ds XQD

Cree® XLamp® XQ-D LED
PRODUCT DESCRIPTION
FEATURES
Table of Contents
Cree XLamp® XQ-D LEDs revolutionize
• Cree’s smallest lighting class LED:
Characteristics........................................ 2
low-cost, high-power LEDs by delivering
Flux Characteristics................................ 3
lighting-class reliability and a wider
• Available in white, 80-minimum CRI
spread of light than typical plastic
white, and 70-minimum CRI cool
Relative Flux vs. Junction
packages.
white
Temperature............................................ 4
The
XQ‑D’s
innovative
Relative Spectral Power Distribution..... 4
wide light emission can improve the
• Binned at 25 °C
Electrical Characteristics........................ 5
omnidirectionality of replacement lamps,
• 700 mA maximum drive current
Relative Flux vs. Current......................... 5
while also reducing system cost by using
• Low thermal resistance: 7.5 °C/W
Typical Spatial Distribution..................... 6
fewer LEDs.
• Wide viewing angle: 145°
Thermal Design....................................... 6
• Reflow solderable - JEDEC
Reflow Soldering Characteristics........... 7
J‑STD‑020C compatible
Notes....................................................... 8
Using Cree’s newest generation of
silicon carbide-based LED chips, XQ-D is
• Unlimited floor life at ≤ 30 °C/85% RH
Mechanical Dimensions....................... 10
optimized to dramatically lower system
• RoHS- and REACh‑compliant
Tape and Reel........................................ 11
cost in replacement lamp, non-directional
• UL recognized component
Packaging.............................................. 12
and outdoor area lighting applications.
www.cree.com/Xlamp
1.6 X 1.6 X 1.6 mm
®
(E349212)
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
1
CLD-DS52 Rev 3E
Product family data sheet
XLamp ® XQ-D LED
Characteristics
Characteristics
Unit
Thermal resistance, junction to solder point
°C/W
7.5
degrees
145
mV/°C
-3
Viewing angle (FWHM)
Temperature coefficient of voltage
ESD classification (HBM per Mil-Std-883D)
DC forward current
Minimum
Typical
Maximum
Class 1
mA
Reverse voltage
V
Forward voltage (@ 350 mA, 25 °C)
V
LED junction temperature
°C
350
700
-5
3.1
3.5
150
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
2
XLamp ® XQ-D LED
Flux Characteristics (TJ = 25 °C)
The following table provides several base order codes for XLamp XQ-D LEDs. It is important to note that the base order codes listed here
are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the ordercode nomenclature, please consult the XLamp XQ LED Family Binning and Labeling document.
Color
CCT Range
Min.
Cool White
70 CRI Minimum
Cool White
Neutral White
80 CRI Minimum
White
Warm White
5000 K
5000 K
3700 K
2600 K
2600 K
Minimum Luminous Flux
@ 350 mA
Max.
Calculated
Minimum
Luminous Flux
(lm)*
Order Code
Group
Flux (lm)
700 mA
R4
130
227
XQDAWT-00-0000-00000LG51
R3
122
213
XQDAWT-00-0000-00000LF51
R2
114
199
XQDAWT-00-0000-00000LE51
R4
130
227
XQDAWT-00-0000-00000BG51
R3
122
213
XQDAWT-00-0000-00000BF51
R2
114
199
XQDAWT-00-0000-00000BE51
R3
122
213
XQDAWT-00-0000-00000BFE5
R2
114
199
XQDAWT-00-0000-00000BEE5
Q5
107
187
XQDAWT-00-0000-00000LDE5
Q4
100
172
XQDAWT-00-0000-00000HCE7
Q3
93.9
164
XQDAWT-00-0000-00000HBE7
Q2
87.4
153
XQDAWT-00-0000-00000HAE7
Q4
100
172
XQDAWT-00-0000-00000LCE7
Q3
93.9
164
XQDAWT-00-0000-00000LBE7
Q2
87.4
153
XQDAWT-00-0000-00000LAE7
8300 K
8300 K
5000 K
4300 K
3700 K
Notes:
• Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI
measurements. See the Measurements section (page 8).
• Typical CRI for Neutral White, 3700 K - 5000K CCT is 75.
• Typical CRI for Warm White, 2600 K - 3700 K CCT is 80.
• Minimum CRI for 70 CRI Minimum Cool White is 70.
• Minimum CRI for 80 CRI Minimum White is 80.
