Multi-Quantum Well (MQW) Laser Diode Specification Model: ELD83NPT5 03.08.2010 eld83npt5.doc 1 of 10 Catalog 1.Scope………………………………………………………………………………………………………..3 2.Outline Dimensions and Terminal Connections …………………………………… ………………3 3. Ratings and Characteristics …………………………………………………………………………..4 4. Reliability ………………………………………………………………………………………………..5 5.Incoming inspection …………………………………………… ………………………………………..6 6. Supplements………………………………………………………………………………………………..7 7. Operation note ………………………………………………………………………………………..7 8. Quality assurance ……………………………………………………………………………………….. 8 9. Security ………………………………………………………………………………………………….9 10. Note …… ……………………………………………………………………………………………….9 03.08.2010 eld83npt5.doc 2 of 10 1 Scope: The specification covers the appearance and characteristics of 830nm Laser Diode used as light source, It’s model is ELD83NPT5.This product is packaged with an ALGaAs multiple quantum well invisible laser diode chip and a silicon photodiode for monitoring optical power output. Oscillation transverse mode of this model is TE. 2. Outline Dimensions and Terminal Connections Average single quality0.31g General tolerance: ±0.2 Unit: mm No. a b c d e f Component Laser diode chip Photodiode chip Stem Cap Window glass Lead pins Material AlGaAs Si Fe Kovar Glass Kovar finish Gold-plated Nickel-plated n = 1.49 Gold-plated 3. Ratings and Characteristics 03.08.2010 eld83npt5.doc 3 of 10 3－1 Absolute Maximum Ratings (Tc=25℃ (case temperature)) Parameter Symbol Value Unit Optical power output (CW) Po 7 mW Laser diode Vrl 2 V Photodiode Vrd 30 V Tc -10 ~ +55 ℃ Tstg -40 ~ +85 ℃ Reverse voltage Operating temperature（case temperature） Storage temperature（case temperature） 3-2 Electro-optical Characteristics（Note 1） （Tc＝25°） Parameter Condition Symbol CW Ith - Operating current Iop - Operating voltage Vop - Threshold current Wavelength Lateral Beam Angle （Note 2、3） Vertical Beam Angle （Note 2、3） cw Po=5mW Monitor current Slope efficiency Min. Max 20 30 30 2.0 45 Unit mA mA 2.3 V λp 820 830 840 nm θ∥ 8 12 16 Degree θ⊥ 20 30 35 Degree 250 500 μA 0.5 0.8 Im CW Typ. ηd 0.4 （Note 1) Initial value, Continuous Work. （Note 2) Angle of 50% peak intensity（Full angle at half-maximum） （Note 3) Parallel to the junction plane（X-Z plane） perpendicular to the junction plane （Y-Z plane） 03.08.2010 eld83npt5.doc 4 of 10 4. Reliability 4-1 The reliability of product satisfy all the items listed below. Reliability：90％ No. Test Reference Sampler Defective LTPD Standard : n C (%) Test Conditions Soldering temperature：250±5℃ 1 Solder ability Terminal strength （Tensile test） Terminal strength 3 （Bending test） second GJB-128A 11 0 20 Load：5N Duration：10±1s Once for each terminal GB-4937 11 0 20 Load：2.5N 0°~ 90°~ 0°~ 90°~0° Once for each terminal GB-4937 11 0 20 GJB-548A 11 0 20 GJB-548A 11 0 20 GB-2423.22 11 0 20 GJB-128A 11 0 20 GB-2423.2 11 0 20 GB-2423.1 t＝96 H Duration: From normal temperature up Moisture to 55℃ in 3h,stay for 9h,down to 25℃ in resistance GB-2423.4 (temperature 3h stay for 9h. humidity cycle) Repeat 6 times.（humidity is 95%） 11 0 20 11 0 20 2 4 Immersion time：5±0.5 brand iron should be grounded Mechanical shock Acceleration：14,700m/s2 Pulse width：0.5ms Direction: X,Y,Z Five times for each direction Acceleration：196m/s2 Variable frequency vibration 5 Frequency：20～2000～20Hz 4min reciprocation：X,Y and Z times for each direction Four Lower temperature：－40℃ 6 Temperature cycling 7 Sealing Higher temperature：＋85℃ Duration：5 times，stay for 3h， switch time:3min Helium gas to detect fine leaks: 5×10－3Pa·cm2/s、 In fluorocarbon liquid 125±5℃ no bubble 8 High temperature 9 Low temperature 10 03.08.2010 Storage temperature：85℃ t＝96 H Storage temperature：－40℃ eld83npt5.doc 5 of 10 4-2 Parameters to be measured and Failure criteria No. * * Parameters Failure judgment criteria 1 Operating current Iop﹥Initial operating current×1.2 2 Operating voltage Vop﹥Initial operating voltage×1.1 3 Monitor current Im﹤Initial operating value×0.8 or Im﹥Initial operating value×1.2 Solder ability test: Solder must cover at least 95% of the total immersed area. Terminal strength test (Tension/Bending);Terminal shall not be destroyed or loosened. 