LUGUANG BAS216

BAS216
Switching Diodes
FEATURES
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Silicon epitaxial planar diode
SMD chip pattern, available in various dimension included 1206 & 0603
Leadfree and RoHS compliance components
MECHANICAL CHARACTERISTICS
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Size: 0805
Weight: approx. 6mg
Marking: Cathode terminal
DIMENSIONS
Dimension/mm
0805
L
W
T
C
2.0±0.2
1.25±0.2
0.85±0.1
0.45±0.2
THERMAL CHARACTERISTICS
Parameter at Tamb=25oC
Symbol
Junction Temperature
Thermal Resistance Junction to Ambient air
Storage Temperature range
Tj
RθJA
Tstg
Unit
o
C
C/W
o
C
o
Value
175
3751)
-65 to 175
1) Valid provided that electrodes are kept at ambient temperature.
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mail:[email protected]
BAS216
Switching Diodes
ELECTRICAL CHARACTERISTICS
Parameter at Tamb=25oC
Symbol
Unit
Value
VR
VRM
IFM
V
V
mA
75
100
300
IF(AV)
mA
1501)
IFSM
Ptot
VF
IR
IR
IR
Ctot
mA
mW
V
nA
μA
μA
pF
500
4001)
1.0 MAX
25 MAX
5 MAX
50 MAX
4 MAX
Vfr
V
2.5
trr
ns
4
ηr
%
45
Reverse Voltage
Peak Reverse Voltage
Forward Continuous Current
Average rectified current sin half wave
rectification with resistive load f>=50Hz
Surge Forward Current at t<1s and Tj=25oC
Power Dissipation
Forward Voltage at IF=10mA
Leakage Current at VR=20V
at VR=75V
at VR=20V, Tj=150oC
Capacitance at VF=VR=0V
Voltage rise when switching ON, tested with
50mA pulses, tp=0.1µs, rise time <30ns,
fp=(5-100)kHz
Reverse Recovery Time at IF =10mA to IR=1mA,
VR=6V, RL=100Ω
Rectification efficiency at f=100MHz, VRF=2V
1) Valid provided that electrodes are kept at ambient temperature.
Rectification Efficiency Measurement Circuit
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mail:[email protected]
MAX
MAX
MIN
BAS216
Switching Diodes
ENVIRONMENTAL CHARACTERISTICS
Hazardous Substance or Element/ppm
Product
BAS216
Pb
Cd
Hg
Cr6+
PBB
PBDE
<1000
<100
<1000
<1000
<1000
<1000
TEST CHARACTERISTICS
Test Item
Solderability
Resistance to
Soldering Heat
Humidity Steady
State
Continue Forward
Operating Life
Hi-Temperature
Reverse Bias
Thermal Shock
Bending Strength
Test Condition
o
Sn bath at 250±5 C for 2±0.5s
o
Sn bath at 260±5 C for 10±2s
Requirement
>95% area tin covered
VF,VZ & IR within spec;
no mechanical damage
At 85oC 85%RH for 1000hrs
VF,VZ & IR within spec
At 25oC IF =Io±10% for 1000hrs
VF,VZ & IR within spec
o
At 150 C VR =0.8VR rated for
1000hrs
-55 ±5oC/5min to 150±5oC/5min
for 10cycles
Bending up to 2mm for 1cycle
VF,VZ & IR within spec
VF,VZ & IR within spec
VF,VZ & IR within spec;
no mechanical damage
PACKING METHOD
Product
BAS216
Quality/Reel
Reel Size
Tape
5,000pcs
7”
Paper
APPLICATIONS
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Function: Fast Switching
Soldering Condition:
Sn-Pb
Leadfree
Wave
Soldering
Soldering
Soldering
Ramp-up rate (from pre-heat stage)
<3oC/s
<3oC/s
△T<150oC
o
o
100-150 C
150-200 C
100-150 oC
Pre-heat Temperature & Time
60-120s
60-180s
60-120s
183 oC
217 oC
260±5oC
Soldering Temperature & Time
60-150s
60-150s
5±2oC
o
o
Peak Temperature
230±5 C
245±5 C
260±5oC
o
Time within 5 C of peak temperature
10-30s
20-40s
o
o
o
Ramp-down rate
<6 C/s
<6 C/s
<6 C/s
Time 25oC to peak temperature
<6min
<8min
Manual Soldering: Approx. 350oC for 3s, avoid solder iron tip direct touch the components body
Recommended Profile Condition
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Storage Condition: Product termination solderability can degrade due to high temperature and
humidity or chemical environment. Storage condition must be in an ambient temperature of <40oC
and ambient humidity of <80%RH, and free from chemical.
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mail:[email protected]