SUMMIT SMM665B_11

SMM665B
Preliminary Information1 (See Last Page)
Six-Channel Active DC Output Controller, Monitor, Marginer and Sequencer
FEATURES & APPLICATIONS
INTRODUCTION
• Extremely accurate (±0.2%) Active
DC Output Control (ADOCTM)
• Undervoltage Lockout function (UVLO)
• ADOCTM Automatically adjusts supply output
voltage level under all DC load conditions
• Monitors, controls, sequences and margins up
to six supplies from 0.3V to 5.5V with 1.25V Vref
ƒ Wide Margin/ADOC range from 0.3V to VDD
• Programmable Power-on/-off sequencing
• Monitors internal temperature sensor
• Operates from any intermediate bus supply
from 8V to 15V and from 2.7V to 5.5V
• Monitors 12V input and VDD
• Monitors two general-purpose 10-bit ADC inputs
• Programmable threshold limits (2 OV/2 UV) for
each monitored input
• Programmable RESET, HEALTHY and FAULT
• 4k-bit general purpose nonvolatile memory
• I2C 2-wire serial bus for programming
configuration and monitoring status, including
10-bit ADC conversion results
Applications
• Monitor/Control Distributed and POL Supplies
• Multi-voltage Processors, DSPs, ASICs used in
Telecom, CompactPCI or server systems
The SMM665B is an Active DC Output power supply
Controller (ADOCTM) that monitors, margins and
cascade sequences. The ADOC feature is unique and
maintains extremely accurate settings of system
supply voltages to within ±0.2% under full load. The
device actively controls up to six DC/DC converters
that use a Trim or Regulator VADJ/FB pin to adjust the
output voltage. For system test, the part also controls
margining of the supplies using I2C commands. It can
margin supplies with either positive or negative control
within a range of 0.3V to VDD depending on the
specified range of the converter. The SMM665B also
intelligently sequences or cascades the power
supplies on and off in any order using enable outputs
with programmable polarity. It can operate off any
intermediate bus supply ranging from 8V to 15V or
from 5.5V to as low as 2.7V. The part monitors six
power supply channels as well as VDD, 12V input, two
general-purpose analog inputs and an internal
temperature sensor using a 10-bit ADC. The 10-bit
ADC can measure the value on any one of the monitor
channels and output the data via the I2C bus. A host
system can communicate with the SMM665B status
register, optionally control Power-on/off, margining and
utilize 4K-bits of nonvolatile memory.
SIMPLIFIED APPLICATIONS DRAWING
12V
12VIN (+8V to +15V Range)
3.3VIN (+2.7V to +5.5V Range)
VDD
12VIN
3.3V
CAPA
SCL
A2
ON/OFF
2 of 6 DC-DC
Converters shown
AIN1
SMM665B
VMA
TRIM_CAPB
AIN2
VREF_CNTL
TRIMB
VREF_ADC
PUPB
μP/
ASIC
DC/DC
Converter D, F
CAPB
MR
External or
Internal
REFERENCE
PUPA
RST
Environ
mental
SENSOR
2.5VIN
TRIM
TRIMA
HEALTHY
External
or
Internal
TEMP
SENSOR
VIN
DC/DC
Converter A
Vout
TRIM_CAPA
SDA
I2C
BUS
DC/DC
Converter C, E
VIN
DC/DC
Converter B
Vout
1.2VIN
TRIM
ON/OFF
VMB
HEALTHY
RESET
READY
Figure 1 – Applications Schematic using the SMM665B Controller to actively control the output levels of
up to six DC/DC Converters while also providing power on/off, cascade sequencing and output margining.
Note: This is an applications example only. Some pins, components and values are not shown.
© SUMMIT Microelectronics, Inc. 2006 • 757 N. Mary Avenue • Sunnyvale CA 94085 • Phone 408 523-1000 • FAX 408 523-1266
The Summit Web Site can be accessed by “right” or “left” mouse clicking on the link: http://www.summitmicro.com/
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SMM665B
Preliminary Information
VDD (+2.7V to +5.5V)
or 12VIN ( +8V to +15V)
2.7V
2.5V
2.0V
1.8V
1.5V
---
RST#
t1 ---
Figure 2 – Example Power Supply Sequencing and System Start-up Initialization using the SMM665B. Any
order of supply sequencing can be applied using the SMM665B. Power supply ordering, trimming and Active
DC control allows supply cascade sequencing, automatic level adjustment, margin testing and reset control.
GENERAL DESCRIPTION
The SMM665B is a highly integrated and accurate
power supply controller, monitor and sequencer. It
has the ability to automatically control, monitor and
cascade sequence up to six power supplies. Also, the
SMM665B can monitor the VDD input, the 12V input,
two general-purpose analog inputs and the internal
temperature sensor.
The SMM665B has four
operating modes: Power-on sequencing mode,
monitor mode, supply margining mode using Active
DC Output Control (ADOCTM), and Power-off
sequencing mode.
Power-on sequencing can be initiated via the
PWR_ON/OFF pin or I2C control. In this mode, the
SMM665B will sequence the power supply channels
on in any order by activating the PUP outputs and
monitoring the respective converter voltages to ensure
cascading of the supplies. Cascade sequencing is the
ability to hold off the next sequenced supply until the
first supply reaches a programmed threshold. A
programmable sequence termination timer can be set
to disable all channels if the Power-on sequence
stalls. Once all supplies have sequenced on and the
voltages are above the UV settings, the Active DC
Control, if enabled, will bring the supply voltages to
their nominal settings.
During this mode, the
HEALTHY output will remain inactive and the RST
output will remain active.
Once the Power-on sequencing mode is complete, the
SMM665B enters monitor mode. In the monitor mode,
the SMM665B starts the ADOC control of the supplies
and adjusts the output voltage to the programmed
setting under all load conditions, especially useful for
supplies without sense lines. Typical converters have
±2% accuracy ratings for their output voltage, the
Active DC Output Control feature of the SMM665B
increases the accuracy to ±0.2% (using a ±0.1%
external voltage reference). The part also enables the
triggering of outputs by monitored fault conditions.
The 10-bit ADC cycles through all 11 channels every
Summit Microelectronics, Inc
2ms and checks the conversions against the
programmed threshold limits. The results can be used
to trigger RST, HEALTHY and FAULT outputs as well
as to trigger a Power-off or a Force Shutdown
operation.
While the SMM665B is in its monitoring mode, an I2C
command to margin the supply voltages can bring the
part into margining mode. In margining mode the
SMM665B can margin six supply voltages in any
combination of nominal, high and low voltage settings
using the ADOC feature, all to within ±0.2% using a
±0.1% external reference. The margin high and low
voltage settings can range from 0.3V to VDD around
the converters’ nominal output voltage setting
depending on the specified margin range of the DCDC converter. During this mode the HEALTHY output
is always active and the RST output is always inactive
regardless of the voltage threshold limit settings and
triggers. Furthermore, the triggers for Power-off and
Force Shutdown are temporarily disabled.
The Power-off sequencing mode can only be entered
while the SMM665B is in the monitoring mode. It can
be initiated by either bringing the PWR_ON/OFF pin
inactive, through I2C control or triggered by a channel
exceeding its programmed thresholds. Once Poweroff is initiated, it will disable the Active DC Control and
sequence the PUP outputs off in either the same or
reverse order as Power-on sequencing and monitor
the supply voltages to ensure cascading of the
supplies as they turn off. The sequence termination
timer can be programmed to immediately disable all
channels if the Power-off sequencing stalls. The RST
output will remain active throughout this mode while
the HEALTHY output remains inactive.
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SMM665B
Preliminary Information
INTERNAL FUNCTIONAL BLOCK DIAGRAM
12VIN
VDD
VDD_CAP
3.6V or
5.5V
Regulator
VREF_ADC
AIN1
VM A
CAPA
Power Supply
Arbitrator
10-Bit ADC
PUPA
PUPB
UVLO
Control
AIN2
PWR_ON/OFF FS
Temperature
Sensor
Cascade
Sequence
Control
PUPC
PUPD
PUPE
PUPF
VM F
MR
CAPF
Output
Control
RST
HEALTHY
FAULT
TRIM A
TRIM_CAPA
Active DC
Control
(ADOCTM)
TRIM F
Memory, Limit
and Status
Registers
SDA
I2C
Interface
SCL
A2
TRIM_CAPF
VREF_CNTL
FILT_CAP
GND
Figure 3 – SMM665B Internal Functional Block Diagram.
Summit Microelectronics, Inc
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SMM665B
Preliminary Information
PIN DESCRIPTIONS
Pin
Number
Pin
Type
Pin Name
1
DATA
SDA
I2C Bi-directional data line
2
CLK
SCL
I2C Clock line
3
IN
A2
The address pin is biased either to VDD_CAP or GND.
When
communicating with the SMM665B over the 2-wire bus A2 provides a
mechanism for assigning a unique bus address.
