SHENZHENFREESCALE AOT5N100

AOT5N100/AOTF5N100
1000V,4A N-Channel MOSFET
General Description
The AOT5N100 & AOTF5N100 are fabricated using an advanced high voltage MOSFET process that is designed
to deliver high levels of performance and robustness in popular AC-DC applications.By providing low RDS(on), Ciss
and Crss along with guaranteed avalanche capability this parts can be adopted quickly into new and existing offline
power supply designs.
Features
VDS
ID (at VGS=10V)
1100@150℃
4A
RDS(ON) (at VGS=10V)
< 4.2Ω
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
AOT5N100
AOTF5N100
Symbol
Drain-Source Voltage
1000
VDS
Gate-Source Voltage
Continuous Drain
Current
VGS
TC=25°C
TC=100°C
ID
V
4
4*
2.5
2.5*
A
Pulsed Drain Current C
IDM
Avalanche Current C
IAR
2.8
A
Repetitive avalanche energy C
EAR
117
mJ
Single pulsed avalanche energy G
Peak diode recovery dv/dt
TC=25°C
Power Dissipation B Derate above 25oC
Junction and Storage Temperature Range
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A,D
EAS
dv/dt
235
5
mJ
V/ns
W
PD
15
195
42
1.6
0.3
TJ, TSTG
-55 to 150
W/ oC
°C
300
°C
TL
Symbol
RθJA
RθCS
Maximum Case-to-sink A
Maximum Junction-to-Case
RθJC
* Drain current limited by maximum junction temperature.
1/6
±30
Units
V
AOT5N100
65
AOTF5N100
65
Units
°C/W
0.5
0.64
-3
°C/W
°C/W
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AOT5N100/AOTF5N100
1000V,4A N-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
ID=250µA, VGS=0V, TJ=25°C
1000
Typ
Max
Units
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
BVDSS
/∆TJ
Zero Gate Voltage Drain Current
IDSS
Zero Gate Voltage Drain Current
ID=250µA, VGS=0V, TJ=150°C
1100
V
ID=250µA, VGS=0V
1.04
V/ oC
VDS=1000V, VGS=0V
1
VDS=800V, TJ=125°C
10
IGSS
Gate-Body leakage current
VDS=0V, VGS=±30V
VGS(th)
Gate Threshold Voltage
VDS=5V, ID=250µA
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=2.5A
gFS
Forward Transconductance
VDS=40V, ID=2.5A
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
ISM
3.9
4.5
nΑ
V
3.5
4.2
Ω
5
S
1
V
Maximum Body-Diode Continuous Current
4
A
Maximum Body-Diode Pulsed Current
15
A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
±100
3.3
µA
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=25V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
0.73
750
950
1150
pF
40
62
85
pF
3.5
6
9
pF
2
4.3
6.5
Ω
19
23
nC
15
VGS=10V, VDS=800V, ID=5A
4.6
nC
6.5
nC
27
ns
40
ns
50
ns
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
IF=5A,dI/dt=100A/µs,VDS=100V
350
450
550
Qrr
Body Diode Reverse Recovery Charge IF=5A,dI/dt=100A/µs,VDS=100V
4.2
5.5
6.8
Body Diode Reverse Recovery Time
VGS=10V, VDS=500V, ID=5A,
RG=25Ω
33
ns
ns
µC
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial
TJ =25°C.
D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
G. L=60mH, IAS=2.8A, VDD=150V, RG=25Ω, Starting TJ=25°C
2/6
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AOT5N100/AOTF5N100
1000V,4A N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
100
7.5
VDS=40V
10V
6.0
-55°C
10
4.5
ID(A)
ID (A)
6V
3.0
125°C
5.5V
1
1.5
25°C
VGS=5V
0.0
0.1
0
5
10
15
20
25
30
2
4
6
8
VGS(Volts)
Figure 2: Transfer Characteristics
VDS (Volts)
Fig 1: On-Region Characteristics
3
Normalized On-Resistance
10.0
8.0
RDS(ON) (Ω
Ω)
10
6.0
VGS=10V
4.0
2.0
0.0
2.5
VGS=10V
ID=2.5A
2
1.5
1
0.5
0
0
2
4
6
8
10
12
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
-100
-50
0
50
100
150
200
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
1.2
1E+02
40
1E+00
IS (A)
BVDSS (Normalized)
1E+01
1.1
1
125°C
1E-01
25°C
1E-02
0.9
1E-03
1E-04
0.8
-100
3/6
-50
0
50
100
150
200
TJ (°C)
Figure 5:Break Down vs. Junction Temparature
0.0
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
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AOT5N100/AOTF5N100
1000V,4A N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10000
15
VDS=800V
ID=5A
Ciss
1000
Capacitance (pF)
VGS (Volts)
12
9
6
Coss
100
Crss
10
3
0
1
0
5
10
15
20
25
Qg (nC)
Figure 7: Gate-Charge Characteristics
30
0.1
100
10
VDS (Volts)
Figure 8: Capacitance Characteristics
100
100
10µs
RDS(ON)
limited
10
100µs
1
ID (Amps)
10
ID (Amps)
1
1ms
DC
10ms
0.1
10µs
RDS(ON)
limited
100µs
1
1ms
DC
0.1
TJ(Max)=150°C
TC=25°C
10ms
0.1s
1s
TJ(Max)=150°C
TC=25°C
0.01
0.01
1
10
100
1000
10000
1
10
100
1000
VDS (Volts)
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area for AOT5N100 (Note F)
Figure 10: Maximum Forward Biased Safe
Operating Area for AOTF5N100 (Note F)
10000
Current rating ID(A)
5
4
3
2
1
0
0
4/6
25
50
75
100
125
TCASE (°C)
Figure 11: Current De-rating (Note B)
150
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AOT5N100/AOTF5N100
1000V,4A N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
Zθ JC Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=0.64°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1
PD
Single Pulse
0.01
Ton
T
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 12: Normalized Maximum Transient Thermal Impedance for AOT5N100 (Note F)
Zθ JC Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=3°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1
PD
0.01
Ton
Single Pulse
T
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 13: Normalized Maximum Transient Thermal Impedance for AOTF5N100 (Note F)
5/6
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AOT5N100/AOTF5N100
1000V,4A N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
DUT
-
Vgs
Ig
Charge
Res istive Switching Test Circuit & Waveforms
RL
Vds
Vds
DUT
Vgs
+
VDC
90%
Vdd
-
Rg
10%
Vgs
Vgs
t d(on)
tr
t d(off)
t on
tf
t off
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
EAR= 1/2 LI
Vds
2
AR
BVDSS
Vds
Id
+ Vdd
Vgs
Vgs
I AR
VDC
-
Rg
Id
DUT
Vgs
Vgs
Diode Recovery Tes t Circuit & Waveforms
Qrr = - Idt
Vds +
DUT
Vgs
Vds -
Isd
Vgs
Ig
6/6
L
Isd
+
VDC
-
IF
trr
dI/dt
IRM
Vdd
Vdd
Vds
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