NCP2890 1.0 Watt Audio Power Amplifier The NCP2890 is an audio power amplifier designed for portable communication device applications such as mobile phone applications. The NCP2890 is capable of delivering 1.0 W of continuous average power to an 8.0 BTL load from a 5.0 V power supply, and 320 mW to a 4.0 BTL load from a 2.6 V power supply. The NCP2890 provides high quality audio while requiring few external components and minimal power consumption. It features a low−power consumption shutdown mode, which is achieved by driving the SHUTDOWN pin with logic low. The NCP2890 contains circuitry to prevent from “pop and click” noise that would otherwise occur during turn−on and turn−off transitions. For maximum flexibility, the NCP2890 provides an externally controlled gain (with resistors), as well as an externally controlled turn−on and turn−off times (with the bypass capacitor). Due to its excellent PSRR, it can be directly connected to the battery, saving the use of an LDO. This device is available in a 9−Pin Flip−Chip CSP (standard Tin−Lead and Lead−Free versions) and a Micro8 package. Features • • • • • • • • • 1.0 W to an 8.0 BTL Load from a 5.0 V Power Supply Excellent PSRR: Direct Connection to the Battery « Pop and Click » Noise Protection Circuit Ultra Low Current Shutdown Mode 2.2 V−5.5 V Operation External Gain Configuration Capability External Turn−on and Turn−off Time Configuration Capability Up to 1.0 nF Capacitive Load Driving Capability Thermal Overload Protection Circuitry http://onsemi.com MARKING DIAGRAMS 9−Pin Flip−Chip CSP FC SUFFIX CASE 499E 1 A1 8 Micro8 DM SUFFIX CASE 846A 8 MAB RYW 1 1 x = Specific Device Code, G or H R = Assembly Location YY, Y = Year WW, W = Work Week PIN CONNECTIONS 9−Pin Flip−Chip CSP A1 A2 A3 INM OUTA INP B1 B2 B3 VM_P VM Vp C1 C2 C3 Typical Applications • Portable Electronic Devices • PDAs • Wireless Phones MAx YYWW BYPASS OUTB SHUTDOWN (Top View) Micro8 SHUTDOWN 1 8 OUTB BYPASS 2 7 VM INP 3 6 Vp INM 4 5 OUTA (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 14 of this data sheet. Semiconductor Components Industries, LLC, 2003 October, 2003 − Rev. 6 1 Publication Order Number: NCP2890/D NCP2890 Rf 20 k Vp 1 F Cs AUDIO INPUT Ci Ri INM 390 nF 20 k INP − + Vp OUTA R1 20 k Vp 300 k − + BYPASS Cbypass 1 F OUTB 300 k SHUTDOWN VIH 8 R2 20 k SHUTDOWN CONTROL VM_P VM VIL Figure 1. Typical Audio Amplifier Application Circuit with Single Ended Input Rf 20 k Vp 1 F Cs Ci Ri 390 nF 20 k + AUDIO INPUT INM − + INP Ci Ri Vp Vp − 390 nF 20 k 20 k Rf 300 k − + BYPASS Cbypass 1 F R1 20 k 8 R2 20 k OUTB 300 k SHUTDOWN VIH OUTA SHUTDOWN CONTROL VM_P VM VIL Figure 2. Typical Audio Amplifier Application Circuit with a Differential Input This device contains 671 active transistors and 1899 MOS gates. http://onsemi.com 2 NCP2890 PIN DESCRIPTION 9−Pin Flip−Chip CSP Micro8 A1 A2 Type Symbol Description 4 I INM Negative input of the first amplifier, receives the audio input signal. Connected to the feedback resistor Rf and to the input resistor Rin. 5 O OUTA A3 3 I INP B1 NA I VM_P B2 7 I VM Core Analog Ground. B3 6 I Vp Positive analog supply of the cell. Range: 2.2 V−5.5 