Circuit Protector Elements UNHS201 Circuit Protector Elements Unit: mm 0.5±0.1 • Sharp cutoff characteristics and low voltage drop • Flame retardant package and low heat generation, high density mounting is possible. 3.0±0.1 ■ Features 3.2±0.2 For overcurrent protection 2.2±0.2 2.3±0.1 Parameter Symbol Rating Unit Operating ambient temperature Topr −55 to +125 °C Storage temperature Tstg −55 to +125 °C 0 to 0.05 ■ Absolute Maximum Ratings Ta = 25°C 1.7±0.1 ■ Electrical Characteristics Ta = 25°C ± 3°C Parameter Min Typ Max SNMiniP2 Package Unit Rated voltage 50 V Rated current 0.7 A Internal Resistance Cutoff current * 71 95 1.4 118 Marking Symbol: 0.7 Lead Connection mΩ A Note) *: Measurement condition of cutoff current shall be at Ta = 25°C, t = 1 s Tolerance of cutoff current shall be ± 20% 2 1 ■ Usage Notes • Package shall be overheated and dangerous for overcurrent. • This device should be used only to the secondary circuit. Package will be damaged for added overpower. • This device is not electrical fuse legally. Please draw a clear line between electrical fuse from this device. Publication date: March 2003 SQB00039AED 1 UNHS201 I2t t 105 1.0 104 I2t (A2 • ms) Cutoff current ratio Cutoff current ratio Ta 1.1 0.9 0.8 Recommendable limit line by pulse (Ta = 25°C) UNHS206 UNHS205 UNHS204 UNHS203 UNHS202 UNHS201 UNHS200 103 102 0.7 10 0.6 −25 0 25 50 75 1 100 125 150 1 102 10 Ambient temperature Ta (°C) 103 I2 t t 10 Cutoff current characteristics 4 1 Ta = 25°C 103 Cutoff time t (s) I2t (A2 • ms) Ta = 25°C 10−1 Limit line of real ability by pulse 102 104 t (ms) Cutoff line of real ability by pulse 10 UNHS204 UNHS205 UNHS206 10−2 Recommendable limit line by pulse 10−3 1 UNHS200 UNHS201 UNHS202 UNHS203 10−1 10−1 1 102 10 103 t (ms) Cutoff time t (s) Ta = 25°C 10−1 −20% 10−2 10−3 0 1 +20% 2 3 4 Cutoff current (A) 2 10−4 0 2 4 6 8 10 Cutoff current (A) Cutoff current characteristics 1 104 SQB00039AED 12 14 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2002 JUL