NSC LP38859T-1.2

LP38859
3A Fast-Response High-Accuracy LDO Linear Regulator
with Soft-Start
General Description
Features
The LP38859 is a high current, fast response regulator
which can maintain output voltage regulation with extremely
low input to output voltage drop. Fabricated on a CMOS
process, the device operates from two input voltages: VBIAS
provides voltage to drive the gate of the N-MOS power
transistor, while VIN is the input voltage which supplies
power to the load. The use of an external bias rail allows the
part to operate from ultra low VIN voltages. Unlike bipolar
regulators, the CMOS architecture consumes extremely low
quiescent current at any output load current. The use of an
N-MOS power transistor results in wide bandwidth, yet minimum external capacitance is required to maintain loop stability.
The fast transient response of this device makes it suitable
for use in powering DSP, Microcontroller Core voltages and
Switch Mode Power Supply post regulators. The LP38859 is
available in TO-220 and TO-263 5-Lead packages.
Dropout Voltage: 240 mV (typical) at 3A load current.
Low Ground Pin Current: 14 mA (typical) at 3A load current.
Soft-Start: Programmable Soft-Start time.
Precision Output Voltage: ± 1.0% for TJ = 25˚C and ± 2.0%
for 0˚C ≤ TJ ≤ +125˚C, across all line and load conditions
n
n
n
n
n
n
n
n
Standard VOUT values of 0.8V and 1.2V
Stable with 10µF Ceramic capacitors
Dropout voltage of 240 mV (typical) at 3A load current
Precision Output Voltage across all line and load
conditions:
— ± 1.0% VOUT for TJ = 25˚C
— ± 2.0% VOUT for 0˚C ≤ TJ ≤ +125˚C
— ± 3.0% VOUT for -40˚C ≤ TJ ≤ +125˚C
Over-Temperature and Over-Current protection
Available in 5 lead TO-220 and TO-263 packages
Custom VOUT values between 0.8V and 1.2V are
available
−40˚C to +125˚C Operating Temperature Range
Applications
n ASIC Power Supplies In:
- Desktops, Notebooks, and Graphics Cards, Servers
- Gaming Set Top Boxes, Printers and Copiers
n Server Core and I/O Supplies
n DSP and FPGA Power Supplies
n SMPS Post-Regulator
Typical Application Circuit
20131201
© 2006 National Semiconductor Corporation
DS201312
www.national.com
LP38859 3A Fast-Response High-Accuracy LDO Linear Regulator with Soft-Start
June 2006
LP38859
Ordering Information
VOUT *
Order Number
Package Type
Package Drawing
LP38859S-0.8
TO263-5
TS5B
Rail of 45
0.8V
LP38859SX-0.8
TO263-5
TS5B
Tape and Reel of 500
LP38859T-0.8
TO220-5
T05D
Rail of 45
LP38859S-1.2
TO263-5
TS5B
Rail of 45
LP38859SX-1.2
TO263-5
TS5B
Tape and Reel of 500
LP38859T-1.2
TO220-5
T05D
Rail of 45
1.2V
Supplied As
* For custom VOUT values between 0.8V and 1.2V please contact the National Semiconductor Sales Office.
Connection Diagrams
20131202
20131203
TO263–5, Top View
TO220–5, Top View
Pin Descriptions
TO220–5 and TO263–5 Packages
Pin #
Pin Symbol
Pin Description
1
SS
Soft-Start capacitor connection. Used to slow the rise time of VOUT at turn-on.
2
IN
3
GND
Ground
4
OUT
The regulated output voltage pin.
5
BIAS
The supply for the internal control and reference circuitry.
TAB
The TAB is a thermal connection that is physically attached to the backside of
the die, and used as a thermal heat-sink connection. See the Application
Information section for details.
TAB
www.national.com
The unregulated voltage input pin.