4-3 Target Lifetime The target mean time to failure(MTTF)of this product is more than three thousand hours. MTTF is to be confirmed by performing the operating test under the following conditions once in six months. Samples tested should have a laser diode chip with the same structure of this model. （Note 1）Defective samples caused by surge current is rejected . 5. Incoming inspection 5-1 Inspection standards : GB-2828-87 ,Normal inspection,1 time sample scheme. 5-2 Inspection level: II 5-3 AQL 5-3-1 Definition of the lot the day shipping the product 5-3-2 Characteristics AQL(%) Parameter Failure judgment criteria Not conforming to the specification 1.0 Ith, Iop, Vop,ηd, λp, θ∥, θ┴,Im 5-3-3 Appearance AQL(%) Failure judgment criteria Parameters of stem and cap are not conforming the specification 1.0 rust、cracking、dirt、bend * Inspection is performed after blowing the window glass. 03.08.2010 eld83npt5.doc 6 of 10 6 Supplements 6.1 ODS materials This product shall not contain the following materials. Also the following materials shall not be used in the production process for this product. Materials for ODS:CFCs、Halon，Carbon tetrachloride ,etc. 6.2 Brominated flame retardants 6.3 Packing 6.3.1 Packing method （1） Laser diodes are packaged in an Anti-Static-plastic box. （2） Each Anti-Static-plastic box can accommodate 100 laser diodes maximum. （3） 5 Anti-Static-plastic box is piled up together and enlaced with an Elastic band. （4） The above bound boxes are stuffed into a clean Anti-Static-bag ,then this is vacuumized and sealed thermally. （5） Each packing case can accommodate 500 laser diodes, which is the minimum unit of packing. labels where the model number, quantity and lot number are printed are struck on both of the bag and on the case（refer to 6.3.4）. 6.3.2 Packing materials No. 1 2 3 Component parts Laser tray Package bag Package box Material Conductive polystyrene resin Anti-static plastic cardboard 6.3.3 Case appearance 03.08.2010 eld83npt5.doc 7 of 10 6.3.4 Label （1） A label on the cleanbag LOT NO : MODEL: QTY(PCS) Po: mW CHIP LOT M . Date: QTY: pcs TO： TYPE G.WT QTY N.WT LOT No. L 38 cm M.Date W 29 cm C/No. H 14.5 cm 7. Operation note 7.1 Absolute maximum ratings If an excessively large current flows in a laser diode, a large optical output will occur and the emitting facet may sustain damage.This optical damage can occur even with momentary over-current. For this reason, absolute maximum ratings which must not be exceeded even momentarily have been established. Exercise particular caution with respect to the drive voltage supply and static electricity. We guarantee use within the absolute maximum ratings. These ratings are established for a case temperature of 25℃. As the temperature of a laser diode increases, its maximum output will decrease and the operating range will shrink.Even when operated within the absolute maximum ratings, operation at high temperature will result in a shorter life than operation at low temperature. For this reason, the design should include sufficient margin for heat radiation and light output. 7.2 Heat radiation conditions Like other semiconductors, prolonged operation of a laser diode will cause heat to build up at junctions and increased case temperature. For this reason, attach aluminum, copper (or other) heat sinks (at least 30 × 30 × 3mm) to the stem of the laser. 7.3 Protection against damage due to electrostatic discharge and other current surges Electrostatic discharge and other current surges can cause deterioration and damage in laser diodes, resulting in reduced reliability ,We advise taking the following protective measures : 7.3.1 Ground the device and circuits. Install surge filters, surge reduction transformers, or other electrostatic discharge protectors in the power supply inputs. 7.3.2 When working with laser diodes wear anti-static clothing, including footwear and caps. Materials should be selected carefully. Grounded wrist should always be worn while working with laser diodes, and the strap should be grounded through a 1 MΩresistance. 03.08.2010 eld83npt5.doc 8 of 10 7.3.3 Use anti-static containers for transport and storage. 