V. C1 2 I BYPASS C2 8 O OUTB C3 1 I SHUTDOWN Negative output of the NCP2890. Connected to the load and to the feedback resistor Rf. Positive input of the first amplifier, receives the common mode voltage. Power Analog Ground. Bypass capacitor pin which provides the common mode voltage (Vp/2). Positive output of the NCP2890. Connected to the load. The device enters in shutdown mode when a low level is applied on this pin. MAXIMUM RATINGS (Note 1) Rating Symbol Value Unit Vp 6.0 V Op Vp 2.2 to 5.5 V 2.0 V = Functional Only − Input Voltage Vin −0.3 to Vcc +0.3 V Max Output Current Iout 500 mA Power Dissipation (Note 2) Pd Internally Limited − Operating Ambient Temperature TA −40 to +85 °C Max Junction Temperature TJ 150 °C Storage Temperature Range Tstg −65 to +150 °C RJA 230 (Note 3) °C/W C/W − >2500 >250 V Supply Voltage Operating Supply Voltage Thermal Resistance Junction−to−Air Junction to Air ESD Protection Micro8 9−Pin Flip−Chip CSP Human Body Model (HBM) (Note 4) Machine Model (MM) (Note 5) 1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C. 2. The thermal shutdown set to 160°C (typical) avoids irreversible damage on the device due to power dissipation. For further information see page 10. 3. For the 9−Pin Flip−Chip CSP package, the RJA is highly dependent of the PCB Heatsink area. For example, RJA can equal 195°C/W with 50 mm2 total area and also 135°C/W with 500 mm2. For further information see page 10. The bumps have the same thermal resistance and all need to be connected to optimize the power dissipation. 4. Human Body Model, 100 pF discharge through a 1.5 k resistor following specification JESD22/A114. 5. Machine Model, 200 pF discharged through all pins following specification JESD22/A115. http://onsemi.com 3 NCP2890 ELECTRICAL CHARACTERISTICS Limits apply for TA between −40°C to +85°C (Unless otherwise noted). Characteristic Supply Quiescent Current Symbol Conditions Min (Note 6) Typ Max (Note 6) Unit Idd Vp = 2.6 V, No Load Vp = 5.0 V, No Load − − 1.5 1.7 4 mA Vp = 2.6 V, 8 Vp = 5.0 V, 8 − − 1.7 1.9 5.5 Common Mode Voltage Vcm − − Vp/2 − V Shutdown Current ISD − − 10 600 nA Shutdown Voltage High VSDIH − 1.2 − − V Shutdown Voltage Low VSDIL − − − 0.4 V Turning On Time (Note 8) TWU Cby = 1 F − 285 − ms Turning Off Time (Note 8) TSD Cby = 1 F and Vp = 5.0 V − 385 − ms Vloadpeak Vp = 2.6 V, RL = 8.0 Vp = 5.0 V, RL = 8.0 (Note 7) 1.6 4.0 2.12 4.15 − − V PO Vp = 2.6 V, RL = 4.0 THD + N < 0.1% Vp = 2.6 V, RL = 8.0 THD + N < 0.1% Vp = 5.0 V, RL = 8.0 THD + N < 0.1% − 0.36 − W PDmax Vp = 5.0 V, RL = 8.0 − Output Offset Voltage VOS Vp = 2.6 V Vp = 5.0 V −30 Signal−to−Noise Ratio SNR Vp = 2.6 V, G = 2.0 10 Hz < F < 20 kHz − Vp = 5.0 V, G = 10 10 Hz < F < 20 kHz − Output Swing Rms Output Power Maximum Power Dissipation (Note 8) Positive Supply Rejection Ratio Efficiency Thermal Shutdown Temperature (Note 9) Total Harmonic Distortion 6. 7. 8. 