2
VOUT Voltage (Survival)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
IOUT Current (Survival)
Internally Limited
Junction Temperature
−40˚C to +150˚C
Storage Temperature Range
−65˚C to +150˚C
Operating Ratings(Note 1)
Lead Temperature
Soldering, 5 seconds
VIN Supply Voltage
260˚C
(VOUT + VDO) to VBIAS
VBIAS Supply Voltage
ESD Rating
Human Body Model (Note 2)
Power Dissipation (Note 3)
−0.3V to +6.0V
± 2 kV
−0.3V to +6.0V
VBIAS Supply Voltage (Survival)
−0.3V to +6.0V
VSS SoftStart Voltage (Survival)
−0.3V to +6.0V
0 mA to 3.0A
Junction Temperature
Range(Note 3)
Internally Limited
VIN Supply Voltage (Survival)
3.0V to 5.5V
IOUT
−40˚C to +125˚C
Electrical Characteristics Unless otherwise specified: VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA,
CIN = COUT = 10 µF, CBIAS = 1 µF, CSS = open. Limits in standard type are for TJ = 25˚C only; limits in boldface type apply
over the junction temperature (TJ) range of -40˚C to +125˚C. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25˚C, and are provided for reference purposes only.
Symbol
Parameter
Conditions
VOUT(NOM) + 1V ≤ VIN ≤ VBIAS,
3.0V ≤ VBIAS ≤ 5.5V,
10 mA ≤ IOUT ≤ 3A
VOUT
∆VOUT/∆VIN
∆VOUT/∆VBIAS
∆VOUT/∆IOUT
VDO
IGND(IN)
MAX
-1.0
-3.0
0.0
1.0
3.0
Units
-2.0
0.0
2.0
Line Regulation, VIN
(Note 4)
VOUT(NOM) + 1V ≤ VIN ≤ VBIAS
-
0.04
-
%/V
Line Regulation, VBIAS
(Note 4)
3.0V ≤ VBIAS ≤ 5.5V
-
0.10
-
%/V
Output Voltage Load Regulation
(Note 5)
10 mA ≤ IOUT ≤ 3.0A
-
0.2
-
%/A
Dropout Voltage (Note 6)
IOUT = 3.0A
-
240
300
450
mV
LP38859-0.8
10 mA ≤ IOUT ≤ 3.0A
-
7.0
8.5
9.0
11
12
15
-
3.0
3.8
4.5
mA
2.20
2.00
2.45
2.70
2.90
V
60
50
150
300
350
mV
-
6.2
-
A
LP38859-0.8
11.0
13.5
16.0
LP38859-1.2
13.5
16.0
18.5
LP38859-0.8, CSS = 10 nF
-
675
-
LP38859-1.2, CSS = 10 nF
-
800
-
Quiescent Current Drawn from
VIN Supply
%
LP38859-1.2
10 mA ≤ IOUT ≤ 3.0A
10 mA ≤ IOUT ≤ 3.0A
UVLO
Under-Voltage Lock-Out
Threshold
VBIAS rising until device is
functional
UVLO(HYS)
Under-Voltage Lock-Out
Hysteresis
VBIAS falling from UVLO
threshold until device is
non-functional
Output Short-Circuit Current
VIN = VOUT(NOM) + 1V,
VBIAS = 3.0V, VOUT = 0.0V
ISC
TYP
VOUT(NOM) + 1V ≤ VIN ≤ VBIAS,
3.0V ≤ VBIAS ≤ 5.5V,
10 mA ≤ IOUT ≤ 3.0A,
0˚C ≤ TJ ≤ +125˚C
VOUT Accuracy
Quiescent Current Drawn from
VBIAS Supply
IGND(BIAS)
MIN
mA
Soft-Start
rSS
Soft-Start internal resistance
tSS
Soft-Start time
tSS = CSS x rSS x 5
3
kΩ
µs
www.national.com
LP38859
Absolute Maximum Ratings (Note 1)
LP38859
Electrical Characteristics Unless otherwise specified: VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA,
CIN = COUT = 10 µF, CBIAS = 1 µF, CSS = open. Limits in standard type are for TJ = 25˚C only; limits in boldface type apply
over the junction temperature (TJ) range of -40˚C to +125˚C. Minimum and Maximum limits are guaranteed through test,
design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25˚C, and are provided for
reference purposes only. (Continued)
Symbol
Parameter
Conditions
MIN
TYP
MAX
VIN = VOUT(NOM) + 1V,
f = 120 Hz
-
80
-
VIN = VOUT(NOM) + 1V,
f = 1 kHz
-
65
-
VBIAS = VOUT(NOM) + 3V,
f = 120 Hz
-
58
-
VBIAS = VOUT(NOM) + 3V,
f = 1 kHz
-
58
-
Output Noise Density
f = 120 Hz
-
1
-
Output Noise Voltage
VOUT = 1.8V
BW = 10 Hz − 100 kHz
-
150
-
BW = 300 Hz − 300 kHz
-
90
-
Thermal Shutdown Junction
Temperature
-
160
-
Thermal Shutdown Hysteresis
-
10
-
Units
AC Parameters
PSRR
(VIN)
PSRR
(VBIAS)
en
Ripple Rejection for VIN Input
Voltage
Ripple Rejection for VBIAS
