TYSEMI KUK128-50DL

Transistors
IC
SMD Type
Product specification
KUK128-50DL
TO-263
Unit: mm
1 .2 7 -0+ 0.1.1
Features
TrenchMOS output stage
+0.1
1.27-0.1
+0.2
4.57-0.2
Current limiting
Protection latched reset by input
5 .2 8 -0+ 0.2.2
5 V logic compatible input level
Control of output stage and supply of overload protection
circuits derived from input
0.1max
+0.1
1.27-0.1
+0.1
0.81-0.1
2.54
2.54
+0.2
-0.2
Low operating input current permits direct drive by
+0.1
5.08-0.1
1 5 .2 5 -0+ 0.2.2
Overtemperature protection
2 .5 4 -0+ 0.2.2
8 .7 -0+ 0.2.2
5 .6 0
Overload protection
+0.2
0.4-0.2
Input
11Gate
Drain
22Drain
Source
33Source
micro-controller
ESD protection on all pins
Overvoltage clamping for turn off of inductive loads
Absolute Maximum Ratings Ta = 25
Parameter
Symbol
Rating
Unit
VDS
50
V
Continuous drain current VIS = 5 V; Tmb = 25
ID
selflimited
A
Continuous drain current VIS = 5 V; Tmb
ID
8
A
II
-5 to 5
mA
IIRM
-10 to 10
mA
PD
40
W
Tstg
-55 To 175
Continuous drain source voltage
125
Continuous input current
Repetitive peak input current tp
Total power dissipation Tmb
1 ms
25
Storage temperature
Continuous junction temperature normal operation
Case temperature during soldering
Electrostatic discharge capacitor voltage *
Tj
150
Tsold
260
VC
2
kV
* C = 250 pF; R = 1.5 kÙ
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4008-318-123
1 of 2
Transistors
IC
SMD Type
Product specification
KUK128-50DL
Electrical Characteristics Ta = 25
Parameter
Symbol
Testconditons
Min
Typ
Max
Unit
Non-repetitive clamping energy
EDSM
IDM = 8 A; VDD
20 V;Tmb
25
100
mJ
Repetitive clamping energy
EDRM
IDM = 8 A; VDD
20 V;Tmb
95 ; f = 250 Hz
20
mJ
35
V
Drain source voltage
Drain-source clamping voltage
VDS
V(CL)DSS
4V
VIS
0
5.5 V
VIS = 0 V;ID = 10 mA
VIS = 0 V;IDM = 2 A; tp
Drain source leakage current
IDSS
50
300 ìs; ä
50
0.01
0.1
VDS = 40 V;Tmb = 25
RDS(ON)
4.4 V; tp
VIS 4.4V; tp
VIS
4 V; tp
VIS 4V;tp
Drain current limiting
ID
60
VDS = 40 V
VIS
Drain-source resistance
V
300 ìs; ä
300 ìs; ä
100
ìA
10
ìA
mÙ
100
mÙ
200
mÙ
72
105
mÙ
12
16
A
68
0.01;IDM = 3 A
300ìs;ä 0.01;IDM=3A;Tmb=25
V
190
0.01;IDM = 3 A
300ìs;ä 0.01;IDM=3A;Tmb = 25
70
VDS = 13 V;VIS = 5 V; Tmb = 25
8
VDS = 13 V;4.4 V
6
18
A
5
18
A
VDS = 13 V;4 V
VIS
VIS
5.5 V
5.5 V
Overload power threshold
PD(TO)
20
55
80
W
Characteristic time
TDSC
200
350
600
ìs
Threshold junction temperature
Tj(TO)
150
170
Input threshold voltage
VIS(TO)
Input supply current
Input supply current
Protection reset voltage
Latch reset time
Input clamping voltage
IIS
IISL
VISR
tlr
V(CL)IS
Input series resistance to gate of
power MOSFET
RIG
Turn-on delay time
td on
Rise time
Turn-off delay time
Fall time
device trips if PD
PD(TO); VIS = 5 V;Tmb = 25
VDS = 5 V; ID = 1 mA
0.6
2.4
V
VDS = 5 V; ID = 1 mA;Tmb = 25
1.1
1.6
2.1
V
normal operation;VIS = 5 V
100
220
400
normal operation;VIS = 4 V
80
195
330
protection latched;VIS = 5 V
200
400
650
protection latched;VIS = 3 V
130
250
430
reset time tr
1.5
2
2.9
V
VIS1 = 5 V, VIS2 < 1 V
10
40
100
ìs
II = 1.5 mA
5.5
8.5
V
100 ìs
II = 1.5 mA;Tmb = 25
33
kÙ
8
20
tr
20
50
td off
25
70
VIS = 5 V
VIS = 0 V
tf
16
40
Junction to mounting base
Rth j-mb
2.5
3.1
Junction to ambient
Rth j-a
http://www.twtysemi.com
ìA
minimum footprint FR4 PCB
[email protected]
50
4008-318-123
ìs
K/W
K/W
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