Technical Note TAPING SPECIFICATIONS AND PACKING OUTLINE DRAWING OF 6-PIN MINIMOLD/ 6-PIN SUPER MINIMOLD PACKAGE IC FOR HIGH FREQUENCY USE Document No. PX10089EJ01V0TN (1st edition) Date Published February 2002 CP(K) NEC Compound Semiconductor Devices 2002 Printed in Japan • The information in this document is current as of February, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 2 Technical Note PX10089EJ01V0TN CONTENTS 1. DESCRIPTION ........................................................................................................................................ 4 2. INDICATION OF PART NUMBER ....................................................................................................... 4 2.1 Indication of Part Number............................................................................................................. 4 2.2 Device Orientation in the Carrier Tape........................................................................................ 4 2.3 An Example of Indication.............................................................................................................. 4 3. SPECIFICATIONS................................................................................................................................... 5 3.1 Tape Dimensions........................................................................................................................... 5 3.1.1 6-pin Minimold Package .......................................................................................................................5 3.1.2 6-pin Super Minimold Package.............................................................................................................6 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 Reel Dimensions (Used Commonly for 2 Package Types)........................................................ 7 Leader and Trailer of Carrier Tape (Used Commonly for 2 Package Types)........................... 8 Sealing Strength between Tapes ................................................................................................. 9 Missing Device............................................................................................................................... 9 Taking Packaged Device Out of the Tape ................................................................................... 9 Splicing........................................................................................................................................... 9 Electrical Characteristics.............................................................................................................. 9 Storage Environment .................................................................................................................... 9 4. PACKING .............................................................................................................................................. 10 4.1 Quantity of Packing..................................................................................................................... 10 4.2 Indication of Part Number and Quantity to the Reel ................................................................ 10 4.3 Indication of Part Number and Quantity to the Packing Case ................................................ 10 5. PACKING OUTLINE DRAWING (Used Commonly for 2 Package Types).................................... 11 5.1 Tape and Reel .............................................................................................................................. 11 5.2 Packing Box Specifications........................................................................................................ 11 Technical Note PX10089EJ01V0TN 3 1. DESCRIPTION This specification covers standards on tape and reel of the 6-pin minimold/6-pin super minimold package for high frequency semiconductors on NEC Compound Semiconductor Devices, Ltd. 2. INDICATION OF PART NUMBER The part number of tape and reel packing device is following. 2.1 Indication of Part Number Part number of device Symbol of device orientation (cf. 2.2) Indicating the embossed carrier tape In IC’s, “T” and “TA” means minimold package, “TB” means super minimold package. 2.2 Device Orientation in the Carrier Tape Pin 1, 2, 3 of the device faces toward perforations of the tape. Caution Only “-E3” type taping is supported for this package. In the drawing, marking is an example. -E3 1 pin C2H C2H C2H Pin 1, 2, 3 face to perforations 2.3 An Example of Indication µPC8172TB-E3: Emboss-taped µPC8172TB, of which pin 1, 2, 3 face toward tape’s perforations. 