TRIQUINT TGA2807-SM

TGA2807-SM
CATV Linear Amplifier
Key Features
•
•
•
•
•
•
•
•
•
•
Measured Performance
Primary Applications
Small Signal Gain (75 Ω) including Balun Loss,
Vdd = 6 V, Idd = 318 mA
25
•
•
S21 (dB)
20
CATV EDGE QAM Cards
CMTS Equipment
Product Description
15
The TriQuint TGA2807-SM is an ultra-linear
packaged Gain Block which operates from 40MHz
to 1GHz.
10
5
0
0
200
400
600
800
1000
Frequency (MHz)
The TGA2807-SM provides flat gain along with
ultra-low distortion. It also provides high output
power with low DC power consumption.
This amplifier is ideally suited for use in CATV
headend systems or other applications requiring
low noise and low distortion.
ACPR (75 Ω), single 256-QAM channel,
Vdd = 6V, Pout = 62 dBmV
-63
Demonstration Boards are available.
Lead-free and RoHS compliant.
-64
ACPR (dBc)
Frequency Range: 40MHz - 1.00 GHz
DOCSIS 3.0 Compliant
ACPR: -69 dBc at 61 dBmV Pout
Pdiss: 1.9W
Gain: 18.5 dB Typical
Psat: 28 dBm
NF: 2.5 dB
Output Return Loss: 20 dB
Bias: Vdd = +6 V, Idd = 318 mA, Single
Supply
Package Dimensions: 5 x 5 x 0.85 mm
-65
-66
-67
-68
-69
-70
-71
0
200
400
600
800
1000
Frequency (MHz)
Datasheet subject to change without notice.
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected]
Apr 2009 © Rev -
1
TGA2807-SM
Table I
Absolute Maximum Ratings 1/
Symbol
Vdd-Vg
Parameter
Value
Notes
Drain to Gate Voltage
11 V
Vdd
Drain Voltage
10 V
Vg1
Gate #1 Voltage Range
-1 to 3 V
Vg2
Gate #2 Voltage Range
0 to 5 V
Drain Current
410 mA
2/
73.75 dBmV
2/
Id
Pin
Input Continuous Wave Power
2/
1/
These ratings represent the maximum operable values for this device. Stresses beyond those listed
under “Absolute Maximum Ratings” may cause permanent damage to the device and / or affect
device lifetime. These are stress ratings only, and functional operation of the device at these
conditions is not implied.
2/
Combinations of supply voltage, supply current, input power, and output power shall not exceed the
maximum power dissipation listed in Table IV.
Table II
Recommended Operating Conditions
Symbol
Parameter 1/
Value
Vdd
Drain Voltage
6V
Idd
Drain Current
318 mA
Vg1
Gate #1 Voltage
0.95 V 2/
Vg2
Gate #2 Voltage
2.65 V 2/
1/
See assembly diagram for bias instructions.
2/
The amplifier is self-biased. Typical values are listed. External gate bias is optional.
2
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TGA2807-SM
Table III
RF Characterization Table
Vdd = 6 V, TA = 25°C 1/
Symbol
Parameter
Min
Typ
Units
1000
MHz
Note
BW
Bandwidth
S21
Power Gain
18.5
dB
GF
Gain Flatness
±0.5
dB
2/
NF
Noise Figure
2.5
dB
3/
IP3
Two-Tone Third-Order Intercept (150MHz)
43
dBm
4/
IP3
Two-Tone Third-Order Intercept (750MHz)
40
dBm
5/
ACPR
-69
dBc
6/
Harmonics (2nd, 3rd, 4th) (40 to 500MHz)
-69
dBc
7/
IRL
Input Return Loss
15
dB
ORL
Output Return Loss
20
dB
Drain current
318
Saturated Output Power (750MHz)
28
ACPR
Idd
Psat
40
Max
410
mA
dBm
1/
Using application circuit on pg. 14
2/
Across the operating frequency band
3/
At 500MHz carrier frequency
4/
Measured at 15 dBm output power per tone, Vdd = 6 V
5/
Measured at 14 dBm output power per tone, Vdd = 6 V
6/
Using single channel 256-QAM signal at 858MHz and 61 dBmV output power, measured in the band
750kHz from channel block edge to 6MHz from channel block edge.
