AOSMD AO3442

AO3442
100V N-Channel MOSFET
General Description
Product Summary
The AO3442 combines advanced trench MOSFET
technology with a low resistance package to provide
extremely low RDS(ON). This device is ideal for boost
converters and synchronous rectifiers for consumer,
telecom, industrial power supplies and LED backlighting.
VDS
100V
1A
ID (at VGS=10V)
RDS(ON) (at VGS=10V)
< 630mΩ
RDS(ON) (at VGS=4.5V)
< 720mΩ
SOT23
Top View
D
Bottom View
D
D
G
S
G
S
S
G
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TA=25°C
Continuous Drain
Current
Pulsed Drain Current
Power Dissipation
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Lead
Rev 0: Jun 2012
Steady-State
Steady-State
A
1.4
W
0.9
TJ, TSTG
Symbol
t ≤ 10s
V
4
PD
TA=70°C
±20
0.8
IDM
TA=25°C
B
Units
V
1
ID
TA=70°C
C
Maximum
100
RθJA
RθJL
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°C
-55 to 150
Typ
70
100
63
Max
90
125
80
Units
°C/W
°C/W
°C/W
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AO3442
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
Drain-Source Breakdown Voltage
BVDSS
Conditions
Min
ID=250µA, VGS=0V
100
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VDS=0V, VGS=±20V
VGS(th)
Gate Threshold Voltage
VDS=VGS,ID=250µA
ID(ON)
On state drain current
VGS=10V, VDS=5V
1
TJ=55°C
±100
nA
2.3
2.9
V
514
630
983
1200
VGS=4.5V, ID=0.8A
554
720
Static Drain-Source On-Resistance
1.7
4
TJ=125°C
A
gFS
Forward Transconductance
VDS=5V, ID=1A
2.8
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.9
IS
Maximum Body-Diode Continuous CurrentG
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
Units
µA
5
VGS=10V, ID=1A
Coss
Max
V
VDS=100V, VGS=0V
IDSS
RDS(ON)
Typ
VGS=0V, VDS=50V, f=1MHz
mΩ
mΩ
S
1.2
V
1
A
100
pF
13
pF
5
pF
5
7.5
Ω
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
2.8
6
nC
Qg(4.5V) Total Gate Charge
1.5
3
nC
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
trr
Body Diode Reverse Recovery Time
Qrr
VGS=0V, VDS=0V, f=1MHz
VGS=10V, VDS=50V, ID=1A
2.5
0.4
nC
0.8
nC
5
ns
4
ns
12
ns
5
ns
52
ns
nC
VGS=10V, VDS=50V, RL=50Ω,
RGEN=3Ω
IF=5.6A, dI/dt=100A/µs
Body Diode Reverse Recovery Charge IF=5.6A, dI/dt=100A/µs
60
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedance from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedance which is measured with the device mounted on 1in2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev 0: Jun 2012
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Page 2 of 5
AO3442
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
3
5
VDS=5V
10V
6V
2.5
5V
4
4.5V
2
ID (A)
ID(A)
3
2
1.5
3.5V
1
1
125°C
25°C
0.5
VGS=3.0V
0
0
0
1
2
3
4
0
5
1200
2
3
4
5
6
Normalized On-Resistance
2.4
1000
RDS(ON) (mΩ
Ω)
1
VGS(Volts)
Figure 2: Transfer Characteristics (Note E)
VDS (Volts)
Fig 1: On-Region Characteristics (Note E)
VGS=4.5V
800
600
VGS=10V
400
200
2.2
VGS=10V
ID=1A
2
1.8
17
5
2
10
1.6
1.4
1.2
VGS=4.5V
ID=0.8A
1
0.8
0
0
0.5
0
1
1.5
2
2.5
3
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
25
50
75
100
125
150
175
0
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
18
(Note E)
1200
1.0E+01
ID=1A
1.0E+00
40
125°C
1.0E-01
IS (A)
RDS(ON) (mΩ
Ω)
900
600
125°C
1.0E-02
25°C
1.0E-03
25°C
300
1.0E-04
1.0E-05
0
2
6
8
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
Rev 0: Jun 2012
4
10
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0.0
0.2
0.4
0.6
0.8
1.0
1.2
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
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AO3442
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
160
VDS=50V
ID=1A
140
8
Capacitance (pF)
VGS (Volts)
120
6
4
Ciss
100
80
60
40
Crss
2
Coss
20
0
0
0
0.5
1
1.5
2
2.5
Qg (nC)
Figure 7: Gate-Charge Characteristics
3
0
20
40
60
80
VDS (Volts)
Figure 8: Capacitance Characteristics
100
10000
10.0
TA=25°C
10µs
ID (Amps)
100µs
1ms
0.1
DC
TJ(Max)=150°C
TA=25°C
0.0
Power (W)
1000
RDS(ON)
limited
1.0
100
10ms
10
10s
1
1E-05
0.01
0.1
1
10
VDS (Volts)
100
0.001
0.1
10
1000
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note F)
Figure 9: Maximum Forward Biased
Safe Operating Area (Note F)
Zθ JA Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
1
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJA=125°C/W
0.1
PD
0.01
Single Pulse
Ton
T
0.001
1E-05
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
Rev 0: Jun 2012
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Page 4 of 5
AO3442
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
DUT
-
Vgs
Ig
Charge
R es istiv e S w itch ing T e st C ircu it & W a ve fo rm s
RL
V ds
Vds
DUT
Vgs
90 %
+
Vdd
VDC
-
Rg
1 0%
Vgs
V gs
t d (o n )
tr
t d (o ff)
to n
tf
t o ff
D iode R ecovery T est C ircuit & W aveform s
Q rr = -
V ds +
Idt
DUT
V gs
V ds -
Isd
V gs
Ig
Rev 0: Jun 2012
L
Isd
+
VD C
-
IF
t rr
dI/dt
I RM
V dd
V dd
V ds
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Page 5 of 5