9. PSRR V+ − 1.08 − 0.65 W 30 mV 84 − dB 77 − G = 2.0, RL = 8.0 Vpripple_pp = 200 mV Cby = 1.0 F Input Terminated with 10 dB F = 217 Hz Vp = 5.0 V Vp = 3.0 V Vp = 2.6 V − − − 64 72 73 − − − F = 1.0 kHz Vp = 5.0 V Vp = 3.0 V Vp = 2.6 V − − − 64 74 75 − − − Vp = 2.6 V, Porms = 320 mW Vp = 5.0 V, Porms = 1.0 W − − 48 63 − − % 140 160 180 °C Vp = 2.6, F = 1.0 kHz RL = 4.0 AV = 2.0 PO = 0.32 W − − − − 0.04 − − − − % Vp = 5.0 V, F = 1.0 kHz RL = 8.0 AV = 2.0 PO = 1.0 W − − − − 0.02 − − − − Tsd THD 0.28 − Min/Max limits are guaranteed by design, test or statistical analysis. This parameter is not tested in production for 9−Pin Flip−Chip CSP package in case of a 5.0 V power supply. See page 11 for a theoretical approach of these parameters. For this parameter, the Min/Max values are given for information. http://onsemi.com 4 NCP2890 Typical Performance Characteristics 1 Vp = 5 V RL = 8 Pout = 250 mW AV = 2 0.1 THD + N (%) THD + N (%) 1 0.01 0.001 Vp = 3.3 V RL = 8 Pout = 150 mW AV = 2 0.1 0.01 0.001 10 100 1000 10,000 100,000 10 100 FREQUENCY (Hz) Figure 1. THD + N versus Frequency 100,000 1 Vp = 3 V RL = 8 Pout = 250 mW AV = 2 0.1 THD + N (%) THD + N (%) 10,000 Figure 2. THD + N versus Frequency 1 0.01 0.001 Vp = 2.6 V RL = 8 Pout = 100 mW AV = 2 0.1 0.01 0.001 10 100 1000 10,000 100,000 10 100 FREQUENCY (Hz) 1000 10,000 100,000 FREQUENCY (Hz) Figure 3. THD + N versus Frequency Figure 4. THD + N versus Frequency 1 10 Vp = 2.6 V RL = 4 Pout = 100 mW AV = 2 0.1 Vp = 5 V RL = 8 1 kHz AV = 2 1 THD + N (%) THD + N (%) 1000 FREQUENCY (Hz) 0.01 0.1 0.01 0.001 0.001 10 100 1000 10,000 100,000 0 FREQUENCY (Hz) 200 400 600 800 1000 1200 Pout, POWER OUT (mW) Figure 5. THD + N versus Frequency Figure 6. THD + N versus Power Out http://onsemi.com 5 1400 NCP2890 Typical Performance Characteristics 10 10 Vp = 3.3 V RL = 8 1 kHz AV = 2 1 THD + N (%) THD + N (%) 1 Vp = 3 V RL = 8 1 kHz AV = 2 0.1 0.1 0.01 0.01 0.001 0.001 0 100 200 300 400 500 0 600 100 Pout, POWER OUT (mW) Figure 7. THD + N versus Power Out 300 400 500 Figure 8. THD + N versus Power Out 10 10 Vp = 2.6 V RL = 8 1 kHz AV = 2 THD + N (%) 1 THD + N (%) 200 Pout, POWER OUT (mW) 0.1 Vp = 2.6 V RL = 4 1 kHz AV = 2 1 0.1 0.01 0.001 0.01 0 100 200 300 400 0 Pout, POWER OUT (mW) 200 300 400 500 Pout, POWER OUT (mW) Figure 9. THD + N versus Power Out Figure 10. THD + N versus Power Out −30 1700 f = 1 kHz RL = 8 1500 Vp = 5 V RL = 8 Rin = 10 AV = 2 Vripple = 200 mVpk−pk Cbypass = 1 F −35 1300 −40 THD+N = 10% 1100 PSRR (dB) OUTPUT POWER (mW) 100 900 THD+N = 1% 700 −45 −50 −55 500 −60 300 −65 100 −70 2.0 2.5 3.0 3.5 4.0 4.5 5.0 10 POWER SUPPLY (V) 100 1000 10,000 FREQUENCY (Hz) Figure 11. Output Power versus Power Supply Figure 12. PSRR @ Vp = 5 V http://onsemi.com 6 100,000 NCP2890 Typical Performance Characteristics −20 −25 Vp = 5 V RL = 8 Rin = Float AV = 2 Vripple = 200 mVpk−pk Cbypass = 1 F PSRR (dB) −40 −50 −35 −60 −70 −40 −45 −50 −80 −55 −90 −60 −100 10 100 Vp = 5 V RL = 8 Rin = 10 AV = 4 Vripple = 200 mVpk−pk Cbypass = 1 F −30 PSRR (dB) −30 1000 10,000 −65 100,000 10 100,000 Figure 14. PSRR @ Vp = 5 V −10 −30 Vp = 5 V RL = 8 Rin = Float AV = 4 Vripple = 200 mVpk−pk Cbypass = 1 F −30 −40 −50 −35 Vp = 3 V RL = 8 Rin = 10 AV = 2 Vripple = 200 mVpk−pk Cbypass = 1 F −40 −45 PSRR (dB) −20 PSRR (dB) 10,000 FREQUENCY (Hz) Figure 13. PSRR @ Vp = 5 V −60 −70 −50 −55 −60 −65 −80 −70 −90 −75 −80 10 −100 10 100 1000 10,000 