ETC WEDF1M32B

WEDF1M32B-XXX5
HI-RELIABILITY PRODUCT
1Mx32 5V FLASH MODULE
ADVANCED*
FEATURES
■
■
■
■
■
■
■ Access Times of 70, 90, 120ns
■ Packaging:
• 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP
(Package 401)
• 68 lead, 22mm Low Profile CQFP, 4.6mm (0.180"),
(Package 509)
■ Sector Architecture
• One 16KByte Sectors
• Two 8KByte Sectors
• One 32KByte Sectors
• Fifteen 64KByte Sectors
■ 1,000,000 Erase/Program Cycles
FIG. 1
Organized as 1Mx32, user configurable as 2Mx16 or 4Mx8.
Commercial, Industrial and Military Temperature Ranges
5V ± 10% for Read and Write Operations.
Low Power CMOS
Embedded Erase and Program Algorithm
Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
■ Weight
WEDF1M32B-XG2TX5 - 8 grams typical
WEDF1M32B-XHX5 - 13 grams typical
* This data sheet describes a product that may or may not be under
development and is subject to change or cancellation without notice.
PIN CONFIGURATION FOR WEDF1M32B-XHX5
TOP VIEW
1
12
23
PIN DESCRIPTION
34
45
56
I/O0-31
Data Inputs/Outputs
A0-19
Address Inputs
I/O30
WE
Write Enable
I/O29
CS1-4
Chip Selects
OE
Output Enable
I/O8
RESET
I/O15
I/O24
VCC
I/O31
I/O9
CS2
I/O14
I/O25
CS4
I/O10
GND
I/O13
I/O26
NC
A7
I/O27
I/O28
OE
A12
A4
A1
A9
A17
NC
A5
A2
GND
Ground
A0
A15
WE
A13
A6
A3
NC
Not Connected
A18
VCC
I/O7
A8
NC
I/O23
A14
I/O11
I/O12
A16
A10
A11
CS1
I/O6
I/O16
CS3
I/O22
I/O1
A19
I/O5
I/O17
GND
I/O21
I/O2
I/O3
I/O4
I/O18
I/O19
I/O20
22
33
44
55
CS 2
CS3
CS 4
1M x 8
1M x 8
1M x 8
66
8
I/O0-7
May 1999 Rev. 1
Power Supply
RESET
WE
OE
A0-19
1M x 8
11
Reset
VCC
BLOCK DIAGRAM
CS 1
I/O0
RESET
1
8
I/O8-15
8
I/O16-23
8
I/O24-31
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
WEDF1M32B-XXX5
FIG. 2
PIN CONFIGURATION FOR WEDF1M32B-XG2TX5
PIN DESCRIPTION
RESET
A0
A1
A2
A3
A4
A5
CS3
GND
CS4
WE1
A6
A7
A8
A9
A10
VCC
TOP VIEW
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
GND
I/O8
I/O9
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
0.940"
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
RESET
Reset
VCC
Power Supply
WE 1 CS 1
WE 2 CS 2
WE 3 CS 3
WE 4 CS 4
RESET
OE
A0-19
A16
CS1
OE
CS2
A17
WE2
WE3
WE4
A18
A19
NC
A15
A14
A13
A12
A11
VCC
Data Inputs/Outputs
A0-19
The White 68 lead G2T CQFP
GND
Ground
fills the same fit and function as
NC
Not Connected
the JEDEC 68 lead CQFJ or 68
PLCC. But the G2T has the TCE
and lead inspection advantage
of the CQFP form.
BLOCK DIAGRAM
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
1M x 8
8
I/O0-7
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
I/O0-31
2
1M x 8
8
I/O8-15
1M x 8
8
I/O16-23
1M x 8
8
I/O24-31
WEDF1M32B-XXX5
RECOMMENDED OPERATING CONDITIONS
ABSOLUTE MAXIMUM RATINGS
Parameter
Parameter
Unit
Voltage on Any Pin with Respect to
GND – VCC and VPP)
-0.5 to +7.0
Voltage with Respect to GND –
A9, OE, and RESET (2)
-2.0 to +12.5
V
Voltage with Respect to GND –
All other pins (1)
-2.0 to +7.0
V
200
mA
Output Short Circuit Current
V
Symbol
Min
Max
Unit
Supply Voltage
V CC
4.5
5.5
V
Input High Voltage
V IH
2.0
V CC + 0.5
V
Input Low Voltage
V IL
-0.5
+0.8
V
Operating Temp. (Mil.)
TA
-55
+125
°C
CAPACITANCE
(TA = +25°C)
NOTES:
1. Minimum DC voltage is -0.5V on input/output pins. During transitions, this
level may undershoot to -2.0V for periods <20ns. Maximum DC voltage on
input/output pins is VCC + 0.5V which, during transitions, may overshoot to
V CC + 2.0V for periods <20ns.
