ETC AT93C46-10SA-5.0C

Features
• Medium-voltage and Standard-voltage Operation
•
•
•
•
•
•
– 5.0 (VCC = 4.5V to 5.5V)
– 2.7 (VCC = 2.7V to 5.5V)
User-selectable Internal Organization
– 1K: 128 x 8 or 64 x 16
– 2K: 256 x 8 or 128 x 16
– 4K: 512 x 8 or 256 x 16
3-wire Serial Interface
2 MHz Clock Rate (5V)
Self-timed Write Cycle (10 ms max)
High Reliability
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
8-lead PDIP and 8-lead JEDEC SOIC Packages
3-wire Serial
Automotive
EEPROMs
Description
1K (128 x 8 or 64 x 16)
The AT93C46/56/66 provides 1024/2048/4096 bits of serial electrically erasable programmable read only memory (EEPROM) organized as 64/128/256 words of 16 bits
each, when the ORG pin is connected to VCC and 128/256/512 words of 8 bits each
when it is tied to ground. The device is optimized for use in many automotive applications where low power and low voltage operations are essential. The AT93C46/56/66
is available in space-saving 8-lead PDIP and 8-lead JEDEC SOIC packages.
Function
CS
Chip Select
SK
Serial Data Clock
DI
Serial Data Input
DO
Serial Data Output
GND
Ground
VCC
Power Supply
ORG
Internal Organization
DC
Don’t Connect
4K (512 x 8 or 256 x 16)
AT93C46
AT93C56
AT93C66
Pin Configurations
Pin Name
2K (256 x 8 or 128 x 16)
8-lead PDIP
CS
SK
DI
DO
1
2
3
4
8
7
6
5
VCC
DC
ORG
GND
8-lead SOIC
CS
SK
DI
DO
1
2
3
4
8
7
6
5
VCC
DC
ORG
GND
Rev. 3264A–SEEPR–01/02
1
Description (Continued)
The AT93C46/56/66 is enabled through the Chip Select pin (CS), and accessed via a
3-wire serial interface consisting of Data Input (DI), Data Output (DO), and Shift Clock
(SK). Upon receiving a READ instruction at DI, the address is decoded and the data is
clocked out serially on the data output pin DO. The WRITE cycle is completely selftimed and no separate ERASE cycle is required before WRITE. The WRITE cycle is
only enabled when the part is in the ERASE/WRITE ENABLE state. When CS is brought
“high” following the initiation of a WRITE cycle, the DO pin outputs the READY/BUSY
status of the part.
The AT93C46/56/66 is available in 4.5V to 5.5V and 2.7V to 5.5V versions.
Absolute Maximum Ratings*
Operating Temperature.................................. -55°C to +125°C
Storage Temperature ..................................... -65°C to +150°C
Voltage on Any Pin
with Respect to Ground .....................................-1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability
DC Output Current........................................................ 5.0 mA
Block Diagram
Notes:
2
1. When the ORG pin is connected to VCC, the x 16 organization is selected. When it is connected to ground, the x 8 organization is selected. If the ORG pin is left unconnected and the application does not load the input beyond the capability of the
internal 1 Meg ohm pullup, then the x 16 organization is selected.
2. For the AT93C46, if x 16 organization is the mode of choice and Pin 6 (ORG) is left unconnected, Atmel recommends using
the AT93C46A device. For more details, see the AT93C46A datasheet.
AT93C46/56/66
3264A–SEEPR–01/02
AT93C46/56/66
Pin Capacitance(1)
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted).
Symbol
Test Conditions
COUT
CIN
Note:
Max
Units
Conditions
Output Capacitance (DO)
5
pF
VOUT = 0V
Input Capacitance (CS, SK, DI)
5
pF
VIN = 0V
1. This parameter is characterized and is not 100% tested.
DC Characteristics
Applicable over recommended operating range from: TA = -40°C to +125°C, VCC = +2.7V to +5.5V (unless otherwise noted).