100,000 100 1000 10,000 FREQUENCY (Hz) FREQUENCY (Hz) Figure 15. PSRR @ Vp = 5 V Figure 16. PSRR @ Vp = 3 V −20 100,000 −25 Vp = 3 V RL = 8 Rin = Float AV = 2 Vripple = 200 mVpk−pk Cbypass = 1 F −40 −50 Vp = 3 V RL = 8 Rin = 10 AV = 4 Vripple = 200 mVpk−pk Cbypass = 1 F −30 −35 −40 PSRR (dB) −30 PSRR (dB) 1000 100 FREQUENCY (Hz) −60 −70 −45 −50 −55 −80 −60 −90 −65 −100 −70 10 100 1000 10,000 100,000 10 100 1000 10,000 FREQUENCY (Hz) FREQUENCY (Hz) Figure 17. PSRR @ Vp = 3 V Figure 18. PSRR @ Vp = 3 V http://onsemi.com 7 100,000 NCP2890 Typical Performance Characteristics −30 −10 −30 PSRR (dB) −40 −50 −40 −45 −60 −50 −55 −70 −60 −80 −65 −90 −70 −100 10 Vp = 3.3 V RL = 8 Rin = 10 AV = 2 Vripple = 200 mVpk−pk Cbypass = 1 F −35 PSRR (dB) −20 Vp = 3 V RL = 8 Rin = Float AV = 4 Vripple = 200 mVpk−pk Cbypass = 1 F −75 100 1000 10,000 10 100,000 100 Figure 19. PSRR @ Vp = 3 V 10,000 100,000 Figure 20. PSRR @ Vp = 3.3 V −20 −30 Vp = 3.3 V RL = 8 Rin = Float AV = 2 Vripple = 200 mVpk−pk Cbypass = 1 F −40 −50 −35 Vp = 2.6 V RL = 8 Rin = 10 AV = 2 Vripple = 200 mVpk−pk Cbypass = 1 F −40 −45 PSRR (dB) −30 PSRR (dB) 1000 FREQUENCY (Hz) FREQUENCY (Hz) −60 −70 −50 −55 −60 −65 −80 −70 −90 −75 −80 10 −100 10 100 1000 10,000 100,000 1000 10,000 FREQUENCY (Hz) Figure 21. PSRR @ Vp = 3.3 V Figure 22. PSRR @ Vp = 2.6 V −20 100,000 −30 Vp = 2.6 V RL = 8 Rin = Float AV = 2 Vripple = 200 mVpk−pk Cbypass = 1 F −40 −50 −40 −60 −70 −45 −50 −55 −80 −60 −90 −65 −100 −70 10 100 Vp = 5 V RL = 8 Rin = 10 AV = 2 Vripple = 200 mVpk−pk −35 PSRR (dB) −30 PSRR (dB) 100 FREQUENCY (Hz) 1000 10,000 100,000 1 F 2.2 F 10 100 1000 10,000 100,000 FREQUENCY (Hz) FREQUENCY (Hz) Figure 23. PSRR @ Vp = 2.6 V Figure 24. PSRR versus Cbypass @ Vp = 5 V http://onsemi.com 8 NCP2890 Typical Performance Characteristics −30 0 Vp = 3 V RL = 8 Rin = 10 AV = 2 Vripple = 200 mVpk−pk −40 PSRR (dB) −45 −50 −20 −55 1 F −60 Vp = 5 V RL = 8 F = 217 Hz AV = 2 Vripple = 200 mVpk−pk Cbypass = 1 F −10 PSRR (dB) −35 −30 −40 −50 −65 −70 −75 −60 2.2 F −80 10 −70 100 1000 10,000 −80 −5 100,000 FREQUENCY (Hz) −3 −2 −1 0 1 2 3 4 5 DC OUTPUT VOLTAGE (V) Figure 26. PSRR @ DC Output Voltage Figure 25. PSRR versus Cbypass @ Vp = 3 V 0 0 Vp = 3 V RL = 8 F = 217 Hz AV = 2 Vripple = 200 mVpk−pk Cbypass = 1 F −20 −30 −40 −20 −50 −60 −30 −40 −50 −70 −60 −80 −70 −90 −2.5 −2 −1.5 −1 −0.5 0 0.5 Vp = 2.6 V RL = 8 F = 217 Hz AV = 2 Vripple = 200 mVpk−pk Cbypass = 1 F −10 PSRR (dB) −10 PSRR (dB) −4 1 1.5 2 −80 −2.5 −2 −1.5 −1 2.5 DC OUTPUT VOLTAGE (V) −0.5 0 0.5 1 1.5 DC OUTPUT VOLTAGE (V) Figure 27. PSRR @ DC Output Voltage Figure 28. PSRR @ DC Output Voltage Figure 29. Turning On Time − Vp = 5 V Figure 30. Turning Off Time − Vp = 5 V http://onsemi.com 9 2 2.5 NCP2890 Typical Performance Characteristics 0.3 PD, POWER DISSIPATION (W) PD, POWER DISSIPATION (W) 0.7 0.6 0.5 0.4 Vp = 5 V RL = 8 F = 1 kHz THD + N < 0.1% 0.3 0.2 0.1 0 0.25 0.2 0.15 Vp = 3.3 V RL = 8 F = 1 kHz THD + N < 0.1% 0.1 0.05 0 0 0.2 0.4 0.6 0.8 1 1.2 0 0.1 Pout, OUTPUT POWER (W) Figure 31. Power Dissipation versus Output Power 0.4 0.5 0.4 PD, POWER DISSIPATION (W) PD, POWER DISSIPATION (W) 0.3 Figure 32. Power