2. Minimum DC input voltage on pins A 9, OE, and RESET is -0.5V. During
voltage transitions, A 9, OE, and RESET may undershoot Vss to -2.0V for
periods of up to 20ns. See Figure 6. Maximum DC input voltage on pin A9 is
+12.5V which may overshoot to +13.5V for periods up to 20ns.
3. Output shorted for no more than one second. No more than one output
shorted at a time.
Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a Stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Parameter
Symbol
Conditions
Max
Unit
OE capacitance
COE
VIN = 0 V, f = 1.0 MHz
50
pF
WE1-4 capacitance
CWE
VIN = 0 V, f = 1.0 MHz
20
pF
CS1-4 capacitance
CCS
VIN = 0 V, f = 1.0 MHz
20
pF
Data I/O capacitance
CI/O
VI/O = 0 V, f = 1.0 MHz
20
pF
Address input capacitance
CAD
VIN = 0 V, f = 1.0 MHz
50
pF
This parameter is guaranteed by design but not tested.
DATA RETENTION
Parameter
Test Conditions
Min
Unit
Minimum Pattern Data
150°C
10
Years
Retention Time
125°C
20
Years
FIG. 3
AC TEST CONDITIONS
AC TEST CIRCUIT
Parameter
I OL
Current Source
VZ
D.U.T.
≈ 1.5V
(Bipolar Supply)
C eff = 50 pf
I OH
Current Source
3
Typ
Unit
Input Pulse Levels
VIL = 0, VIH = 3.0
V
Input Rise and Fall
5
ns
Input and Output Reference Level
1.5
V
Output Timing Reference Level
1.5
V
NOTES:
V Z is programmable from -2V to +7V.
I OL & IOH programmable from 0 to 16mA.
Tester Impedance Z 0 = 75 Ω.
V Z is typically the midpoint of V OH and V OL.
I OL & IOH are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
WEDF1M32B-XXX5
DC CHARACTERISTICS - CMOS COMPATIBLE
(VCC = 5.0V, GND = 0V, TA = -55°C to +125°C)
Parameter
Symbol
Conditions
Min
Max
Unit
Input Leakage Current
I LI
V IN = VCC to GND
10
µA
Output Leakage Current
I LO
V OUT = VCC to GND
10
µA
V CC Read Current (1,2)
I CC1
CS = VIL, OE V IH, f = 5 MHz, I OUT = 0mA
160
mA
V CC Write Current (2,3,4)
I CC2
CS = VIL, OE V IH
200
mA
VCC Standby Current (2,5)
ICC3
CS = RESET = OE = VIH, f = 5MHz
20.0
mA
Output Low Voltage
V OL
V CC = 4.5, I OL = 5.8 mA
0.45
V
Output High Voltage
V OH
V CC = 4.5, I OH = -2.5 mA
Low V CC Lockout Voltage (4)
V LKO
4.2
V
2.4
V
3.2
NOTES:
1. The Icc current listed is typically less than 2mA/MHz, with OE at VIH .
2. Maximum Icc specifications are tested with VCC = V CC max.
3. I CC active while Embedded Erase or Embedded Program is in progress.
4. Not 100% tested.
5. I CC3 = 20µA max at extended temperature (> +85°C).
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS - WE CONTROLLED
(VCC = 5.0V, GND = 0V, TA = -55°C to +125°C)
Parameter
Symbol
-70
Min
-90
Max
Min
-120
Max
Min
Unit
Max
Write Cycle Time
tAVAV
tWC
70
90
120
ns
Chip Select Setup Time
tELWL
t CS
0
0
0
ns
Write Enable Pulse Width
tWLWH
tWP
35
45
50
ns
Address Setup Time
tAVWH
t AS
0
0
0
ns
Data Setup Time
tDVWH
tDS
30
45
50
ns
Data Hold Time
tWHDX
tDH
0
0
0
ns
Address Hold Time
tWHAX
tAH
45
45
50
ns
Chip Select Hold Time
tWHEH
tCH
0
0
0
ns
Write Enable Pulse Width High
tWHWL
tWPH
20
20
20
ns
Programming Operation (2)
tWHWH1
300
300
300
µs
Sector Erase Operation (3)
tWHWH2
8
8
8
sec
Write Recovery before Read
tWHGL
50
sec
0
Chip Programming Time
NOTES:
1. Guaranteed by design, not tested.
2. Typical value for t WHWH1 is 7µs.
3. Typical value for t WHWH2 is 1sec.
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
0
50
4
µs
0
50
WEDF1M32B-XXX5
AC CHARACTERISTICS – WRITE OPERATION - CS CONTROLLED (1)
(VCC = 5.0V, GND = 0V, TA = -55°C to +125°C)
Parameter
Symbol
-70
Min
-90
Max
Min
-120
Max
Min
Unit
Max
Write Enable Cycle Time
tAVAV
tWC
70
90
120
Write Enable Setup Time
tWLEL
tWS
0
0
0
ns
Chip Select Pulse Width
tELEH
tCP
35
45
50
ns
Address Setup Time
tAVEH
tAS
0
0
0
ns
Data Setup Time
tDVEH
tDS
30
45
50
ns
Data Hold Time
tEHDX
tDH
0
0
5
ns
Address Hold Time
tEHAX
tAH
45
45
50
ns
Write Enable Hold Time
tEHWH
tWH
0
0
0
ns
Chip Select Pulse Width High
tEHEL
tEPH
20
Programming Operation (1)
tWHWH1
300
300
300
µs
Sector Erase Operation (2)
tWHWH2
8
8
8
sec
Write Recovery before Read
tEHGL
20
0
ns
20
0
ns
µs
0
NOTES:
1. Typical value for t WHWH1 is 7µs.
2. Typical value for t WHWH2 is 1sec.
AC CHARACTERISTICS – READ-ONLY OPERATIONS
(VCC = 5.0V, GND = 0V, TA = -55°C to +125°C)
Parameter
Symbol
-70
Min
Read Cycle Time
t AVAV
t RC
Address Access Time
t AVQV
t ACC
Chip Select to Output Valid (1)
t ELQV
t CE
Output Enable to Output Valid (1)
t GLQV
t OE
Chip Select to Output Low Z (2)
t ELQX
t LZ
Chip Select High to Output High Z (2)
t EHQZ
t HZ
Output Enable to Output Low Z (2)
t GLOX
t OLZ
Output Enable High to Output High Z (2)
t GHQZ
t DF
Output Hold from Addresses, CS or OE
Change, Whichever is First (2)
-90
Max
70
t OH
Min
90
70
Min
Unit
Max
120
ns
90
120
70
90
120
ns
30
35
50
ns
50
ns
30
ns
0
0
20
0
0
20
0
20
0
-120
Max
0
ns
0
20
0
ns
ns
ns
NOTES:
1. OE may be delayed up to t CE-t OE after the falling edge of CS without impact on tCS .
2. Guaranteed by design, not tested.
5
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
WEDF1M32B-XXX5
PACKAGE 509:
68 LEAD, LOW PROFILE CERAMIC QUAD FLAT PACK, CQFP (G2T)
25.15 (0.990) ± 0.26 (0.010) SQ
4.57 (0.180) MAX
22.36 (0.880) ± 0.26 (0.010) SQ
0.27 (0.011) ± 0.04 (0.002)
0.25 (0.010) REF
Pin 1
R 0.25
(0.010)
24.03 (0.946)
± 0.26 (0.010)
0.19 (0.007)
± 0.06 (0.002)
1° / 7°
1.0 (0.040)
± 0.127 (0.005)
23.87
(0.940) REF
DETAIL A
1.27 (0.050) TYP
SEE DETAIL "A"
0.38 (0.015) ± 0.05 (0.002)
20.3 (0.800) REF
The White 68 lead G2T CQFP
fills the same fit and function as
the JEDEC 68 lead CQFJ or 68
PLCC. But the G2T has the TCE
and lead inspection advantage
of the CQFP form.
0.940"
TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
6
WEDF1M32B-XXX5
PACKAGE 401:
66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H)
30.1 (1.185) ± 0.38 (0.015) SQ
PIN 1 IDENTIFIER
SQUARE PAD
ON BOTTOM
25.4 (1.0) TYP
6.22 (0.245)
MAX
3.81 (0.150)
± 0.1 (0.005)
1.27 (0.050) ± 0.1 (0.005)
0.76 (0.030) ± 0.1 (0.005)
2.54 (0.100)
TYP
15.24 (0.600) TYP
1.27 (0.050) TYP DIA
0.46 (0.018) ± 0.05 (0.002) DIA
25.4 (1.0) TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
7
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
WEDF1M32B-XXX5
ORDERING INFORMATION
WED F 1M32 B - XXX X X 5 X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
VPP PROGRAMMING VOLTAGE
5 = 5V
DEVICE GRADE:
M = Military Screened
I = Industrial
C = Commercial
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
PACKAGE TYPE:
H = Ceramic Hex-In-Line Package, HIP (Package 401)
G2T = 22mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 509)
ACCESS TIME (ns)
Bottom Boot Block
ORGANIZATION, 1M x 32
User configurable as 2M x 16 or 4M x 8
Flash
WHITE ELECTRONIC DESIGNS CORP.
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
8