7.3.4 Laser deterioration and damage can occur due to excessive current spikes when the power is turned on or off. Design circuits to avoid the generation of excessive current spikes. 7.3.5 Inductive surges near equipment that emits high frequency EMI can damage or destroy lasers. Avoid using lasers near fluorescent lamps or other sources of EMI emissions. 7.4 Soldering Use a grounded soldering iron to solder laser leads. Solder at a temperature of no more than 250℃ for a maximum of 3 seconds, at a point at least 2 mm from the base of the leads . 7.5 Handling laser diodes Never touch the glass window of the laser. A damaged or dirtied window will impair the performance of the laser. 7.6 Handling packages Due to the glass window in each device, packages must not be dropped or subjected to excessive pressure. 7.7 Safety It is extremely dangerous to look, either directly or through a lens, at the laser beam emitted from a laser diode. Use a TV camera or other similar device to adjust the optical axis. 8. Quality assurance 8.1 Laser diodes (semiconductor lasers) have a much longer life than other lasers such as gas or solid-state lasers. The components of our lasers have optimum characteristic ranges. To ensure these characteristics and product life, we manufacture our laser diodes based on comprehensive data control using our own custom manufacturing, measuring, and inspection equipment. 8.2 Quality assurance system 8.2.1 After the wafers have been manufactured, electrical and optical characteristics are measured to verify that characteristics can be achieved as the manufacturing process progresses. 8.2.2 In-process inspections are conducted at various manufacturing points to ensure the stability of our assembly operations. 8.2.3 All products are burned-in to minimize initial and random failures. 8.2.4 Characteristics of all products are tested before shipping. 8.2.5 Products are managed by wafer lot. 8.2.6 Reliability tests are performed on randomly selected samples. 8.3 Quality assurance measures 8.3.1 Materials, manufacturing conditions, and inspection are controlled and maintained based on company set standards. Temperature, dust, humidity and other environmental conditions are also controlled based on company standards. 8.3.2 Measurement instruments used during the manufacturing process are regularly inspected and calibrated based on company measurement control standards. 9. Security The laser beam emitted from a laser diode is almost invisible to both the human eye and the animal eye, however, it will injure the eye and sufficient caution must be exercised to avoid direct exposure or exposure through a fiber to the beam when a laser diode is in operation. To adjust the optical axis or perform other similar work, we recommend using an infrared-sensitive ITV camera. We also recommend that protective glasses be worn 10. Note No unauthorized transmission or reproduction of this specification, either in whole or in part, is permitted. The contents of these sheets are subject to change without notice. Always verify before use that the contents are the latest specifications. If, by any chance, a defect should arise in the equipment as a result of use without verification of the specifications, manufacturer, can bear no responsibility 03.08.2010 eld83npt5.doc 9 of 10 whatsoever. Upon the sale of any such devices; other than for the buyer’s right to use such devices itself, resell or otherwise dispose of the same; no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by us, is granted to any such buyer. The products listed in this specification are designed to be used with ordinary electronic equipment or devices (such as audio-visual equipment, office-automation equipment, communications devices, electrical appliances, and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers, or other safety devices) please be sure to consult with our sales representatives in advance. 10.5 when exporting, please be sure to consult with our sales representatives to ascertain whether any product is classified as a strategic material. 03.08.2010 eld83npt5.doc 10 of 10