Voltage
dB
µV/√Hz
µV (rms)
Thermal Parameters
TSD
TSD(HYS)
θJ-A
Thermal Resistance, Junction to
Ambient(Note 3)
TO220-5
-
60
-
TO263-5
-
60
-
θJ-C
Thermal Resistance, Junction to
Case(Note 3)
TO220-5
-
3
-
TO263-5
-
3
-
˚C
˚C/W
Note 1: Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the
device is intended to be functional, but does not guarantee specific performance limits. For guaranteed specifications and conditions, see the Electrical
Characteristics.
Note 2: The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-A114. The HBM rating for device
pin 1 (SS) is ± 1.5 kV.
Note 3: Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to ambient thermal
resistance (θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not exceed the maximum operating rating. See
the Application Information section for details.
Note 4: Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.
Note 5: Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from no load to full load.
Note 6: Dropout voltage is defined the as input to output voltage differential (VIN - VOUT) where the input voltage is low enough to cause the output voltage to drop
no more than 2% from the nominal value.
www.national.com
4
VBIAS Ground Pin Current (IGND(BIAS)) vs VBIAS
VBIAS Ground Pin Current (IGND(BIAS)) vs Temperature
20131287
20131261
VIN Ground Pin Current vs Temperature
Load Regulation vs Temperature
20131262
20131263
Dropout Voltage (VDO) vs Temperature
Output Current Limit (ISC) vs Temperature
20131265
20131266
5
www.national.com
LP38859
Typical Performance Characteristics Unless otherwise specified: TJ = 25˚C, VIN = VOUT(NOM) + 1V,
VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF Ceramic, CBIAS = 1 µF Ceramic, CSS = open.
LP38859
Typical Performance Characteristics Unless otherwise specified: TJ = 25˚C, VIN = VOUT(NOM) + 1V,
VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF Ceramic, CBIAS = 1 µF Ceramic, CSS = open. (Continued)
VOUT vs Temperature
UVLO Thresholds vs Temperature
20131268
20131267
Soft-Start Resistor (rSS) vs Temperature
Soft-Start rSS Variation vs Temperature
20131274
20131275
VOUT vs CSS, 10 nF to 47 nF
VIN Line Transient Response
20131276
www.national.com
20131277
6
VIN Line Transient Response
VBIAS Line Transient Response
20131278
20131279
VBIAS Line Transient Response
Load Transient Response, COUT = 10 µF Ceramic
20131280
20131281
Load Transient Response, COUT = 10 µF Ceramic
Load Transient Response, COUT = 100 µF Ceramic
20131282
20131283
7
www.national.com
LP38859
Typical Performance Characteristics Unless otherwise specified: TJ = 25˚C, VIN = VOUT(NOM) + 1V,
VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF Ceramic, CBIAS = 1 µF Ceramic, CSS = open. (Continued)
LP38859
Typical Performance Characteristics Unless otherwise specified: TJ = 25˚C, VIN = VOUT(NOM) + 1V,
VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF Ceramic, CBIAS = 1 µF Ceramic, CSS = open. (Continued)
Load Transient Response, COUT = 100 µF Ceramic
Load Transient Response, COUT = 100 µF Tantalum
20131284
20131285
Load Transient Response, COUT = 100 µF Tantalum
VBIAS PSRR
20131286
20131270
VIN PSRR
Output Noise
20131271
www.national.com
20131269
8
LP38859
Block Diagram
20131205
9
www.national.com
LP38859
When the bias voltage is between the UVLO threshold and
the Minimum Operating Rating value of 3.0V the device will
be functional, but the operating parameters will not be within
the guaranteed limits.