Dissipation versus Output Power 0.25 0.2 0.15 Vp = 3 V RL = 8 F = 1 kHz THD + N < 0.1% 0.1 0.05 0 0.35 RL = 4 0.3 0.25 0.2 RL = 8 0.15 0.1 Vp = 2.6 V F = 1 kHz THD + N < 0.1% 0.05 0 0 0.1 0.2 0.3 0.4 0 0.05 0.1 Pout, OUTPUT POWER (W) 0.15 0.2 0.25 0.3 0.35 0.4 Pout, OUTPUT POWER (W) Figure 33. Power Dissipation versus Output Power Figure 34. Power Dissipation versus Output Power 180 DIE TEMPERATURE (°C) @ AMBIENT TEMPERATURE 25°C 700 PD, POWER DISSIPATION (mW) 0.2 Pout, OUTPUT POWER (W) PCB Heatsink Area 600 200 mm2 500 50 mm2 500 mm2 400 300 200 PDmax = 633 mW for Vp = 5 V, RL = 8 100 0 0 20 40 140 80 100 120 140 160 Vp = 5 V 120 Vp = 4.2 V 100 80 Vp = 3.3 V 60 40 60 Maximum Die Temperature 150°C RL = 8 160 Vp = 2.6 V 50 100 150 200 250 PCB HEATSINK AREA (mm2) TA, AMBIENT TEMPERATURE (°C) Figure 35. Power Derating − 9−Pin Flip−Chip CSP Figure 36. Maximum Die Temperature versus PCB Heatsink Area http://onsemi.com 10 300 NCP2890 APPLICATION INFORMATION Detailed Description Current Limit Circuit The NCP2890 audio amplifier can operate under 2.6 V until 5.5 V power supply. It delivers 320 mW rms output power to 4.0 load (Vp = 2.6 V) and 1.0 W rms output power to 8.0 load (Vp = 5.0 V). The structure of the NCP2890 is basically composed of two identical internal power amplifiers; the first one is externally configurable with gain−setting resistors Rin and Rf (the closed−loop gain is fixed by the ratios of these resistors) and the second is internally fixed in an inverting unity−gain configuration by two resistors of 20 k. So the load is driven differentially through OUTA and OUTB outputs. This configuration eliminates the need for an output coupling capacitor. The maximum output power of the circuit (Porms = 1.0 W, Vp = 5.0 V, RL = 8.0 ) requires a peak current in the load of 500 mA. In order to limit the excessive power dissipation in the load when a short−circuit occurs, the current limit in the load is fixed to 800 mA. The current in the four output MOS transistors are real−time controlled, and when one current exceeds 800 mA, the gate voltage of the MOS transistor is clipped and no more current can be delivered. Thermal Overload Protection Internal amplifiers are switched off when the temperature exceeds 160°C, and will be switched on again only when the temperature decreases fewer than 140°C. The NCP2890 is unity−gain stable and requires no external components besides gain−setting resistors, an input coupling capacitor and a proper bypassing capacitor in the typical application. The first amplifier is externally configurable (Rf and Rin), while the second is fixed in an inverting unity gain configuration. The differential−ended amplifier presents two major advantages: − The possible output power is four times larger (the output swing is doubled) as compared to a single−ended amplifier under the same conditions. − Output pins (OUTA and OUTB) are biased at the same potential Vp/2, this eliminates the need for an output coupling capacitor required with a single−ended amplifier configuration. The differential closed loop−gain of the amplifier is Internal Power Amplifier The output Pmos and Nmos transistors