* Calculated flux values at 700 mA are for reference only.
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
3
XLamp ® XQ-D LED
Relative Spectral Power
Relative Spectral Power Distribution
Relative Radiant Power (%)
100%
80%
60%
Cool White
Neutral White
Warm White
40%
20%
0%
380
430
480
530
580
630
680
730
780
Wavelength (nm)
Relative Flux Output vs. Junction Temperature
Relative Flux vs. Junction Temperature (IF = 350 mA)
120%
Relative Luminous Flux
100%
80%
60%
40%
20%
0%
25
50
75
100
125
150
Junction Temperature (ºC)
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
4
XLamp ® XQ-D LED
Electrical Characteristics
(Tj = 85ºC) (T = 25 °C)
Electrical
Characteristics
J
700
Forward Current (mA)
600
500
400
300
200
100
0
2.5
2.6
2.7
2.8
2.9
Relative Intensity vs. Current (Tj = 85ºC)
3.0
3.1
3.2
3.3
Forward Voltage (V)
Relative Flux vs. Current (TJ = 25 °C)
180%
Relative Luminous Flux (%)
160%
140%
120%
100%
80%
60%
40%
20%
0%
0
100
200
300
400
500
600
700
Forward Current (mA)
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
5
XLamp ® XQ-D LED
Typical Spatial Radiation Pattern
Typical Spatial Distribution
100%
90%
Relative Luminous Intensity (%)
80%
70%
60%
50%
40%
30%
20%
10%
-90
-70
-50
-30
-10
0%
10
30
50
70
90
Angle (º)
Thermal Design
Thermal Design
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end
product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life
and optical characteristics.
800
Maximum Current (mA)
700
600
500
400
300
Rj-a = 10°C/W
Rj-a = 15°C/W
200
Rj-a = 20°C/W
100
0
Rj-a = 25°C/W
0
20
40
60
80
100
120
140
160
Ambient Temperature (ºC)
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
6
XLamp ® XQ-D LED
Reflow Soldering Characteristics
In testing, Cree has found XLamp XQ-D LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general
guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
tP
TP
Critical Zone
TL to TP
Temperature
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
IPC/JEDEC J-STD-020C
Time
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Lead-Free Solder
1.2 °C/second
Preheat: Temperature Min (Tsmin)
120 °C
Preheat: Temperature Max (Tsmax)
170 °C
Preheat: Time (tsmin to tsmax)
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
65-150 seconds
217 °C
45-90 seconds
235 - 245 °C
Time Within 5 °C of Actual Peak Temperature (tp)
20-40 seconds
Ramp-Down Rate
1 - 6 °C/second
Time 25 °C to Peak Temperature
4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
7
XLamp ® XQ-D LED
Notes
Measurements
The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely
represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors
that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are
provided for informational purposes only and are not intended as specifications.
Pre‑Release Qualification Testing
Please read the LED Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp
LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs.
Lumen Maintenance
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance.
For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document.
Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting.
Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect
the LED junction temperature.
Moisture Sensitivity
Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.
Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp XQ-D LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in
conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree recommends sealing any unsoldered LEDs in the
original MBP.
RoHS Compliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold
limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as
implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product
Documentation sections of www.cree.com.
REACh Compliance
REACh substances of very high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA)
has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to
insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available
upon request.
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
8
XLamp ® XQ-D LED
Notes - Continued
UL® Recognized Component
Level 1 enclosure consideration. The LED package or a portion thereof has not been investigated as a fire enclosure or a fire and electrical
enclosure per ANSI/UL 8750.
Vision Advisory
WARNING: Do not look at an exposed lamp in operation. Eye injury can result. For more information about LEDs and eye safety, please
refer to the LED Eye Safety application note.
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
9
XLamp ® XQ-D LED
66
6
55
5
44
4
33
3
22
2
Mechanical Dimensions
11
1
REVISONS
REVISONSREVISONS
NOTICE
NOTICE NOTICE
CREECONFIDENTIAL.
CONFIDENTIAL.
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PLOT
AND
THEINFORMATION
INFORMATION
CONFIDENTIAL.
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AND
THEAND
INFORMATION
CREE
THIS
PLOT
THE
CONTAINED
WITHIN
ARETHE
THEPROPRIETARY
PROPRIETARY
AND
AINED
WITHIN ARE
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PROPRIETARY
AND
CONTAINED
WITHIN
AND
CONFIDENTIAL
INFORMATION
OF
CREE,
INC.
