ETC BGY118B

DISCRETE SEMICONDUCTORS
DATA SHEET
BGY118A; BGY118B; BGY118D
UHF amplifier modules
Product specification
Supersedes data of April 1994
File under Discrete Semiconductors, SC09
1996 May 21
Philips Semiconductors
Product specification
UHF amplifier modules
BGY118A; BGY118B; BGY118D
FEATURES
PINNING SOT321A
• Single 4.8 V nominal supply voltage
PIN
DESCRIPTION
• 1.2 W output power
1
RF input
• Easy output power control by DC voltage
2
VC
• Very high efficiency (typ. 55 %)
3
VS
4
RF output
• Silicon bipolar technology
• Standby current less than 100 µA.
Flange
ground
APPLICATIONS
• Hand-held transmitting equipment operating in the
824 to 849 MHz, 872 to 905 MHz and 898 to 928 MHz
frequency ranges respectively.
DESCRIPTION
The BGY118A, BGY118B and BGY118D are three-stage
UHF amplifier modules in a SOT321A package. Each
module consists of three NPN silicon planar transistor
chips mounted together with matching and bias circuit
components on a metallized ceramic substrate.
1
2
3
4
Top view
MSA487
Fig.1 Simplified outline.
QUICK REFERENCE DATA
RF performance at Tmb = 25 °C.
TYPE
MODE OF
OPERATION
f
(MHz)
VS
(V)
PL
(W)
GP
(dB)
η
(%)
ZS, ZL
(Ω)
BGY118A
CW
824 to 849
4.8
1.2
≥27.8
typ. 55
50
BGY118B
CW
872 to 905
4.8
1.2
≥27.8
typ. 55
50
BGY118D
CW
898 to 928
4.8
1.2
≥27.8
typ. 55
50
1996 May 21
2
Philips Semiconductors
Product specification
UHF amplifier modules
BGY118A; BGY118B; BGY118D
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VS
DC supply voltage
−
7
V
VC
DC control voltage
−
3.5
V
PD
input drive power
−
5
mW
PL
load power
−
1.6
W
Tstg
storage temperature
−40
+100
∞C
Tmb
operating mounting base temperature
−30
+100
∞C
CHARACTERISTICS
ZS = ZL = 50 W; PD = 2 mW; VS = 4.8 V; VC ≤ 3 V; Tmb = 25 °C; unless otherwise specified.
SYMBOL
f
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
frequency
BGY118A
824
−
849
MHz
BGY118B
872
−
905
MHz
BGY118D
898
−
928
MHz
IQ
total leakage current
VC = 0; PD < −60 dBm
−
−
100
µA
IC
control current
adjust VC for PL = 1.2 W
−
−
500
µA
PL
load power
1.2
−
−
W
GP
power gain
adjust VC for PL = 1.2 W
27.8
-
−
dB
η
efficiency
adjust VC for PL = 1.2 W
50
55
−
%
H2
second harmonic
adjust VC for P = 1.2 W
−
−
−40
dBc
H3
third harmonic
adjust VC for PL = 1.2 W
−
−
−40
dBc
VSWRin
input VSWR
adjust VC for PL = 1.2 W
−
−
3:1
stability
PD = 0 to 6 dBm; VS = 4 to 6.5 V;
VC = 0 to 3 V; PL ≤ 1.2 W;
VSWR ≤ 6 : 1 through all phases
−
−
−60
dBc
Pn
isolation
VC = 0
−
−
−40
dBm
noise power
adjust VC for PL = 1.2 W;
bandwidth = 30 kHz; note 1
−
−
−90
dBm
ruggedness
VS = 6.5 V; adjust VC for PL = 1.4 W;
VSWR ≤ 10 : 1 through all phases
Note
1. BGY118A, BGY118B: fn = fo + 45 MHz.
BGY118D: fn = fo − 55 MHz.
1996 May 21
3
no degradation
Philips Semiconductors
Product specification
UHF amplifier modules
BGY118A; BGY118B; BGY118D
MLB605
MLB604
80
2
handbook, halfpage
handbook, halfpage
η
824 MHz
(%)
P
L
(W)
60
849 MHz
824 MHz
849 MHz
40
1
20
0
0
0
1
2
3
0
4
0.4
0.8
1.2
1.6
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.
Fig.2
Load power as a function of control
voltage; BGY118A; typical values.
Fig.3
MLB606
2
2
P L (W)
VC (V)
Efficiency as a function of load power;
BGY118A; typical values.
MLB607
2
handbook, halfpage
handbook, halfpage
VS = 4.8 V
824 MHz
PL
PL
(W)
849 MHz
(W)
VS = 4 V
1
1
0
0
800
820
840
860
f (MHz)
880
ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C.
