BAS216 Switching Diodes FEATURES Silicon epitaxial planar diode SMD chip pattern, available in various dimension included 1206 & 0603 Leadfree and RoHS compliance components MECHANICAL CHARACTERISTICS Size: 0805 Weight: approx. 6mg Marking: Cathode terminal DIMENSIONS Dimension/mm 0805 L W T C 2.0±0.2 1.25±0.2 0.85±0.1 0.45±0.2 THERMAL CHARACTERISTICS Parameter at Tamb=25oC Symbol Junction Temperature Thermal Resistance Junction to Ambient air Storage Temperature range Tj RθJA Tstg Unit o C C/W o C o Value 175 3751) -65 to 175 1) Valid provided that electrodes are kept at ambient temperature. http://www.luguang.cn mail:[email protected] BAS216 Switching Diodes ELECTRICAL CHARACTERISTICS Parameter at Tamb=25oC Symbol Unit Value VR VRM IFM V V mA 75 100 300 IF(AV) mA 1501) IFSM Ptot VF IR IR IR Ctot mA mW V nA μA μA pF 500 4001) 1.0 MAX 25 MAX 5 MAX 50 MAX 4 MAX Vfr V 2.5 trr ns 4 ηr % 45 Reverse Voltage Peak Reverse Voltage Forward Continuous Current Average rectified current sin half wave rectification with resistive load f>=50Hz Surge Forward Current at t<1s and Tj=25oC Power Dissipation Forward Voltage at IF=10mA Leakage Current at VR=20V at VR=75V at VR=20V, Tj=150oC Capacitance at VF=VR=0V Voltage rise when switching ON, tested with 50mA pulses, tp=0.1µs, rise time <30ns, fp=(5-100)kHz Reverse Recovery Time at IF =10mA to IR=1mA, VR=6V, RL=100Ω Rectification efficiency at f=100MHz, VRF=2V 1) Valid provided that electrodes are kept at ambient temperature. Rectification Efficiency Measurement Circuit http://www.luguang.cn mail:[email protected] MAX MAX MIN BAS216 Switching Diodes ENVIRONMENTAL CHARACTERISTICS Hazardous Substance or Element/ppm Product BAS216 Pb Cd Hg Cr6+ PBB PBDE <1000 <100 <1000 <1000 <1000 <1000 TEST CHARACTERISTICS Test Item Solderability Resistance to Soldering Heat Humidity Steady State Continue Forward Operating Life Hi-Temperature Reverse Bias Thermal Shock Bending Strength Test Condition o Sn bath at 250±5 C for 2±0.5s o Sn bath at 260±5 C for 10±2s Requirement >95% area tin covered VF,VZ & IR within spec; no mechanical damage At 85oC 85%RH for 1000hrs VF,VZ & IR within spec At 25oC IF =Io±10% for 1000hrs VF,VZ & IR within spec o At 150 C VR =0.8VR rated for 1000hrs -55 ±5oC/5min to 150±5oC/5min for 10cycles Bending up to 2mm for 1cycle VF,VZ & IR within spec VF,VZ & IR within spec VF,VZ & IR within spec; no mechanical damage PACKING METHOD Product BAS216 Quality/Reel Reel Size Tape 5,000pcs 7” Paper APPLICATIONS Function: Fast Switching Soldering Condition: Sn-Pb Leadfree Wave Soldering Soldering Soldering Ramp-up rate (from pre-heat stage) <3oC/s <3oC/s △T<150oC o o 100-150 C 150-200 C 100-150 oC Pre-heat Temperature & Time 60-120s 60-180s 60-120s 183 oC 217 oC 260±5oC Soldering Temperature & Time 60-150s 60-150s 5±2oC o o Peak Temperature 230±5 C 245±5 C 260±5oC o Time within 5 C of peak temperature 10-30s 20-40s o o o Ramp-down rate <6 C/s <6 C/s <6 C/s Time 25oC to peak temperature <6min <8min Manual Soldering: Approx. 350oC for 3s, avoid solder iron tip direct touch the components body Recommended Profile Condition Storage Condition: Product termination solderability can degrade due to high temperature and humidity or chemical environment. Storage condition must be in an ambient temperature of <40oC and ambient humidity of <80%RH, and free from chemical. http://www.luguang.cn mail:[email protected]