4 Technical Note PX10089EJ01V0TN 3. SPECIFICATIONS 3.1 Tape Dimensions 3.1.1 6-pin Minimold Package t H δ J A0 E δ K0 K1 K C W B0 θ θ D D1 G F (Unless otherwise specified, Unit: mm) Item Symbol Size Length A0 3.18±0.1 Bottom size Width B0 3.40±0.1 Bottom size Depth K0 1.4±0.1 Inner size Pitch F 4.0±0.1 Accumulated tolerance ±0.2 MAX./10 pitch Air Hole Diameter D1 φ1.0±0.2 Perforation Diameter J φ1.55±0.05 Pitch H 4.0±0.1 Accumulated tolerance ±0.2 MAX./10 pitch Position E 1.75±0.1 Distance between edge of tape and center of hole. Length Direction G 2.0±0.05 Width Direction D 3.5±0.05 Distance between center of pocket and center of perforation. Cover Tape Width W 5.5 −0.1 Carrier Tape Width C 8.0±0.2 Thickness t 0.3±0.05 Bend δ 0.3 MAX. Depth K1 1.6±0.1 Pocket Distance Between Centerline Device Outline Tilt Overall Thickness Remarks +0.3 See the product specification θ 20° MAX. K 1.65 MAX. Cover tape + Carrier tape This carrier tape is applied treatment of electro static prevention. Technical Note PX10089EJ01V0TN 5 3.1.2 6-pin Super Minimold Package t H δ J A0 E δ K0 K1 K C W B0 θ θ D D1 G F (Unless otherwise specified, Unit: mm) Item Symbol Size Length A0 2.2±0.1 Bottom size Width B0 2.4±0.1 Bottom size Depth K0 1.2±0.1 Inner size Pitch F 4.0±0.1 Accumulated tolerance ±0.2/10 pitch Air Hole Diameter D1 φ1.0 Perforation Diameter J φ1.55±0.05 Pitch H 4.0±0.1 Accumulated tolerance ±0.2/10 pitch Position E 1.75±0.1 Distance between edge of tape and center of hole. Length Direction G 2.0±0.05 Width Direction D 3.5±0.05 Distance between center of pocket and center of perforation. Cover Tape Width W 5.5 −0.1 Carrier Tape Width C 8.0±0.2 Thickness t 0.3±0.05 Bend δ 0.3 MAX. Depth K1 1.7 MAX. Pocket Distance Between Centerline Device Outline Tilt Overall Thickness +0.3 Thickness: 0.1 MAX. See the product specification θ 20° MAX. K 1.8 MAX. This carrier tape is applied treatment of electro static prevention. 6 Remarks Technical Note PX10089EJ01V0TN Cover tape + Carrier tape 3.2 Reel Dimensions (Used Commonly for 2 Package Types) A C B θ1 TYPE CLASS Label W (Unless otherwise specified, Unit: mm) Item Flange Hub Marking Symbol Size Diameter A +0 φ180 −1.5 Space Between Flanges W 9 −0 Outer Diameter B φ60 +1 −0 Spindle Hole Diameter C φ13±0.2 Key Slit Location θ1 120° Remarks +1 Label shall be attached to one Part number, quantity, lot number and class side of flanges are marked or labeled This reel applied treatment of electro static prevention. Technical Note PX10089EJ01V0TN 7 3.3 Leader and Trailer of Carrier Tape (Used Commonly for 2 Package Types) Adhesive tape Empty carrier tape Cover tape Trailer Leader Label (Unit: mm) Item Leader Cover Tape Empty Carrier Tape Trailer 8 Empty Carrier Tape Specification − Remarks Tip taped to roll, and fixed by adhesive tape 100 MIN. The winding direction is shown above 400 MIN. Length of cover tape + empty carrier tape 160 MIN. Technical Note PX10089EJ01V0TN 3.4 Sealing Strength between Tapes Item Data Cover Tape Adhesion 0.1 to 1.0 N Remarks Peeling angle: 165° to 180°, Peeling speed: 300±10 mm/min Cover tape 165˚ to 180˚ Carrier tape Direction of tape 3.5 Missing Device Item Spec Remarks Successive Void None Within 40 mm to carrier except leader and trailer Non-successive Void Rate of incidence 0.2% MAX./reel Except leader and trailer Wrong Orientation None Reverse Orientation Wrong Type No 3.6 Taking Packaged Device Out of the Tape (1) Packaged devices should not adhere to the cover tape. (2) Excess epoxy mold should not affect on taking the device out. 3.7 Splicing No carrier or cover tape should be spliced. 3.8 Electrical Characteristics Electrical characteristics of taping device shall be provide in the specification. 3.9 Storage Environment Ambient Temperature : TA = +5 to +30°C Humidity : Rh = 20 to 70% Technical Note PX10089EJ01V0TN 9 4. PACKING 4.1 Quantity of Packing 3 000 pieces/reel 4.2 Indication of Part Number and Quantity to the Reel Part number, quantity, rank and lot number are indicated at the side of the reel. 4.3 Indication of Part Number and Quantity to the Packing Case Part number, quantity, rank and lot number are indicated at the side of packing case. 10 Technical Note PX10089EJ01V0TN 5. PACKING OUTLINE DRAWING (Used Commonly for 2 Package Types) 5.1 Tape and Reel C1X C1X C1X -E3 Type Label Direction of feed Quantity (pcs) 3 000 Contens of Label Indication Part Number, Quantity, Lot Number, Class 5.2 Packing Box Specifications H W L Label Contens of Label Indication Dimension (mm) (W × H × L) Quantity (reel) 185 × 75 × 185 1 to 5 185 × 135 × 185 6 to 10 Part Number, Quantity, Lot Number, Class Remark Dimensions and maximum quantity of a packing box are for shipment. In some using case, the packing box might replace another box. Technical Note PX10089EJ01V0TN 11 Business issue NEC Compound Semiconductor Devices, Ltd. 5th Sales Group, Sales Division TEL: +81-3-3798-6372 FAX: +81-3-3798-6783 E-mail: [email protected] NEC Compound Semiconductor Devices Hong Kong Limited Hong Kong Head Office FAX: +852-3107-7309 TEL: +852-3107-7303 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office FAX: +82-2-528-0302 TEL: +82-2-528-0301 NEC Electron Devices European Operations http://www.nec.de/ TEL: +49-211-6503-101 FAX: +49-211-6503-487 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Technical issue NEC Compound Semiconductor Devices, Ltd. http://www.csd-nec.com/ Sales Engineering Group, Sales Division E-mail: [email protected] FAX: +81-44-435-1918 0110