TRIQUINT TQM8M9075

TQM8M9075
0.05−4 GHz Digital Variable Gain Amplifier
Applications
Wireless Infrastructure
Fixed Wireless
Microwave and Satellite Radio
General Purpose Wireless
5x5mm 32-pin leadless SMT package
The TQM8M9075 integrates a high performance digital
step attenuator and a high linearity, broadband gain
block. Both stages are internally matched to 50 Ohms
and do not require any external matching components.
A serial output port enables cascading with other serial
controlled devices.
The TQM8M9075 is packaged in a RoHS-compliant,
compact 5x5 mm surface-mount leadless package.
Superior thermal design allows the product to have a
minimum MTTF rating of 1000 years at a mounting
temperature of +85°C.
The TQM8M9075 is targeted for use in wireless
infrastructure, point-to-point, or can be used for any
general purpose wireless application.
© 2012 TriQuint Semiconductor, Inc.
25 CLK
26 SID
27 LE
28 GND
29 AMPout/VAMP
1
24 NC
GND
2
23 NC
GND
3
22 NC
ATTout
4
ACG1
5
ACG2
6
19 NC
ACG3
7
18 NC
ACG4
8
17 VDD
21 NC
20 NC
NC 16
NC 15
GND 13
ATTin 12
SOD 14
6-BIT
SPI
DSA
Pin Configuration
The TQM8M9075 is a digitally controlled variable gain
amplifier (DVGA) with a broadband frequency range of
50 to 4000 MHz. The DVGA features high linearity and
low noise while providing digital variable gain with a
31.5 dB of range in 0.5 dB steps through a 6-bit serial
mode control interface.
This combination of
performance parameters makes the DVGA ideal for
receiver applications requiring gain control with high
IIP3 and low noise figure.
Data Sheet: Rev F 12/05/2012
30 GND
AMPin
ACG5
General Description
31 GND
32 GND
Integrates DSA + Amp Functionality
50-4000 MHz Broadband Performance
18 dB Gain at 2.14 GHz
2.9 dB Noise Figure at max gain setting
+21 dBm P1dB
+36.5 dBm OIP3
+5 V Supply Voltage
88 mA Operating Current
MTTF > 1000 Years
9
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Functional Block Diagram
NC 11
Product Features
ACG6 10




Pin #
Symbol
1
2, 3, 13, 28, 30, 31, 32
4
5, 6, 7, 8, 9, 10
11, 15, 16, 18-24
14
12
17
25
26
27
29
Backside Paddle
AMPin
GND (Ground)
ATTout
ACG1-6
NC (No Connect)
SOD
ATTin
VDD
CLK
SID
LE
AMPout /VAMP
RF/DC Ground
Ordering Information
Part No.
Description
TQM8M9075
TQM8M9075−PCB
Digital Variable Gain Amplifier
0.3-4.0 GHz Evaluation Board
Standard T/R size = 2500 pieces on a 13” reel.
- 1 of 8 -
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TQM8M9075
0.05−4 GHz Digital Variable Gain Amplifier
Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Rating
Parameter
Min Typ Max Units
Storage Temperature
RF Input Power, CW, 50Ω,T = 25°C
Supply Voltage (VDD)
Reverse Device Voltage
Digital Input Voltage
−65 to 150°C
+24 dBm
+6 V
−0.3 V
VDD+ 0.5 V
Supply Voltage (VDD)
Supply Current (IDD)
Operating Temp. Range
6
TJ (for >10 hours MTTF)
+3.3
Operation of this device outside the parameter ranges
given above may cause permanent damage.
+5
88
−40
+5.25
V
mA
°C
°C
+85
+190
Electrical specifications are measured at specified test
conditions. Specifications are not guaranteed over all
recommended operating conditions.
Electrical Specifications
Test conditions unless otherwise noted: VDD =+5V, Temp.=+25°C, Configured as DSA followed by Amp
Parameter
Operational Frequency Range
Test Frequency
Gain
Gain Control Range
Gain Accuracy
Attenuation Step
Time rise / fall
Time on, Time off
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
Noise Figure
Supply Current (IDD)
Thermal Resistance
Conditions
Min
50
Pout=+3 dBm/tone, Δf=1 MHz
At max gain level
Channel to case
Data Sheet: Rev F 12/05/2012
© 2012 TriQuint Semiconductor, Inc.