7/
Using quad 256-QAM channels at 54dBmV output power per channel
3
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TGA2807-SM
Table IV
Power Dissipation and Thermal Properties
Parameter
Test Conditions
Value
Notes
1/ 2/
Maximum Power Dissipation
Tbaseplate = 85°C
Pd = 4.1 W
Tchannel = 153 °C
Tm = 7.9E+5 Hrs
Thermal Resistance, θjc
Vdd = 6 V
Idd = 318 mA
Pd = 1.92 W
θjc = 16.7 °C/W
Tchannel = 117 °C
Tm = 2.1E+7 Hrs
Mounting Temperature
Refer to Solder Reflow
Profiles (pg18)
Storage Temperature
1/
-65 to 150 °C
For a median life of 1E+6 hours, Power Dissipation is limited to
Pd(max) = (150 ºC – Tbase °C)/θjc.
Channel operating temperature will directly affect the device lifetime. For maximum life, it is
recommended that channel temperatures be maintained at the lowest possible levels.
Median Lifetime (Tm) vs. Channel Temperature
1.E+13
1.E+12
Median Lifetime (Hours)
2/
1.E+11
1.E+10
1.E+09
1.E+08
1.E+07
1.E+06
1.E+05
1.E+04
FET3
25
50
75
100
125
150
175
200
Channel Temperature (° C)
4
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TGA2807-SM
Measured S-Parameters (75 Ω) from Application Circuit,
Vdd = 6V
S21 (dB)
25
20
15
10
0
200
400
600
800
1000
1200
Frequency (MHz)
0
-5
S11, S22 (dB)
-10
-15
-20
-25
-30
-35
S11
-40
S22
-45
-50
0
200
400
600
800
1000
1200
Frequency (MHz)
5
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TGA2807-SM
Measured Noise Figure from Application Circuit,
NF (dB)
Vdd = 6V
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0
200
400
600
800
1000
Frequency (MHz)
6
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TGA2807-SM
Measured ACPR vs. Pout and Vdd (75 Ω), single 858MHz,
256-QAM channel 1/
-57
ACPR (dBc)
-59
+63dBmV
+62dBmV
+61dBmV
+60dBmV
-61
-63
-65
-67
-69
-71
5
5.5
6
6.5
7
Vdd (V)
1/ Measured in the band 750kHz from the channel block edge
to 6MHz from the channel block edge
7
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Apr 2009 © Rev -
TGA2807-SM
Measured ACPR and Gain vs. Pout, Vdd and
Frequency (75 Ω) with a single 256-QAM channel
-65
20.0
-66
19.0
-67
18.0
-68
17.0
-69
16.0
ACPR
-70
Gain
-71
0
200
400
600
800
Gain (dB)
ACPR (dBc)
Vdd = 5.5 V, Pout = +61 dBmV
15.0
14.0
1000
Frequency (MHz)
-65
20.0
-66
19.0
-67
18.0
-68
17.0
-69
16.0
ACPR
-70
Gain
-71
0
200
400
600
800
Gain (dB)
ACPR (dBc)
Vdd = 6 V, Pout = +62 dBmV
15.0
14.0
1000
Frequency (MHz)
8
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Apr 2009 © Rev -
TGA2807-SM
Measured ACPR vs. Vdd and Temperature (75 Ω) with a single
858MHz, 256-QAM channel at Pout = +61dBmV
-57
ACPR (dBc)
-59
85°C
25°C
-40°C
-61
-63
-65
-67
-69
-71
5
5.5
6
6.5
7
Vdd (V)
9
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Apr 2009 © Rev -
TGA2807-SM
0
45
x
2
2
x
40
32
x
3
x
2
0
0
0
32
0
20
3x
20
2x
15
3
x
15
x
2
0
0
-60
-62
-64
-66
-68
-70
-72
-74
-76
-78
-80
0
Modulated Harmonic (dBc)
Measured Modulated Harmonics (75 Ω) from Application
Circuit, Vdd = 6V 1/
Harmonic, MHz
1/ Using quad 256-QAM channels at 54dBmV output power per
channel at the fundamental frequencies shown
10
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Apr 2009 © Rev -
TGA2807-SM
70
20
65
19
60
18
55
17
Output Power
Gain
50
Gain (dB)
Output Power (dBmV)
Measured Pout and Vd (75 Ω) to maintain -66dBc ACPR,
single 858MHz, 256-QAM channel
16
45
15
3
4
5
6
7
8
9
4.0
450
3.5
400
3.0
350
2.5
300
2.0
250
DC Power
1.5
200
Current
1.0
150
0.5
100
3
4
5
6
7
8
Current (mA)
DC Power (W)
Vdd (V)
9
Vdd (V)
11
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Apr 2009 © Rev -