MR
Programmable active high/low input. When asserted the RST output will be
go active. When de-asserted the RST output will go inactive immediately
after a reset timeout period (tPRTO) if there are no RST trigger sources active.
This timeout period makes it suitable to use a pushbutton for manual reset.
4
IN
Pin Description
5
IN
PWR_ON/OFF
Programmable active high/low input signals the start of the power
sequencing. When asserted the part will sequence the supplies on and
when de-asserted the part will sequence the supplies off.
Note: The SMM665B does not monitor for faults during sequencing. The
PWR_ON/OFF pin is overridden by the I2C power on/off command. To get
the pin to work again requires the part be given an I2C 'Clear' command (see
page 16, “RESTART OF POWER-ON CASCADE SEQUENCING”).
6
IN
FS
Programmable active high/low input. Force shutdown is used to immediately
turn off all converter enable signals (PUP outputs) when a fault is detected.
7
OUT
FAULT
Programmable active high/low open drain Fault output. Active when a
programmed fault condition exists on AIN1, AIN2, or the internal temperature
sensor.
8
OUT
HEALTHY
Programmable active high/low open drain Healthy output. Active when all
programmed power supply inputs and monitored inputs are within OV and
UV limits.
9
OUT
RST
Programmable active high/low open drain Reset output. Active when a
programmed fault condition exists on any power supply inputs or monitored
inputs or when MR is active. RST has a programmable timeout period with
options for 0.64ms, 25ms, 100ms and 200ms.
10
IN
AIN1
General purpose monitored analog input
11
IN
AIN2
General purpose monitored analog input
12
GND
GND
Ground
13
IN
Summit Microelectronics, Inc
VREF_ADC
Voltage reference input used for A/D conversion where:
(4XVREF_ADC) = Full Scale (FS) for VMA-F and VDD
(12XVREF_ADC) = FS for 12VIN
(2XVREF_ADC) = FS for AIN1 and AIN2.
VREF_ADC can be connected to VREF_CNTL in most applications.
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SMM665B
Preliminary Information
PIN DESCRIPTIONS (Cont.)
Pin
Number
Pin
Type
Pin Name
14
I/O
VREF_CNTL
15
CAP
FILT_CAP
External capacitor input used to filter VMX inputs
IN
VMX
Positive converter sense line, VMA through VMF
Pin Description
Voltage reference input used for DC output control and margining.
VREF_CNTL can be programmed to output the internal 1.25V reference.
41,36,
31,26,
21,16
42,37,
32,27,
22,17
43,38,
33,28,
23,18
44,39,
34,29,
24,19
45,40,
35,30,
25,20
CAP
CAPX
External capacitor input used to filter the VMX inputs to the 10-bit ADC, CAPA
through CAPF. This provides an RC filter where R = 25kΩ.
OUT
PUPX
Programmable active high/low open drain converter enable output, PUPA
through PUPF
OUT
TRIMX
Output voltage used to control the output of DC/DC converters, TRIMA
through TRIMF . If the ADOC/margining functionality is not used on a
channel the associated TRIMX pin should be left floating
CAP
TRIM_CAPX
External sample and hold capacitor input used to set the voltage on the
TRIM pins, TRIM_CAPA through TRIM_CAPF
46
PWR
VDD
47
PWR
12VIN
48
CAP
VDD_CAP
Summit Microelectronics, Inc
Power supply of the part
12V power supply input internally regulated to either 3.6V or 5.5V
External capacitor input used to filter the internal supply
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SMM665B
Preliminary Information
PACKAGE AND PIN CONFIGURATION
VDD_CAP
12VIN
VDD
TRIM _CAPA
TRIM A
PUPA
CAPA
VM A
TRIM _CAPB
TRIM B
PUPB
CAPB
48
47
46
45
44
43
42
41
40
39
38
37
48 LEAD TQFP
FAULT
7
30
TRIM_CAPD
HEALTHY
8
29
TRIMD
RST
9
28
PUPD
AIN1
10
27
CAPD
AIN2
11
26
VMD
GND
12
25
TRIM_CAPE
Summit Microelectronics, Inc
24
VMC
TRIM E
31
23
6
PUPE
FS
22
CAPC
CAPE
32
21
5
VM E
PW R_ON/OFF
20
PUPC
TRIM _CAPF
33
19
4
TRIM F
MR
18
TRIMC
PUPF
34
17
3
CAPF
A2
16
TRIM_CAPC
VM F
35
15
2
FILT_CAP
SCL
14
VMB
VREF_CNTL
36
13
1
VREF_ADC
SDA
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SMM665B
Preliminary Information
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
Temperature Under Bias....................... -55°C to 125°C
Storage Temperature ............................ -65°C to 150°C
Terminal Voltage with Respect to GND:
VDD Supply Voltage ......................... -0.3V to 6.0V
12VIN Supply Voltage ..................... -0.3V to 15.0V
PUPA, through PUPF ....................... -0.3V to 15.0V
All Others ................................ -0.3V to VDD + 0.7V
Output Short Circuit Current ............................... 100mA
Lead Solder Temperature (10 secs) .................... 300°C
Junction Temperature.......................…….....…...150°C
ESD Rating per JEDEC…………………....……..2000V
Latch-Up testing per JEDEC………..…....……±100mA
Temperature Range (Industrial) ...........–40°C to +85°C
(Commercial) ............–5°C to +70°C
VDD Supply Voltage .................................. 2.7V to 5.5V
12VIN Supply Voltage1 ............................ 8.0V to 14.0V
VIN ............................................................ GND to VDD
VOUT ...................................................... GND to 14.0V
Package Thermal Resistance (θJA)
48 Lead TQFP……………………………….…80oC/W
Note - The device is not guaranteed to function outside its operating rating.
Stresses listed under Absolute Maximum Ratings may cause permanent
damage to the device. These are stress ratings only and functional operation
of the device at these or any other conditions outside those listed in the
operational sections of the specification is not implied. Exposure to any
absolute maximum rating for extended periods may affect device performance
and reliability.
Devices are ESD sensitive. Handling precautions are
recommended.
Note 1 – Range depends on internal regulator set to 3.6V or 5.5V,
see 12VIN specification below.
Moisture Classification Level 1 (MSL 1) per J-STD- 020.
MSL 3 for 100% Sn, RoHS compliant, see Ordering
Information.
RELIABILITY CHARACTERISTICS
Data Retention…………………………..…..100 Years
Endurance…………………….……….100,000 Cycles
DC OPERATING CHARACTERISTICS
(Over recommended operating conditions, unless otherwise noted. All voltages are relative to GND.)
Symbol
Parameter
Notes
Min
Typ
Max
VDD
Supply Voltage
2.7
5.5
Unit
V
Internally regulated to 5.5V
10
14
V
Internally regulated to 3.6V
6
14
V
3
5
mA
3
5
mA
12VIN
Supply Voltage
IDD
Power Supply Current from VDD
All TRIM pins floating,
12VIN floating
I12VIN
Power Supply Current from 12VIN
All TRIM pins floating,
VDD floating
TRIM characteristics
ITRIM
VTRIM
TRIM output current through 100Ω to
1.0V
Margin Control and ADOC Range
TRIM Sourcing
Maximum Current
TRIM Sinking Maximum
Current
Depends on Trim range
of DC-DC Converter
1.5
mA
1.5
mA
VREF_CNT
L/4
VDD
V
TRIM_CAP characteristics
ITRIM_CAP
TRIM output current through 1uF
capacitor to ground
Max acceptable board
and cap leakage is 50
nA2
100
nA
All other input and output characteristics
VVDD_CAP
VDD_CAP voltage
Internally regulated to 3.6V
3.4
3.6
3.8
V
Internally regulated to 5.5V
5.3
5.5
5.7
V
VDD - 0.1
VDD
VDD + 0.1
V
No voltage on 12VIN
Summit Microelectronics, Inc
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SMM665B
Preliminary Information
OPERATING CHARACTERISTICS (CONTINUED)
DC OPERATING CHARACTERISTICS (CONTINUED)
(Over recommended operating conditions, unless otherwise noted. All voltages are relative to GND.)
