REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHEET REV SHEET 15 16 17 18 REV STATUS REV OF SHEETS SHEET PMIC N/A PREPARED BY Steve L. Duncan STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A 1 2 3 4 5 7 8 9 10 11 12 13 MICROCIRCUIT, HYBRID, MEMORY, DIGITAL, FLASH EPROM, 2M X 16-BIT DRAWING APPROVAL DATE 00-07-18 REVISION LEVEL 14 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 CHECKED BY Michael C. Jones APPROVED BY Raymond Monnin 6 SIZE A SHEET CAGE CODE 5962-97610 67268 1 OF DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 18 5962-E043-00 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes, class D (lowest reliability), class E, (exceptions), class G (lowered high reliability), class H (high reliability), and class K, (highest reliability) and a choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 Federal stock class designator \ RHA designator (see 1.2.1) 97610 01 Device type (see 1.2.2) H Device class designator (see 1.2.3) / X Case outline (see 1.2.4) X Lead finish (see 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 02 03 Generic number Circuit function WMF2M16-150 WMF2M16-120 WMF2M16-90 Access time FLASH EPROM, 2M x 16-bit FLASH EPROM, 2M x 16-bit FLASH EPROM, 2M x 16-bit 150 ns 120 ns 90 ns 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level as follows: Device class Device performance documentation D, E, G, H, or K Certification and qualification to MIL-PRF-38534 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Descriptive designator See figure 1 Terminals Package style 56 Ceramic flatpack, lead formed 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 2 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) 2/ ......................................................... Signal voltage range (any pin except A9) 2/ ..................................... Power dissipation (PD)..................................................................... Storage temperature range .............................................................. Lead temperature (soldering, 10 seconds) ....................................... Data retention.................................................................................. Endurance (write/erase cycles) ........................................................ RESET, OE, and A9 voltage for auto select and sector protect (VID): ....................................................................................................... -2.0 V dc to +7.0 V dc -2.0 V dc to +7.0 V dc 0.33 W maximum at 5 MHz -65°C to +150°C +300°C 10 years minimum 10,000 cycles minimum -2.0 V dc to +12.5 V dc 3/ 1.4 Recommended operating conditions. Supply voltage range (VCC) .............................................................. Input low voltage range (VIL) ............................................................ Input high voltage range (VIH) .......................................................... Case operating temperature range (TC)............................................ RESET, OE, and A9 voltage for auto select and sector protect (VID): ....................................................................................................... +4.5 V dc to +5.5 V dc -0.5 V dc to +0.8 V dc +2.0 V dc to VCC + 0.5 V dc -55°C to +125°C +11.5 V dc to +12.5 V dc 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Microcircuit Case Outlines. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Minimum DC voltage in input or I/O pins is –0.5 V dc. During voltage transitions, inputs may overshoot VSS to –2.0 V dc for periods up to 20 ns. Maximum DC voltage on output and I/O pins VCC +0.5 V dc. During voltage transitions, outputs may overshoot to VCC +2.0 V dc for periods up to 20 ns. 3/ Minimum DC input voltage on RESET, OE, and A9 is –0.5 V dc. During voltage transitions, RESET, OE, and A9 may overshoot VSS to –2.0 V dc for periods up to 20 ns. Maximum DC input voltage on A9 is +13.5 V which may overshoot to +14.0 V dc for periods up to 20 ns. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 3 HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's). MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534). Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3. 3.2.4 Timing diagrams. The timing diagram(s) shall be specified on figures 4, 5, and 6. 3.2.5 Block diagram. The block diagram shall be as specified on figure 7. 3.2.6 Output load circuit. The output load circuit shall be as specified on figure 8. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available upon request. 