Fig.4
0
40
80
120
Tmb ( oC)
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; VC = 3 V; Tmb = 25 °C.
Load power as a function of frequency;
BGY118A; typical values.
1996 May 21
40
Fig.5
4
Load power as a function of mounting-base
temperature; BGY118A; typical values.
Philips Semiconductors
Product specification
UHF amplifier modules
BGY118A; BGY118B; BGY118D
MLB608
4
handbook, halfpage
VC
(V)
MLB609
40
3.0
handbook, halfpage
VSWR in
PL
(dBm)
824 MHz
30
849 MHz
2.5
3
20
VC
2.0
2
VSWRin
10
1
1.5
0
0
800
820
840
860
f (MHz)
−10
−30
1.0
880
−20
−10
0
10
PD (dBm)
ZS = ZL = 50 Ω; PD = 2 mW; PL = 1.2 W; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C.
Fig.6
Fig.7
Control voltage and VSWR input as function
of frequency; BGY118A; typical values.
MLB610
20
H 2 , H3
handbook, halfpage
(dBc)
30
40
H3
50
H2
60
70
800
820
840
860
f (MHz)
880
ZS = ZL = 50 Ω; PD = 2 mW; PL = 1.2 W; Tmb = 25 °C.
Fig.8
Harmonics as a function of frequency;
BGY118A; typical values.
1996 May 21
5
Load power as a function of drive power;
BGY118A; typical values.
Philips Semiconductors
Product specification
UHF amplifier modules
BGY118A; BGY118B; BGY118D
MLB611
MLB612
2
80
handbook, halfpage
handbook, halfpage
η
(%)
905 MHz
P
L
(mW)
60
905 MHz
872 MHz
872 MHz
40
1
20
0
0
0
1
2
3
4
0
0.4
0.8
1.2
VC (V)
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.
Fig.9
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.
Load power as a function of control
voltage; BGY118B; typical values.
Fig.10 Efficiency as a function of load power;
BGY118B; typical values.
MLB613
2
1.6
2
P L (mW)
MLB614
2
handbook, halfpage
handbook, halfpage
905 MHz
PL
(W)
PL
(W)
1
1
0
850
0
870
890
910
f (MHz)
930
ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C.
40
0
40
80
120
Tmb ( oC)
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; VC = 3 V; Tmb = 25 °C.
Fig.11 Load power as a function of frequency;
BGY118B; typical values.
1996 May 21
872 MHz
Fig.12 Load power as a function of mounting-base
temperature; BGY118B; typical values.
6
Philips Semiconductors
Product specification
UHF amplifier modules
BGY118A; BGY118B; BGY118D
MLB615
4
handbook, halfpage
VC
(V)
MLB616
40
3.0
handbook, halfpage
PL
(dBm)
VSWR in
30
2.5
3
20
VC
905 MHz
2.0
2
10
VSWR in
872 MHz
1
0
850
1.5
890
870
910
f (MHz)
0
−10
−30
1.0
930
−20
−10
0
10
PD (dBm)
ZS = ZL = 50 Ω; PD = 2 mW; PL = 1.2 W; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C.
Fig.13 Control voltage and VSWR input as function
of frequency; BGY118B; typical values.
Fig.14 Load power as a function of drive power;
BGY118B; typical values.
MLB617
20
H 2 , H3
handbook, halfpage
(dBc)
30
40
H3
50
H2
60
70
850
870
890
910
f (MHz)
930
ZS = ZL = 50 Ω; PD = 2 mW; PL = 1.2 W; Tmb = 25 °C.
Fig.15 Harmonics as a function of frequency;
BGY118; typical values.
1996 May 21
7
Philips Semiconductors
Product specification
UHF amplifier modules
BGY118A; BGY118B; BGY118D
MGD420
MGD421
2
80
handbook, halfpage
handbook, halfpage
η
(%)
PL
(W)
60
898 MHz
898 MHz
928 MHz
928 MHz
1
40
20
0
0
1
2
3
0
4
Vc (V)
0
0.8
1.2
1.6
2
PL (W)
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 2 mW; VS 4.8 V; Tmb = 25 °C.
Fig.16 Load power as a function of control
voltage; BGY118D; typical values.
Fig.17 Efficiency as a function of load power;
BGY118D; typical values.
MGD422
2
0.4
MGD423
2
handbook, halfpage
handbook, halfpage
PL
(W)
PL
(W)
VS = 4.8 V
898 MHz
928 MHz
4V
1
0
870
890
1
910
930
0
950
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; VC = 3 V; Tmb = 25 °C.