Symbol
Parameter
Notes
Min
Typ
Max
Unit
Input High Voltage (FS,
PWR_ON/OFF, MR#, SDA,
SCL)3
VDD = 2.7V
VIH
0.7 x
VDD_CAP
VDD = 5.0V
0.7 x
VDD_CAP
VDD = 2.7V
0.3 x
VDD_CAP
V
VIL
Input Low Voltage (FS,
PWR_ON/OFF, MR#, SDA,
SCL)3
VDD = 5.0V
0.3 x
VDD_CAP
V
VIH
Input High Voltage (FS,
PWR_ON, MR#, SDA, SCL)3
VIL
Input Low Voltage (FS, PWR_ON,
MR#, SDA, SCL)3
0.7 x
VDD_CAP
V
Internally regulated to 5.5V
0.7 x
VDD_CAP
V
Internally regulated to 3.6V
0.3 x
VDD_CAP
V
Internally regulated to 5.5V
0.3 x
VDD_CAP
V
1.0
mA
Output Low Current6
Note – Total ISINK from all PUPx pins
should not exceed 6mA or ADOCACC
specification will be affected
0
IOLSDA
Output low current for SDA
VOL=0.4V
3
IS
Leakage current on SDA and
SCL
When SDA or SCL are at
3.6V
VSENSE
VMonitor
Positive Sense Voltage
Monitor Threshold Step Size
VM pin
VM, AIN1/AIN2 pins
TSA
Internal Temperature Sensor
Accuracy5
Commercial Temp Range
Industrial Temp Range
Temperature Threshold Step Size
Internal 1.25VREF Output Voltage
Internal Temp Sensor
VREF TC
Internal VREF Temperature
Coefficient
VREF ACC
Ext VREF
ADOCACC
VOUT_VALID
V
Internally regulated to 3.6V
IOL
TMonitor
VREF
V
mA
+0.3
1.0
μA
VDD_CAP
V
mV
5
-4
-6
o
+6
o
C
C
o
1.26
C
V
–40°C to +85°C
-0.25
+0.25
%
–5°C to +70°C
-0.15
+0.15
%
Internal VREF Accuracy
-0.4
+0.4
%
External VREF Voltage Range
0.5
VDD_CAP
V
ADOC/Margin Accuracy
Minimum Output Valid Voltage
Summit Microelectronics, Inc
1.24
External VREF=1.25V,
±0.1%, Total PUPx ISINK =
6ma, VSENSE ≤ 3.5V
External VREF=1.25V,
±0.1%, Total PUPx ISINK =
6ma, VSENSE ≥ 3.5V
Internal VREF=1.25V,
Total PUPx ISINK = 6ma
VDD_CAP voltage at
which the PUP, RST,
HEALTHY and FAULT
outputs are valid
2089 2.1 5/25/2011
0.25
1.25
+4
-0.2
±0.1
+0.2
%
-0.5
±0.3
+0.5
%
-0.5
±0.3
+0.5
%
1
V
8
SMM665B
Preliminary Information
DC OPERATING CHARACTERISTICS (CONTINUED)
(Over recommended operating conditions, unless otherwise noted. All voltages are relative to GND.)
AIN1/AIN2 ADC characteristics
Symbol
Parameter
N
Resolution
Notes
MC
Missing codes
Minimum resolution for which no
missing codes are guaranteed
S/N
DNL
INL
GAIN
OFFSET
Signal-to-noise Ratio
Differential non-linearity
Integral non-linearity
Positive full scale gain error
Offset error
Full scale temperature
coefficient
Analog ADC Input Impedance
VREF input current
VREF input capacitance
VREF input impedance
Conversion rate = 500Hz
ADC_TC
IMADC
IIVREF
ICVREF
IRVREF
Note 7
Note 7
Note 7
Min
Typ
Max
Unit
10
Bits
10
Bits
72
-1/2
-1
-0.5
-1
+1/2
+1
+0.5
+1
±15
10
250
200
1
dB
LSB
LSB
%
LSB
PPM/
o
C
MΩ
nA
pF
kΩ
VMA-VMF, VDD ADC characteristics
Symbol
Parameter
N
Resolution
MC
Missing codes
Notes
Minimum resolution for which no
missing codes are guaranteed
S/N
Signal-to-noise Ratio
Conversion rate = 500Hz
ERR_ADC
Total ADC Error
Total ADC Read Error
IMADC
Analog ADC Input Impedance
VMA-VMF
Min
Typ
Max
Unit
10
Bits
10
Bits
72
-4
+4
100
dB
LSB
KΩ
12VIN ADC characteristics
Symbol
Parameter
N
Resolution
Notes
MC
Missing codes
Minimum resolution for which no
missing codes are guaranteed
S/N
Signal-to-noise Ratio
Conversion rate = 500Hz
ERR_ADC
Total ADC Error
Total ADC Read Error
Min
Typ
Max
Unit
10
Bits
10
Bits
72
-4
+4
dB
LSB
Note 1 – Range depends on internal regulator set to 3.6V or 5.5V see 12VIN specification.
Note 2 – See Application Note 37 which describes the type of capacitors to use to obtain minimum leakage.
Note 3 – All logic levels are with respect to the voltage on VDD_CAP, when supplied from VDD; VDD_CAP is equal to VDD, under no load.
Note 4 – (100mV typical Hysteresis)
Note 5 – Under certain operating conditions, self-heating could result in additional temperature sensor error.
Note 6 – SDA not included (separate electrical specification)
Note 7 – The formula for the total ADC inaccuracy is: [((ADC read voltage) +/- INL)*(range of gain error)]+range of offset error
Summit Microelectronics, Inc
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SMM665B
Preliminary Information
AC OPERATING CHARACTERISTICS
Over recommended operating conditions, unless otherwise noted. All voltages are relative to GND. See
Figure 5 and 6 Timing diagrams.
Symbol
Description
tDPON
Programmable Power-on delay from
VMX out-of-fault to PUPY active
tDPOFF
Programmable Power-off delay from
VMX off to PUPY inactive
tPRTO
Programmable Reset Time-Out
Period
tSTT
Programmable Sequence
Termination Timer
tADC
10-bit ADC sampling period
tDC_CONTROL
tconv
TMARGIN
Active DC Control sampling period
Single ADC channel conversion time
Margin Time from Nominal
Summit Microelectronics, Inc
Conditions
tDPON = 0.64ms
tDPON = 12.5ms
tDPON = 25ms
tDPON = 50ms
tDPOFF = 0.64ms
tDPOFF = 12.5ms
tDPOFF = 25ms
tDPOFF = 50ms
tPRTO = 0.64ms
tPRTO = 25ms
tPRTO = 100ms
tPRTO = 200ms
tSTT = OFF
tSTT = 100ms
tSTT = 200ms
tSTT = 400ms
Time for ADC conversion
of all 11 channels
Update period for Active
DC Control of channels
A–F
Update period for Active
DC Control per channel
Slow Margin, + 10%
change in voltage with
0.1% ripple
TRIM_CAP=1μF
Fast Margin, + 10%
change in voltage with
0.1% ripple
TRIM_CAP=1μF
2089 2.1 5/25/2011
Min
Typ
Max
Unit
-15
tDPON
+15
%
-15
tDPOFF
+15
%
-15
tPRTO
+15
%
-15
tSTT
+15
%
2
ms
1.7
ms
182
μs
850
ms
85
ms
10
SMM665B
Preliminary Information
I2C 2-WIRE SERIAL INTERFACE AC OPERATING CHARACTERISTICS – 100/400kHz
Over recommended operating conditions, unless otherwise noted. All voltages are relative to GND.
See Figure 4 Timing Diagram.
Conditions
100kHz
400kHz
Symbol Description
Min Typ
Max
Min Typ
Max
fSCL
SCL Clock Frequency
tLOW
Clock Low Period
tHIGH
Clock High Period
0
Before New Transmission
- Note 1/
100
0
400
Units
KHz
4.7
1.3
μs
4.0
0.6
μs
4.7
1.3
μs
tBUF
Bus Free Time
tSU:STA
Start Condition Setup
Time
4.7
0.6
μs
tHD:STA
Start Condition Hold Time
4.0
0.6
μs
tSU:STO
Stop Condition Setup Time
4.7
0.6
μs
SCL low to valid
SDA (cycle n)
SCL low (cycle n+1)
to SDA change
0.2
3.5
0.2
0.9
tAA
Clock Edge to Data Valid
tDH
Data Output Hold Time
tR
SCL and SDA Rise Time
Note 1/
1000
1000
ns
tF
SCL and SDA Fall Time
Note 1/
300
300
ns
tSU:DAT
Data In Setup Time
250
150
ns
tHD:DAT
Data In Hold Time
0
0
ns
TI
Noise Filter SCL and SDA
Noise suppression
tWR_CONFIG
Write Cycle Time Config
Configuration
Registers
10
10
ms
tWR_EE
Write Cycle Time EE
Memory Array
5
5
ms
0.2
0.2
100
μs
μs
100
ns
Note: 1/ - Guaranteed by Design.
TIMING DIAGRAMS
tR
tF
tSU:SDA
t HD:SDA
tHIGH
t W R (For W rite O peration Only)
t LOW
SCL
SDA
tSU:DAT
tSU:STO
tBUF
(IN)
tAA
SDA
tHD:DAT
t DH
(OUT)
Figure 4 - Basic I2C Serial Interface Timing
Summit Microelectronics, Inc
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SMM665B
Preliminary Information
TIMING DIAGRAMS (CONTINUED)
0
PUP A
1
2
t DPONA
VM A
PUP B
t DPO NB
VM B
t DPO NC
PUP C
VM C
PUP D
t DPOND
VM D
Figure 5 - The SMM665B cascade sequencing the supplies on and then monitoring for fault conditions.