TGA2807-SM
Measured CATV Parameters (75 Ω), 83 channels at different
Pout, Vdd = 6V
XMD
-55
-60
XMD (dBc)
-65
40dBmV
-70
37dBmV
-75
34dBmV
-80
-85
-90
-95
0
100
200
300
400
500
600
Frequency (MHz)
CTB (dBc)
CTB
-55
-60
-65
-70
-75
-80
-85
-90
-95
-100
+40 dBmV
+37 dBmV
+34 dBmV
0
100
200
300
400
500
600
Frequency (MHz)
12
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Apr 2009 © Rev -
TGA2807-SM
Measured CATV Parameters (75 Ω), 83 channels at different
Pout, Vdd = 6V
CSO (dBc)
CSO
-65
-70
-75
-80
-85
-90
-95
-100
-105
-110
+40dBmV
+37dBmV
+34dBmV
0
100
200
300
400
500
600
Frequency (MHz)
13
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Apr 2009 © Rev -
TGA2807-SM
Application Circuit
+5 to +7 V
C5
L1
T1
TGA2807-SM
26
25
T2
24
C3
C1
19, 20
2, 3
RF Input
75 Ω
75 Ω
1:1 Balun
RF Output
1:1 Balun
16, 17
5, 6
C4
C2
10
11
12
L2
C6
+5 to +7 V
Reference
Description
Part Number
C1, C2
0.01μF
C3, C4
470pF
C5, C6
1μF
L1, L2
560nH
Coilcraft 0603LS-561XGLB
T1, T2
75 Ω 1:1 Balun 1/
Mini-Circuits ADTL1-15-75+
1/ Other manufacturers’ baluns can be used, but small-signal
performance, specifically S22, will be affected.
14
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TGA2807-SM
Pin
Description
Pin
Description
2
RF Input 1
16
RF Output 2
3
RF Input 1
17
RF Output 2
NC
29
GND
5
RF Input 2
19
RF Output 1
6
RF Input 2
20
RF Output 1
4, 18
1, 7, 8,14
NC
15, 21, 22, 23
NC
9
GND
24
VDD (choked)
10
VG2 (Optional)
25
VDD
11
VDD
26
VG1 (Optional)
12
VDD (choked)
27
GND
13
Isense
28
NC
Notes: Pin 13 (Isense) is used to monitor the drain current across a 4 ohm resistor, if desired.
The voltage at pin 13 is Vsense = Idd * 4 Volts.
Pins 9 and 27 are internally connected to GND but may be left open.
NC pins (1,7,8,14,15,21,22,23,28) are not connected internally; they may be grounded
externally, if desired.
Pins 10 and 26 are internally connected and may be left open.
15
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TGA2807-SM
29
max
Dimensions are in mm.
16
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TGA2807-SM
Recommended Assembly Diagram
C5
L1
T1
C1
C3
C2
C4
T2
L2
C6
Board material: 1.57mm thick FR4
Forty nine (49) open plated vias in center of land pattern
Vias are 12 mil diameter with 18 mil center-to-center spacing.
17
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TGA2807-SM
Assembly Notes
Recommended Surface Mount Package Assembly
• Proper ESD precautions must be followed while handling packages.
• Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
• TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow
oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles
are listed in the table below.
• Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot
placement. The volume of solder paste depends on PCB and component layout and should be well
controlled to ensure consistent mechanical and electrical performance.
• Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
SnPb
Pb Free
Ramp-up Rate
3 °C/sec
3 °C/sec
Activation Time and Temperature
60 – 120 sec @ 140 – 160 °C
60 – 180 sec @ 150 – 200 °C
Time above Melting Point
60 – 150 sec
60 – 150 sec
Max Peak Temperature
240 °C
260 °C
Time within 5 °C of Peak Temperature
10 – 20 sec
10 – 20 sec
Ramp-down Rate
4 – 6 °C/sec
4 – 6 °C/sec
Ordering Information
Part
Package Style
TGA2807-SM, TAPE AND REEL
5mm x 5mm QFN Surface Mount, TAPE AND REEL
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
18
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Apr 2009 © Rev -