ETC 2SD1268P

Power Transistors
2SD1268
Silicon NPN epitaxial planar type
For power switching
Complementary to 2SB0943 (2SB943)
Unit: mm
●
0.7±0.1
■ Absolute Maximum Ratings
(TC=25˚C)
Parameter
Symbol
Ratings
Unit
Collector to base voltage
VCBO
130
V
Collector to emitter voltage
VCEO
80
V
Emitter to base voltage
VEBO
7
V
Peak collector current
ICP
6
A
Collector current
IC
3
A
Collector power TC=25°C
dissipation
30
PC
Ta=25°C
Junction temperature
Tj
Storage temperature
Tstg
4.2±0.2
7.5±0.2
16.7±0.3
φ3.1±0.1
1.4±0.1
0.8±0.1
1.3±0.2
0.5 +0.2
–0.1
2.54±0.25
5.08±0.5
1
2
3
1:Base
2:Collector
3:Emitter
TO–220 Full Pack Package(a)
W
2
■ Electrical Characteristics
2.7±0.2
4.0
●
Low collector to emitter saturation voltage VCE(sat)
Satisfactory linearity of foward current transfer ratio hFE
Large collector current IC
Full-pack package which can be installed to the heat sink with
one screw
14.0±0.5
●
4.2±0.2
5.5±0.2
Solder Dip
■ Features
●
10.0±0.2
150
˚C
–55 to +150
˚C
(TC=25˚C)
Parameter
Symbol
Conditions
min
typ
Unit
10
µA
50
µA
ICBO
Emitter cutoff current
IEBO
VEB = 5V, IC = 0
Collector to emitter voltage
VCEO
IC = 10mA, IB = 0
80
hFE1
VCE = 2V, IC = 0.1A
45
hFE2*
VCE = 2V, IC = 0.5A
60
Collector to emitter saturation voltage
VCE(sat)
IC = 2A, IB = 0.1A
0.5
V
Base to emitter saturation voltage
VBE(sat)
IC = 2A, IB = 0.1A
1.5
V
Transition frequency
fT
VCE = 10V, IC = 0.5A, f = 10MHz
Turn-on time
ton
Storage time
tstg
Fall time
tf
Forward current transfer ratio
*h
FE2
VCB = 100V, IE = 0
max
Collector cutoff current
IC = 0.5A, IB1 = 50mA, IB2 = –50mA,
VCC = 50V
V
260
30
MHz
0.5
µs
2.5
µs
0.15
µs
Rank classification
Rank
R
Q
P
hFE2
60 to 120
90 to 180
130 to 260
Note: Ordering can be made by the common rank (PQ rank hFE = 90 to 260) in the rank classification.
Note)The part number in the parenthesis shows conventional part number.
1
Power Transistors
2SD1268
IC — VCE
20
(2)
10
4
50mA
3
30mA
25mA
2
20mA
10mA
1
5mA
(3)
(4)
2mA
1mA
0
0
20
40
60
80 100 120 140 160
0
Ambient temperature Ta (˚C)
2
4
3
TC=–25˚C
100˚C
0.3
0.1
0.03
0.1
0.3
1
3
300
TC=100˚C
25˚C
100
–25˚C
30
10
3
0.01
0.01 0.03
0.1
0.3
1
3
Switching time ton,tstg,tf (µs)
100
30
10
3
10
3
tstg
1
ton
tf
0.3
0.1
Collector to base voltage VCB (V)
10
100
30
10
0.1
0.3
1
3
10
100
Non repetitive pulse
TC=25˚C
30
10 I
CP
IC
3
t=0.5ms
10ms
1
1ms
0.3
DC
0.1
0.03
0.01
0.01
100
3
Area of safe operation (ASO)
0.03
30
1
Collector current IC (A)
Pulsed tw=1ms
Duty cycle=1%
IC/IB=10 (IB1=–IB2)
VCC=50V
TC=25˚C
30
300
0.3
300
1
0.01 0.03
10
ton, tstg, tf — IC
1000
0.1
VCE=10V
f=10MHz
TC=25˚C
Collector current IC (A)
IE=0
f=1MHz
TC=25˚C
10
0.03
3
100
3
–25˚C
0.1
1000
Cob — VCB
1
25˚C
0.3
3000
1
0.01 0.03
10
10000
0.3
TC=100˚C
VCE=2V
3000
Collector current IC (A)
3000
1
fT — IC
1000
0.01
0.01 0.03
3
Collector current IC (A)
Transition frequency fT (MHz)
10
25˚C
10
10000
IC/IB=20
1
0.1
12
IC/IB=20
30
hFE — IC
30
1
10
10000
Forward current transfer ratio hFE
Base to emitter saturation voltage VBE(sat) (V)
8
100
Collector to emitter voltage VCE (V)
VBE(sat) — IC
100
Collector output capacitance Cob (pF)
6
Collector current IC (A)
(1)
IB=100mA
Collector current IC (A)
Collector power dissipation PC (W)
40
30
TC=25˚C
(1) TC=Ta
(2) With a 100 × 100 × 2mm
Al heat sink
(3) With a 50 × 50 × 2mm
Al heat sink
(4) Without heat sink
(PC=2W)
0
2
VCE(sat) — IC
5
Collector to emitter saturation voltage VCE(sat) (V)
PC — Ta
50
0
0.4
0.8
1.2
1.6
Collector current IC (A)
2.0
1
3
10
30
100
300
1000
Collector to emitter voltage VCE (V)
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the
"Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial
property, the granting of relative rights, or the granting of any license.
(3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(4) The products and product specifications described in this material are subject to change without
notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to
make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, redundant design is recommended,
so that such equipment may not violate relevant laws or regulations because of the function of our
products.
(6) When using products for which dry packing is required, observe the conditions (including shelf life
and after-unpacking standby time) agreed upon when specification sheets are individually exchanged.
(7) No part of this material may be reprinted or reproduced by any means without written permission
from our company.
Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic
semiconductor products best suited to their applications.
Due to modification or other reasons, any information contained in this material, such as available
product types, technical data, and so on, is subject to change without notice.
Customers are advised to contact our semiconductor sales office and obtain the latest information
before starting precise technical research and/or purchasing activities.
B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but
there is always the possibility that further rectifications will be required in the future. Therefore,
Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material.
C. These materials are solely intended for a customer's individual use.
Therefore, without the prior written approval of Panasonic, any other use such as reproducing,
selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited.
2001 MAR