SHENZHENFREESCALE AOK22N50

AOK22N50
500V,22A N-Channel MOSFET
General Description
The AOK22N50 is fabricated using an advanced high voltage MOSFET process that is designed to deliver high
levels of performance and robustness in popular AC-DC applications.By providing low RDS(on) , C issand C rss along
with guaranteed avalanche capability this parts can be adopted quickly into new and existing offline power supply
designs.
Features
VDS
ID (at VGS=10V)
600V@150℃
22A
RDS(ON) (at VGS=10V)
< 0.26Ω
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
VGS
Gate-Source Voltage
Continuous Drain
Current
1/5
TC=25°C
TC=100°C
ID
AOK22N50
500
Units
V
±30
V
22
15
A
Pulsed Drain Current C
IDM
Avalanche Current C
IAR
7
A
Repetitive avalanche energy C
EAR
735
mJ
Single plused avalanche energy G
Peak diode recovery dv/dt
TC=25°C
Power Dissipation B Derate above 25oC
Junction and Storage Temperature Range
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A,D
Maximum Case-to-sink A
Maximum Junction-to-Case
EAS
dv/dt
1470
5
417
mJ
V/ns
W
3.3
-55 to 150
W/ oC
°C
300
°C
AOK22N50
40
0.5
0.3
Units
°C/W
°C/W
°C/W
PD
TJ, TSTG
TL
Symbol
RθJA
RθCS
RθJC
88
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AOK22N50
500V,22A N-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
ID=250µA, VGS=0V, TJ=25°C
500
Typ
Max
Units
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
BVDSS
/∆TJ
Zero Gate Voltage Drain Current
IDSS
Zero Gate Voltage Drain Current
ID=250µA, VGS=0V, TJ=150°C
600
V
ID=250µA, VGS=0V
0.57
V/ oC
VDS=500V, VGS=0V
1
VDS=400V, TJ=125°C
10
IGSS
Gate-Body leakage current
VDS=0V, VGS=±30V
VGS(th)
Gate Threshold Voltage
VDS=5V ID=250µA
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=11A
gFS
Forward Transconductance
VDS=40V, ID=11A
25
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.7
IS
ISM
4
4.5
nΑ
V
0.21
0.26
Ω
S
1
V
Maximum Body-Diode Continuous Current
22
A
Maximum Body-Diode Pulsed Current
88
A
DYNAMIC PARAMETERS
Input Capacitance
Ciss
Coss
±100
3.4
µA
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
2465
3086
3710
pF
VGS=0V, VDS=25V, f=1MHz
200
290
380
pF
14
24
35
pF
VGS=0V, VDS=0V, f=1MHz
0.7
1.4
2.1
Ω
55
69
83
nC
17
22
27
nC
12
24
36
nC
SWITCHING PARAMETERS
Qg
Total Gate Charge
VGS=10V, VDS=400V, ID=22A
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
IF=22A,dI/dt=100A/µs,VDS=100V
415
524
630
Qrr
Body Diode Reverse Recovery Charge IF=22A,dI/dt=100A/µs,VDS=100V
7.5
9.6
12
Body Diode Reverse Recovery Time
VGS=10V, VDS=250V, ID=22A,
RG=25Ω
60
ns
122
ns
124
ns
77
ns
ns
µC
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial
TJ =25°C.
D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
G. L=60mH, IAS=7A, VDD=150V, RG=25Ω, Starting TJ=25°C
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
AOK22N50
500V,22A N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
100
40
VDS=40V
10V
30
6.5V
20
-55°C
ID(A)
ID (A)
10
6V
125°C
1
10
VGS=5.5V
25°C
0
0.1
0
5
10
15
20
25
30
0
2
4
6
8
VGS(Volts)
Figure 2: Transfer Characteristics
VDS (Volts)
Fig 1: On-Region Characteristics
0.4
Normalized On-Resistance
3
0.3
RDS(ON) (Ω
Ω)
10
VGS=10V
0.2
0.1
VGS=10V
ID=11A
2.5
2
1.5
1
0.5
0
0.0
0
5
10
15
20
-100
25
-50
0
50
100
150
200
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
1.2
1.0E+02
40
1.0E+00
IS (A)
BVDSS (Normalized)
1.0E+01
1.1
1
125°C
1.0E-01
1.0E-02
25°C
0.9
1.0E-03
0.8
1.0E-04
-100
-50
0
50
100
150
200
TJ (°
°C)
Figure 5:Break Down vs. Junction Temparature
0.0
0.2
0.4
0.6
0.8
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
1.0
AOK22N50
500V,22A N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10000
15
Ciss
VDS=400V
ID=22A
Capacitance (pF)
VGS (Volts)
12
9
6
1000
Coss
Crss
100
3
0
10
0
20
40
60
80
Qg (nC)
Figure 7: Gate-Charge Characteristics
100
0.1
1
10
VDS (Volts)
Figure 8: Capacitance Characteristics
100
25
10µs
RDS(ON)
limited
20
100µs
10
ID (Amps)
Current rating ID(A)
100
15
10
1ms
10ms
1
DC
0.1
5
TJ(Max)=150°C
TC=25°C
0
0.01
0
25
50
75
100
125
150
TCASE (°
°C)
Figure 9: Current De-rating (Note B)
1
10
100
1000
VDS (Volts)
Figure 10: Maximum Forward Biased Safe Operating
Area for AOK22N50 (Note F)
Zθ JC Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=0.3°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1
PPDD
0.01
TTonon
Single Pulse
TT
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance for AOK22N50 (Note F)
1
10
AOK22N50
500V,22A N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
DUT
-
Vgs
Ig
Charge
Res istive Switching Test Circuit & Waveforms
RL
Vds
Vds
DUT
Vgs
+
VDC
90%
Vdd
-
Rg
10%
Vgs
Vgs
t d(on)
tr
t d(off)
t on
tf
t off
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
EAR= 1/2 LI
Vds
2
AR
BVDSS
Vds
Id
+ Vdd
Vgs
Vgs
I AR
VDC
-
Rg
Id
DUT
Vgs
Vgs
Diode Recovery Tes t Circuit & Waveforms
Qrr = - Idt
Vds +
DUT
Vgs
Vds -
Isd
Vgs
Ig
L
Isd
+
VDC
-
IF
trr
dI/dt
IRM
Vdd
Vdd
Vds