- 2 of 8 -
Max
Units
4000
MHz
MHz
dB
dB
dB
dB
ns
ns
dB
dB
dBm
dBm
dB
mA
°C/W
2140
18
20
31.5
± (0.3 + 4% of Atten. Setting) Max
0.5
90
100
-16
-16.5
+20.5
+32.5
+36.5
2.9
70
88
110
41
16
10% / 90% RF
50% CTL to 10% / 90% RF
Typ
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TQM8M9075
0.05−4 GHz Digital Variable Gain Amplifier
Serial Control Interface
TM
The TQM8M9075 has a CMOS SPI input compatible serial interface. This serial control interface converts the
TM
serial data input stream to parallel output word. The input is 3-wire (CLK, LE and SID) SPI input compatible. At
power up, the serial control interface resets the DSA to the minimum gain state. The 6-bit SID (Serial Input Data)
word is loaded into the register on rising edge of the CLK, MSB first. When LE is high, CLK is internally disabled.
Serial Control Timing Characteristics (Test conditions: V
Parameter
Condition
Clock Frequency
50% Duty Cycle
LE Setup Time, tLESUP
LE Pulse Width, tLEPW
SID set-up time, tSDSUP
SID hold-time, tSDHLD
LE Pulse Spacing tLE
Propagation Delay tPLO
after last CLK rising edge
DD
= +5 V, Temp.=25°C)
Min
Serial Control DC Logic Characteristics (Test conditions: V
Input Low State Voltage, VIL
Input High State Voltage, VIH
Output High State Voltage, VOH
Output Low State Voltage, VOL
Input Current, IIH / IIL
6-Bit Control Word
LSB
30
ns
ns
ns
ns
ns
ns
DD
= +5 V, Temp.=25°C)
Max
Units
On SOD pin
On SOD pin
On SID, LE and CLK pins
0
2.4
2.0
0
−10
0.8
VDD
VDD
0.8
+10
V
V
V
V
µA
Gain Relative to
Maximum Gain
Timing Diagram
CLK is internally disabled when LE is high
D5-D0
MSB-LSB
D4
D3
D2
D1
D0
1
1
1
1
1
1
Maximum Gain
1
1
1
1
1
0
−0.5 dB
1
1
1
1
0
1
−1 dB
1
1
1
0
1
1
−2 dB
1
1
0
1
1
1
−4 dB
1
0
1
1
1
1
−8 dB
0
1
1
1
1
1
−16 dB
0
0
0
0
0
0
−31.5 dB
D5-D0
MSB-LSB
LE
tPLO
CLK
SID
tSDSUP
Any combination of the possible 64 states will provide a
reduction in gain of approximately the sum of the bits
selected.
© 2012 TriQuint Semiconductor, Inc.
MHz
Min
D5
Data Sheet: Rev F 12/05/2012
10
Condition
SERIN Control Logic Truth Table
MSB
Units
10
30
10
10
630
before CLK rising edge
after CLK rising edge
LE to LE pulse spacing
LE to Parallel output valid
Parameter
Max
- 3 of 8 -
tSDHLD
tLESUP
tLEPW
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TQM8M9075
0.05−4 GHz Digital Variable Gain Amplifier
TQM8M9075−PCB Evaluation Board
C7
VDD
J6 Pin 19
C3
C6
C11
C5
8
C7
C6
C5
C4
C4
6
5
4
3
C1
C2
L1
RF
Input
11
30
12
29
U1
TQM8M9075
13
14
C11
15
RF
Output
28
25
17
J6
J2
26
16
SOD
J6 Pin 14
C2
27
6-BIT
SPI
C8
L1
31
Amp
DSA
C3
U1
1
2
32
10
J1
C1
7
9
18
19
20
21
22
23
24
C8
VDD
J6 Pin 1
J6 Pins
CLK SID LE
12 11 13
Notes:
1. See Evaluation Board PCB Information section for material and stack-up.
2. C4, C5, C6 and C7 may be removed for operation above 700 MHz.
Bill of Material − TQM8M9075−PCB
Reference Des.
Value
N/A
U1
Description
Manuf.
Part Number
N/A
Printed Circuit Board
TriQuint
1081051
N/A
Digital Variable Gain Amp
TriQuint
TQM8M9075
L1 (Note 3)
68 nH
Inductor, 0603
Coilcraft
0603CS-47NXJLW
C1, C2, C3
68 pF
Capacitor, 0402
various
C4, C5, C6, C7
330 pF
Capacitor, 0402
various
C8
1000 pF
Capacitor, 0603
various
C11
0.01 uF
Capacitor, 0603
various
Notes:
1. For IF applications (<300 MHz) increase L1 to 330 nH.
Data Sheet: Rev F 12/05/2012
© 2012 TriQuint Semiconductor, Inc.