Symbol
Parameter
VCC1
Supply Voltage
VCC2
Supply Voltage
ICC
Supply Current
ISB1
Standby Current
ISB2
Test Condition
Min
Typ
Max
Unit
2.7
5.5
V
4.5
5.5
V
READ at 1.0 MHz
0.5
2.0
mA
WRITE at 1.0 MHz
0.5
2.0
mA
VCC = 2.7V
CS = 0V
6.0
10.0
µA
Standby Current
VCC = 5.0V
CS = 0V
17
30
µA
IIL
Input Leakage
VIN = 0V to VCC
0.1
1.0
µA
IOL
Output Leakage
VIN = 0V to VCC
0.1
1.0
µA
VIL1(1)
VIH1(1)
Input Low Voltage
Input High Voltage
2.7V ≤ VCC ≤ 5.5V
VCC x 0.3
VCC + 1
V
VOL1
VOH1
Output Low Voltage
Output High Voltage
4.5V ≤ VCC ≤ 5.5V
0.4
V
VOL2
VOH2
Output Low Voltage
Output High Voltage
1.8V ≤ VCC ≤ 2.7V
Note:
VCC = 5.0V
-0.6
VCC x 0.7
IOL = 2.1 mA
IOH = -0.4 mA
2.4
IOL = 0.15 mA
IOH = -100 µA
V
0.2
VCC - 0.2
V
V
1. VIL min and VIH max are reference only and are not tested.
3
3264A–SEEPR–01/02
AC Characteristics
Applicable over recommended operating range from TA = -40°C to + 125°C, VCC = As Specified,
CL = 1 TTL Gate and 100 pF (unless otherwise noted).
Symbol
Parameter
Test Condition
fSK
SK Clock
Frequency
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
0
0
tSKH
SK High Time
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
250
250
ns
tSKL
SK Low Time
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
250
250
ns
tCS
Minimum CS
Low Time
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
250
250
ns
tCSS
CS Setup Time
Relative to SK
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
50
50
ns
tDIS
DI Setup Time
Relative to SK
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
100
100
ns
tCSH
CS Hold Time
Relative to SK
0
ns
tDIH
DI Hold Time
Relative to SK
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
100
100
ns
tPD1
Output Delay to ‘1’
AC Test
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
250
500
ns
tPD0
Output Delay to ‘0’
AC Test
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
250
500
ns
tSV
CS to Status Valid
AC Test
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
250
250
ns
tDF
CS to DO in High
Impedance
AC Test
CS = VIL
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
100
100
ns
10
ms
tWP
Write Cycle Time
Endurance
Note:
4
(1)
Min
2.7V ≤ VCC ≤ 5.5V
5.0V, 25°C, Page Mode
Typ
3
1M
Max
Units
2
1
MHz
ms
Write Cycles
1. This parameter is characterized and is not 100% tested.
AT93C46/56/66
3264A–SEEPR–01/02
AT93C46/56/66
Instruction Set for the AT93C46
Address
Data
SB
Op
Code
x8
x 16
READ
1
10
A6 - A0
A5 - A0
EWEN
1
00
11XXXXX
11XXXX
Write enable must precede all
programming modes.
ERASE
1
11
A6 - A0
A5 - A0
Erase memory location A n - A0.
WRITE
1
01
A6 - A0
A5 - A0
ERAL
1
00
10XXXXX
10XXXX
WRAL
1
00
01XXXXX
01XXXX
EWDS
1
00
00XXXXX
00XXXX
Instruction
Note:
x8
x 16
Comments
Reads data stored in memory, at
specified address.
D7 - D 0
D15 - D0
Writes memory location An - A0.
Erases all memory locations. Valid
only at VCC = 4.5V to 5.5V.
D7 - D 0
D15 - D0
Writes all memory locations. Valid
only at VCC = 4.5V to 5.5V.
Disables all programming instructions.
The X’s in the address field represent don’t care values and must be clocked.
5
3264A–SEEPR–01/02
Functional
Description
The AT93C46/56/66 is accessed via a simple and versatile 3-wire serial communication
interface. Device operation is controlled by seven instructions issued by the host processor. A valid instruction starts with a rising edge of CS and consists of a Start Bit
(logic “1”) followed by the appropriate Op Code and the desired memory Address
location.
READ (READ): The Read (READ) instruction contains the Address code for the memory location to be read. After the instruction and address are decoded, data from the
selected memory location is available at the serial output pin DO. Output data changes
are synchronized with the rising edges of serial clock SK. It should be noted that a
dummy bit (logic “0”) precedes the 8- or 16-bit data output string.