2
1
PUP A
0
t DPOFFA
VM A
PUP B
t DPOFFB
VM B
PUP C t
DPOFFC
VM C
PUP D
t DPOFFD
VM D
Figure 6 - The SMM665B cascade sequencing the supplies off.
Summit Microelectronics, Inc
2089 2.1 5/25/2011
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SMM665B
Preliminary Information
APPLICATIONS INFORMATION
DEVICE OPERATION
POWER SUPPLY
The SMM665B can be powered by either a 12V input
through the 12VIN pin or by a 3.3V or 5.0V input
through the VDD pin. The 12VIN pin feeds an internal
programmable regulator that internally generates
either 5.5V or 3.6V. A voltage arbitration circuit allows
the device to be powered by the highest voltage from
either the regulator output or the VDD input. This
voltage arbitration circuit continuously checks for these
voltages to determine which will power the SMM665B.
The resultant internal power supply rail is connected to
the VDD_CAP pin that allows both filtering and holdup of the internal power supply. To ensure that the
input voltage is high enough for reliable operation, an
under voltage lockout circuit holds the controlled
supplies off until the UVLO thresholds are met.
MODES OF OPERATION
The SMM665B has four basic modes of operation
(shown in Figures 5 through 8): Power-on cascade
sequencing mode, ongoing operations-monitoring
mode, supply margining mode and Power-off cascade
sequencing mode. In addition, there are two features:
ADOC and forced shutdown which can be used during
monitoring and margining mode. A detailed description
of each mode and feature follows.
ACTIVE DC OUTPUT CONTROL (ADOCTM)
The SMM665B can actively control the DC output
voltage of bricks or DC/DC converters that have a trim
pin during monitoring and margining mode. The
converter may be an off-the shelf compact device, or
may be a “roll your own” circuit on the application
board. In either case, the SMM665B dramatically
improves voltage accuracy (down to 0.2%) by
implementing closed-loop ADOC active control. This
utilizes the DC-DC’s “trim” pin as shown in Figure 12,
or an equivalent output voltage feedback adjustment
“VADJ” or “FB” node in a user’s custom circuit, Figure
13. Each of the TRIMX pins on the SMM665B is
connected to the trim input pins on the power supply
converters. A sense line from the channel’s point-ofload connects to the corresponding VM input. The
ADOC function cycles through all six channels (A-F)
every 1.7ms making slight adjustments to the voltage
on the associated TRIMX output pins based on the
voltage inputs on the VMX pins. These voltage
adjustments allow the SMM665B to control the output
voltage of power supply converters to within ±0.2%
when using a ±0.1% external voltage reference.
Figure 7 - Waveform shows four SMM665B channels
exhibiting Sequence-on to Nominal voltage, Margin
High or Low, Nominal voltage and then sequence-off
Figure 8 - Waveform shows two SMM665B channels
Sequencing-on to Nominal voltage, Margin High and
Low, and then sequence-off. Channel 3 and 4 shows
the RST and HEALTHY signals.
Ch 1 = 2.5V DC-DC converter output (Yellow trace)
Ch 2 = 1.8V DC-DC converter output (Blue trace)
Ch 3 = 1.5V DC-DC converter output (Purple trace)
Ch 4 = 1.2V DC-DC converter output (Green trace
Ch 1 = 2.5V DC-DC converter output (Yellow trace)
Ch 2 = 1.5V DC-DC converter output (Blue trace)
Ch 3 = RST signal output (Purple trace)
Ch 4 = HEALTHY signal output (Green trace
Summit Microelectronics, Inc
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SMM665B
Preliminary Information
APPLICATIONS INFORMATION (CONTINUED)
A pulse of current, either sourced or sunk for 5µs
every 1.7ms, to the capacitors connected to the
TRIM_CAPX pins adjusts the voltage output on the
TRIMX pins. The voltages on the TRIM_CAPX pins are
buffered and applied to the TRIMX pins. The voltage
adjustments on the TRIMX pins cause a slight ripple of
less than 1mV on the power supply voltages. The
amplitude of this ripple is a function of the TRIM_CAP
capacitor and the trim gain of the converter.
Application Note 37 details the calculation of the
TRIM_CAP capacitor to achieve a desired minimum
ripple.
Each channel can be programmed to either enable or
disable the Active DC Control function.
When
disabled or not active, the TRIMX pins on the
SMM665B are high impedance inputs. If disabled and
not used, they can be connected to ground. The
voltages on the TRIMX pins are buffered and applied
to the TRIM_CAPX pins charging the capacitors. This
allows a smooth transition from the converter powering
up to its nominal voltage; to the SMM665B controlling
that voltage, and to the Active DC Control nominal
setting.
The pulse of current can be increased to a 10X pulse
of current until the power supply voltages are at their
nominal settings by selecting the programmable
Speed-Up Convergence option. As the name implies,
this option decreases the time required to bring a
supply voltage from the converter’s nominal output
voltage to the Active DC Control nominal voltage
setting.
POWER-ON CASCADE SEQUENCING
The SMM665B can be programmed to sequence up to
six power supplies in any order. Each of these six
channels (A-F) has an associated open drain PUP
output that, when connected to a converter’s enable
pin, controls the turn-on of the converter.
The
channels are assigned sequence positions to
determine the order of the sequence. Any channel
can also be programmed to not take part in the
sequencing in applications with fewer than six
supplies. The polarity of each of the PUPX outputs is
programmable for use with various types of
converters.
Power-on sequencing can be initiated by the
PWR_ON/OFF pin or via I2C control. The polarity of
the PWR_ON/OFF pin is programmable. If hard wired
in its active state the SMM665B will automatically
initiate the Power-on sequence. Otherwise, toggling
Summit Microelectronics, Inc
the PWR_ON/OFF pin to its active state will initiate the
Power-on sequence. To enable software control of
the sequencing feature, the SMM665B offers an I2C
command to initiate Power-on sequencing while the
PWR_ON/OFF pin is in its inactive state.
The SMM665B can be programmed to wait until either
or both VDD and 12VIN inputs are within their
respective voltage threshold limits before Power-on
sequencing is allowed to begin. This ensures that the
converters have their full supply voltage before they
are enabled.
Once Power-on sequencing begins, the SMM665B will
wait a Power-on delay time (tDPON) for any channel in
the first sequence position (0) and then activate the
PUPX outputs for those channels. The Power-on
delay times are individually programmable for each
channel. The SMM665B will then wait until all VMX
inputs of the channels assigned to the first sequence
position (0) are above their programmed UV1
thresholds which is called cascade sequencing. At
this point, the SMM665B will enter the second
sequence position (1) and begin to timeout the Poweron delay times for the associated channels. This
process continues until all of channels in the sequence
have turned on and are above their UV1 threshold.
The status registers indicates that all sequenced
power supply channels have turned on. Once these
channels are above their UV1 thresholds, the
SMM665B will begin the Active DC Control of the
enabled channels. The Power-on sequencing mode
ends when the Active DC Controlled channels are at
their nominal voltage setting. The “Ready” bit in the
status registers signifies that the voltages are at their
set points.
The programmable sequence termination timer can be
used to protect against a stalled Power-on sequence.
This timer resets itself at the beginning of each
sequence position. All channels in the sequence
position must go above their UV1 threshold before the
sequence termination timer times out (tSTT) or the
sequence will terminate and all PUPX outputs will be
switched to their inactive state. The status registers
contain bits that indicate the sequence has been
terminated and in which sequence position the timer
timed out. This timer has four settings of OFF, 100ms,
200ms and 400ms.
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SMM665B
Preliminary Information
APPLICATIONS INFORMATION (CONTINUED)
While the SMM665B is in the Power-on sequencing
mode the RST output is held active and the HEALTHY
output is held inactive regardless of trigger sources
(Figure 8). The Power-off and Force Shutdown trigger
options are also disabled while in this mode.
Furthermore, the SMM665B will not respond to activity
on the PWR_ON/OFF pin or to a Power-off I2C
command during Power-on sequencing mode.
ONGOING OPERATIONS-MONITORING MODE
During ongoing operations mode, the part can (1)
monitor (2) actively control via ADOC, and (3) use
force shutdown if necessary.
Once the Power-on sequence is complete and before
a Power-off sequence has been initiated, the
SMM665B continues to monitor all VMX inputs, the
VDD and 12VIN inputs, and two temperature sensor
inputs with a 10-bit ADC. Each of these inputs is
sampled and converted by the ADC every 2ms. The
ADC input has a range of 0V to four times the voltage
on VREF_ADC for inputs VMA-F and the VDD input.
The range is extended to 12 times VREF_ADC for the
12VIN input and is reduced to two times VREF_ADC
for the AIN1 and AIN2 inputs.