- 4 of 8 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
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TQM8M9075
0.05−4 GHz Digital Variable Gain Amplifier
Typical Performance TQM8M9075-PCB
Test conditions unless otherwise noted: VDD=+5 V, IDD=88 mA (typ.), Temp=+25°C
Parameter
Conditions
Output Return Loss
Output P1dB
Output IP3
(1)
Noise figure
Units
Typical Value
Frequency
Gain
Input Return Loss
Pout= +3 dBm/tone, Δf=1 MHz
500
20.7
16.6
900
20.5
27.2
2140
18.0
16.5
2700
16.7
15.2
3500
14.7
14.6
4000
13.4
25.0
MHz
dB
dB
8.3
+21
+36.7
1.9
12.9
+21
+36.7
2.0
16.0
+20.5
+36.5
2.9
13.9
+20.1
+38.0
3.3
10.9
+19.7
+34.9
4.1
8.9
+19.0
+33.8
4.9
dB
dBm
dBm
dB
Notes:
1. Gain values reflect de-embedding of 0.4 dB eval board RF I/O line losses that would not be present in target applications.
2. NF values reflect de-embedding of eval board RF I/O line losses that would not be present in target applications.
3. Unless otherwise stated, performance plots shown below for DVGA maximum gain state.
Performance Plots - TQM8M9075-PCB
Gain vs. Frequency
24
Input Return Loss vs. Frequency
0
+85°C
18
16
14
12
10
+25°C
-10
-5
Output Return Loss (dB)
+85°C
+25°C
40°C
20
Gain (dB)
Input Return Loss (dB)
22
40°C
-20
-30
+85°C
1
2
3
4
40°C
-15
-20
-25
0
1
2
Frequency (GHz)
3
0
4
1
P1dB vs. Frequency
25
1 MHz Tone Spacing
Pout / tone = +3 dBm
30
4
6
5
21
NF (dB)
P1dB (dBm)
35
3
Noise Figure vs. Frequency
7
+85°C
+25°C
−40°C
23
+85°C
+25°C
−40°C
40
2
Frequency (GHz)
Frequency (GHz)
OIP3 vs. Frequency
45
+25°C
-10
-40
0
OIP3 (dBm)
Output Return Loss vs. Frequency
0
19
4
3
+85°C
+25°C
−40°C
2
17
1
25
15
1.0
2.0
3.0
4.0
0
0.0
1.0
Frequency (MHz)
900 MHz
0
-0.5
2600 MHz
1900 MHz
-1
10
15
20
1
25
30
Attenuation (dB)
Data Sheet: Rev F 12/05/2012
© 2012 TriQuint Semiconductor, Inc.
35
1.5
2
2.5
3.5
4
Temp.=+25°C
Key bit states
-10
Max Gain
-15
-20
Min Gain
-25
3
Output Return Loss vs. Frequency
0
-30
-40
5
0.5
Frequency (GHz)
-35
-1.5
0
0
Temp.=+25°C
Key bit states
-5
1
0.5
4.0
Input Return Loss vs. Frequency
0
Input Return Loss (dB)
Attenuation Accuracy (dB)
3.0
Frequency (GHz)
Attenuation Accuracy vs. Attenuation
1.5
2.0
Output Return Loss (dB)
0.0
-5
-10
Min Gain
-15
Max Gain
-20
-25
0
1
2
Frequency (MHz)
- 5 of 8 -
3
4
0
1
2
3
4
`
Frequency (MHz)
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TQM8M9075
0.05−4 GHz Digital Variable Gain Amplifier
25 CLK
26 SID
27 LE
28 GND
29 AMPout/VAMP
30 GND
31 GND
32 GND
Pin Configuration and Description
AMPin
1
24 NC
GND
2
23 NC
22 NC
GND
3
ATTout
4
ACG1
5
ACG2
6
19 NC
ACG3
7
18 NC
ACG4
8
17 VDD
NC 16
20 NC
NC 15
SOD 14
GND 13
ATTin 12
NC 11
ACG6 10
9
DSA
ACG5
21 NC
6-BIT
SPI
Pin No.