of the amplifier were designed to deliver the output power of the specifications without clipping. The channel resistance (Ron) of the Nmos and Pmos transistors does not exceed 0.6 when they drive current. The structure of the internal power amplifier is composed of three symmetrical gain stages, first and medium gain stages are transconductance gain stages to obtain maximum bandwidth and DC gain. Turn−On and Turn−Off Transitions A cycle with a turn−on and turn−off transition is illustrated with plots that show both single ended signals on the previous page. In order to eliminate « pop and click » noises during transitions, output power in the load must be slowly established or cut. When logic high is applied to the shutdown pin, the bypass voltage begins to rise exponentially and once the output DC level is around the common mode voltage, the gain is established slowly (50 ms). This way to turn−on the device is optimized in terms of rejection of « pop and click » noises. The device has the same behavior when it is turned−off by a logic low on the shutdown pin. During the shutdown mode, amplifier outputs are connected to the ground. A theoretical value of turn−on and off times at 25°C is given by the following formula. Cby: bypass capacitor R: internal 300 k resistor with a 25% accuracy Ton = 0.95 * R * Cby Toff = R * Cby * Ln(Vp/1.4) given by Avd 2 * V Rf orms . Rin Vinrms Output power delivered to the load is given by Porms (Vopeak)2 (Vopeak is the peak differential 2 * RL output voltage). When choosing gain configuration to obtain the desired output power, check that the amplifier is not current limited or clipped. The maximum current which can be delivered to the load is 500 mA Iopeak Vopeak . RL Gain−Setting Resistor Selection (Rin and Rf) Rin and Rf set the closed−loop gain of the amplifier. In order to optimize device and system performance, the NCP2890 should be used in low gain configurations. The low gain configuration minimizes THD + noise values and maximizes the signal to noise ratio, and the Shutdown Function The device enters shutdown mode when shutdown signal is low. During the shutdown mode, the DC quiescent current of the circuit does not exceed 100 nA. http://onsemi.com 11 NCP2890 amplifier can still be used without running into the bandwidth limitations. A closed loop gain in the range from 2 to 5 is recommended to optimize overall system performance. An input resistor (Rin) value of 22 K is realistic in most of applications, and doesn’t require the use of a too large capacitor Cin. large input coupling capacitor requires more time to reach its quiescent DC voltage (Vp/2) and can increase the turn−on pops. An input capacitor value between 0.1 and 0.39 F performs well in many applications (With Rin = 22 K). Bypass Capacitor Selection (Cby) The bypass capacitor Cby provides half−supply filtering and determines how fast the NCP2890 turns on. This capacitor is a critical component to minimize the turn−on pop. A 1.0 F bypass capacitor value (Cin = < 0.39 F) should produce clickless and popless shutdown transitions. The amplifier is still functional with a 0.1 F capacitor value but is more susceptible to « pop and click » noises. Thus, a 1.0 F bypassing capacitor is recommended. Input Capacitor Selection (Cin) The input coupling capacitor blocks the DC voltage at the amplifier input terminal. This capacitor creates a high−pass filter with Rin, the cut−off frequency is given by fc 1 . 