THISPLOT
PLOT
DENTIAL
INFORMATION
OF CREE,
INC.
THIS
PLOT
CONFIDENTIAL
INFORMATION
OF
CREE,
INC.
THIS
MAY
NOTBE
BECOPIED,
COPIED,REPRODUCED
REPRODUCED
ORDISCLOSED
DISCLOSED
TOANY
ANY
OT
BE COPIED,
REPRODUCED
OR DISCLOSED
TO ANY TO
MAY
NOT
OR
UNAUTHORIZED
PERSON
WITHOUT
THEWRITTEN
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WITHOUT
THE
CONSENT
OF
CREEINC.
INC.
EEOF
INC.
CREE
REV
REV
REV
BY
DATE
BY
BY
DESCRIPTION
DESCRIPTION
DESCRIPTION
DATE
APP'D
DATE
A
AP
All dimensions in mm.
Measurement tolerances unless indicated otherwise: ±.13 mm
1.60
DD
1.60
1.60
1.60
.375
1.60
.600
R.936
1.60
1.60
1.60
1.41
1.60
.600
.600
.600
.375
.600
.600
D
R.936
NOTCH
ISON
ON
NOTCHNOTCH
IS ON IS
CATHODE
(-)SIDE
SIDE
CATHODE
(-) SIDE(-)
CATHODE
1.500
1.500 1.500
1.41
1.41
1.60
1.5
C
CC
1.60± .05
.05
1.60± .05
1.60±
Top View
.300
.300
.300
Side View
±.08 1.58 ±.08
Bottom1.58
View
1.500
1.500 1.500
.300
.65
1.500
.300
.300
1.500
.300
.65
.65
.30
.300
SOLDER
PAD
SOLDER
PAD PAD
SOLDER
REFERENCE
REFERENCE
REFERENCE
.30
.30
B
B
.65
.65
.30
3.300
3.300 3.300
1.60
1.60
1.60
1.60
1.60
1.60
1.60
SOLDER PAD
SOLDER PAD
REFERENCEREFERENCE
.30
3.300
1.60
RECOMMENDED
PCBOARD
BOARD
SOLDER
PAD
RECOMMENDED
PC BOARD
SOLDER
PAD PAD
RECOMMENDED
PC
SOLDER
3.300
3.300 3.300
A
1.60
DRAWN BY
1.60
RECOMMENDED
TRACELAYOUT
LAYOUT
RECOMMENDED
TRACETRACE
LAYOUT
RECOMMENDED
Recommended PCB solder pad
66
5
55
4
44
DATE
DATE
DRAWN
BY
DATE
DRAWN
BY
UNLESSOTHERWISE
OTHERWISE
SPECIFIED
UNLESS OTHERWISE
SPECIFIED SPECIFIED
UNLESS
CRONIN
5/23/12
5/23/12
5/23/12
DIMENSIONS
AREININD. CRONIND.D.CRONIN
DIMENSIONS
ARE IN
DIMENSIONS
ARE
CHECK
DATE
CHECK
DATE
DATE
MILLIMETERS
ANDAFTER
AFTER
FINISH. CHECK
MILLIMETERS
AND AFTERAND
FINISH.
MILLIMETERS
FINISH.
TOLERANCE
UNLESSSPECIFIED:
SPECIFIED:
-TOLERANCE
UNLESS SPECIFIED:
---- ----TOLERANCE
UNLESS
.XX ± ± .25
.25
.XX ±
.25
.XX
APPROVED
DATE
DATE
APPROVED
DATE
APPROVED
.XXX ± ± .125
.125
TITLE
.XXX ± .XXX
.125
-- ------X°
±
.5
°
X°
±
.5
°
X°
±
.5 °
THIRD
ANGLEPROJECTION
PROJECTION
THIRD ANGLE
PROJECTION
THIRD
ANGLE
MATERIAL
MATERIAL
FORSHEET
SHEET
METAL
PARTS
ONLY MATERIAL
FOR SHEETFOR
METAL
PARTS
ONLY
METAL
PARTS
ONLY
.X ± ±
1.5
.X
±
1.5
.X
1.5
SIZE
.XX ± ± .75
.75
.XX ±
.75
.XX
.XXX ± ± .25
.25
.XXX ± .XXX
.25
FINAL
PROTECTIVE
FINISH
FINAL PROTECTIVE
FINISH
FINAL
PROTECTIVE
FINISH
X°
±
.5X°° ± ±
X°
.5.5° °
--
RECOMMENDED
PC BOARD SOLDER
PAD
RECOMMENDED
PC BOARD
SOLDER PAD
6
3.300
3.300
3.300
1.6
1.6 FINISH: 1.6
SURFACE
SURFACE FINISH:
SURFACE
FINISH:
3
33
--
2
-------
22
C
SCALE
4600
Silicon
Drive
4600 Silicon Drive
4600
Silicon
Drive
Durham,
N.C
27703
Durham, N.C 27703
Durham,
N.C
27703
Phone
(919)
313-530
Phone (919) 313-5300
Phone
(919)
313-5300
Fax
(919)
313-5558
Fax (919) 313-5558
Fax
(919)
313-5558
A
TITLE
TITLE
XQxOUTLINE
OUTLINE
XQx OUTLINE
XQx
REV.
