® ® Cree XLamp XH-B LED PRODUCT DESCRIPTION FEATURES Table of Contents Unlike common plastic packages, • Package size: 3.0 X 3.0 mm Characteristics.......................... 2 XLamp XH LEDs use a ceramic • Available in white, 70-minimum Flux Characteristics.................... 3 package to deliver the unique CRI cool white, 80-minimum Relative Spectral Power CRI white and 85- and Distribution.............................. 4 reliability not available elsewhere in 90-minimum CRI warm white Relative Flux vs. Junction mid‑power LEDs. The ceramic‑based • 125 mA maximum drive current Temperature............................. 4 XH LEDs are designed to deliver the • Viewing angle: 130° Electrical Characteristics............. 5 long L70 lifetimes of Cree’s other • Reflow solderable - JEDEC Thermal Design......................... 5 J-STD-020C compatible Relative Flux vs. Current............ 6 combination of high performance and high‑power LEDs, such as XP or XT LEDs, as well as industry‑leading LED efficacy levels. • Unlimited floor life at Typical Spatial Distribution.......... 6 ≤ 30 °C/85% RH Reflow Soldering Characteristics.. 7 Notes....................................... 8 Optimized fluorescent Mechanical Dimensions.............. 9 applications, Tape and Reel......................... 10 such as troffers and panel lights, Packaging............................... 11 replacement for lighting where high efficacy, long lifetime and smooth appearance are critical, the XH LEDs allow lighting manufacturers to offer products that meet the lifetime expectations of www.cree.com/Xlamp LED technology. Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 CLD-DS70 Rev 0 Product family data sheet xlamp xH-B led Characteristics Characteristics Unit Thermal resistance, junction to solder point °C/W 45 degrees 130 mV/°C -2 Viewing angle (FWHM) Temperature coefficient of voltage ESD classification (HBM per Mil-Std-883D) DC forward current Minimum Typical Maximum Class 2 mA 125 Reverse voltage V -5 Forward voltage (@ 65 mA, 25 °C) V LED junction temperature °C 3.1 3.6 150 Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 2 xlamp xH-B led Flux Characteristics (TJ = 25 °C) The following table provides several base order codes for XLamp XH-B LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XH Family Binning and Labeling document. Color CCT Range Base Order Codes Minimum Luminous Flux @ 65 mA Calculated Minimum Luminous Flux (lm)* Order Code Min. Max. Group Flux (lm) 125 mA Cool White 5000 K 8300 K J3 26.8 46 XHBAWT-00-0000-00000LX51 Neutral White 3700 K 5000 K J2 23.5 41 XHBAWT-00-0000-00000LXE5 Warm White 2600 K 3700 K J2 23.5 41 XHBAWT-00-0000-00000LWE7 5000 K 8300 K J3 26.8 46 XHBAWT-00-0000-00000BX51 3700 K 5000 K J2 23.5 41 XHBAWT-00-0000-00000BXE5 2600 K 3700 K J2 23.5 41 XHBAWT-00-0000-00000BWE7 5000 K 8300 K J3 26.8 46 XHBAWT-00-0000-00000HW51 3700 K 5000 K J2 23.5 41 XHBAWT-00-0000-00000HWE5 2600 K 3700 K J2 23.5 41 XHBAWT-00-0000-00000HWE7 85-CRI White 2600 K 3200 K H0 18.1 31 XHBAWT-00-0000-00000PVE7 90-CRI White 2600 K 3200 K H0 18.1 31 XHBAWT-00-0000-00000UVE7 70-CRI White 80-CRI White Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. • Typical CRI for Neutral White, 3700 K - 5000 K CCT is 75. • Typical CRI for Warm White, 2600 K - 3700 K CCT is 80. • Minimum CRI for 70-CRI Minimum Cool White is 70. • Minimum CRI for 80-CRI Minimum White is 80. • Minimum CRI for 85-CRI Minimum White is 85. • Minimum CRI for 90-CRI Minimum White is 90. * Calculated flux values at 125 mA are for reference only. Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 3 xlamp xH-B led Relative Spectral Power Relative Spectral Power Distribution Relative Radiant Power (%) 100 80 60 Cool White Warm White 40 20 0 380 430 480 530 580 630 680 730 780 Wavelength (nm) Relative Flux Output vs. Junction Temperature Relative Flux vs. Junction Temperature (IF = 65 mA) 100 Relative Luminous Flux (%) 90 80 70 60 50 40 30 20 10 0 25 50 75 100 125 150 Junction Temperature (ºC) Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 4 xlamp xH-B led Electrical Characteristics (Tj = 25°C) Electrical Characteristics (TJ = 25 °C) Forward Current (mA) 125 100 75 50 25 2.8 2.9 3.0 3.1 3.2 3.3 3.4 Forward Voltage (V) Thermal Design Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. 