Symbol
Description
1
AMPin
Amp RF input. External DC block required.
2, 3,13, 28, 30, 31, 32
GND (Ground)
DC ground
11, 15, 16, 18-24
NC (No Connect)
No electrical connection. Provide land pads for PCB mounting integrity.
29
AMPout/VAMP
Amp RF output / DC supply. External DC block and bias choke required.
12
ATTin
DSA Input
4
ATTout
DSA Output
5, 6, 7, 8, 9, 10
ACG1-6
Place external capacitor to Ground for applications below 700 MHz.
14
SOD
Serial Output Data
17
Vdd
DC supply into SPI and DSA
25
CLK
Serial Clock
26
SID
Serial Input Data
27
LE
Backside Paddle
RF/DC GND
Latch Enable
RF/DC ground. Use recommended via pattern and ensure good solder attach
for best thermal and electrical performance.
Evaluation Board PCB Information
TriQuint PCB 1081051 Material and Stack-up
0.014"
0.062" ± 0.006"
Finished Board
Thickness
Nelco N-4000-13
εr=3.7 typ.
1 oz. Cu top layer
1 oz. Cu inner layer
Core
1 oz. Cu inner layer
0.014"
Nelco N-4000-13
1 oz. Cu bottom layer
50 ohm line dimensions: width = .026”, spacing = .032”
Data Sheet: Rev F 12/05/2012
© 2012 TriQuint Semiconductor, Inc.
- 6 of 8 -
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TQM8M9075
0.05−4 GHz Digital Variable Gain Amplifier
Mechanical Information
Package Marking and Dimensions
Marking: Part number – TQM8M9075
Year, week, country code - YYWW CCCC
Assembly Code – AaXXXX
.10 C
2X
TERMINAL #1
IDENTIFIER
5.0±0.1
32X 0.50 Pitch
0.25
32X 0.10
TERMINAL #1
IDENTIFIER
4
(32X) 0.450x X 0.240y
0.10
C A B
1.90
TQM8M9075
YYWW CCCC
AaXXXX
4.50
5.0±0.1
1.90
0.25
(1X) shape
0.10
C A B
.10 C
2X
0.20
1.90
1.90
5
4.50
GND/THERMAL PAD
.10 C
32X
1.02±0.08
.08 C
SEATING PLANE
5
C
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Except where noted, this part outline conforms to JEDEC standard MO-220, Issue E (Variation VGGC) for thermally
enhanced plastic very thin fine pitch quad flat no lead package (QFN).
3. Dimension and tolerance formats conform to ASME Y14.4M-1994.
4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.
PCB Mounting Pattern
25X
3
PACKAGE
OUTLINE
28X 0.28
0.50 PITCH
0.12
1
28X 0.75
3.70
0.76
0.38
0.66
3.70
COMPONENT SIDE
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We
recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Data Sheet: Rev F 12/05/2012
© 2012 TriQuint Semiconductor, Inc.
- 7 of 8 -
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TQM8M9075
0.05−4 GHz Digital Variable Gain Amplifier
Product Compliance Information
ESD Sensitivity Ratings
Solderability
Compatible with both lead-free (260 °C max. reflow
temperature) and tin/lead (245 °C max. reflow
temperature) soldering processes.
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes ≥ 250 V to < 500 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class IV
Passes ≥ 1000 V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Contact plating: Electrolytic plated Au over Ni
RoHs Compliance
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain
Hazardous Substances in Electrical and Electronic
Equipment).
MSL Rating
MSL Rating: Level 3
Test:
260°C convection reflow
Standard:
JEDEC Standard IPC/JEDEC J-STD-020
This product also has the following attributes:
 Lead Free
 Halogen Free (Chlorine, Bromine)
 Antimony Free
 TBBP-A (C15H12Br402) Free
 PFOS Free
 SVHC Free
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and
information about TriQuint:
Web: www.triquint.com
Email: [email protected]
Tel:
Fax:
For technical questions and application information:
+1.503.615.9000
+1.503.615.8902
Email: [email protected]
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information
contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained
herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein.
The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated
with such information is entirely with the user. All information contained herein is subject to change without notice.
Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The
information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any
patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or
anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe
personal injury or death.
Data Sheet: Rev F 12/05/2012
© 2012 TriQuint Semiconductor, Inc.
- 8 of 8 -
Disclaimer: Subject to change without notice
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