3.6 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 4 3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 3.10 Endurance. A reprogrammability test shall be completed as part of the vendor’s reliability monitors. This reprogrammability test shall be done for the intial characterization and after any design process changes which may affect the reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of program/erase cycles listed in section 1.3 herein over the full military temperature range. The vendors procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity. 3.11 Data retention. A data retention stress test shall be completed as part of the vendor’s reliabilty monitors. This test shall be done for the intial characterization and after any design or process change which may affect data retention. The methods and procedures may be vendor specific, but shall gurantee the number of years listed in section 1.3 herein over the full military temperature range. The vendor’s procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 5 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ Group A subgroups -55°C ≤ TC ≤+125°C unless otherwise specified Device type Limits Min Unit Max DC parameters Input leakage current ILI VCC = 5.5 V dc, VIN = GND to VCC 1,2,3 All 10 µA Output leakage current ILO VCC = 5.5 V dc, VIN = GND to VCC 1,2,3 All 10 µA VCC active current for read ICC1 CS = VIL, OE = VIH, f = 5 MHz, VCC = 5.5 V dc 1,2,3 All 80 mA VCC active current for Program or erase 3/ ICC2 CS = VIL, OE = VIH, VCC = 5.5 V dc 1,2,3 All 120 mA VCC standby current ICC3 VCC = 5.5 V dc, CS = VIH, f = 5 MHz, RESET = VCC ± 0.3 V 1,2,3 All 0.50 mA Input low level 3/ VIL 1,2,3 All -0.5 0.8 V Input high level 3/ VIH 1,2,3 All 2.0 VCC + 0.5 V V Output low voltage VOL VCC = 4.5 V dc, IOL = 12.0 mA 1,2,3 All 0.45 V Output high voltage VOH VCC = 4.5 V dc, IOH = -2.5 mA 1,2,3 All 0.85 x VCC Low VCC , lockout voltage VLKO 1,2,3 All 3.2 V 4.2 V Dynamic characteristics Address capacitance 3/ CAD VIN = 0 V dc, f = 1.0 MHz, TA = +25°C 4 All 25 pF Output enable Capacitance COE VIN = 0 V dc, f = 1.0 MHz, TA = +25°C 4 All 25 pF 3/ See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ Group A subgroups -55°C ≤ TC ≤+125°C unless otherwise specified Device type Limits Min Unit Max Dynamic characterisitics - continued Write enable 3/ Capacitance CWE VIN = 0 V dc, f = 1.0 MHz, TA = +25°C 4 All 25 pF Chip select capacitance 3/ CCS VIN = 0 V dc, f = 1.0 MHz, TA = +25°C 4 All 15 pF Data I/O capacitance 3/ CI/O VIN = 0 V dc, f = 1.0 MHz, TA = +25°C 4 All 15 pF See 4.3.1c 7,8A,8B All Functional testing Functional tests Read cycle AC timing characteristics Read cycle time 3/ tRC See figure 4 9,10,11 01 02 03 Address access time tACC See figure 4 9,10,11 01 02 03 150 120 90 ns Chip select access time tCE See figure 4 9,10,11 01 02 03 150 120 90 ns Output enable to output valid tOE See figure 4 9,10,11 01 02 03 55 50 40 ns Output hold from address, CS or OE change, 3/ Whichever is first tOH See figure 4 9,10,11 All 150 120 90 ns 0 ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ Group A subgroups -55°C ≤ TC ≤ +125°C unless otherwise specified Device type Limits Min Unit Max Write/Erase/ Program AC timing characteristics WE controlled Write cycle time 3/ tWC See figure 5 9,10,11 01 02 03 150 120 90 ns Chip select setup time tCS See figure 5 9,10,11 All 0 ns Write enable pulse width tWP See figure 5 9,10,11 01,02 50 ns 03 45 0 ns ns Address setup time tAS See figure 5 9,10,11 All Data setup time tDS See figure 5 9,10,11 01,02 50 03 45 Data hold time tDH See figure 5 9,10,11 All 0 ns Address hold time tAH See figure 5 9,10,11 01,02 50 ns 03 45 9,10,11 All 20 ns Write enable pulse width 3/ High tWPH See figure 5 Write/Erase/Program AC timing characteristics CS controlled Write cycle time 3/ tWC See figure 6 9,10,11 01 02 03 150 120 90 ns Write enable setup time tWS See figure 6 9,10,11 All 0 ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 8 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ Group A subgroups -55°C ≤ TC ≤ +125°C unless otherwise specified Device type Limits Min Unit Max Write/Erase/ Program AC timing characteristics CS controlled - continued Chip select pulse width tCP See figure 6 9,10,11 01,02 50 03 45 ns Address setup time tAS See figure 6 9,10,11 All 0 ns Data hold time tDH See figure 6 9,10,11 All 0 ns Data setup time tDS See figure 6 9,10,11 01,02 50 ns 03 45 01,02 50 03 45 All 20 Address hold time Chip select pulse width 3/ High tAH tCPH See figure 6 9,10,11 See figure 6 9,10,11 ns ns 1/ Unless otherwise specified, 4.5 V dc ≤ VCC ≤ 5.5 V dc and VSS = 0 V. 2/ Unless otherwise specified, the DC test conditions are as follows: Input pulse levels: VIH = VCC - 0.3 V and VIL = 0.3 V. Unless otherwise specified, the AC test conditions are as follows: Input pulse levels: VIL = 0 V and VIH = 3.0 V. Input rise and fall times: 5 nanoseconds. Input and output timing reference levels: 1.5 V. 3/ Parameters shall be tested as part of device characterization and after design and process changes. Parameters shall be guaranteed to the limits specified in table I for all lots not specifically tested. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 9 FIGURE 1. Case outline. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 10 Symbol Millimeters Min Inches Max A Min Max 4.06 .160 A2 0.38 0.64 .033 .047 B 0.20 0.30 .008 .012 c 0.13 0.23 .006 .010 C1 0° -4° 0° -4° C2 D 0.51 TYP 23.37 D2 .020 TYP 23.88 .920 21.59 TYP .940 .850 TYP E 12.80 13.11 .504 .516 E1 16.00 16.26 .630 .640 e 0.80 TYP .315 TYP L 1.58 TYP .063 TYP R 0.18 TYP .007 TYP NOTES: 1. The U.S preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. FIGURE 1. Case outline(s) – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 11 Device Types All Device types All Device Types All Device types All Case Outline X Case outline X Case Outline X Case outline X Terminal number Terminal Symbol Terminal number Terminal Symbol Terminal Number Terminal Symbol Terminal number Terminal Symbol 1 CS 17 I/O14 33 I/O2 49 A3 2 A12 18 I/O7 34 NC 50 A2 3 A13 19 I/O15 35 NC 51 A1 4 A14 20 RY/BY 36 NC 52 A9 5 A15 21 OE 37 A0 53 A10 6 NC 22 WE 38 I/O0 54 A11 7 CS2 23 NC 39 I/O8 55 RESET 8 NC 24 I/O13 40 I/O1 56 NC 9 A20 25 I/O5 41 I/O9 10 A19 26 I/O12 42 VCC 11 A18 27 I/O4 43 A8 12 A17 28 VCC 44 GND 13 A16 29 GND 45 A7 14 VCC 30 I/O11 46 A6 15 GND 31 I/O3 47 A5 16 I/O6 32 I/O10 48 A4 NOTE: NC is a no connection FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 12 CS OE WE I/O MODE VIL VIL VIH DOUT Read VIL VIH VIL DIN Write VIH X X High Z Standby VIL VIH VIH High Z Output disable NOTES: 1. VIH = High logic level 2. VIL = Low logic level 3. X = Do not care (either high or low) 4. High Z = High impedance state FIGURE 3. Truth table. FIGURE 4. Read cycle timing diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 13 FIGURE 5. Write cycle timing diagram, WE controlled. FIGURE 6. Write cycle timing diagram, CS controlled. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 14 FIGURE 7. Block diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 15 Parameter Typ. Unit Input pulse level VIL = 0 V, VIH = 3.0 V V Input rise and fall 5 ns Input and output reference level 1.5 V Timing reference level 1.5 V NOTES: 1. VZ is programmable from +2 V to +7 V. 2. IOL and IOH are programmable from 0 to 16 mA. 3. Tester impedance is Z0 = 75 ohms. 4. VZ is typically the midpoint of VOL and VOH. 5. IOL and IOH are adjusted to simulate a typical resistive load circuit. 6. ATE tester includes jig capacitance. FIGURE 8. Output load circuit. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 16 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1,4,7,9 Final electrical parameters 1*, 2,3,4,7,8A,8B,9,10,11 Group A test requirements 1,2,3,4,7,8A,8B,9,10,11 Group C end-point electrical parameters 1,2,3,4,7,8A,8B,9,10,11 End-point electrical parameters for Radiation Hardness Assurance (RHA) devices Not applicable * PDA applies to subgroup 1. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) (2) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. TA as specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table on figure 3. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 17 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614) 692-0512. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK103 and QML-38534 have submitted a certificate of compliance (see 3.8 herein) to DSCC-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-97610 A REVISION LEVEL SHEET 18 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 00-07-18 Approved sources of supply for SMD 5962-97610 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. 1/ 2/ Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 5962-9761001HXA 5962-9761001HXC 54230 54230 WMF2M16-150DAQ5 WMF2M16-150DAQ5 5962-9761002HXA 5962-9761002HXC 54230 54230 WMF2M16-120DAQ5 WMF2M16-120DAQ5 5962-9761003HXA 5962-9761003HXC 54230 54230 WMF2M16-90DAQ5 WMF2M16-90DAQ5 The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE Number 54230 Vendor name and address White Electronic Designs Corporation 3601 East University Drive. Phoenix, AZ 85034 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.