NICHIA NS4L107T

Nichia STS-DA1-0204
<Cat.No.080513>
SPECIFICATIONS FOR NICHIA CHIP TYPE WARM WHITE
MODEL : NS4L107T
NICHIA CORPORATION
LED
Nichia STS-DA1-0204
<Cat.No.080513>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Dice Temperature
Soldering Temperature
IFP Conditions
:
Symbol
IF
IFP
IR
PD
Topr
Tstg
Tj
Tsld
Pulse Width ≤ 10msec.
Absolute Maximum Rating
60
80
85
0.96
-40 ~ + 85
-40 ~ +100
130
Reflow Soldering : 260°C
and
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
VF
Luminous Flux
φv
x
Chromaticity Coordinate
y
-
(Tc=25°C)
Unit
mA
mA
mA
W
°C
°C
°C
for 10sec.
Duty ≤ 1/10
Condition
IF=50[mA]
IF=50[mA]
IF=50[mA]
IF=50[mA]
Typ.
(14.7)
(33)
0.452
0.409
(Tc=25°C)
Max.
Unit
16.0
V
lm
-
Min.
15.0
14.0
13.0
42.8
36.0
30.3
25.5
(Tc=25°C)
Max.
Unit
16.0
V
15.0
14.0
51.0
42.8
lm
36.0
30.3
Please refer to CIE 1931 chromaticity diagram.
(3) Ranking
Item
Forward Voltage
Luminous Flux
Rank H
Rank M
Rank L
Rank P13
Rank P12
Rank P11
Rank P10
Symbol
Condition
VF
IF=50[mA]
φV
IF=50[mA]
Forward Voltage Measurement allowance is ± 3%.
Luminous Flux Measurement allowance is ± 7%.
Color Ranks
x
y
x
y
0.3575
0.3612
0.3545
0.3408
(IF=50mA,Tc=25°C)
0.3610
0.3850
Rank d1
0.3780 0.3988
0.3970 0.4116
0.3897
0.3823
0.3720
0.3714
0.3575
0.3612
Rank d2
0.3720 0.3897
0.3714 0.3823
0.3822
0.3580
0.3667
0.3484
-1-
Nichia STS-DA1-0204
<Cat.No.080513>
x
y
x
y
x
y
x
y
0.3988
0.4116
Rank e1
0.4162 0.4390
0.4200 0.4310
0.4255
0.4000
0.4053
0.3907
0.3822
0.3580
0.3897
0.3823
Rank e2
0.4053 0.4255
0.3907 0.4000
0.4129
0.3725
0.3954
0.3642
0.4255
0.4000
Rank f3
0.4390 0.4680
0.4310 0.4385
0.4129
0.3725
Rank f5
0.4255 0.4519
0.4000 0.4086
0.3897
0.3823
0.4519
0.4086
x
y
0.4355
0.3785
x
y
0.4519
0.4086
Rank f4
0.4680 0.4970
0.4385 0.4466
0.4770
0.4137
0.4355
0.3785
Rank f6
0.4519 0.4770
0.4086 0.4137
0.4588
0.3838
Color Coordinates Measurement allowance is ± 0.01.
Basically, a shipment shall consist of the LEDs of a combination of the above ranks.
The percentage of each rank in the shipment shall be determined by Nichia.
Correspondence table of Color Coordinates – Luminous Flux ranks
Ranking by Luminous Flux
Ranking by Color Coordinates
P10
P11
P12
P13
d1, d2
e1, e2,
f3, f4, f5, f6
Shaded ranks are available.
2.INITIAL
OPTICAL/ELECTRICAL
CHARACTERISTICS
Please refer to “CHARACTERISTICS” on the following pages.
3.OUTLINE
DIMENSIONS
AND
MATERIALS
Please refer to “OUTLINE DIMENSIONS” on the following page.
Material as follows ; Package
: Ceramics
Encapsulating Resin
: Silicone Resin (with Diffused + Phosphor)
Electrodes
: Au Plating
Die Heat sink
: Ag Plating Copper
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to “TAPING DIMENSIONS” and “PACKING ”on the following pages.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
-2-
Nichia STS-DA1-0204
<Cat.No.080513>
5.LOT
NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
-U
- Year
( 7 for 2007, 8 for 2008 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
- Nichia's Product Number
U - Ranking by Color Coordinates
- Ranking by Luminous Flux
- Ranking by Forward Voltage
-3-
B for Nov. )
Nichia STS-DA1-0204
<Cat.No.080513>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Steady State Operating Life
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Note
2 times
Number of
Damaged
0/22
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
0°C ~ 100°C
15sec. 15sec.
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
1 time
over 95%
20 cycles
0/22
100 cycles
0/22
10 cycles
0/22
1000 hrs.