Application Information
EXTERNAL CAPACITORS
To assure regulator stability, input and output capacitors are
required as shown in the Typical Application Circuit.
SUPPLY SEQUENCING
There is no requirement for the order that VIN or VBIAS are
applied or removed.
Output Capacitor
A minimum output capacitance of 10 µF, ceramic, is required
for stability. The amount of output capacitance can be increased without limit. The output capacitor must be located
less than 1 cm from the output pin of the IC and returned to
the device ground pin with a clean analog ground.
Only high quality ceramic types such as X5R or X7R should
be used, as the Z5U and Y5F types do not provide sufficient
capacitance over temperature.
One practical limitation is that the Soft-Start circuit starts
charging CSS when VBIAS rises above the UVLO threshold. If
the application of VIN is delayed beyond this point the benefits of Soft-Start will be compromised.
In any case, the output voltage cannot be guaranteed until
both VIN and VBIAS are within the range of guaranteed
operating values.
If used in a dual-supply system where the regulator output
load is returned to a negative supply, the output pin must be
diode clamped to ground. A Schottky diode is recommended
for this diode clamp.
Tantalum capacitors will also provide stable operation across
the entire operating temperature range. However, the effects
of ESR may provide variations in the output voltage during
fast load transients. Using the minimum recommended 10
µF ceramic capacitor at the output will allow unlimited capacitance, Tantalum and/or Aluminum, to be added in parallel.
REVERSE VOLTAGE
A reverse voltage condition will exist when the voltage at the
output pin is higher than the voltage at the input pin. Typically
this will happen when VIN is abruptly taken low and COUT
continues to hold a sufficient charge such that the input to
output voltage becomes reversed.
Input Capacitor
The input capacitor must be at least 10 µF, but can be
increased without limit. It’s purpose is to provide a low
source impedance for the regulator input. A ceramic capacitor, X5R or X7R, is recommended.
The NMOS pass element, by design, contains no body
diode. This means that, as long as the gate of the pass
element is not driven, there will not be any reverse current
flow through the pass element during a reverse voltage
event. The gate of the pass element is not driven when VBIAS
is below the UVLO threshold.
When VBIAS is above the UVLO threshold the control circuitry is active and will attempt to regulate the output voltage.
Since the input voltage is less than the output voltage the
control circuit will drive the gate of the pass element to the
full VBIAS potential when the output voltage begins to fall. In
this condition, reverse current will flow from the output pin to
the input pin , limited only by the RDS(ON) of the pass element
and the output to input voltage differential. This condition is
outside the guaranteed operating range and should be
avoided.
Tantalum capacitors may also be used at the input pin. There
is no specific ESR limitation on the input capacitor (the lower,
the better).
Aluminum electrolytic capacitors can be used, but are not
recommended as their ESR increases very quickly at cold
temperatures. They are not recommended for any application where the ambient temperature falls below 0˚C.
Bias Capacitor
The capacitor on the bias pin must be at least 1 µF, and can
be any good quality capacitor (ceramic is recommended).
INPUT VOLTAGE
The input voltage (VIN) is the high current external voltage
rail that will be regulated down to a lower voltage, which is
applied to the load. The input voltage must be at least VOUT
+ VDO, and no higher than whatever values is used for VBIAS.
SOFT-START
The LP38859 incorporates a Soft-Start function that reduces
the start-up current surge into the output capacitor (COUT) by
allowing VOUT to rise slowly to the final value. This is accomplished by controlling VREF at the SS pin. The soft-start
timing capacitor (CSS) is internally held to ground until VBIAS
rises above the Under-Voltage Lock-Out threshold (ULVO).
