PEREGRINE EK42430-01

Product Specification
PE42430
Product Description
The PE42430 is a HaRP™-enhanced reflective SP3T RF
switch developed on the UltraCMOS® process
technology. This tiny general purpose switch is ideal for
WLAN and bluetooth applications in the 2.4 - 2.5 GHz
bands as well as general broadband switching
applications. It is comprised of three RF ports and has
low insertion loss and high isolation. An on-chip CMOS
decode logic facilitates a three-pin CMOS control
interface. Unlike competitive solutions, there is no need
for blocking capacitors when using the PE42430.
Peregrine’s HaRP™ technology enhancements deliver
high linearity and exceptional harmonics performance.
It is an innovative feature of the UltraCMOS® process,
providing performance superior to GaAs with the
economy and integration of conventional CMOS.
Figure 1. Functional Diagram
UltraCMOS® SP3T Reflective
RF Switch 100 – 3000 MHz
Features
 HaRP™-enhanced UltraCMOS® device
 Low insertion loss
 Typical 0.45 dB @ 1 GHz
 Typical 0.55 dB @ 2.5 GHz
 IIP3: Typical +66 dBm
 P0.1dB Compression: Typical +30 dBm
 Excellent ESD tolerance of 4500V HBM
and 250V MM on all ports
 No external VDD required. VDD is derived
from switch control inputs
 Package type: 8-lead 1.5 x 1.5 mm DFN
Figure 2. Package Type
8-lead 1.5 x 1.5 mm DFN
RFC
ESD
RF1
RF3
ESD
ESD
RF2
ESD
CMOS
Control/Driver
and ESD
V1
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V2
V3
©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Page 1 of 11
PE42430
Product Specification
Table 1. Electrical Specifications1: Nominal @ 25°C, V1, V2 or V3 = 3V/5V (ZS = ZL = 50 Ω)
Electrical Parameter
Path
Condition
Min
Typ
100
Operating Frequency
Insertion Loss
RFC-RFX
Isolation
RFX-RFX
Isolation
RFC-RFX
Return Loss (Active Port)
RFX
Return Loss (Common Port)
RFC
Max
Unit
3000
MHz
100 to 1000 MHz
0.45
0.56
dB
1000 to 3000 MHz
0.65
0.9
dB
2400 to 2500 MHz
0.55
0.8
dB
100 to 1000 MHz
35
40
dB
1000 to 3000 MHz
23
28
dB
2400 to 2500 MHz
25
30
dB
100 to 1000 MHz
34
40
dB
1000 to 3000 MHz
23
28
dB
2400 to 2500 MHz
25
30
dB
100 to 1000 MHz
22
dB
1000 to 3000 MHz
16
dB
2400 to 2500 MHz
18
dB
100 to 1000 MHz
22
dB
1000 to 3000 MHz
16
dB
2400 to 2500 MHz
18
dB
Input 0.1 dB compression 2
RFC-RFX
100 to 3000 MHz
30
dBm
IIP3
RFC-RFX
100 to 3000 MHz
66
dBm
IIP2
RFC-RFX
100 to 3000 MHz
100
dBm
50% CTRL to 90% or 10% of final value
500
nS
50% CTRL to 90% or 10% of RF
1.5
Switching Time 3
Turn on Time
4
10
Video Feedthrough 5
2.0
µS
mV
Notes: 1. Specifications under min and max nominal conditions
2. Please refer to Maximum Input Power (50 Ω ) in Table 4
3. Switching time is measured while the part is powered on and one of the control pins is switching state
4. Turn on time is defined as the time it takes the part to go from an unpowered state to 90% RF voltage. Max power
can only be applied after the part is turned on
5. Video feedthrough is measured by terminating all ports and measuring peak transients while switching logic state
©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Page 2 of 11
Document No. 70-0326-04 │ UltraCMOS® RFIC Solutions
PE42430
Product Specification
Table 3. Electrical Specifications: Min/Max Performance @ -40 to +85°C, V1, V2 or V3 = 3.0V to 5.5V
(ZS = ZL = 50 Ω)
Electrical Parameter
Path
Condition
Min
Typ
100
Operating Frequency
Insertion Loss
RFC-RFX
Isolation
RFX-RFX
Isolation
RFC-RFX
Document No. 70-0326-04 │ www.psemi.com
Max
Unit
3000
MHz
100 to 1000 MHz
0.45
0.65
dB
1000 to 3000 MHz
0.65
0.95
dB
2400 to 2500 MHz
0.55
0.85
dB
100 to 1000 MHz
35
40
dB
1000 to 3000 MHz
23
28
dB
2400 to 2500 MHz
25
30
dB
100 to 1000 MHz
34
40
dB
1000 to 3000 MHz
23
28
dB
2400 to 2500 MHz
25
30
dB
