ETC UPC29M33

Information
Voltage Regulator of SMD
SOT-89 (Power mini mold)
MP-3Z (SC-63)
Document No. G11872EJ3V0IF00 (3rd edition)
Date Published March 2000 N CP(K)
©
Printed in Japan
2000
[MEMO]
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Information G11872EJ3V0IF00
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
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this document.
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intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
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of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
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measures in its design, such as redundancy, fire-containment, and anti-failure features.
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before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
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The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
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M7 98. 8
Information G11872EJ3V0IF00
3
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, pIease contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
•
Device availability
•
Ordering information
•
Product release schedule
•
Availability of related technical literature
•
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
•
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
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J99.1
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Information G11872EJ3V0IF00
1. INTRODUCTION
In recent years electronic devices such as camcorders, notebook PCs, and cellular telephones, have been
increasingly miniaturized. In response, the need for smaller and lighter semiconductor devices and electronic
components employed for these systems to increase the mounting density on PC boards has intensified.
NEC offers SOT-89 and MP-3Z surface-mount packages for power supply ICs.
This document explains the characteristics and taping specifications of the SOT-89 and MP-3Z packages.
2. DIMENSIONS
Figure 1 shows the dimensions of the SOT-89 package, and Figure 2 shows the dimensions of the MP-3Z
package.
Figure 1. SOT-89 Dimensions (unit: mm)
0.42
±0.06
4.0±0.25
1.5±0.1
2.5±0.1
0.8 MIN.
4.5±0.1
1.6±0.2
0.42±0.06
0.47
1.5 ±0.06
3.0
0.41+0.03
−0.05
Figure 2. MP-3Z Dimensions (unit: mm)
2.3±0.2
+0.2
1.5 −0.1
6.5±0.2
5.0±0.2
0.5±0.1
3
1.0 MIN.
1.5 TYP.
2
1.1±0.2
0.9 MAX.
2.3
2.3
0.5
0.8
2.0 MIN.
1
10.0 MAX.
5.5±0.2
4.3 MAX.
4
0.8 MAX.
0.8
Information G11872EJ3V0IF00
5
3. CHARACTERISTICS
Because of the construction, the SOT-89 and MP-3Z packages change their thermal characteristics, i.e., total
power dissipation, depending on the material and area of the PC board on which the packages are to be mounted.
The Data Sheet for a power IC housed in the SOT-89 package shows the total power dissipation when the
package is mounted on a ceramic PC board.
Figure 3 shows the total power dissipation when the package is
mounted on a glass epoxy board.
Figures 4 and 5 show the typical mounting pad dimensions.
The recommended soldering conditions are described in the Data Sheet of each product. Be sure to read this
description.
Figure 3. Size of Glass Epoxy Board and Total Power Dissipation of SOT-89
Total power dissipation PT (W)
10
Board with Cu electrode on total
surface (electrode thickness: 35 µ m)
1
Board without Cu electrode
0.1
100
1000
10000
100000
Glass epoxy board area S (mm2)
10
Board size
50 mm × 50 mm × 1.6 mm
Total power dissipation PT (W)
50 mm
Cu electrode area: A
Collector electrode of transistor is connected
to Cu electrode of the board (35 µ m thick).
50 mm
Collector electrode of transistor is connected
to Cu electrode of the board (18 µ m thick).
1
Emitter electrode of transistor is
connected to Cu electrode of the board
Transistor electrode are not
connected to Cu electrodes.
Ratio of Cu electrode
area to board area
1%
5%
10 %
50 %
100 %
0.1
0
10
100
Board Cu electrode area A (mm2)
6
Information G11872EJ3V0IF00
1000
10000
Figure 4. SOT-89 Typical Mounting Pad Dimensions (unit: mm)
1.5
45°
0.9
2.2
45°
0.9
2.2
1.0
1.0
1.5
1.0
1.5
Figure 5. MP-3Z Typical Mounting Pad Dimensions (unit: mm)
2.0
2.0
7.0
7.0
1.5
1.5
2.3
2.3
Information G11872EJ3V0IF00
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4. TAPING SPECIFICATIONS
The SOT-89 and MP-3Z packages can be delivered on a tape like other ICs.
Figures 6 and 7 show the tape shape and dimensions. Figures 8 and 9 show the reel shape.