The SMM665B monitors internal temperature using
the 10-bit ADC and the automonitor function. Two
under temperature and two over temperature
thresholds can be set, each with its own
programmable trigger options and consecutive
conversion before trigger counter. Resolution is 0.25 C
per bit scaled over the range of -128 C to 127.75 C.
The temperature value can be acquired over the I2C
bus as a 10-bit signed two's complement value.
The SMM665B compares each resulting ADC
conversion with two programmable 10-bit undervoltage limits (UV1, UV2) and two programmable 10bit over-voltage limits (OV1, OV2) for the
corresponding input.
A consecutive conversion
counter is used to provide filtering of the ADC inputs.
Each limit can be programmed to require 1, 2, 4 or 6
consecutive out-of-limit conversions before it is said to
be in fault. One in-limit conversion will remove the
fault from the threshold limit. This provides digital
filtering of the monitored inputs. The ADC inputs VMAF can use additional filtering by connecting a capacitor
from the corresponding CAPX pins to ground to form
an analog RC filter (R=25kΩ). The input is considered
to be in a fault condition if any of its limit thresholds
are in fault. Setting an OV threshold limit to full-scale
(3FFHEX), or setting an UV threshold limit to 000HEX
ensures that the limit can never be in fault.
Summit Microelectronics, Inc
The status registers provide the real-time status of all
monitored inputs.
The voltage threshold limits for inputs VMA-F, VDD and
12VIN can be programmed to trigger the RST and
HEALTHY outputs as well as a Force Shutdown and
Power-off operation when exceeded. The threshold
limits for the internal temperature sensor and the AIN1
and AIN2 inputs can be programmed to trigger the
RST, HEALTHY, and FAULT outputs.
The HEALTHY and FAULT outputs of the SMM665B
are active as long as the triggering limit remains in a
fault condition. The RST output also remains active as
long as the triggering limit remains in a fault condition;
however, once the trigger source goes away the RST
will remain active for a reset timeout period (tPRTO).
TEMPERATURE SENSOR ACCURACY
The internal temperature sensor accuracy is ±5oC from
-40 to +90oC. The sensor measures the temperature
of the SMM665B die and the ambient temperature. If
VDD is at 5V, the die temperature is +2oC and at 12V,
it is +4oC. In order to calculate this difference in
specific applications measure the Vdd or 12VIN supply
current and calculate the power dissipated and
multiply by 80oC/W. For instance, 5V and 5mA is
25mW, which creates a 2oC offset.
MARGINING
The SMM665B has two additional Active DC Output
Control voltage settings for channels A-F; margin high
and margin low. The margin high and margin low
voltage settings can range from 0.3V to VDD of the
converters’ nominal output voltage depending on the
specified margin range of the DC-DC converter.
These settings are stored in the configuration registers
and are loaded into the Active DC Control voltage
setting by margin commands issued via the I2C bus.
The channel must be enabled for Active DC Control in
order to enable margining. The margin command
registers contain two bits for each channel that decode
the commands to margin high, margin low, or control
to the nominal setting. Therefore, any combination of
margin high, margin low, and nominal control is
allowed in the margining mode.
Once the SMM665B receives the command to margin
the supply voltages, it begins adjusting the supply
voltages to move toward the desired setting. When all
channels are at their voltage setting, a bit is set in the
margin status registers.
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SMM665B
Preliminary Information
APPLICATIONS INFORMATION (CONTINUED)
Note: Configuration writes or reads of registers 00HEX
to 0FHEX should not be performed while the SMM665B
is margining.
POWER-OFF CASCADE SEQUENCING
The SMM665B can be programmed to perform Poweroff sequencing in either the same order or reverse
order of Power-on cascade sequencing.
Power-off cascade sequencing can be initiated by the
PWR_ON/OFF pin, via I2C control or triggered by a
fault condition on any of the monitored inputs.
Toggling the PWR_ON/OFF pin to its inactive state will
initiate the Power-off sequence.
To enable software control of the Power-off
sequencing feature, the SMM665B offers an I2C
command to initiate Power-off sequencing regardless
of the state of the PWR_ON/OFF pin. Furthermore,
Power-off sequencing can be initiated by a fault
condition on a monitored input.
Once Power-off sequencing begins, the SMM665B will
wait a Power-off delay time (tDPOFF) for any channel in
the last sequence position (reverse order) and then
deactivate the PUP outputs for those channels. The
Power-off delay times are individually programmable
for each channel. The SMM665B will then wait until all
VMX inputs of the channels assigned to that sequence
position are below the programmed OFF thresholds.
At this point, the SMM665B will decrement to the next
sequence position and begin to timeout the Power-off
delay times for the associated channels. This process
continues until all of channels in the sequence have
turned off and are below their OFF thresholds. The
status register reveals that all sequenced channels
have turned off. The Power-off sequencing mode
ends when all sequenced supplies are below their
OFF thresholds.
The programmable sequence termination timer can be
used to protect against a stalled Power-off sequence.
This timer resets itself at the beginning of each
sequence position. All channels in the sequence
position must go below their OFF threshold before the
sequence termination timer times out (tSTT) or the
sequence will terminate and all PUP outputs will be
switched to their inactive state. This timer has four
settings of OFF, 100ms, 200ms and 400ms. The
sequence termination timer can be disabled separately
for Power-off sequencing.
Summit Microelectronics, Inc
While the SMM665B is in the Power-off sequencing
mode the RST output is held active and the HEALTHY
output is held inactive regardless of trigger sources
(Figure 8). The Force Shutdown trigger option is also
disabled while in this mode.
Furthermore, the
SMM665B will not respond to activity on the
PWR_ON/OFF pin or to a Power-on I2C command
during Power-off sequencing mode.
FORCE SHUTDOWN
The Force Shutdown operation brings all PUPX
outputs to their inactive state. This operation is used
for an emergency shutdown when there is not enough
time to sequence the supplies off.
The Force
Shutdown operation shuts off all sequenced channels
and waits for the supply voltages to drop below their
respective OFF thresholds.
A Force Shutdown operation can be initiated by any
one of four events. The first two methods for initiating
a Force Shutdown are always enabled. Simply taking
the FS pin to its active state will initiate a Force
Shutdown operation and maintain it until the pin is
brought to its inactive state. An I2C Force Shutdown
command allows the Force Shutdown operation to be
initiated via software control. This I2C Force Shutdown
command sets a volatile register bit that triggers a
Force Shutdown.
This bit is cleared after all
sequenced channels have dropped below their OFF
voltage threshold. During Power-on and Power-off
sequencing, the sequence termination timer can
initiate a Force Shutdown operation.
As described in the previous sections, the sequence
termination timer triggers a Force Shutdown operation
if it times out before the power supply voltages
surpass their voltage thresholds.
This Force
Shutdown will remain active until all sequenced power
supply channels have dropped below their OFF
voltage threshold. While the SMM665B is in ongoing
operations-monitor mode, a programmed fault
condition on any power supply channel or on the
12VIN or VDD inputs can trigger a Force Shutdown. A
Force Shutdown resulting from this will remain active
until all sequenced power supply channels have
dropped below their OFF voltage threshold.
For restarting the device, the FS command needs to
be cleared by writing that bit to a zero. This will clear
the command and, if the POWER-ON/OFF pin is not
being forced low externally the SMM665B will begin a
power-on sequence
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SMM665B
Preliminary Information
APPLICATIONS INFORMATION (CONTINUED)
SMM665 Brownout Recovery/Handling
During a power ‘brown-out’ (Figure 9) the SMM665B
can default to a power-off state, thus requiring toggling
of the PWR_ON/OFF pin to enable the device to
perform a power-on sequence. For applications using
I2C control of the power-on/power-off function, the
same result may be effected by, upon recovery of
power, issuing a software (I2C) ‘Power-Off’ command
followed by a ‘Power-On’ command and ending with
a ‘Clear’ command. If the PWR_ON/OFF pin is in the
asserted state, the SMM665B will initiate a power-on
sequence once all input conditions are met. Otherwise
the PWR_ON/OFF pin may require toggling if, upon
recovery from the ‘brownout’, it is in the de-asserted
state.
-48V Supply
0V
-48V
Pow er Brow n-Out
SMM665 Supplies
SMM665 Hold-Up Time
+12VIN
VDD_CAP
Figure 9 - Power Brown-Out with Resulting Loss of SMM665B Supply Voltages
Summit Microelectronics, Inc
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SMM665B
Preliminary Information
APPLICATIONS INFORMATION (CONTINUED)
RESTART
OF
SEQUENCING
POWER-ON
CASCADE
Once a Force Shutdown or Power-off operation has
completed, the SMM665B can restart the Power-on
cascade sequencing. The device can be programmed
to automatically restart after a Force Shutdown
provided the PWR_ON/OFF pin remains in the active
state or the I2C Power-on command remains in the
command register. If this option is not selected, the
SMM665B requires toggling of the PWR_ON/OFF pin
or toggling of the I2C commands by issuing a Poweroff command and then reissuing the Power-on
command in order to restart Power-on sequencing.
