VSSC520S 200V Surface Mount Trench MOS Barrier Schottky Rectifier 5.0A FEATURES • Low profile package • Ideal for automated placement • Trench MOS Schottky technology • Low power losses, high efficiency • Low forward voltage drop • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC • Halogen-free according to IEC 61249-2-21 definition Mechanical Data Case: DO-214AB (SMC) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free and RoHS compliant, commercial grade Terminals: Matte tin plated leads, solderable J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 1A whisker test per Polarity: Color band denotes the cathode end MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL VSSC520S Device marking code UNIT V5D Maximum repetitive peak reverse voltage VRRM V IF 5.0 IF (2) 2.2 IFSM 100 A dV/dt 10 000 V/μs TJ, TSTG - 40 to + 150 °C Maximum DC forward current Peak forward surge current 10 ms single half sine-wave superimposed on rated load Voltage rate of change (rated VR) Operating junction and storage temperature range 200 (1) A ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER Instantaneous forward voltage TEST CONDITIONS IF = 5.0 A VR = 180 V Reverse current per diode VR = 200 V Typical junction capacitance TA = 25 °C TA = 125 °C SYMBOL VF (1) TYP. MAX. 1.19 1.70 0.67 0.75 UNIT V TA = 25 °C 2.0 - μA TA = 125 °C 2.0 - mA TA = 25 °C IR (2) TA = 125 °C 4.0 V, 1 MHz CJ 4 200 μA 3.2 25 mA 280 - pF THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL Typical thermal resistance VSSC520S RJA (1) 95 RJM (2) 9 UNIT °C/W Notes (1) Free air, mounted on recommended PCB 1 oz. pad area; thermal resistance R JA - junction to ambient (2) Units mounted on PCB with 25 mm x 25 mm copper pad areas; thermal resistance R JM - junction to mount E-mail: [email protected] 1 of 2 Web Site: www.taychipst.com VSSC520S 200V Surface Mount Trench MOS Barrier Schottky Rectifier RATINGS AND CHARACTERISTIC CURVES Average Power Loss (W) Average Forward Rectified Current (A) D = 0.3 5 4 3 2 D = 0.2 3.5 3.0 D = 1.0 D = 0.1 2.5 2.0 T 1.5 1.0 1 0.5 TM Measured at Terminal D = tp/T tp 0 0 25 75 50 100 125 150 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0 175 TM - Mount Temperature (°C) Average Forward Current (A) Fig. 1 - Maximum Forward Current Derating Curve Fig. 2 - Forward Power Loss Characteristics 1000 100 TJ = 25 °C f = 1.0 MHz Vsig = 50 mVp-p TA = 150 °C Junction Capacitance (pF) Instantaneous Forward Current (A) D = 0.5 D = 0.8 4 0 10 TA = 125 °C TA = 100 °C 1 100 TA = 25 °C 0.1 10 0 0.2 0.4 0.6 1.0 0.8 1.2 1.4 0.1 1.6 1 10 100 Instantaneous Forward Voltage (V) Reverse Voltage (V) Fig. 3 - Typical Instantaneous Forward Characteristics Fig. 5 - Typical Junction Capacitance 100 1000 Transient Thermal Impedance (°C/W) Instantaneous Reverse Current (mA) VSSC520S 4.5 6 5.0A 10 TA = 150 °C TA = 125 °C 1 TA = 100 °C 0.1 0.01 0.001 TA = 25 °C 20 30 40 50 60 70 80 90 100 10 1 0.01 0.0001 10 Junction to Ambient 100 0.1 1 10 100 Percent of Rated Peak Reverse Voltage (%) t - Pulse Duration (s) Fig. 4 - Typical Reverse Characteristics Fig. 6 - Typical Transient Thermal Impedance E-mail: [email protected] 2 of 2 Web Site: www.taychipst.com