0
40
80
120
ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C.
Fig.18 Load power as a function of frequency;
BGY118D; typical values.
1996 May 21
40
Tmb (oC)
f (MHz)
Fig.19 Load power as a function of mounting-base
temperature; BGY118D; typical values.
8
Philips Semiconductors
Product specification
UHF amplifier modules
BGY118A; BGY118B; BGY118D
MGD417
4
handbook, halfpage
Vc
(V)
MGD418
40
3.0
handbook, halfpage
PL
(dBm)
VSWRin
30
2.5
3
898 MHz
928 MHz
20
Vc
2.0
2
10
VSWR
1
1.5
0
870
890
910
0
−10
−30
1.0
950
930
f (MHz)
−20
−10
0
10
PD (dBm)
ZS = ZL = 50 Ω; PD = 2 mW; PL = 1.2 W; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C.
Fig.20 Control voltage and VSWR input as function
of frequency; BGY118D; typical values.
Fig.21 Load power as a function of drive power;
BGY118D; typical values.
MGD419
−20
handbook, halfpage
H2, H3
(dBc)
−30
−40
H2
−50
−60
870
H3
890
910
930
f (MHz)
950
ZS = ZL = 50 Ω; PD = 2 mW; PL = 1.2 W; Tmb = 25 °C.
Fig.22 Harmonics as a function of frequency;
BGY118D; typical values.
1996 May 21
9
Philips Semiconductors
Product specification
UHF amplifier modules
BGY118A; BGY118B; BGY118D
handbook, full pagewidth
pin
numbers
1
2
3
L2
L1
Z1
C1
C4
C3
C5
Z2
C2
RF input
4
C6
VC
MSA914
VS
RF output
Fig.23 Test circuit.
90
handbook, full pagewidth
1
2
3
4
50 Ω
input
50 Ω
output
VC
VS
Dimensions in mm.
Fig.24 Printed-circuit board layout.
1996 May 21
10
MSA915
60
Philips Semiconductors
Product specification
UHF amplifier modules
BGY118A; BGY118B; BGY118D
List of components (See Fig.23)
COMPONENT
DESCRIPTION
VALUE
CATALOGUE NO.
C1, C4
multilayer ceramic chip capacitor
100 nF
C2, C5
tantalum capacitor
2.2 µF; 35 V
C3, C6
multilayer ceramic chip capacitor
33 pF
2222 851 13339
3122 108 20153
L1, L2
Ferroxcube coil
5 µH
Z1, Z2
stripline; note 1
50 Ω
2222 852 47104
Note
1. The striplines are on a double copper-clad PCB with PTFE fibre-glass dielectric (er = 2.2); thickness 1/32 inch.
1996 May 21
11
Philips Semiconductors
Product specification
UHF amplifier modules
BGY118A; BGY118B; BGY118D
SOLDERING
The indicated temperatures are those at the solder
interfaces.
MLB740
300
handbook, halfpage
Advised solder types are types with a liquidus less than or
equal to 210 °C.
T mb
( oC)
Solder dots or solder prints must be large enough to wet
the contact areas.
200
Footprints for soldering should cover the module contact
area +0.1 mm on all sides.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
100
Hand soldering must be avoided because the soldering
iron tip can exceed the maximum permitted temperature of
250 °C and damage the module.
0
0
100
200
300
t (s)
400
The maximum temperature profile and soldering time is
indicated as follows (see Fig.25):
t = 350 s at 100 °C
Fig.25 Maximum allowable temperature profile.
t = 300 s at 125 °C
t = 200 s at 150 °C
t = 100 s at 175 °C
t = 50 s at 200 °C
t = 5 s at 250 °C (maximum temperature).
Cleaning
The following fluids may be used for cleaning:
• Alcohol
• Bio-Act (Terpene Hydrocarbon)
• Triclean B/S
• Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
1996 May 21
12
Philips Semiconductors
Product specification
UHF amplifier modules
BGY118A; BGY118B; BGY118D
PACKAGE OUTLINE
25.0
24.6
handbook, full pagewidth
1.65
1.25
22.1
21.7
4.0
3.6
4.3
3.9
3.1 (4×)
2.9
13.4
13.0
5.1
4.9
2.4
2.2
1
2
3
0.55 (4×)
0.45
3.7
3.3
5.08
7.62
5.08
Dimensions in mm.
Fig.26 SOT321A.
1996 May 21
13
MSA352
1.2
min
4
0.25 M
(4×)
0.1
0.30
0.20
Philips Semiconductors
Product specification
UHF amplifier modules
BGY118A; BGY118B; BGY118D
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 May 21
14