Figure 6. SOT-89 Tape Dimensions (12 mm embossed-type carrier tape)
t
δ
H
δ
J
G
θ
W
B
θ
C
D
E
A
K0
K1
K
F
Unit: mm
Item
Recessed hole for
component
insertion
Feeding hole
Distance between
center lines
Symbol
+0.1
5.0−0.1
+0.1
4.6−0.1
Remark
Height
A
Width
B
Depth
K0
1.8±0.1
Internal space
Pitch
F
8.0±0.1
Total error:
+0.1
MAX./10
−0.3
pitch
Diameter
J
+0.1
φ1.5−0.05
Pitch
H
4.0±0.1
Total error:
+0.1
−0.3 MAX./10
pitch
Position
E
1.5±0.1
Distance between edge of tape and center of hole
Vertical
G
2.0±0.05
Center line of recessed hole and feeding hole
Horizontal
D
5.65±0.05
Center line of recessed hole and feeding hole
Thickness: 0.1 MAX.
Warp δ 0.3 MAX.
Cover tape
Width
W
+0.3
9.5 −0
Carrier tape
Width
C
12±0.2
Thickness
t
0.3±0.05
Hole depth
K1
2.1±0.1
Inclination
θ
30° MAX.
K
2.15±0.1
Device
Total thickness
8
Dimensions, Angle
Inner side of edge on surface 0.5 mm above inner bottom
Inner side of edge on surface 0.5 mm above inner bottom
Total of cover tape and carrier tape
Information G11872EJ3V0IF00
Figure 7 (A). MP-3Z Tape Dimensions (16 mm embossed-type taping)
Unit: mm
P0
D0
Standard
A
7.1 MAX.
B
10.7 MAX.
T
B
F
W
E
P2
Symbol
D1
P1
A
T2
T
+0.1
D0
φ1.5−0
D1
φ1.5 MIN.
E
1.75±0.1
F
7.5±0.1
P0
4.0±0.1
P1
8.0±0.1
P2
2.0±0.1
T
0.2
T2
2.7±0.1
W
16.0±0.3
Figure 7 (B). MP-3Z Tape Dimensions (32 mm adhesive-type taping)
Unit: mm
D (12 Pitch)
C
I
G
B
A
2-H
d
d
J
E
t2t1
F
MP-3Z
Information G11872EJ3V0IF00
Symbol
Standard
A
32 −0.4
B
26±0.1
C
4.0±0.1
D
48±0.3
E
12±0.1
+0
+0.1
F
φ1.0 −0
G
6.0±0.2
H
R2.0
I
8.0
J
4.0
t2
0.15
t1
0.18
d
0±0.5
9
Figure 8. SOT-89 Reel Dimensions
Unit: mm
θ
Symbol
Dimensions,
Angle
A
φ178±2
W
13±0.5
B
φ60±1
θ1
90°
C
φ13±0.5
θ2
120°
1
B
A
C
θ2
W
Figure 9 (A). MP-3Z Reel Dimensions (embossed-type taping)
Unit: mm
θ1
θ1
F
V
C
3-r
E
θ2
W1
10
W1
W
W2
Information G11872EJ3V0IF00
Standard
A
329
B
100
C
13±0.5
D
21±0.8
E
2.0±0.5
F
2
V
8
A
K
B
D
Symbol
+2.0
W
16.4 −0
W1
(2.5)
W2
22.4 MAX.
K
260
r
1.0
θ1
120
θ2
60
Figure 9 (B). MP-3Z Reel Dimensions (adhesive-type taping)
t
Symbol
Dimensions,
Angle
A
φ300
B
φ80
C
φ15.5
W
34
t
2
F
38±1
A
B
C
Unit: mm
t
W
F
Information G11872EJ3V0IF00
11
The direction of a taped product is as shown in Figures 10 and 11. The part number of a taped product, including
the symbol indicating the direction, is as follows:
Note The part number of the taped product of the SOT-89 package differs from those of discrete devices such as
transistors and diodes.
Figure 10. SOT-89 Taping Direction
“-E1”
“-E2”
Draw-out direction
Figure 11. MP-3Z Taping Direction
(A) Embossed-type taping
“-E1”
“-E2”
Draw-out direction
(B) Adhesive-type taping
“-T1”
“-T2”
Draw-out direction
µ PC×××××T
Part number on Data Sheet
12
−
Type and direction of taping
Information G11872EJ3V0IF00
Table 1 shows the number of packages on a tape.
Table 1. Number of Packages per Tape
Package
Quantity (units/reel)
SOT-89
1000
MP-3Z (embossed taping)
2000
MP-3Z (adhesive taping)
1500
Information G11872EJ3V0IF00
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[MEMO]
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Information G11872EJ3V0IF00
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