©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Page 3 of 11
PE42430
Product Specification
Figure 3. Pin Configuration (Top View)
Table 4. Operating Ranges
Pin 1 Indicator
RFC
1
N/C
2
V1
3
RF1
Parameter
8
Exposed
9
Ground
Paddle
DGND
4
Min
Typ
Max
Units
130
230
µA
IDD Power Supply Current
IDD
VCTRL Control Voltage High
VIH
3
5.5
V
VCTRL Control Voltage Low
VIL
0
0.6
V
Operating temperature range
TOP
-40
+85
°C
Maximum Input Power (50 Ω)
CW @ +85°C
CW @ +25°C
Pin
+27
+30
dBm
dBm
RF3
7
V3
6
V2
5
Symbol
RF2
Table 5. Absolute Maximum Ratings
Symbol
Table 3. Pin Descriptions
Pin #
Pin Name
Description
1
RFC1
RF Common
2
N/C
No Connect
3
V1
Switch Control Input, CMOS logic level
4
RF11
RF I/O
5
RF21
RF I/O
6
V2
Switch Control Input, CMOS Logic Level
7
V3
Switch Control Input, CMOS Logic Level
8
RF31
RF I/O
Paddle
GND
Exposed Ground Paddle. Ground for
Proper Device Operation
Parameter/Conditions
Min
Max
Units
TST
Storage temperature range
-55
+150
°C
PIN
Maximum Input Power (50 Ω)
30
dBm
VESD
ESD Voltage HBM1 All Pins
4500
V
VESD
ESD Voltage MM2, All Pins
250
V
Notes: 1. HBM ESD Voltage (MIL_STD 883 Method 3015.7)
2. MM ESD Voltage (MM, JEDEC JESD22-A115-A )
Exceeding absolute maximum ratings may cause
permanent damage. Operation should be
restricted to the limits in the Operating Ranges
table.
Note 1: RF pins 1, 4, 5 and 8 must be at 0 VDC. The RF pins do not require
DC blocking capacitors for proper operation if the 0 VDC requirement
is met
©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Page 4 of 11
Document No. 70-0326-04 │ UltraCMOS® RFIC Solutions
PE42430
Product Specification
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS® device, observe
the same precautions that you would use with
other ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the specified rating.
Table 6. Truth Table
Path
V1
V2
V3
RFC - RF1
1
0
0
RFC - RF2
0
1
0
RFC - RF3
0
0
1
Note: Any state other than shown in Table 6 are undefined states
Moisture Sensitivity Level
The Moisture Sensitivity Level rating for the
PE42430 in the 8-lead 1.5 x 1.5 mm DFN package
is MSL1.
Switching Frequency
The PE42430 has a maximum 25 kHz switching
rate.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS®
devices are immune to latch-up.
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©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Page 5 of 11
PE42430
Product Specification
Figure 4. Insertion Loss vs Temperature
(RFX-RFC)
Figure 5. Insertion Loss vs VDD
(RFX-RFC)
Figure 6. Insertion Loss RFX
©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Page 6 of 11
Document No. 70-0326-04 │ UltraCMOS® RFIC Solutions
PE42430
Product Specification
Figure 7. RFX-RFX Isolation vs Temperature
Figure 8. RFX-RFX Isolation vs VDD
Figure 9. RFC-RFX Isolation vs Temperature
Figure 10. RFC-RFX Isolation vs VDD
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©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Page 7 of 11
PE42430
Product Specification
Figure 11. RFC Port Return Loss vs
Temperature
Figure 12. RFC Port Return Loss vs VDD
Figure 13. Active Port Return Loss vs
Temperature (RFX)
Figure 14. Active Port Return Loss vs VDD
(RFX)
©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Page 8 of 11
Document No. 70-0326-04 │ UltraCMOS® RFIC Solutions
PE42430
Product Specification
Evaluation Kit Information
Figure 15. Evaluation Board Layouts
The SP3T Switch Evaluation Kit facilitates customer evaluation of the PE42430 SP3T switch. The
RF common port is connected through a 50 Ω
transmission line to J2. Ports 1, 2 and 3 are connected through 50 Ω transmission lines to J3, J5
and J4 respectively. J1 provides digital inputs V1,
V2 and V3 to the device.