0/22
Ta=60°C,
1000 hrs.
0/22
Ta=-40°C
1000 hrs.
0/22
Ta=25°C, IF=60mA
1000 hrs.
0/22
1000 hrs.
0/22
500 hrs.
0/22
1000 hrs.
0/22
1 time
0/22
48min.
0/22
3 times
0/22
RH=90%
0/22
Tested with Nichia standard circuit board.
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Permanence of Marking
Ta=85°C, IF=40mA
Tested with Nichia standard circuit board.
60°C, RH=90%, IF=60mA
Tested with Nichia standard circuit board.
Ta=-40°C, IF=50mA
Tested with Nichia standard circuit board.
JEITA ED-4701
500 501
Vibration
JEITA ED-4701
400 403
Electrostatic Discharges
JEITA ED-4701
300 304
Solvent : Isopropyl Alcohol
Solvent Temperature : 20 ~ 25°C
Dipping Time : 5 min.
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s2
3directions, 4cycles
R=1.5kΩ, C=100pF
Test Voltage=2kV
Negative/Positive
Thermal resistance of LED with Nichia standard circuit board : Rja ≒ 70°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Min.
Max.
Item
Symbol Test Conditions
Forward Voltage
VF
IF=50mA
Initial Level
Luminous Flux
φv
IF=50mA
Initial Level 0.7
The test is performed after the board is cooled down to the room temperature.
-4-
1.1
Nichia STS-DA1-0204
<Cat.No.080513>
7.CAUTIONS
The LEDs are devices which are materialized by combining Blue LEDs and special phosphors.
Consequently, the color of the LEDs is changed a little by an operating current.
Care should be taken after due consideration when using LEDs.
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag. A package of
a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within
a year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in the moisture proof packages, such as sealed containers with packages of moisture
absorbent material (silica gel).
It is also recommended to return the LEDs to the original
moisture proof bag and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following condition.
Baking treatment : more than 24 hours at 65 ± 5°C
· This product has silver plated metal parts that are inside and/or outside the package body. The silver
plating becomes tarnished when being exposed to an environment which contains corrosive gases.
Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics.
Please do not expose the LEDs to corrosive atmosphere during storage.
· After assembly and during use, silver plating can be affected by the corrosive gases emitted by
components and materials in close proximity of the LEDs within an end product, and the gases entering
into the product from the external atmosphere. The above should be taken into consideration when
designing.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
-5-
Nichia STS-DA1-0204
<Cat.No.080513>
(3) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower,
or the LEDs do not light at the low current.
Criteria : (VF > 8.0V at IF=0.5mA)
(4) Application Design Considerations
· In designing a circuit, the current through each LED must not exceed the absolute maximum rating
specified for each LED. It is recommended to use Circuit B which regulates the current flowing
through each LED. In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the
current through the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the
worst case, some LED may be subjected to stresses in excess of the absolute maximum rating.
(B)
(A)
...
...
· This product should be operated in forward bias. A driving circuit must be designed so that the product
is not subjected to either forward or reverse voltage while it is off. In particular, if a reverse voltage is
continuously applied to the product, such operation can cause migration resulting in LED damage.
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· Please determine the operating current with consideration of the ambient temperature local to the LED
and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS
in this specifications. Please also take measures to remove heat from the area near the LED (heat sink)
to improve the operational characteristics of the LED.
· The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation
between Tj and Tc.
Tj=Ta + Rja W
1
Tj=Tc + Rjc W
2
Tj = Dice Temperature : °C, Ta = Ambient Temperature : °C,
Tc = Die Heat sink Temperature : °C,
Rja = Heat resistance from Dice to Ambient temperature : °C /W,
Rjc = Heat resistance from Dice to Tc measuring point ≒ 12°C /W,
W = Inputting Power (IF VF) : W
-6-
Nichia STS-DA1-0204
<Cat.No.080513>
· Warpage of circuit board with soldered LEDs may result in damage or package breakage of the LEDs.
Please pay special attention to the orientation of the LEDs as to avoid LED failure caused by bow, twist
and warpage of the board.
【Non-preferable】
【Preferable】
Cathode mark
Cathode mark
Solder connections
Solder connections
When mechanical stress from the board affects the soldered LED, place the LED in the preferable
location and orientation as shown above.
· Depending on the position and direction of LED, the mechanical stress on the LED package can be
changed. Refer to the following figure.
E
D
C
Perforated line
A
B
Slit
Stress : A > B = C > D > E
· When separating the circuit boards with soldered LEDs, please use appropriate tools and equipment.
Hand brake without these tools and equipment may not be used.
· The use of aluminum substrate increases stress to solder joints due to thermal expansion of substrate and
subsequently may result in solder joint crack. Users may need to evaluate their specific application to
determine any impact due to the use of aluminum substrate.