In either case, assertion of the FS pin will prevent the
SMM665B from restarting Power-on sequencing. In
addition, the device can be programmed to check that
VDD and the 12VIN are within their programmed
voltage thresholds before restarting Power-on
sequencing.
In cases where brownout conditions (Figure 10) or
loss of power are used to cause a sequence off of the
supplies or a Force Shutdown, it is best to toggle the
PWR_ON/OFF pin or use the I2C Power commands
after the brownout condition is over or if the supplies
do not fully discharge before initiating a Power-on
sequence.
Recommended Use of the PWR_ON/OFF pin:
The PWR_ON/OFF pin is edge-triggered to lock out
false or nuisance signals during both the power-on
and power-off sequences. If during a system powerdown, whether deliberate or due to a failed power
system, the VDD_CAP voltage falls below 2.5V, the
SMM665B internal UVLO (UnderVoltage LockOut)
circuit resets all internal logic. Once power has
recovered above 2.6V the SMM665B will restart
assuming the PWR_ON/OFF pin is in the asserted
state or an I2C power command is issued. The
SMM665B can be used with the PWR_ON/OFF pin
either toggled by a logic level, controlled by a software
command or tied either high or low as described in the
data sheet.
VDD_CAP
3.6V, 5.5V
2.6V
2.5V
UVLO
(Internal)
Figure 10 - Timing Sequence recovering from a VDD_CAP Power ‘Brown-Out’
Summit Microelectronics, Inc
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SMM665B
Preliminary Information
APPLICATIONS INFORMATION (CONTINUED)
SMM665B
Figure 11 – SMM665B Distributed power applications schematic. The accuracy of the external reference
(U10) sets the accuracy of the ADOC function. Total accuracy with a ±0.1% external reference is ±0.2%.
Summit Microelectronics, Inc
2089 2.1 5/25/2011
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SMM665B
Preliminary Information
APPLICATIONS INFORMATION (CONTINUED)
VIN
12V
VREG_IN
12V
PUPB
C8
Rtrim
1.6K
SS1
TRIMB
FB1
SDA
I2C BUS
CS
R7
R9
SCL
VMB+
VSW1
FB1S
SMM665B
Not all components Shown
For interface purposes only
Part designators are from
the International Rectifier
iP1202 Demo board .
PUPA
VOUT1
1.5V
C7
TRIMA
Rtrim
3.3K
SS2
FB2
R8
R10
VMA+
IR
iP1202
VSW2
FB2S
VOUT2
2.5V
Figure 12 – The SMM665B can be used to sequence and control discrete DC switching regulators. The ADOC
function sets the output voltage of the IR iP1202 Regulator through the FBX feedback pins. Accuracy is
improved even under full load, essentially acting as a “SENSE” pin. The sequence function is applied
through the iP1202 SSX soft start pins.
Figure 13 – Ch1 is set to 2.5V and Ch2 is set to
1.5V on the ip1202 board. Ch1 is set to sequence
on first followed by Ch2 after 50ms. Then Ch1 is
margined high while Ch2 is margined low. Ch2 is
then sequenced off followed by Ch1 after 50ms.
Summit Microelectronics, Inc
Figure 14 – This is the same sequencing-on
function but with a shorter delay between
channels, the HEALTHY and RESET flags are also
shown.
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SMM665B
Preliminary Information
DEVELOPMENT HARDWARE & SOFTWARE
The end user can obtain the Summit SMX3200
programming
system
for
device
prototype
development. The SMX3200 system consists of a
programming Dongle, cable and WindowsTM GUI
software. It can be ordered on the website or from a
local representative.
The SMX3200 programming Dongle/cable interfaces
directly between a PC’s parallel port and the target
application. The device is then configured on-screen
via an intuitive graphical user interface employing
drop-down menus.
The Windows GUI software will generate the data and
send it in I2C serial bus format so that it can be directly
downloaded to the SMM665B via the programming
Dongle and cable. An example of the connection
interface is shown in Figure 15.
When design prototyping is complete, the software
can generate a HEX data file that should be
transmitted to Summit for approval. Summit will then
assign a unique customer ID to the HEX code and
program production devices before the final electrical
test operations.
This will ensure proper device
operation in the end application.
Top view of straight 0.1" x 0.1 closed-side
connector. SMX3200 interface cable connector.
D1
Pin 10, Reserved
Pin 8, Reserved
Pin 6, MR#
Pin 4, SDA
Pin 2, SCL
1N4148
VDD_CAP
SMM665B
MR
SDA
SCL
10
8
6
4
2
9
7
5
3
1
Pin 9, 5V
Pin 7, 10V
Pin 5, Reserved
Pin 3, GND
Pin 1, GND
0.1μF
GND
Figure 15 – SMX3200 Programmer I2C serial bus connections to program the SMM665B. Note that the MR
pin does not need to be connected to pin 6 for programming purposes.
The latest revisions of all software and an application brief describing the SMX3200 is available from the website at:
http://www.summitmicro.com/tech_support/program_kit/SMX3200.htm
Summit Microelectronics, Inc
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SMM665B
Preliminary Information
I2C PROGRAMMING INFORMATION
SERIAL INTERFACE
Access to the configuration registers, general-purpose
memory and command and status registers is carried
out over an industry standard 2-wire serial interface
(I2C). SDA is a bi-directional data line and SCL is a
clock input. Data is clocked in on the rising edge of
SCL and clocked out on the falling edge of SCL. All
data transfers begin with the MSB. During data
transfers SDA must remain stable while SCL is high.
Data is transferred in 8-bit packets with an intervening
clock period in which an Acknowledge is provided by
the device receiving data. The SCL high period (tHIGH)
is used for generating Start and Stop conditions that
precede and end most transactions on the serial bus.
A high-to-low transition of SDA while SCL is high is
considered a Start condition while a low-to-high
transition of SDA while SCL is high is considered a
Stop condition.
The interface protocol allows operation of multiple
devices and types of devices on a single bus through
unique device addressing.
The address byte is
comprised of a 4-bit device type identifier (slave
address) and a 3-bit bus address. The remaining bit
indicates either a read or a write operation. Refer to
Table 1 for a description of the address bytes used by
the SMM665B.
The device type identifier for the memory array is
generally set to 1010BIN following the industry standard
for a typical nonvolatile memory. There is an option to
change the identifier to 1011BIN allowing it to be used
on a bus that may be occupied by other memory
devices. The configuration registers are grouped with
the memory array and thus use 1010BIN or 1011BIN as
the device type identifier. The command and status
registers as well as the 10-bit ADC are accessible with
the separate device type identifier of 1001BIN.
The bus address bits A[1:0] are programmed into the
configuration registers. Bus address bit A[2] can be
programmed as either 0 or biased by the A2 pin. The
bus address accessed in the address byte of the serial
data stream must match the setting in the SMM665B
and on the A2 pin.
Summit Microelectronics, Inc
Any access to the SMM665B on the I2C bus will
temporarily halt the monitoring function. This does not
affect the ADOC function, which will continue
functioning and control the DC outputs. This is true
not only during the monitor mode, but also during
Power-on and Power-off sequencing when the device
is monitoring the channels to determine if they have
turned on or turned off.
The SMM665B halts the monitor function from when it
acknowledges the address byte until a valid stop is
received.
WRITE
Writing to the memory or a configuration register is
illustrated in Figures 16, 17, 19, 21 and 22. A Start
condition followed by the address byte is provided by
the host; the SMM665B responds with an
Acknowledge; the host then responds by sending the
memory address pointer or configuration register
address pointer; the SMM665B responds with an
acknowledge; the host then clocks in on byte of data.
For memory and configuration register writes, up to 15
additional bytes of data can be clocked in by the host
to write to consecutive addresses within the same
page. After the last byte is clocked in and the host
receives an Acknowledge, a Stop condition must be
issued to initiate the nonvolatile write operation.
READ
The address pointer for the configuration registers,
memory, command and status registers and ADC
registers must be set before data can be read from the
SMM665B. This is accomplished by a issuing a
dummy write command, which is simply a write
command that is not followed by a Stop condition.
The dummy write command sets the address from
which data is read. After the dummy write command
is issued, a Start command followed by the address
byte is sent from the host. The host then waits for an
Acknowledge and then begins clocking data out of the
slave device. The first byte read is data from the
address pointer set during the dummy write command.
Additional bytes can be clocked out of consecutive
addresses with the host providing an Acknowledge
after each byte. After the data is read from the desired
registers, the read operation is terminated by the host
holding SDA high during the Acknowledge clock cycle
and then issuing a Stop condition. Refer to Figures
18, 20 and 23 for an illustration of the read sequence.