On the back of the board, a through line connects
SMA connectors J6 and J7. This transmission line
can be used to estimate the PCB loss over the
environmental conditions.
This four layer board is composed of Rogers 4350
on the top and bottom and FR4 on the inner layers
with a total thickness of 0.062”. All transmission
lines have 21.5 mil width and 7.25 mil gap.
Use jumpers on header J1 to short the control pins
to ground for logic low. VDD is supplied to the part
through at least one of the control pins via Pins 1,
3 or 5 (V3, V2, V1) on header J1.
101-0604
Figure 16. Evaluation Kit Schematics
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©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Page 9 of 11
PE42430
Product Specification
Figure 17. Mechanical Specifications
Symbol
A
A3
A1
b
D
D2
E
E2
e
L
K
Common
Dimensions (mm)
Dimensions (in)
Min
Nom
Max
Min
Nom
0.45
0.50
0.55
0.018
0.020
0.127 ref
0.005 ref
0.00
0.02
0.05
0.000
0.001
0.15
0.20
0.25
0.006
0.008
1.45
1.50
1.55
0.058
0.060
1.15
1.20
1.25
0.046
0.048
1.45
1.50
1.55
0.058
0.060
0.65
0.70
0.75
0.026
0.028
0.016 BSC
0.40 BSC
0.125
0.175
0.225
0.005
0.007
0.200
0.008
-
Max
0.022
0.002
0.010
0.062
0.050
0.062
0.030
0.009
-
Figure 18. Marking Specifications
Marking Spec Symbol Package
Marking
P
A-Z
ZZ
00-99
Y
0-9
WW
01-53
PZZ
YWW
17-0154
©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Page 10 of 11
Definition
Part# code
Last two digits of lot code
Last digit of year, starƟng from 2011
(1 for 2011,2 for 2012 etc)
Work week
Document No. 70-0326-04 │ UltraCMOS® RFIC Solutions
PE42430
Product Specification
Figure 19. Tape and Reel Drawing
Drawing not drawn to scale
Pocket hole diameter 0.6 ± 0.05 mm
Bumped die are oriented active side down
Maximum cavity angle 5o
Table 7. Ordering Information
Order Code
Description
Package
Shipping Method
PE42430MLAA-Z
PE42430 SP3T RF Switch
Green 8LD 1.5x1.5 DFN
3000 units T/R
EK42430-01
PE42430 Evaluation board
Evaluation Kit
1/Box
Sales Contact and Information
For sales and contact information please visit www.psemi.com.
Advance Information: The product is in a formative or design stage. The datasheet contains design target
specifications for product development. Specifications and features may change in any manner without notice.
Preliminary Specification: The datasheet contains preliminary data. Additional data may be added at a later
date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best
possible product. Product Specification: The datasheet contains final data. In the event Peregrine decides to
change the specifications, Peregrine will notify customers of the intended changes by issuing a CNF (Customer
Notification Form).
The information in this datasheet is believed to be reliable. However, Peregrine assumes no liability for the use
of this information. Use shall be entirely at the user’s own risk.
Document No. 70-0326-04 │ www.psemi.com
No patent rights or licenses to any circuits described in this datasheet are implied or granted to any third party.
Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant,
or in other applications intended to support or sustain life, or in any application in which the failure of the
Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no
liability for damages, including consequential or incidental damages, arising out of the use of its products in
such applications.
The Peregrine name, logo, UltraCMOS and UTSi are registered trademarks and HaRP, MultiSwitch and DuNE
are trademarks of Peregrine Semiconductor Corp.
©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Page 11 of 11