VREF will rise at an RC rate defined by the internal resistance
of the SS pin (rSS), and the external capacitor connected to
the SS pin. This allows the output voltage to rise in a controlled manner until steady-state regulation is achieved. Typically, five time constants are recommended to assure that
the output voltage is sufficiently close to the final steadystate value. During the soft-start time the output current can
rise to the built-in current limit.
BIAS VOLTAGE
The bias voltage (VBIAS) is a low current external voltage rail
required to bias the control circuitry and provide gate drive
for the N-FET pass transistor. The bias voltage must be in
the range of 3.0V to 5.5V to ensure proper operation of the
device.
UNDER VOLTAGE LOCKOUT
The bias voltage is monitored by a circuit which prevents the
device from functioning when the bias voltage is below the
Under-Voltage Lock-Out (UVLO) threshold of approximately
2.45V.
As the bias voltage rises above the UVLO threshold the
device control circuitry becomes active. There is approximately 150 mV of hysteresis built into the UVLO threshold to
provide noise immunity.
www.national.com
Soft-Start Time = CSS x rSS x 5
10
(1)
vice. Under all possible conditions, the junction temperature
must be within the range specified under operating conditions.
(Continued)
Since the VOUT rise will be exponential, not linear, the in-rush
current will peak during the first time constant (τ), and VOUT
will require four additional time constants (4τ) to reach the
final value (5τ) .
After achieving normal operation, should VBIAS fall below the
ULVO threshold the device output will be disabled and the
Soft-Start capacitor (CSS) discharge circuit will become active. The CSS discharge circuit will remain active until VBIAS
falls to 500 mV (typical). When VBIAS falls below 500 mV
(typical), the CSS discharge circuit will cease to function due
to a lack of sufficient biasing to the control circuitry.
Since VREF appears on the SS pin, any leakage through CSS
will cause VREF to fall, and thus affect VOUT. A leakage of 50
nA (about 10 MΩ) through CSS will cause VOUT to be approximately 0.1% lower than nominal, while a leakage of 500
nA (about 1 MΩ) will cause VOUT to be approximately 1%
lower than nominal. Typical ceramic capacitors will have a
factor of 10X difference in leakage between 25˚C and 85˚C,
so the maximum ambient temperature must be included in
the capacitor selection process.
Typical CSS values will be in the range of 1 nF to 100 nF,
providing typical Soft-Start times in the range of 70 µs to 7
ms (5τ). Values less than 1 nF can be used, but the SoftStart effect will be minimal. Values larger than 100 nF will
provide soft-start, but may not be fully discharged if VBIAS
falls from the UVLVO threshold to less than 500 mV in less
than 100 µs.
Figure 1 shows the relationship between the COUT value and
a typical CSS value.
The total power dissipation of the device is the sum of three
different points of dissipation in the device.
The first part is the power that is dissipated in the NMOS
pass element, and can be determined with the formula:
PD(PASS) = (VIN - VOUT) x IOUT
(2)
The second part is the power that is dissipated in the bias
and control circuitry, and can be determined with the formula:
PD(BIAS) = VBIAS x IGND(BIAS)
(3)
where IGND(BIAS) is the portion of the operating ground current of the device that is related to VBIAS.
The third part is the power that is dissipated in portions of the
output stage circuitry, and can be determined with the formula:
PD(IN) = VIN x IGND(IN)
(4)
where IGND(IN) is the portion of the operating ground current
of the device that is related to VIN.
The total power dissipation is then:
PD = PD(PASS) + PD(BIAS) + PD(IN)
(5)
The maximum allowable junction temperature rise (∆TJ) depends on the maximum anticipated ambient temperature
(TA) for the application, and the maximum allowable operating junction temperature (TJ(MAX)) .