150 Maximum Current (mA) 125 100 75 Rj-a Rj-a Rj-a Rj-a 50 = = = = 50 60 70 80 °C/W °C/W °C/W °C/W 25 0 0 20 40 60 80 100 120 140 Ambient Temperature (ºC) Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 5 xlamp xH-B led Relative Intensity vs. Current (Tj = 25°C) Relative Flux vs. Current (TJ = 25 °C) Relative Luminous Flux (%) 175 150 125 100 75 50 25 0 25 50 75 100 125 Forward Current (mA) Typical Spatial Radiation Pattern Typical Spatial Distribution 100 Relative Luminous Intensity (%) 90 80 70 60 50 40 30 20 10 0 -90 -70 -50 -30 -10 10 30 50 70 90 Angle (º) Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 6 xlamp xH-B led Reflow Soldering Characteristics In testing, Cree has found XLamp XH-B LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 Profile Feature t 25˚C to Peak Time Lead-Based Solder Lead-Free Solder 3 °C/second max. 3 °C/second max. Preheat: Temperature Min (Tsmin) 100 °C 150 °C Preheat: Temperature Max (Tsmax) 150 °C 200 °C 60-120 seconds 60-180 seconds 183 °C 217 °C 60-150 seconds 60-150 seconds 215 °C 260 °C 10-30 seconds 20-40 seconds 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Average Ramp-Up Rate (Tsmax to Tp) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp) Ramp-Down Rate Time 25 °C to Peak Temperature Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 7 xlamp xH-B led Notes Lumen Maintenance Projections Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document at www.cree.com/xlamp_app_notes/LM80_results. Please read the XLamp Long-Term Lumen Maintenance application note at www.cree.com/xlamp_app_notes/lumen_ maintenance for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note at www.cree.com/xlamp_app_notes/thermal_management for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature. Moisture Sensitivity In testing, Cree has found XLamp XH-B LEDs to have unlimited floor life in conditions ≤30 ºC/85% relative humidity (RH). Moisture testing included a 168-hour soak at 85 ºC/85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage. Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LEDs to the resealable moisture-barrier bag and closing the bag immediately after use. Vision Advisory Claim WARNING: Do not look at exposed lamp in operation. Eye injury can result. See the LED Eye Safety application note at www.cree.com/xlamp_app_notes/led_eye_safety. Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 8 xlamp xH-B led Mechanical Dimensions All dimensions in mm. Measurement tolerances unless indicated otherwise: .xx = .25 mm, .xxx = .125 mm 2.8 0.635 2.8 0.635 0.1 NOTCH IS ON CATHODE (-) SIDE 1.6 1.6 3.0 3.0 0.5 0.7 0.7 0.1 3.0 0.7+/-.2mm 3.0 2.8 0.7+/-.2mm 2.8 Top ViewSide ViewBottom View 0.5 1.7 0.5 0.65 0.8 1.55 0.33 1.7 0.65 0.8 0.65 0.33 3 2.84 3 1.33 0.25 0.65 1.55 2.84 1.33 0.25 RECOMMENDED PC BOARD SOLDER PAD 0.25 0.25 RECOMMENDED STENCIL PAD RECOMMENDED PC BOARD SOLDER PAD RECOMMENDED STENCIL PAD Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 9 xlamp xH-B led Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. All dimensions in mm. Measurement tolerances unless indicated otherwise: .xx = .25 mm, .xxx = .125 mm 1.5±.1 4.0±.1 8.0±.1 1.75±.10 2.5±.1 Cathode Side 4.0 ±.1 8.0 ±.1 1.75 ±.10 +.3 12.0 .0 1.5 ±.1 2.5 ±.1 Cathode Side 12.0 +.3 .0 Anode Side (denoted by + and circle) Anode SideUser Feed Direction (denoted by + and circle) END START User Feed Direction END 4 START 3 2 1 Loaded Pockets (1,000 Lamps) Trailer 160mm (min) of Trailer empty pockets 160 mm (min) of sealed with tape empty pockets (20 pockets min.) sealed with tape Loaded Pockets (2,000 Lamps) D (20 pockets min.) Leader 400mm (min) of Leader empty pockets with 400 mm (min) of at least 100mm empty pockets with sealed byattape least 100 mm (50 empty pockets sealedmin.) by tape (50 empty pockets min.) 16.40 User Feed Direction User Feed Direction C 62 Cover Tape Cover Tape Pocket TapePocket Tape +0.20 12.40 0 MEASURED AT HUB B 13mm 7" 7" 13mm +3.20 12.40 0 MEASURED AT INSIDE EDGE Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. DRAWN BY UNLESS OTHERWISE SPECIFIED R.CHALOUPECKY DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. CHECK TOLERANCE UNLESS SPECIFIED: APPROVED .X ± 0.3 .XX ± .13 DATE 6/25/08 4600 Silicon Drive Durham, N.C 27703 DATE Phone (919) 361-4770 DATE TITLE A 10 xlamp xH-B led Packaging The diagrams below show the packaging and labels Cree uses to ship XLamp XH-B LEDs. XLamp XH-B LEDs are shipped in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag. Unpackaged Reel Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label CREE Binwith Code Cree Bin & Barcode LabelLot # Code, Qty, Label with Cree Bin Code, Qty, Reel ID Label with Cree Bin Label with Customer P/N, Qty,Qty, Lot #, Lot PO # # Code, Packaged Reel Patent Label Label with Customer Order Label with Cree Order Code, Code, Qty, Reel ID, PO # Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Boxed Reel Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Patent Label (on bottom of box) Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 11