ETC UC1706J

application
INFO
available
UC1706
UC2706
UC3706
Dual Output Driver
FEATURES
DESCRIPTION
•
Dual, 1.5A Totem Pole Outputs
•
40nsec Rise and Fall into 1000pF
•
Parallel or Push-Pull Operation
The UC1706 family of output drivers are made with a high-speed
Schottky process to interface between low-level control functions and
high-power switching devices - particularly power MOSFET's. These devices implement three generalized functions as outlined below.
•
Single-Ended to Push-Pull Conversion
•
High-Speed, Power MOSFET
Compatible
•
Low Cross-Conduction Current Spike
•
Analog, Latched Shutdown
•
Internal Deadband Inhibit Circuit
•
Low Quiescent Current
•
5 to 40V Operation
•
Thermal Shutdown Protection
•
16-Pin Dual-In-Line Package
These devices are available in a two-watt plastic “bat-wing” DIP for operation over a 0°C to 70°C temperature range and, with reduced power,
in a hermetically sealed cerdip for -55°C to +125°C operation. Also available in surface mount Q and L packages.
•
20-Pin Surface Mount Package
TRUTH TABLE
First: They accept a single-ended, low-current digital input of either polarity and process it to activate a pair of high-current, totem pole outputs
which can source or sink up to 1.5A each.
Second: They provide an optional single-ended to push-pull conversion
through the use of an internal flip-flop driven by double-pulsesuppression logic. With the flip-flop disabled, the outputs work in parallel
for 3.0A capability.
Third: Protection functions are also included for pulse-by-pulse current
limiting, automatic deadband control, and thermal shutdown.
INV
H
L
H
L
BLOCK DIAGRAM
SLUS200A - OCTOBER 1998 - REVISED APRIL 2001
N.I
H
H
L
L
OUT
L
H
L
L
OUT = INV and N.I.
OUT = INV or N.I.
UC1706
UC2706
UC3706
ABSOLUTE MAXIMUM RATINGS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . N--Pkg . . . . . . . . . . . . . . . J--Pkg
Supply Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . 40V
Collector Supply Voltage, VC . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . 40V
Output Current (Each Output, Source or Sink)
Steady--State . . . . . . . . . . . . . . . . . . . . . . . . . . ±500mA. . . . . . . . . . . . . . . ±500mA
Peak Transient . . . . . . . . . . . . . . . . . . . . . . . . . . ±1.5A. . . . . . . . . . . . . . . . . ±1.0A
Capacitive Discharge Energy . . . . . . . . . . . . . . . 20µJ
. . . . . . . . . . . . . . . . . . . 15µJ
Digital Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V . . . . . . . . . . . . . . . . . 5.5V
Analog Stop Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . VIN
. . . . . . . . . . . . . . . . . . . . VIN
Power Dissipation at TA = 25°C (See Note) . . . . . . . 2W . . . . . . . . . . . . . . . . . . 1W
Power Dissipation at T (Leads/Case) = 25°C . . . . . . 5W . . . . . . . . . . . . . . . . . . . 2
(See Note)
Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . --55°C to +125°C
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . --65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . . . . . . . 300°C
Note: All voltages are with respect to the four ground pins which must be connected
together. All currents are positive into, negative out of the specified trerminal. Consult
Packaging sections of the Databook for thermal limitations and considerations of package.
CONNECTION DIAGRAMS
DIL-16, SOIC-16 (TOP VIEW)
J or N Package, DW Package
PLCC-20, LCC-20 (TOP VIEW)
Q, L Packages
N/C
B INHIBIT
1
16
A INHIBIT
INV. INPUT
2
15
INHIBIT REF
N.I. INPUT
3
14
VIN
GROUND
4
13
GROUND
GROUND
5
12
GROUND
6
A OUTPUT
11
B INHIBIT
INV INPUT
A INHIBIT
INHIBIT REF
3
B OUTPUT
7
VC
8
10
9
STOP NON-INV.
1
20 19
N.I.INPUT
4
18
VIN
GROUND
5
17
GROUND
N/C
6
16
N/C
GROUND
7
15
GROUND
A OUTPUT
8
14
B OUTPUT
9
FLIP/FLOP
2
10 11 12 13
FLIP/FLOP
STOP INV.
STOP NON-INV.
VC
STOP INV.
N/C
Note: All four ground pins must be connected to a common
ground.
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA = –55°C to +125°C for
the UC1706, –25°C to +85°C for the UC2706 and 0°C to +70°C for the UC3706; VIN = VC = 20V. TA = TJ.
PARAMETERS
TEST CONDITIONS
VIN Supply Current
VIN = 40V
VC Supply Current
VC = 40V, Outputs Low
VC Leakage Current
VIN = 0, VC = 30V, No Load
MIN
TYP
MAX
UNITS
8
10
mA
4
5
mA
.05
0.1
mA
0.8
V
Digital Input Low Level
Digital Input High Level
2.2
V
Input Current
VI = 0
–0.6
–1.0
mA
Input Leakage
VI = 5V
.05
0.1
mA
2
UC1706
UC2706
UC3706
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA = –55°C to +125°C for
the UC1706, –25°C to +85°C for the UC2706 and 0°C to +70°C for the UC3706; VIN = VC = 20V. TA = TJ.
PARAMETERS
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Output High Sat., VC-VO
IO = -50mA
2.0
V
Output Low Sat., VO
IO = 50mA
0.4
V
IO = 500mA
2.5
V
Inhibit Threshold
VREF = 0.5V
0.4
0.6
V
VREF = 3.5V
3.3
3.7
V
Inhibit Input Current
VREF = 0
Analog Threshold
VCM = 0 to 15V, for the UC2706 and UC3706
100
VCM = 0 to 15V, for the UC1706
80
Input Bias Current
VCM = 0
Thermal Shutdown
–10
–20
µA
130
160
mV
130
160
mV
–10
–20
µA
155
°C
TYPICAL SWITCHING CHARACTERISTICS: VIN = VC = 20V, TA = 25°C. Delays measured to 10% output change.