-7-
Nichia STS-DA1-0204
<Cat.No.080513>
(5) Handling Precautions
· Bare Hand
When handling the product, touching encapsulant with bare hands will contaminate its surface that could
affects on optical characteristics. In the worst cases, excessive force to the encapsulant by hands might
result in catastrophic failure of the LEDs due to wire deformation and/or breakage.
· Tweezers
When handling it with tweezers, the product should only be held by the ceramics body, not by the
encapsulant. Failure to comply might result in chip-out and/or delamination of encapsulant, and in the
worst cases, catastrophic failure of the LEDs due to wire deformation and/or breakage.
Encapsulant
Ceramics body
· Pick and Place
Recommended conditions :
Area of outer nozzle ≥ 2 mm2
(more than 30% of encapsulant top surface)**
Contact area of nozzle with encapsulant ≥ 0.9 mm2
(15 to 85% of encapsulant top surface)**
Placement pressure ≤ 3N/mm2 *max. force : 5N
Vacuum pressure ≤ 7.8N/ cm2 (≤ 0.8 kgf/cm2)
**For reference.
Failure to comply might result in damage to encapsulant and in the worst cases,
catastrophic failure of the LEDs due to wire deformation and/or breakage.
-8-
Nichia STS-DA1-0204
<Cat.No.080513>
· Printed Circuit Board Assembled (PCB with LEDs soldered)
Do not stack assembled PCBs together. Since silicone is a soft material, abrasion between two PCB
assembled with silicone encapsulated LED might cause catastrophic failure of the LEDs due to damage
to encapsulant (such as scratch, chip-out and delamination) and wire (such as deformation and breakage)
and LED detachment.
-9-
Nichia STS-DA1-0204
<Cat.No.080513>
(6) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip or hand soldering method.
· Recommended soldering conditions
Reflow Soldering
Lead Solder
Lead-free Solder
Pre-heat
120 ~ 150°C
180 ~ 200°C
Pre-heat time
120 sec. Max.
120 sec. Max.
Peak
240°C Max.
260°C Max.
Soldering time
10 sec. Max.
10 sec. Max.
Condition
refer to
refer to
temperature
Temperature - profile 1.
Temperature - profile 2.
(N2 reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C 60sec.Max.
Above 200°C
1 ~ 5°C / sec.
240°C Max.
10sec. Max.
1 ~ 5°C / sec.
Pre-heating
180 ~ 200°C 60sec.Max.
260°C Max.
10sec. Max.
Above 220°C
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
2.9
1.8
4.0
2.8
(Unit : mm)
1.8
4-R0.3
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the User use the nitrogen reflow method.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a hot plate should be used.
It should be confirmed beforehand whether the characteristics of the LEDs
will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· Die Heat sink is to be soldered.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
-10-
Nichia STS-DA1-0204
<Cat.No.080513>
(7) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic.
When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
(8) Others
· NS4L107 complies with RoHS Directive.
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent
looking directly at the LEDs with unaided eyes for more than a few seconds.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia.
When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-11-
Nichia STS-DA1-0204
<Cat.No.080513>
ICI Chromaticity Diagram
0.9
520
530
0.8
540
510
550
0.7
560
0.6
570
500
0.5
580
y
e1
f3 f4
590
d1
0.4
d2
e2
600
f5 f6
610
620
0.3 490
630
0.2
480
0.1
470
460
0
0
0.1
0.2
0.3
0.4
x
Color coordinates Measurement allowance is ± 0.01.
-12-
0.5
0.6
0.7
0.8
8
1.5
1.0
0.5
0
10
12
14
16
18
Forward Voltage VF (V)
0
20
40
60
80 100
Forward Current IFP (mA)
Ambient Temperature vs.
Forward Voltage
Ambient Temperature vs.
Relative Luminous Flux
18
2.0
-13-
17
IFP=50mA
16
15
14
13
12
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
IFP=50mA
1.0
0.5
0.2
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Forward Current vs.
Luminous Efficiency
200
Luminous Efficiency (lm/W)
Luminous Flux (lm)
Ta=25°C
Allowable Forward Current IFP (mA)
5
2.0
Duty Ratio vs.
Allowable Forward Current
Ta=25°C
100
80
60
20
10
1
5 10 20
50 100
Duty Ratio (%)
100
Luminous Efficiency :
Luminous Flux :
80
Ta=25°C
60
40
20
0
0
20
40
60
80 100
Forward Current IFP (mA)
Ambient Temperature vs.
Allowable Forward Current
Allowable Forward Current IF (mA)
Ta=25°C
10
1
Forward Voltage VF (V)
Relative Luminous Flux (a.u.)