2089 2.1 5/25/2011
22
SMM665B
Preliminary Information
I2C PROGRAMMING INFORMATION (CONTINUED)
WRITE PROTECTION
The SMM665B powers up into a write protected mode.
Writing a code to the volatile write protection register
can disable the write protection. The write protection
register is located at address 87HEX of slave address
1001BIN.
Writing 0101BIN to bits [7:4] of the write protection
register allow writes to the general-purpose memory
while writing 0101BIN to bits [3:0] allow writes to the
configuration registers. The write protection can reenable by writing other codes (not 0101BIN) to the write
protection register. Writing to the write protection
register is shown in Figure 16.
CONFIGURATION REGISTERS
The majority of the configuration registers are grouped
with the general-purpose memory located at either
slave address 1010BIN or 1011BIN. The bus address
bits, A[1:0], used to differentiate the general-purpose
memory from the configuration registers are set to
11BIN. Bus address bit A[2] can be programmed as
either 0 or biased by the A2 pin.
Two additional configuration registers are located at
addresses 83HEX and 84HEX of slave address 1001BIN.
Writing and reading the configuration registers is
shown in Figures 17, 18, 19, 20 and 21
Note: Configuration writes or reads of registers 00HEX
to 0FHEX should not be performed while the SMM665B
is margining.
GENERAL-PURPOSE MEMORY
The 4k-bit general-purpose memory is located at
either slave address 1010BIN or 1011BIN. The bus
address bits, A[1:0], used to differentiate the generalpurpose memory from the configuration registers are
set to 00BIN for the first 2k-bits and 01BIN for the second
2k-bits. Bus address bit A[2] can be programmed as
either 0 or biased by the A2 pin. The word address
must be set each time the memory is accessed.
Slave Address
1001BIN
1010BIN
or
1011BIN
Summit Microelectronics, Inc
Bus Address
A2 A1 A0
Memory writes and reads are shown in Figures 22, 23
and 24.
COMMAND AND STATUS REGISTERS
The command and status registers are located at
slave address 1001BIN. Writes and reads of the
command and status registers are shown in Figures
25 and 26.
ADC CONVERSIONS
An ADC conversion on any monitored channel can be
performed and read over the I2C bus using the ADC
read command and requires 182μs to complete. The
ADC read command, shown in Figure 27, starts with a
dummy write to the 1001BIN slave address. Bits [6:3]
of the word address byte are used to address the
desired monitored input.
Once the device
acknowledges the channel address, it begins the ADC
conversion of the addressed input. This conversion
requires 70μs to complete. During this conversion
time, acknowledge polling can be used.
The
SMM665B will not acknowledge the address bytes
until the conversion is complete. When the conversion
has completed, the SMM665B will acknowledge the
address byte and return the 10-bit conversion along
with a 4-bit channel address echo.
GRAPHICAL USER INTERFACE (GUI)
Device configuration utilizing the Windows based
SMM665B graphical user interface (GUI) is highly
recommended. The software is available from the
Summit website at:
(http://www.summitmicro.com/tech_support/tech.htm#
GUI.
Using the GUI in conjunction with this datasheet and
Application Note 33, simplifies the process of device
prototyping and the interaction of the various
functional blocks. A programming Dongle (SMX3200)
is available from Summit to communicate with the
SMM665B. The Dongle connects directly to the
parallel port of a PC and programs the device through
a cable using the I2C bus protocol.
Register Type
Write Protection Register,
Command and Status Registers,
Two Configuration Registers,
ADC Conversion Readout
A2 0 0
1st 2-k Bits of General-Purpose Memory
A2 0 1
2nd 2-k Bits of General-Purpose Memory
A2 1 1
Configuration Registers
2089 2.1 5/25/2011
23
SMM665B
Preliminary Information
I2C PROGRAMMING INFORMATION (CONTINUED)
Table 1 - Address bytes used by the SMM665B.
M aster
S
T
A
R
T
Configuration
Register Address = 87 HEX
Bus Address
1
0
0
A
2
1
A
1
A
0
W
1
0
A
C
K
Slave
0
0
0
1
8 HEX
S
T
O
P
Data = 55 HEX
1
1
0
1
0
1
0
1
0
1
A
C
K
7 HEX
A
C
K
5 HEX Unlocks
General Purpose
EE
W rite Protection
Register Address
5 HEX Unlocks
Configuration
Registers
Figure 16 – Write Protection Register Write
Master
S
T
A
R
T
Configuration
Register Address
Bus Address
1
0
S
A
0
1
A
2
1
1
C
7
W
C
6
C
5
C
4
C
3
Data
C
2
C
1
C
0
D
7
A
C
K
Slave
S
T
O
P
D
6
D
5
D
4
D
3
D
2
D
1
D
0
A
C
K
A
C
K
Figure17 – Configuration Register Byte Write
Master
S
T
A
R
T
Configuration
Register Address
Bus Address
1
0
1
S
A
0
A
2
1
1
C
6
C
5
C
4
C
3
C
2
C
1
C
0
A
C
K
Slave
D
7
D
6
D
7
D
6
D
5
D
4
D
3
D
5
D
4
D
3
D
2
D
1
D
0
A
C
K
A
C
K
Data (2)
Master
Slave
C
7
W
Data (1)
S
T
O
P
Data (16)
D
2
D
1
D
0
D
7
D
6
D
5
D
2
D
1
A
C
K
D
0
D
7
D
6
D
5
D
4
A
C
K
D
3
D
2
D
1
D
0
A
C
K
Figure 18 – Configuration Register Page Write
Summit Microelectronics, Inc
2089 2.1 5/25/2011
24
SMM665B
Preliminary Information
I2C PROGRAMMING INFORMATION (CONTINUED)
Master
S
T
A
R
T
Configuration
Register Address
Bus Address
1
0
S
A
0
1
A
2
1
1
S
T
A
R
T
C
7
W
C
6
C
5
C
4
C
3
C
2
C
1
C
0
A
C
K
Slave
Master
Bus Address
1
0
D
6
D
5
D
4
A
2
1
D
2
D
1
D
0
D
7
Slave
R
A
C
K
N
A
C
K
Data (n)
D
3
1
A
C
K
Data (1)
D
7
S
A
0
1
D
6
D
5
D
2
D
1
D
0
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
S
T
O
P
D
0
A
C
K
Figure 19 - Configuration Register Read
Master
S
T
A
R
T
Configuration
Register Address
Bus Address
1
0
0
A
2
1
A
1
A
0
C
7
W
C
6
C
5
C
4
C
3
Data
C
2
C
1
C
0
D
7
A
C
K
Slave
S
T
O
P
D
6
D
5
D
4
D
3
D
2
D
1
D
0
A
C
K
A
C
K
Figure 20 - Configuration Register with Slave Address 1001BIN Write
S
T
A
R
T
Master
Configuration
Register Address
Bus Address
1
0
0
1
A
2
A
1
A
0
S
T
A
R
T
C
7
W
C
6
C
5
C
4
C
3
C
2
C
1
C
0
A
C
K
Slave
Bus Address
1
D
7
Slave
D
6
D
5
D
4
D
3
0
1
A
2
A
1
D
1
D
0
D
7
R
A
C
K
N
A
C
K
Data (n)
D
2
A
0
A
C
K
Data (1)
Master
0
D
6
D
5
D
2
D
1
D
0
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
S
T
O
P
D
0
A
C
K
Figure 21 - Configuration Register with Slave Address 1001BIN Read
Summit Microelectronics, Inc
2089 2.1 5/25/2011
25
SMM665B
Preliminary Information
I2C PROGRAMMING INFORMATION (CONTINUED)
Master
S
T
A
R
T
Memory Address
Bus Address
0
1
S
A
0
1
A
2
0
/
1
0
C
6
C
7
W
C
5
C
4
C
3
Data
C
2
C
1
C
0
D
7
A
C
K
Slave
S
T
O
P
D
6
D
5
D
4
D
3
D
2
D
1
D
0
A
C
K
A
C
K
Figure 22 – General Purpose Memory Byte Write
Master
S
T
A
R
T
Memory Address
Bus Address
1
0
1
S
A
0
A
2
0
/
1
0
C
7
W
C
6
C
5
C
4
C
3
Data (1)
C
2
C
1
C
0
A
C
K
Slave
Master
D
7
D
6
D
6
D
5
D
4
D
3
D
4
D
3
D
2
D
1
D
0
A
C
K
A
C
K
Data (2)
D
7
D
5
S
T
O
P
Data (16)
D
2
D
1
D
0
D
7
D
6
D
5
D
2
D
1
D
0
A
C
K
Slave