PARAMETERS
TEST CONDITIONS
OUTPUT CL =
UNITS
open
1.0
2.2
Rise Time Delay
110
130
140
ns
10% to 90% Rise
20
40
60
ns
Fall Time Delay
80
90
110
ns
90% to 10% Fall
25
30
50
ns
120
130
140
ns
From Inv. Input to Output:
nF
From N. I. Input to Output:
Rise Time Delay
10% to 90% Rise
20
40
60
ns
Fall Time Delay
100
120
130
ns
90% to 10% Fall
25
30
50
ns
VC Cross-Conduction Current Spike Duration Output Rise
25
ns
0
ns
Inhibit Delay
Output Fall
Inhibit Ref. = 1V, Inhibit Inv. = 0.5 to 1.5V
250
ns
Analog Shutdown Delay
Stop Non-Inv. = 0V, Stop Inv. = 0 to 0.5V
180
ns
CIRCUIT DESCRIPTION
Outputs
The totem-pole outputs have been designed to minimize
cross-conduction current spikes while maximizing fast,
high-current rise and fall times. Current limiting can be
done externally either at the outputs or at the common
VC pin. The output diodes included have slow recovery
and should be shunted with high-speed external diodes
when driving high-frequency inductive loads.
Flip/Flop
Grounding pin 7 activates the internal flip-flop to alternate the two outputs. With pin 7 open, the two outputs
operate simultaneously and can be paralleled for higher
current operation. Since the flip-flop is triggered by the
digital input, an off-time of at last 200nsec must be provided to allow the flip/flop to change states. Note that the
circuit logic is configured such that the “OFF” state is defined as the outputs low.
Digital Inputs
With both an inverting and non-inverting input available,
either active-high or active-low signals may be accepted.
These are true TTL compatible inputs—the threshold is
approximately 1.2V with no hysteresis; and external pullup resistors are not required.
Inhibit Circuit
Although it may have other uses, this circuit is included to
eliminate the need for deadband control when driving
relatively slow bipolar power transistors. A diode from
each inhibit input to the opposite power switch collector
will keep one output from turning-on until the other has
turned-off. The threshold is determined by the voltage on
pin 15 which can be set from 0.5 to 3.5V. When this circuit is not used, ground pin 15 and leave 1 and 16 open.
3
UC1706
UC2706
UC3706
CIRCUIT DESCRIPTION (cont.)
use with a 7 to 40V supply; however, with some slight response time degradation, it can also be driven from 5V.
When VIN is low, the entire circuit is disabled and no current is drawn from VC. When combined with a UC1840
PWM, the Driver Bias switch can be used to supply VIN to
the UC1706. VIN switching should be fast as if VC is
high, undefined operation of the outputs may occur with
VIN less than 5V.
Analog Shutdown
This circuit is included to get a latched shutdown as close
to the outputs as possible, from a time standpoint. With
an internal 130mV threshold, this comparator has a
common-mode range from ground to (VIN – 3V). When
not used, both inputs should be grounded. The time required for this circuit to latch is inversely proportional to
the amount of overdrive but reaches a minimum of
180nsec. As with the flip-flop, an input off-time of at least
200nsec is required to reset the latch between pulses.
Thermal Considerations
Should the chip temperature reach approximately 155°C,
a parallel, non--inverting input is activated driving both
outputs to the low state.
Supply Voltage
With an internal 5V regulator, this circuit is optimized for
APPLICATIONS
D1, D2; UC3611 Schottky Diodes
D1, D2; UC3611 Schottky Diodes
Power MOSFET Drive Circuit
Power MOSFET Drive Circuit Using Negative Bias Voltage and
Level Shifting to Ground Referenced PWMs
D1, D2: UC3611 Schottky Diodes
Transformer Coupled MOSFET Drive Circuit
4
Charge Pump Circuits
UC1706
UC2706
UC3706
APPLICATIONS (cont'd)
D1, D2: UC3611 Schottky Diodes
D1, D2: UC3611 Schottky Diodes
Power Bipolar Drive Circuit
Transformer Coupled Push-Pull MOSFET Drive Circuit
UC3706 Converts Single Output PWMs to High Current Push-Pull Configuration
UNITRODE CORPORATION
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054
TEL. (603) 424-2410 • FAX (603) 424-3460
5
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pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its products to the specifications applicable at the time of sale in accordance with
TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary
to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except
those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
products or services might be or are used. TI’s publication of information regarding any third party’s products
or services does not constitute TI’s approval, license, warranty or endorsement thereof.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
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service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Resale of TI’s products or services with statements different from or beyond the parameters stated by TI for
that product or service voids all express and any implied warranties for the associated TI product or service,
is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Also see: Standard Terms and Conditions of Sale for Semiconductor Products. www.ti.com/sc/docs/stdterms.htm
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright  2001, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its products to the specifications applicable at the time of sale in accordance with
TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary
to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except
those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
products or services might be or are used. TI’s publication of information regarding any third party’s products
or services does not constitute TI’s approval, license, warranty or endorsement thereof.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations and notices. Representation
or reproduction of this information with alteration voids all warranties provided for an associated TI product or
service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Resale of TI’s products or services with statements different from or beyond the parameters stated by TI for
that product or service voids all express and any implied warranties for the associated TI product or service,
is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Also see: Standard Terms and Conditions of Sale for Semiconductor Products. www.ti.com/sc/docs/stdterms.htm
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright  2001, Texas Instruments Incorporated