ERASE/WRITE (EWEN): To assure data integrity, the part automatically goes into the
Erase/Write Disable (EWDS) state when power is first applied. An Erase/Write Enable
(EWEN) instruction must be executed first before any programming instructions can be
carried out. Please note that once in the Erase/Write Enable state, programming
remains enabled until an Erase/Write Disable (EWDS) instruction is executed or VCC
power is removed from the part.
ERASE (ERASE): The Erase (ERASE) instruction programs all bits in the specified
memory location to the logical “1” state. The self-timed erase cycle starts once the
ERASE instruction and address are decoded. The DO pin outputs the READY/BUSY
status of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS).
A logic “1” at pin DO indicates that the selected memory location has been erased, and
the part is ready for another instruction.
WRITE (WRITE): The Write (WRITE) instruction contains the 8 or 16 bits of data to be
written into the specified memory location. The self-timed programming cycle, tWP, starts
after the last bit of data is received at serial data input pin DI. The DO pin outputs the
READY/BUSY status of the part if CS is brought high after being kept low for a minimum
of 250 ns (tCS). A logic “0” at DO indicates that programming is still in progress. A logic
“1” indicates that the memory location at the specified address has been written with the
data pattern contained in the instruction and the part is ready for further instructions. A
READY/BUSY status cannot be obtained if the CS is brought high after the end of
the self-timed programming cycle, tWP.
ERASE ALL (ERAL): The Erase All (ERAL) instruction programs every bit in the memory array to the logic “1” state and is primarily used for testing purposes. The DO pin
outputs the READY/BUSY status of the part if CS is brought high after being kept low for
a minimum of 250 ns (tCS). The ERAL instruction is valid only at VCC = 5.0V ± 10%.
WRITE ALL (WRAL): The Write All (WRAL) instruction programs all memory locations
with the data patterns specified in the instruction. The DO pin outputs the READY/BUSY
status of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS).
The WRAL instruction is valid only at VCC = 5.0V ± 10%.
ERASE/WRITE DISABLE (EWDS): To protect against accidental data disturb, the
Erase/Write Disable (EWDS) instruction disables all programming modes and should be
executed after all programming operations. The operation of the READ instruction is
independent of both the EWEN and EWDS instructions and can be executed at any
time.
6
AT93C46/56/66
3264A–SEEPR–01/02
AT93C46/56/66
Timing Diagrams
Synchronous Data Timing
Note:
1. This is the minimum SK period.
Organization Key for Timing Diagrams
AT93C46 (1K)
I/O
Notes:
x8
AT93C56 (2K)
x 16
AN
A6
A5
DN
D7
D15
x8
A8
(1)
D7
AT93C66 (4K)
x 16
x8
x 16
(2)
A8
A7
D7
D15
A7
D15
1. A8 is a DON’T CARE value, but the extra clock is required.
2. A7 is a DON’T CARE value, but the extra clock is required.
READ Timing
7
3264A–SEEPR–01/02
EWEN Timing
tCS
CS
SK
DI
1
0
0
1
...
1
EWDS Timing
tCS
CS
SK
DI
1
0
0
0
...
0
WRITE Timing
tCS
CS
SK
DI
DO
1
0
1
AN
...
A0
DN
...
D0
HIGH IMPEDANCE
BUSY
READY
tWP
WRAL Timing(1)
tCS
CS
SK
DI
DO
1
0
0
0
1
...
DN
...
D0
BUSY
HIGH IMPEDANCE
READY
tWP
Note:
8
1. Valid only at VCC = 4.5V to 5.5V.
AT93C46/56/66
3264A–SEEPR–01/02
AT93C46/56/66
ERASE Timing
tCS
CS
STANDBY
CHECK
STATUS
SK
DI
1
1
1
AN
AN-1 AN-2
...