2 * * Rin * Cin The size of the capacitor must be large enough to couple in low frequencies without severe attenuation. However a AUDIO INPUT C2 390 nF Vp R3 20 k C4* 1 F R2 INM 20 k INP C1 − + Vp 20 k Vp 300 k BYPASS Vp C3 100 k 1 F R1 8 − + 20 k OUTB 300 k SHUTDOWN R4* OUTA SHUTDOWN CONTROL VM_P VM * R4, C4: Not Mounted Figure 37. Schematic of the Demonstration Board of the 9−Pin Flip−Chip CSP Device http://onsemi.com 12 NCP2890 Silkscreen Layer Top Layer Bottom Layer Figure 38. Demonstration Board for 9−Pin Flip−Chip CSP Device − PCB Layers http://onsemi.com 13 NCP2890 BILL OF MATERIAL Item Part Description Ref. PCB Footprint Manufacturer Manufacturer Reference 1 NCP2890 Audio Amplifier − − ON Semiconductor NCP2890 2 SMD Resistor 100 K R1 0805 Vishay−Draloric D12CRCW Series 3 SMD Resistor 20 K R2, R3 0805 Vishay−Draloric CRCW0805 Series 4 Ceramic Capacitor 1.0 F 16 V X7R C1 1206 Murata GRM42−6X7R105K16 5 Ceramic Capacitor 390 nF 50 V Z5U C2 1812 Kemet C1812C394M5UAC 6 Ceramic Capacitor 1.0 F 16 V X7R C3 1206 Murata GRM42−6X7R105K16 7 Not Mounted R4, C4 − − − 8 BNC Connector J3 − Telegartner JO1001A1948 9 I/O Connector. It can be plugged by BLZ5.08/2 (Weidmüller Reference) J4, J5 − Weidmüller SL5.08/2/90B ORDERING INFORMATION Device Marking Package Shipping NCP2890AFCT2 MAG 9−Pin Flip−Chip CSP 3000/Tape and Reel NCP2890AFCT2G MAH 9−Pin Flip−Chip CSP (Lead−Free) 3000/Tape and Reel NCP2890DMR2 MAB Micro8 4000/Tape and Reel NOTE: This product is offered with either eutectic (SnPb−tin/lead) or lead−free solder bumps (G suffix) depending on the PCB assembly process. The NCP2890AFCT2G version requires a lead−free solder paste and should not be used with a SnPb solder paste. http://onsemi.com 14 NCP2890 PACKAGE DIMENSIONS 9−PIN FLIP−CHIP CSP FC SUFFIX CASE 499E−01 ISSUE O −A− 4X D 0.10 C −B− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. E A 0.10 C DIM A A1 A2 D E b e D1 E1 0.05 C −C− A2 A1 SEATING PLANE D1 e C B e E1 A 9X b 1 2 3 0.05 C A B 0.03 C RECOMMENDED PCB FOOTPRINT 0.5 0.5 0.250 0.280 http://onsemi.com 15 MILLIMETERS MIN MAX 0.540 0.660 0.210 0.270 0.330 0.390 1.450 BSC 1.450 BSC 0.290 0.340 0.500 BSC 1.000 BSC 1.000 BSC NCP2890 PACKAGE DIMENSIONS Micro8 DM SUFFIX CASE 846A−02 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A−01 OBSOLETE, NEW STANDARD 846A−02. −A− −B− K PIN 1 ID G D 8 PL 0.08 (0.003) M T B S A S SEATING −T− PLANE 0.038 (0.0015) C H L J DIM A B C D G H J K L MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 −−− 1.10 0.25 0.40 0.65 BSC 0.05 0.15 0.13 0.23 4.75 5.05 0.40 0.70 INCHES MIN MAX 0.114 0.122 0.114 0.122 −−− 0.043 0.010 0.016 0.026 BSC 0.002 0.006 0.005 0.009 0.187 0.199 0.016 0.028 Micro8 is a trademark of International Rectifier. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 16 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NCP2890/D