100
80
50
Forward Current vs.
Relative Luminous Flux
Relative Luminous Flux (a.u.)
Forward Current IFP (mA)
Forward Voltage vs.
Forward Current
100
80
Thermal resistance
Rja=70°C/W
60
40
20
0
0
20
40
60
80 100
Ambient Temperature Ta (°C)
NICHIA CORPORATION
NS4L107
Title
CHARACTERISTICS
No.
070821770141
Nichia STS-DA1-0204
<Cat.No.080513>
Model
Spectrum
Forward Current vs.
Chromaticity Coordinate
Relative Emission Intensity (a.u.)
0.43
Ta=25°C
y
0.42
80mA 60mA
50mA
5mA
1mA
0.41
0.40
0.39
0.43
0.44
0.45
0.46
0.47
x
Ambient Temperature vs.
Chromaticity Coordinate
0.8
0.6
0.4
0.2
0
400
500
600
700
Wavelength λ (nm)
Relative Illuminance (a.u.)
-14-
0.42
-40°C
0°C
0.41
25°C
50°C
0.40
85°C
0.44
0.45
x
0.46
800
0°
1.0
IFP=50mA
y
Ta=25°C
IF=50mA
1.0
Directivity
0.43
0.39
0.43
1.2
0.47
10° 20°
30°
Ta=25°C
IFP=50mA
40°
50°
60°
0.5
70°
80°
0
90°
60°
30°
Radiation Angle
0°
0.5
NICHIA CORPORATION
NS4L107
Title
CHARACTERISTICS
No.
070821770151
Nichia STS-DA1-0204
<Cat.No.080513>
Model
90°
1.0
Cathode mark
3.5
1.5
Die Heat sink
0.8
2.8
2
2.8± 0.1
2
2.8
3.5
Cathode
4-R1
Anode
2.9 ± 0.1
3.3 ± 0.1
-15-
A
K
Protection device
MATERIALS
PACKAGE
Ceramics
Silicone Resin
(with Diffused + Phosphor)
Au Plating
Ag Plating Copper
ENCAPSULATING RESIN
ELECTRODES
DIE HEAT SINK
Note 1) NS4L107 has a protection device built in as a protection
circuit against static electricity.
Note 2) The die heat sink is electrically neutral.
Model
NICHIA CORPORATION
Title
No.
NS4L107
OUTLINE DIMENSIONS
080310811361
Nichia STS-DA1-0204
<Cat.No.080513>
ITEM
Unit
mm
8/1
Scale
Allow
±0.2
Taping part
φ 180+0
-3
5.5±0.05
Cathode mark
0.2±0.05
φ2
1 ±0.8
φ 60+1
-0
2±0.05 4±0.1
15.4±1
13+1
-0
3.85±0.1
8±0.1
12+0.3
- 0.1
φ 1.5+0.1
-0
1.75±0.1
Reel part
±0.2
φ 13
2±0.1
φ 1.5+0.2
-0
Label
XXXX LED
3.85±0.1
Reel End of tape
LEDs mounting part
No LEDs
TYPE NS4x107T
LOT xxxxxx-U„z
QTY
pcs
RoHS
No LEDs
-16Pull direction
Top cover
tape
Embossed carrier tape
Reel Lead Min.100mm (No LEDs)
Reel Lead Min.160mm (No LEDs)
Reel Lead Min.400mm
1,200pcs/Reel
NICHIA CORPORATION
Title
No.
NS4x107T
TAPING DIMENSIONS
080501815611
Nichia STS-DA1-0204
<Cat.No.080513>
Model
Taping is based on the JIS C 0806 : Packaging of Electronic
Components on Continuous Tapes.
Unit
mm
Scale
Allow
Nichia STS-DA1-0204
<Cat.No.080513>
The reel and moisture absorbent material are put in the moisture proof foil bag
and then heat sealed.
Reel
Label
NICHIA
Seal
XXXX LED
TYPE
LOT
QTY
NS4x107T
xxxxxx-U„z
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture proof foil bag
Moisture
absorbent material
The box is partitioned with the
cardboard.
Label
NICHIA
Nichia
XXXX LED
LED
TYPE
RANK
QTY
NS4x107T
U„z
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag
Cardboard box
Cardboard box S
Cardboard box M
Cardboard box L
Reel/bag
1reel
Quantity/bag (pcs)
1,200 MAX.
Dimensions (mm)
291¯237¯120¯8t
259¯247¯243¯5t
444¯262¯259¯8t
NICHIA CORPORATION
-17-
Reel/box
5reel MAX.
10reel MAX.
20reel MAX.
Quantity/box (pcs)
6,000 MAX.
12,000 MAX.
24,000 MAX.
Model
NS4x107T
Title
PACKING
No.
070821770101