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
A
C
K
A
C
K
Figure 23 - General Purpose Memory Page Write
Master
S
T
A
R
T
Memory Address
Bus Address
1
0
1
S
A
0
A
2
0
0
/
1
C
7
W
C
6
C
5
C
4
C
3
C
2
C
1
C
0
A
C
K
Slave
Master
Bus Address
1
D
6
D
5
D
4
D
3
0
1
S
A
0
A
2
0
D
1
D
0
D
7
R
A
C
K
N
A
C
K
Data (n)
D
2
0
/
1
A
C
K
Data (1)
D
7
Slave
S
T
A
R
T
D
6
D
5
D
2
D
1
A
C
K
D
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
S
T
O
P
D
0
A
C
K
Figure 24 - General Purpose Memory Read
Summit Microelectronics, Inc
2089 2.1 5/25/2011
26
SMM665B
Preliminary Information
I2C PROGRAMMING INFORMATION (CONTINUED)
Master
S
T
A
R
T
Command and Status
Register Address
Bus Address
1
0
0
A
2
1
A
1
A
0
C
7
W
C
6
C
5
C
4
C
3
C
2
Data
C
1
C
0
A
C
K
Slave
S
T
O
P
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
A
C
K
A
C
K
Figure 25 – Command and Status Register Write
Master
S
T
A
R
T
Command and Status
Register Address
Bus Address
1
0
0
A
2
1
A
1
A
0
S
T
A
R
T
C
7
W
C
6
C
5
C
4
C
3
C
2
C
1
C
0
A
C
K
Slave
Bus Address
1
D
7
D
6
D
5
D
4
D
3
0
A
2
1
A
1
A
0
A
C
K
N
A
C
K
Data (n)
D
2
D
1
D
0
Slave
D
7
R
A
C
K
Data (1)
Master
0
D
6
D
5
D
2
D
1
D
0
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
S
T
O
P
D
0
A
C
K
Figure 26 - Command and Status Register Read
Master
S
T
A
R
T
Channel Address
Bus Address
1
0
0
1
A
2
A
1
A
0
C
H
3
C
H
2
C
H
1
C
H
0
0
0
S
T
A
R
T
0
1
A
2
A
1
A
0
1
Channel Address Echo
R
0
0
1
A
2
A
1
A
0
R
A
C
K
Bus Address
0
N
A
C
K
Bus Address
0
A
C
K
1
Slave
0
W
Slave
Master
S
T
A
R
T
0
C
H
3
C
H
2
C
H
1
C
H
0
N
A
C
K
10-Bit ADC Data
0
D
9
D
8
D
7
D
6
D
5
D
4
D
3
D
2
D
1
S
T
O
P
D
0
A
C
K
A
C
K
Figure 27 – ADC Conversion Read
Summit Microelectronics, Inc
2089 2.1 5/25/2011
27
SMM665B
Preliminary Information
DEFAULT CONFIGURATION REGISTER SETTINGS – SMM665BFC-266
Register
Contents
Register
Contents
Register
Contents
Register
Contents
R0
0D
R40
0D
R98
41
RBF
E0
R1
83
R41
B9
R99
3E
RC0
0B
R2
0D
R42
0E
R9A
81
RC1
38
R3
FF
R43
39
R9B
33
RC2
0B
R4
0E
R44
0E
R9C
29
RC3
38
R5
61
R45
A4
R9D
9A
RC4
09
R6
0E
R46
0F
R9E
11
RC5
90
R7
C7
R47
16
R9F
AE
RC6
09
R8
0F
R48
0F
RA0
41
RC7
90
R9
54
R49
B4
RA1
0B
RC8
0C
RA
0B
R4A
06
RA2
80
RC9
00
RB
22
R4B
7F
RA3
F6
RCA
0C
RC
7F
R4C
00
RA4
29
RCB
00
RD
3F
R4D
12
RA5
5D
RCC
0F
RE
03
R4E
50
RA6
11
RCD
FF
RF
01
R80
42
RA7
71
RCE
0F
R10
8F
R81
48
RA8
40
RCF
FF
R11
9F
R82
82
RA9
CE
RD0
0C
R12
AF
R83
3E
RAA
80
RD1
00
R13
BF
R84
2A
RAB
8F
RD2
0C
R14
CF
R85
B8
RAC
29
RD3
00
R15
DF
R86
12
RAD
1F
RD4
0F
R18
00
R87
F6
RAE
11
RD5
D8
R19
00
R88
41
RAF
33
RD6
0F
R30
0D
R89
C8
RB0
2A
RD7
D8
R31
60
R8A
81
RB1
67
RE0
00
R32
0D
R8B
B9
RB2
0A
RE1
3D
R33
DC
R8C
2A
RB3
52
RE2
00
R34
0E
R8D
34
RB4
03
RE3
3D
R35
45
R8E
12
RB5
FF
RE4
00
R36
0E
R8F
49
RB6
03
RE5
3D
R37
A2
R90
49
RB7
FF
RE6
00
R38
0F
R91
5C
RB8
0D
RE7
3D
R39
08
R92
81
RB9
9A
RE8
00
R3A
0F
R93
52
RBA
0D
RE9
3D
R3B
D6
R94
29
RBB
56
REA
00
R3C
00
R95
D7
RBC
0F
REB
3D
R3D
12
R96
11
RBD
E0
R3E
50
R97
EB
RBE
0F
The default device ordering number is SMM665BFC-266. It is programmed with the register contents as shown above
and tested over the commercial temperature range with a default VREF setting of 1.25V. Other standard external
VREF voltage settings that can be specified and tested are values of: 1.024, 1.225, 1.250, 2.048, 2.500, 3.000 or
3.300. The value is derived from the customer supplied hex file. New device suffix numbers are assigned for all nondefault VREF requirements. If other VREF values are required, please contact a Summit Microelectronics Sales
Representative.
RC1
Application Note 33 contains a complete description of the Windows GUI and the default settings of each of
the 154 individual Configuration Registers.
Summit Microelectronics, Inc
2089 2.1 5/25/2011
28
SMM665B
Advanced Information
PACKAGE
48 PIN TQFP PACKAGE
0.354
(9.00)
BSC (A)
0.276
(7.00)
BSC (B)
Inches
(Millim eters)
0.02
(0.5)
BSC
0.007 - 0.011
(0.17 - 0.27)
DETAIL "A"
(B)
(A)
Ref Jedec M S-026
0.037 - 0.041
0.95 - 1.05
Pin 1
Indicator
0.039
(1.00)
0.047
MAX.
(1.2)
A
0 o Min to
7 o Max
0.002 - 0.006
(0.05-0.15)
B
Ref
0.018 - 0.030
(0.45 - 0.75)
DETAIL "B"
Summit Microelectronics, Inc
2083 1.1 05/13/04
29
SMM665B
Preliminary Information
PART MARKING
100% Sn, RoHS compliant
SUMMIT
SMM665BFL
Summit
Part Number
Unique Assembly Lot
Tracking Code
MNYYWW
nnnn
AYWW
Pin 1
Date Code (YWW)
Lot tracking code (Summit use)
Part Number suffix
(Contains Customer specific
ordering requirements)
Drawing not to scale
ORDERING INFORMATION
Summit
Part
Number
SMM665B F
Package
F=48 Lead TQFP
C
nnnn L
Environmental Attribute
Temp Range
C=Commercial
Blank=Industrial
Part Number Suffix (see page 28)
Specific requirements are contained in the suffix such as Hex code, Hex
code revision, etc. The calibrated VREF voltage settings are standard
values of: 1.024, 1.225, 1.250, 2.048, 2.500, 3.000 or 3.300
NOTICE
NOTE 1 - This is a Preliminary Information data sheet that describes a Summit product currently in pre-production with limited characterization.
Revision 2.1 - This document supersedes all previous versions. Data Sheet updates can be accessed by “right” or “left” mouse clicking on the link:
http://www.summitmicro.com/prod_select/summary/SMM665/SMM665.htm
SUMMIT Microelectronics, Inc. reserves the right to make changes to the products contained in this publication in order to improve design,
performance or reliability. SUMMIT Microelectronics, Inc. assumes no responsibility for the use of any circuits described herein, conveys no license
under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained
herein reflect representative operating parameters, and may vary depending upon a user’s specific application. While the information in this
publication has been carefully checked, SUMMIT Microelectronics, Inc. shall not be liable for any damages arising as a result of any error or
omission.
SUMMIT Microelectronics, Inc. does not recommend the use of any of its products in life support or aviation applications where the failure or
malfunction of the product can reasonably be expected to cause any failure of either system or to significantly affect their safety or effectiveness.
Products are not authorized for use in such applications unless SUMMIT Microelectronics, Inc. receives written assurances, to its satisfaction, that:
(a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of SUMMIT Microelectronics, Inc.
is adequately protected under the circumstances.
© Copyright 2006 SUMMIT MICROELECTRONICS, Inc.
TM
ADOC
PROGRAMMABLE POWER FOR A DIGITAL WORLD™
is a registered trademark of Summit Microelectronics Inc., I2C is a trademark of Philips Corporation.
Summit Microelectronics, Inc
2089 2.1 5/25/2011
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