuit boards with soldered LEDs, please use appropriate tools and equipment. Hand brake without these tools and equipment may not be used. · The use of aluminum substrate increases stress to solder joints due to thermal expansion of substrate and subsequently may result in solder joint crack. Customers may need to evaluate their specific application to determine any impact due to the use of aluminum substrate. -6- Nichia STS-DA1-1207 <Cat.No.100831> (7) Soldering Conditions · The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. · Recommended soldering conditions Reflow Soldering Hand Soldering Lead Solder Lead-free Solder Pre-heat 120 ~ 150°C 180 ~ 200°C Temperature 350°C Max. Pre-heat time 120 sec. Max. 120 sec. Max. Soldering time 3 sec. Max. Peak 240°C Max. 260°C Max. Soldering time 10 sec. Max. 10 sec. Max. Condition refer to refer to (one time only) temperature Temperature - profile 1. Temperature - profile 2. (N2 reflow is recommended.) Although the recommended soldering conditions are specified in the above table, reflow or hand soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. Use the conditions shown to the under figure. [Temperature-profile (Surface of circuit board)] <2 : Lead-free Solder> <1 : Lead Solder> 2.5 ~ 5°C / sec. 2.5 ~ 5°C / sec. Pre-heating 120 ~ 150°C 60sec.Max. Above 200°C 1 ~ 5°C / sec. 240°C Max. 10sec. Max. 1 ~ 5°C / sec. Pre-heating 180 ~ 200°C 60sec.Max. 260°C Max. 10sec. Max. Above 220°C 120sec.Max. 120sec.Max. [Recommended soldering pad design] Use the following conditions shown in the figure. (Unit : mm) · Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the customer use the nitrogen reflow method. · The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resin should be used. · Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. · Reflow soldering should not be done more than two times. · When soldering, do not put stress on the LEDs during heating. -7- Nichia STS-DA1-1207 <Cat.No.100831> (8) Heat Generation · Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum dice temperature (Tj). · The operating current should be decided after considering the ambient maximum temperature of LEDs. (9) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. (10) Safety Guideline for Human Eyes · The International Electrical Commission (IEC) published in 2006 IEC 62471:2006 Photobiological safety of lamps and lamp systems which includes LEDs within its scope. Meanwhile LEDs were removed from the scope of the IEC 60825-1:2007 laser safety standard, the 2001 edition of which included LED sources within its scope. However, keep in mind that some countries and regions have adopted standards based on the IEC laser safety standard IEC 60825-1:2001 which includes LEDs within its scope. Following IEC 62471:2006, most of Nichia LEDs can be classified as belonging to either Exempt Group or Risk Group 1. Optical characteristics of a LED such as radiant flux, spectrum and light distribution are factors that affect the risk group determination of the LED. Especially a high-power LED, that emits light containing blue wavelengths, may be in Risk Group 2. Great care should be taken when viewing directly the LED driven at high current or the LED with optical instruments, which may greatly increase the hazard to your eyes. (11) Others · NSSU100D complies with RoHS Directive. · This LED also emits visible light. Please take notice of visible light spectrum, in case you use this LED as light source of sensors etc. · The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). · The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis. · The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice. -8- 100 80 5 20 10 1 2.5 4 3 2 1 0 3.0 3.5 4.0 4.5 順電圧 VF (V) Forward Voltage VF (V) ■ 周囲温度-順電圧特性 Ambient Temperature TaVf vs. Forward Voltage 5.0 IFP=60mA IFP=20mA IFP=5mA 0 相対放射束 (a.u.) Relative Radiant Flux (a.u.) 3.5 3.0 2.5 1.2 1.0 0.8 0.6 -60 -30 0 30 60 90 120 周囲温度 Ta (℃) Ambient Temperature Ta (℃) 10 1 1 -60 -30 0 30 60 90 10 デューティー比 (％) Duty Ratio (%) ■ 周囲温度-許容順電流特性 Ambient Temperature vs. Allowable Forward Current 許容順電流 IF (mA) Allowable Forward Current IF (mA) -9- 4.0 25 40 60 80 100 順電流 IFP (mA) Forward Current IFP (mA) 1.4 4.5 100 80 20 ■ 周囲温度-相対放射束特性 TaIv vs. Ambient Temperature IFP= 20mA Relative Radiant Flux 5.0 順電圧 VF (V) Forward Voltage VF (V) Ta=25℃ ■ デューティー比－許容順電流特性 Duty Duty Ratio vs. Ta=25℃ Allowable Forward Current 許容順電流 IFP (mA) Allowable Forward Current IFP (mA) Ta=25℃ ■ 順電流-相対放射束特性 IfIv Forward Current vs. Relative Radiant Flux 相対放射束 (a.u.) Relative Radiant Flux (a.u.) 