AOSMD AO4852

AO4852
60V Dual N-Channel MOSFET
General Description
Product Summary
The AO4852 uses advanced trench technology to
provide excellent RDS(ON) and low gate charge. As a pair
these MOSFETs operate very efficiently in Push Pull
and Bridge topologies.
VDS (V) = 60V
(VGS = 10V)
ID = 3.5A
RDS(ON) <90mΩ (VGS = 10V)
RDS(ON) <105mΩ (VGS = 4.5V)
100% UIS Tested
100% Rg Tested
SOIC-8
Top View
Bottom View
D2
D1
Top View
S2
G2
S1
G1
1
2
3
4
D2
D2
D1
D1
8
7
6
5
G2
G1
S2
S1
Pin1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Drain-Source Voltage
Symbol
VDS
Gate-Source Voltage
TA=70°C
ID
B
±20
V
3.5
3
2.8
2.4
IDM
TA=25°C
Power Dissipation
Units
V
VGS
TA=25°C
Continuous Drain
Current A
Pulsed Drain Current
Maximum
10 Sec
Steady State
60
Avalanche Current B
2
1.4
1.3
0.9
B
Junction and Storage Temperature Range
A
9.6
mJ
-55 to 150
°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A t ≤ 10s
Maximum Junction-to-Ambient A Steady-State
Steady-State
EAR
TJ, TSTG
Symbol
RθJA
RθJL
W
8
IAR
Repetitive avalanche energy 0.3mH
Maximum Junction-to-Lead C
20
PD
TA=70°C
A
Typ
48
74
33
Max
62.5
90
40
Units
°C/W
°C/W
°C/W
AO4852
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Min
ID=250µA, VGS=0V
Units
V
1
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±20V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=250µA
1.7
ID(ON)
On state drain current
VGS=10V, VDS=5V
20
TJ=55°C
VGS=10V, ID=3A
Static Drain-Source On-Resistance
Max
60
VDS=60V, VGS=0V
IDSS
RDS(ON)
Typ
TJ=125°C
VGS=4.5V, ID=2A
5
µA
100
nA
2.3
2.6
V
79
90
146
159
86
105
mΩ
1
V
A
mΩ
gFS
Forward Transconductance
VDS=5V, ID=3A
15
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.8
ISM
Pulsed Body-Diode CurrentB
20
A
IS
Maximum Body-Diode Continuous Current
2.5
A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
372
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
S
450
31
VGS=0V, VDS=0V, f=1MHz
1.7
2.6
Ω
7.1
9.2
nC
pF
17
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
Qg(4.5V) Total Gate Charge
pF
VGS=0V, VDS=30V, f=1MHz
VGS=10V, VDS=30V, ID=3A
3.6
nC
1
nC
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
2
tD(on)
Turn-On DelayTime
4.1
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Body Diode Reverse Recovery Time
IF=3A, dI/dt=100A/µs
23.4
Qrr
Body Diode Reverse Recovery Charge IF=3A, dI/dt=100A/µs
23.2
VGS=10V, VDS=30V, RL=10Ω,
RGEN=3Ω
pF
nC
5.3
2.1
ns
ns
15
ns
2.1
ns
29
ns
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The
value in any given application depends on the user's specific board design.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using < 300 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in
curve provides a single pulse rating.
Rev1: Nov. 2010
2
FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
AO4852
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
20
16
10V
4.5V
16
6V
VDS=5V
4V
12
ID(A)
ID (A)
12
8
125°C
8
3.5V
4
4
25°C
VGS=3V
0
0
0
1
2
3
4
5
2
2.4
VDS (Volts)
Fig 1: On-Region Characteristics
3.2
3.6
4
VGS(Volts)
Figure 2: Transfer Characteristics
105
Normalized On-Resistance
2.2
95
VGS=4.5V
RDS(ON) (mΩ )
2.8
85
75
VGS=10V
65
55
45
2
ID=2A
1.8
Vgs=4.5v
1.6
VGS=10V
1.4
ID=3A
1.2
1
0.8
0
2
4
6
8
0
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
25
50
75
100
125
150
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
180
1.0E+01
ID=3A
1.0E+00
150
1.0E-01
IS (A)
RDS(ON) (mΩ )
125°C
120
90
125°C
1.0E-02
25°C
25°C
60
1.0E-03
1.0E-04
30
1.0E-05
0
2
3
4
5
6
7
8
9
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
0.0
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics
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AO4852
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
600
10
VDS=30V
ID=3A
500
Capacitance (pF)
VGS (Volts)
8
6
4
2
Ciss
400
300
200
Coss
100
0
Crss
0
0
1
2
3
4
5
6
7
8
0
10
Qg (nC)
Figure 7: Gate-Charge Characteristics
30
50
60
35
TJ(Max)=150°C
TA=25°C
30
10µs
ID (Amps)
25
100µs
1ms
Power (W)
10.0
10ms
0.1s
1.0
1s
TJ(Max)=150°C
TA=25°C
20
15
10
10s
5
DC
0
0.001
0.1
0.1
40
VDS (Volts)
Figure 8: Capacitance Characteristics
RDS(ON)
limited
100.0
20
1
10
100
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
Zθ JA Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=62.5°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
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