万和兴电子有限公司 www.whxpcb.com AO4566 30V N-Channel MOSFET General Description Product Summary • Latest Trench Power AlphaMOS (αMOS LV) technology • Very Low RDS(ON) at 4.5V VGS • Low Gate Charge • High Current Capability • RoHS and Halogen-Free Compliant Application VDS ID (at VGS=10V) 30V 12A RDS(ON) (at VGS=10V) < 11mΩ RDS(ON) (at VGS=4.5V) < 17mΩ 100% UIS Tested 100% Rg Tested • DC/DC Converters in Computing, Servers, and POL • Isolated DC/DC Converters in Telecom and Industrial SOIC-8 Top View D D D Bottom View D D G G S S S S Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage Continuous Drain CurrentG VGS TA=25°C Units V ±20 V 12 ID TA=70°C Maximum 30 9.4 A Pulsed Drain Current C IDM 48 Avalanche Current C IAS 15 A Avalanche energy L=0.1mH C EAS 11 mJ 36 V VDS Spike Power Dissipation B 100ns TA=25°C VSPIKE PD TA=70°C Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-to-Ambient A Maximum Junction-to-Ambient A D Maximum Junction-to-Lead Rev 0: Aug 2012 2.5 Steady-State Steady-State -55 to 150 TJ, TSTG Symbol t ≤ 10s W 1.6 RθJA RθJL www.aosmd.com Typ 42 70 20 °C Max 50 85 30 Units °C/W °C/W °C/W Page 1 of 5 AO4566 万和兴电子有限公司 www.whxpcb.com Electrical Characteristics (TJ=25°C unless otherwise noted) Symbol Parameter STATIC PARAMETERS Drain-Source Breakdown Voltage BVDSS IDSS Zero Gate Voltage Drain Current Conditions Min ID=250µA, VGS=0V Gate-Body leakage current VDS=0V, VGS=±20V Gate Threshold Voltage VDS=VGS,ID=250µA RDS(ON) Static Drain-Source On-Resistance VGS=10V, ID=12A TJ=125°C VGS=4.5V, ID=10A gFS Forward Transconductance VDS=5V, ID=12A VSD Diode Forward Voltage IS=1A,VGS=0V IS Maximum Body-Diode Continuous Current Crss Reverse Transfer Capacitance Rg Gate resistance Qgs Gate Source Charge ±100 nA 2.3 V 9 11 12.5 15 13.5 17 mΩ 1 V 3.5 A 45 VGS=0V, VDS=0V, f=1MHz VGS=10V, VDS=15V, ID=12A 1 mΩ S 542 VGS=0V, VDS=15V, f=1MHz SWITCHING PARAMETERS Qg(10V) Total Gate Charge Qg(4.5V) Total Gate Charge 1.8 0.72 DYNAMIC PARAMETERS Ciss Input Capacitance Output Capacitance µA 5 1.3 Units V 1 TJ=55°C IGSS Max 30 VDS=30V, VGS=0V VGS(th) Coss Typ pF 233 pF 31 pF 2 3 Ω 9 12.2 nC 4.3 5.8 nC 2.2 nC Qgd Gate Drain Charge 1.7 nC tD(on) Turn-On DelayTime 4 ns tr Turn-On Rise Time tD(off) Turn-Off DelayTime tf Turn-Off Fall Time trr Body Diode Reverse Recovery Time Qrr 3.5 ns 18 ns 3 ns IF=12A, dI/dt=500A/µs 9.7 Body Diode Reverse Recovery Charge IF=12A, dI/dt=500A/µs 11.5 ns nC VGS=10V, VDS=15V, RL=1.25Ω, RGEN=3Ω A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The value in any given application depends on the user's specific board design. B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep initialTJ=25°C. D. The RθJA is the sum of the thermal impedance from junction to lead RθJL and lead to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-ambient thermal impedance which is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating. THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev 0: Aug 2012 www.aosmd.com Page 2 of 5 AO4566 万和兴电子有限公司 www.whxpcb.com TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 50 50 10V 4.5V VDS=5V 4V 6V 40 40 30 30 ID(A) ID (A) 3.5V 125°C 20 20 10 10 25°C VGS=3.0V 0 0 0 1 2 3 4 0 5 18 2 3 4 5 Normalized On-Resistance 1.6 16 VGS=4.5V 14 RDS(ON) (mΩ Ω) 1 VGS(Volts) Figure 2: Transfer Characteristics (Note E) VDS (Volts) Fig 1: On-Region Characteristics (Note E) 12 10 8 VGS=10V 6 VGS=10V ID=12A 1.4 17 5 2 10 VGS=4.5V 1.2 1 ID=10A 0.8 4 0 3 0 6 9 12 15 ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage (Note E) 25 50 75 100 125 150 175 0 Temperature (°C) Figure 4: On-Resistance vs. Junction Temperature 18 (Note E) 25 1.0E+01 ID=12A 1.0E+00 20 40 125°C 1.0E-01 15 IS (A) RDS(ON) (mΩ Ω) 125°C 1.0E-02 10 1.0E-03 25°C 5 25°C 1.0E-04 1.0E-05 0 2 6 8 VGS (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage (Note E) Rev 0: Aug 2012 4 10 www.aosmd.com 0.0 0.2 0.4 0.6 0.8 1.0 1.2 VSD (Volts) Figure 6: Body-Diode Characteristics (Note E) Page 3 of 5 AO4566 万和兴电子有限公司 www.whxpcb.com TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 10 800 VDS=15V ID=12A 8 Ciss Capacitance (pF) VGS (Volts) 600 6 4 400 Coss 200 2 0 Crss 0 0 2 4 6 8 Qg (nC) Figure 7: Gate-Charge Characteristics 10 0 IDM limited 5 10 15 20 25 VDS (Volts) Figure 8: Capacitance Characteristics 30 1000 100.0 TA=25°C 10µs ID (Amps) 100µs 1ms 1.0 RDS(ON) @10V limited 10ms 0.1 Power (W) 10.0 100 10 10s DC TJ(Max)=150°C TA=25°C 1 0.0 1E-05 0.01 0.1 1 VDS (Volts) 10 0.001 0.1 10 1000 100 Pulse Width (s) * VGS > minimum VGS at which RDS(ON) is specified Figure 9: Maximum Forward Biased Safe Operating Area (Note F) Figure 10: Single Pulse Power Rating Junction-toAmbient (Note F) Zθ JA Normalized Transient Thermal Resistance 10 In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse D=Ton/T TJ,PK=TA+PDM.ZθJA.RθJA 1 RθJA=85°C/W 0.1 PD 0.01 Single Pulse Ton T 0.001 1E-05 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance (Note F) Rev 0: Aug 2012 www.aosmd.com Page 4 of 5 AO4566 万和兴电子有限公司 www.whxpcb.com Gate Charge Test Circuit & Waveform Vgs Qg 10V + + Vds VDC - Qgs Qgd VDC DUT - Vgs Ig Charge R es istiv e S w itch ing T e st C ircu it & W a ve fo rm s RL V ds Vds DUT Vgs 90 % + Vdd VDC - Rg 1 0% Vgs V gs t d (o n ) tr t d (o ff) to n tf t o ff D io d e R eco very T est C ircu it & W a vefo rm s Q rr = - V ds + Idt DUT V gs V ds - Isd V gs Ig Rev 0: Aug 2012 Isd L + VD C - IF t rr dI/dt I RM V dd V dd V ds www.aosmd.com Page 5 of 5