順電流 IFP (mA) Forward Current IFP (mA) ■ 順電圧－順電流特性 VfIf Forward Voltage vs. Forward Current 周囲温度 Ta (℃) Ambient Temperature Ta (℃) Derating 50 40 30 (50,25.0) 20 10 (85,7.50) 0 0 120 100 30 60 90 120 周囲温度 Ta (℃) Ambient Temperature Ta (℃) NSSU100D 日亜化学工業 (株) NICHIA CORPORATION 名称 Title 初期電気/光学特性 CHARACTERISTICS 管理番号 No. 100820 062501 Nichia STS-DA1-1207 <Cat.No.100831> 型名 Model ■ 順電流-ピーク波長特性 Forward Current IfλD vs. Peak Wavelength ■ 発光スペクトル Spectrum Spectrum 相対発光強度 (a.u.) Relative Emission Intensity (a.u.) ピーク波長 λp (nm) Peak Wavelength λp (nm) 381 379 377 375 373 371 10 順電流 IFP (mA) Forward Current IFP (mA) ■ 周囲温度-ピーク波長特性 TaλD vs. Ambient Temperature Peak Wavelength 1.2 1.0 0.8 0.6 0.4 0.2 0.0 300 350 400 450 500 550 600 369 1 100 波長 λ (nm) Wavelength λ (nm) ■ 指向特性 Directivity -10° -20° -30° -40° 379 放射角度 Radiation Angle ピーク波長 λp (nm) Peak Wavelength λp (nm) -10- IFP= 20mA 377 375 373 371 369 0 30 60 90 120 周囲温度 Ta (℃) Ambient Temperature Ta (℃) 0° 10° 20° Y 30° X 40° -50° X 50° Y 60° -60° 70° -70° 80° -80° -90° 1 X-X Y-Y Ta=25℃ IFP= 20mA Directivity 381 -60 -30 Ta=25℃ IF= 20mA Ta=25℃ 90° 0.5 0 0.5 1 相対放射強度 (a.u.) Relative Radiant Intensity (a.u.) NSSU100D 日亜化学工業 (株) NICHIA CORPORATION 名称 Title 初期電気/光学特性 CHARACTERISTICS 管理番号 No. 100820 062511 Nichia STS-DA1-1207 <Cat.No.100831> 型名 Model Nichia STS-DA1-1207 <Cat.No.100831> Cathode mark 2+0.3 -0.2 (1.3) LED chip 1.2 ± 0.15 1.7 0.5 (2) 3 Cathode K 1.6 Anode A 保護素子 Protection device 項目 Item 材質 Materials パッケージ材質 Package 封止樹脂 Encapsulating Resin 電極 Electrodes セラミックス Ceramics シリコーン樹脂 Silicone Resin 金メッキ Au Plating （注） 本製品には静電気に対する保護素子が内蔵されています。 (NOTE) The LEDs have a protection device built in as a protection circuit against static electricity. 型名 Model NSSU100D 日亜化学工業 (株) NICHIA CORPORATION -11- 名称 Title 外形寸法図 OUTLINE DIMENSIONS 管理番号 No. 100820062491 単位 Unit mm 公差 Allow ±0.2 4 Φ 1.5+0.1 -0 1.75±0.1 テーピング部 Taping part ±0.1 2±0.05 0.2±0.05 リール部 Reel part 180+0 -3 11.4±1 9±0.3 4±0.1 2 MAX. Φ 1+0.25 -0 2211±± 00..88 Φ 60-+10 Φ 3.5±0.2 8+0.3 -0.1 3.5±0.05 Cathode mark 0.20.2 ±± Φ 1133 ラベル Label 2.5±0.2 トレーラ部/リーダ部 Trailer Part/Leader Part エンボスキャリアテープ Embossed carrier tape -12引き出し方向 Pull direction トレーラ部Min.160mm（空部） Trailer part Min.160mm (No LEDs) トップカバーテープ Top cover tape 引き出し部Min.100mm（空部） Reel Lead Min.100mm(No LEDs) リーダ部Min.400mm Leader part Min.400mm 数量 2,500個入/リール Quantity 2,500pcs/Reel 型名 Model NSSU100xT 日亜化学工業 (株) NICHIA CORPORATION 名称 Title テーピング仕様図 TAPING DIMENSIONS 管理番号 No. 090406939961 単位 Unit mm Nichia STS-DA1-1207 <Cat.No.100831> JIS C 0806電子部品テーピング準拠 : Packaging of Electronic Taping is based on the Components on Continuous Tapes. LED装着部 LEDs mounting part Nichia STS-DA1-1207 <Cat.No.100831> シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をする。 The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. アルミ防湿袋 Moisture proof foil bag リール Reel ラベル Label 熱シール Seal UV LED TYPE NSSU100xT LOT QTY. xxxxxx-◇◇◇ PCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN シリカゲル Moisture absorbent material 警告ラベル Caution Label LED RADIATION 光学測定装置で 直接観察してはならない DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS クラス1M LED製品 CLASS 1M LED PRODUCT アルミ防湿袋、外箱に貼り付け This Caution Label is applied on Moisture proof foil bag and on Cardboard box. ダンボールで仕切りをする The box is partitioned with the cardboard. ラベル Label UV LED TYPE NSSU100xT RANK ◇◇◇ QTY. PCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Nichia LED 基本梱包単位 Packing Unit アルミ防湿袋 Moisture proof foil bag 梱包箱（段ボール） Cardbord box S M L リール数 Reel/bag チップ個数 Quantity/bag(pcs) 1reel 2,500 MAX. 箱の寸法 Dimensions(mm) 291×237×120×8t 259×247×243×5t 444×262×259×8t リール数 Reel/box 7reel MAX. 15reel MAX. 30reel MAX. 型名 Model NSSU100xT 日亜化学工業 (株) NICHIA CORPORATION -13- チップ個数 Quantity/box(pcs) 17,500 MAX. 37,500 MAX. 75,000 MAX. 名称 Title 梱包仕様図 PACKING 管理番号 No. 090406939971