DRAWING
NO.
SIZE DRAWING NO.DRAWING
NO.
SIZE
C
C
SCALE
SCALE
45.000
45.000
45.000
R
2610-00026 A
2610-00026
2610-00026
SHEET
1
RECOMMENDED
TRACE LAYOUT
RECOMMENDED
TRACE
LAYOUT
Recommended
trace
layout
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
10
SHEET
OF
SHEET
11
OF
OF
1 /1
INFORMATION
RY AND
C. THIS PLOT
ISCLOSED TO ANY
RITTEN CONSENT
REV
BY
DESCRIPTION
DATE
APP'D
XLamp ® XQ-D LED
D
Tape and Reel
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
Except as noted, all dimensions in mm.
Measurement tolerances unless indicated otherwise: .xx = ±.25 mm, .xxx = ±.125 mm
1.500
+.10
4.0 ±.1
-.00
4.000
1.5 ±.1
CATHODE SIDE
1.75 ±.10
8.0 ±.1
A
12.0
C
2.5 ±.1
1.750
1.65
Cathode Side
8.000
NOMINAL
8.30
MAX
+.3
.0
1.85
1.000
2.000
ANODE SIDE
A
3.50 ±.10
.30 ± .10
Anode Side
(denoted by + and circle)
B
User Feed Direction
END
START
REFERENCE VENDOR PART NUMBER 021142
Loaded Pockets
(2,000 Lamps)
Trailer
160 mm (min) of
empty pockets
sealed with tape
(20 pockets min.)
mulative tolerance ±
THIRD ANGLE PROJECTION
0.2mm
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
.XX ±
.25
.XXX ±
.125
X°
±
.5 °
FOR SHEET METAL PARTS ONLY
.X
±
1.5
.XX ±
.75
.XXX ±
.25
X°
±
.5 °
Leader
400
mm
(min) of
D. CRONIN
5/31/12
empty pockets with
at least 100 mm
sealed by tape
Carrier Tape, 1.7X1.7 XPQ
(50 empty pockets min.)
DRAWN BY
DATE
CHECK
DATE
APPROVED
DATE
Fax (919) 313-5558
3
A
MATERIAL
SIZE
FINAL PROTECTIVE FINISH
SCALE
1.6
4
Phone (919) 313-5300
TITLE
SURFACE Feed
FINISH:
User
Direction
5
4600 Silicon Drive
Durham, N.C 27703
2
C
4.000
DRAWING NO.
2402-00023
SHEET
REV.
A
OF
1
Cover Tape
Pocket Tape
13mm
7"
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
11
1 /1
XLamp ® XQ-D LED
Packaging
The diagrams below show the packaging and labels Cree uses to ship XLamp XQ-D LEDs. XLamp XQ-D LEDs are shipped in tape loaded
on a reel. Each box contains only one reel in a moisture barrier bag.
Unpackaged Reel
Vacuum-Sealed
Vacuum-Sealed
Moisture
Barrier Bag
Moisture Barrier Bag
Label
CREE
Binwith
Code Cree Bin
&
Barcode
LabelLot #
Code,
Qty,
Label with Cree Bin Code,
Quantity, Reel ID
Label
with
Cree Bin
Label with
Customer
P/N, Qty,Qty,
Lot #, Lot
PO # #
Code,
Packaged Reel
Patent Label
Label with Customer Order
Label
with Cree Order Code,
Code, Qty, Reel ID, PO #
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Boxed Reel
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Patent Label
(on bottom of box)
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
12