A0
tDF
tSV
DO
HIGH IMPEDANCE
HIGH IMPEDANCE
BUSY
READY
tWP
ERAL Timing(1)
tCS
CS
CHECK
STATUS
STANDBY
tSV
tDF
SK
DI
DO
1
0
0
1
0
BUSY
HIGH IMPEDANCE
HIGH IMPEDANCE
READY
tWP
Note:
1. Valid only at VCC = 4.5V to 5.5V.
9
3264A–SEEPR–01/02
AT93C46 Ordering Information
tWP (max)
(ms)
ICC (max)
(µA)
ISB (max)
(µA)
fMAX
(kHz)
Ordering Code
Package
10
2000
30.0
2000
AT93C46-10PA-5.0C
AT93C46-10SA-5.0C
8P3
8S1
Automotive
(-40°C to 125°C)
10
800
10.0
1000
AT93C46-10PA-2.7C
AT93C46-10SA-2.7C
8P3
8S1
Automotive
(-40°C to 125°C)
Operation Range
Package Type
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
Options
-5.0
Standard Operation (4.5V to 5.5V)
-2.7
Low Voltage (2.7V to 5.5V)
10
AT93C46/56/66
3264A–SEEPR–01/02
AT93C46/56/66
AT93C56 Ordering Information
tWP (max)
(ms)
ICC (max)
(µA)
ISB (max)
(µA)
fMAX
(kHz)
Ordering Code
Package
10
2000
30.0
2000
AT93C56-10PA-5.0C
AT93C56-10SA-5.0C
8P3
8S1
Automotive
(-40°C to 125°C)
10
800
10.0
1000
AT93C56-10PA-2.7C
AT93C56-10SA-2.7C
8P3
8S1
Automotive
(-40°C to 125°C)
Operation Range
Package Type
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
Options
-5.0
Standard Operation (4.5V to 5.5V)
-2.7
Low Voltage (2.7V to 5.5V)
11
3264A–SEEPR–01/02
AT93C66 Ordering Information
tWP (max)
(ms)
ICC (max)
(µA)
ISB (max)
(µA)
fMAX
(kHz)
Ordering Code
Package
10
2000
30.0
2000
AT93C66-10PA-5.0C
AT93C66-10SA-5.0C
8P3
8S1
Automotive
(-40°C to 125°C)
10
800
10.0
1000
AT93C66-10PA-2.7C
AT93C66-10SA-2.7C
8P3
8S1
Automotive
(-40°C to 125°C)
Operation Range
Package Type
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
Options
-5.0
Standard Operation (4.5V to 5.5V)
-2.7
Low Voltage (2.7V to 5.5V)
12
AT93C46/56/66
3264A–SEEPR–01/02
AT93C46/56/66
Packaging Information
8P3 – PDIP
D
PIN
1
E1
A
B1
SEATING PLANE
A1
L
B
B2
e
(4 PLACES)
E
COMMON DIMENSIONS
(Unit of Measure = mm)
C
eC
SYMBOL
eB
Notes:
1. This package conforms to JEDEC reference MS-001 BA.
2. Dimensions D and E1 do not include mold Flash or Protrusion.
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
R
NOM
MAX
A
–
–
4.318
A1
0.381
–
–
D
9.144
–
9.652
E
7.620
–
8.255
E1
6.096
–
6.604
B
0.406
–
0.508
B1
1.397
–
1.651
B2
0.762
–
1.143
L
3.175
–
3.429
C
0.203
–
0.356
eB
–
–
10.922
eC
0.000
–
1.524
e
TITLE
2325 Orchard Parkway
8P3, 8-lead (0.300"/7.62 mm Wide) Plastic Dual
San Jose, CA 95131
Inline Package (PDIP)
MIN
NOTE
Note 2
Note 2
2.540 TYP
09/28/01
DRAWING NO. REV.
8P3
B
13
3264A–SEEPR–01/02
8S2 – JEDEC SOIC
3
2
1
H
N
Top View
e
B
A
D
COMMON DIMENSIONS
(Unit of Measure = mm)
Side View
A2
C
L
SYMBOL
MIN
NOM
MAX
A
–
–
1.75
B
–
–
0.51
C
–
–
0.25
D
–
–
5.00
E
–
–
4.00
e
E
End View
NOTE
1.27 BSC
H
–
–
6.20
L
–
–
1.27
Note: This drawing is for general information only. Refer to JEDEC Drawing MS-012 for proper dimensions, tolerances, datums, etc.
10/10/01
R
14
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
DRAWING NO.
REV.
8S1
A
AT93C46/56/66
3264A–SEEPR–01/02
Atmel Headquarters
Atmel Operations
Corporate Headquarters
Memory
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© Atmel Corporation 2002.
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Printed on recycled paper.
3264A–SEEPR–01/02
0M