(6)
The maximum allowable value for junction to ambient Thermal Resistance, θJA, can be calculated using the formula:
(7)
Heat-Sinking The TO-220 Package
The TO220-5 package has a θJA rating of 60˚C/W and a θJC
rating of 3˚C/W. These ratings are for the package only, no
additional heat-sinking, and with no airflow. If the needed
θJA, as calculated above, is greater than or equal to 60˚C/W
then no additional heat-sinking is required since the package
can safely dissipate the heat and not exceed the operating
TJ(MAX). If the needed θJA is less than 60˚C/W then additional heat-sinking is needed.
The thermal resistance of a TO-220 package can be reduced
by attaching it to a heat sink or a copper plane on a PC
board. If a copper plane is to be used, the values of θJA will
be same as shown in next section for TO-263 package.
The heat-sink to be used in the application should have a
heat-sink to ambient thermal resistance, θHA:
20131223
FIGURE 1. Typical CSS vs COUT Values
The CSS capacitor must be connected to a clean ground
path back to the device ground pin. No components, other
than CSS, should be connected to the SS pin, as there could
be adverse effects to VOUT.
If the Soft-Start function is not needed the SS pin should be
left open, although some minimal capacitance value is always recommended.
POWER DISSIPATION AND HEAT-SINKING
Additional copper area for heat-sinking may be required
depending on the maximum device dissipation (PD) and the
maximum anticipated ambient temperature (TA) for the de11
www.national.com
LP38859
Application Information
LP38859
Application Information
(Continued)
Figure 2 shows that increasing the copper area beyond 1
square inch produces very little improvement. The minimum
value for θJA for the TO-263 package mounted to a PCB is
32˚C/W.
(8)
where θJA is the required total thermal resistance from the
junction to the ambient air, θCH is the thermal resistance from
the case to the surface of the heart-sink, and θJC is the
thermal resistance from the junction to the surface of the
case.
For this equation, θJC is about 3˚C/W for a TO-220 package.
The value for θCH depends on method of attachment, insulator, etc. θCH varies between 1.5˚C/W to 2.5˚C/W. Consult
the heat-sink manufacturer datasheet for details and recommendations.
Figure 3 shows the maximum allowable power dissipation
for TO-263 packages for different ambient temperatures,
assuming θJA is 35˚C/W and the maximum junction temperature is 125˚C.
Heat-Sinking The TO-263 Package
The TO-263 package has a θJA rating of 60˚C/W, and a θJC
rating of 3˚C/W. These ratings are for the package only, no
additional heat-sinking, and with no airflow.
The TO-263 package uses the copper plane on the PCB as
a heat-sink. The tab of this package is soldered to the copper
plane for heat sinking. shows a curve for the θJA of TO-263
package for different copper area sizes, using a typical PCB
with 1 ounce copper and no solder mask over the copper
area for heat-sinking.
20131226
FIGURE 3. Maximum power dissipation vs ambient
temperature for the TO-263 package
20131225
FIGURE 2. θJA vs Copper (1 Ounce) Area for the
TO-263 package
www.national.com
12
LP38859
Physical Dimensions
inches (millimeters) unless otherwise noted
TO-220 5-Lead, Stagger Bend Package (TO220-5)
NS Package Number TO5D
TO-263 5-Lead, Molded, Surface Mount Package (TO263-5)
NS Package Number TS5B
13
www.national.com
LP38859 3A Fast-Response High-Accuracy LDO Linear Regulator with Soft-Start
Notes
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor follows the provisions of the Product Stewardship Guide for Customers (CSP-9-111C2) and Banned Substances
and Materials of Interest Specification (CSP-9-111S2) for regulatory environmental compliance. Details may be found at:
www.national.com/quality/green.
Lead free products are RoHS compliant.
National Semiconductor
Americas Customer
Support Center
Email: [email protected]
Tel: 1-800-272-9959
www.national.com
National Semiconductor
Europe Customer Support Center
Fax: +49 (0) 180-530 85 86
Email: [email protected]
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
National Semiconductor
Asia Pacific Customer
Support Center
Email: [email protected]
National Semiconductor
Japan Customer Support Center
Fax: 81-3-5639-7507
Email: [email protected]
Tel: 81-3-5639-7560