ETC HM511667CTT-6

HM511667C Series
1M EDO DRAM (64-kword × 16-bit)
256 refresh
ADE-203-625A (Z)
Rev. 1.0
Dec. 20, 1997
Description
The Hitachi HM511667C Series is a CMOS dynamic RAM organized 65,536-word × 16-bit. HM511667C
Series has realized higher density, higher performance and various functions by employing 0.8 µm CMOS
process technology and some new CMOS circuit design technologies. The HM511667C Series offers
Extended Data Out (EDO) Page Mode as a high speed access mode. Multiplexed address input permits the
HM511667C to be packaged in standard 400-mil 40-pin plastic SOJ and standard 400-mil 44-pin plastic
TSOPII.
Features
• Single 5 V supply: 5 V ± 10%
• Access time: 60/70/80 ns (max)
• Power dissipation
 Active mode: 660/633/495 mW (max)
 Standby mode: 11 mW (max)
• EDO page mode capability
• Refresh cycles
 256 refresh cycles : 4 ms
• 2 variations of refresh
 RAS-only refresh
 CAS-before-RAS refresh
• 2WE-byte control
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HM511667C Series
Ordering Information
Type No.
Access time
Package
HM511667CJ-6
HM511667CJ-7
HM511667CJ-8
60 ns
70 ns
80 ns
400-mil 40-pin plastic SOJ (CP-40D)
HM511667CTT-6
HM511667CTT-7
HM511667CTT-8
60 ns
70 ns
80 ns
400-mil 44-pin plastic TSOPII (TTP-44/40DA)
Pin Arrangement
HM511667CJ Series
VCC
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
I/O8
NC
VCC
UWE
LWE
RAS
A0
A1
A2
A3
A4
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
(Top view)
2
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VSS
I/O16
I/O15
I/O14
I/O13
I/O12
I/O11
I/O10
I/O9
NC
VSS
CAS
OE
NC
NC
NC
A7
A6
A5
VSS
HM511667CTT Series
VCC
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
I/O8
NC
1
2
3
4
5
6
7
8
9
10
44
43
42
41
40
39
38
37
36
35
VSS
I/O16
I/O15
I/O14
I/O13
I/O12
I/O11
I/O10
I/O9
NC
VCC
UWE
LWE
RAS
A0
A1
A2
A3
A4
VCC
13
14
15
16
17
18
19
20
21
22
32
31
30
29
28
27
26
25
24
23
VSS
CAS
OE
NC
NC
NC
A7
A6
A5
VSS
(Top view)
HM511667C Series
Pin Description
Pin name
Function
A0 to A7
Address input
•
Row address A0 to A7
•
Refresh address
A0 to A7
•
Column address
A0 to A7
I/O1 to I/O16
Data-in/data-out
RAS
Row address strobe
CAS
Column address strobe
UWE, LWE
Read/write enable
OE
Output enable
VCC
Power supply
V SS
Ground
NC
No connection
Block Diagram
RAS
CAS
UWE
LWE
OE
Timing and control
Column decoder
A0
Column
A1
to
•
•
•
address
buffers
•
•
•
Row
address
buffers
Row decoder
A7
64k array
64k array
64k array
64k array
64k array
64k array
64k array
64k array
64k array
64k array
64k array
64k array
64k array
64k array
64k array
64k array
I/O buffers
I/O1
to
I/O16
3
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HM511667C Series
Operation Table
The HM511667C series has the following 10 operation modes.
1. Read cycle
2. Early write cycle
3. Delayed write cycle
4. Read-modify-write cycle
5. RAS-only refresh cycle
6. CAS-before-RAS refresh cycle
7. EDO page mode read cycle
8. EDO page mode early write cycle
9. EDO page mode delayed write cycle
10. EDO page mode read-modify-write cycle
Inputs
RAS
CAS
UWE
LWE
Output
Operation
H
H
D
D
Open
Standby
H
L
H
H
Valid
Standby
L
L
H
H
L
L
L
*2
*2
Valid
Read cycle
*2
Open
Early write cycle
L
*2
Undefined
Delayed write cycle
L
L
L
L
L
L
H to L
H to L
Valid
Read-modify-write cycle
L
H
D
D
Open
RAS-only refresh cycle
H to L
L
D
D
Open
CAS-before-RAS refresh cycle
L
H to L
H
H
L
H to L
L
*2
*2
L
H to L
L
L
H to L
H to L
Valid
EDO page mode read cycle
*2
Open
EDO page mode early write cycle
L
*2
Undefined
EDO page mode delayed write cycle
H to L
Valid
EDO page mode read modify-write cycle
L
Notes: 1. H: High (inactive) L: Low (active) D: H or L
2. t WCS ≥ 0 ns Early write cycle
t WCS < 0 ns Delayed write cycle
3. Mode is determined by the OR function of the UWE and LWE. (Mode is set by the earliest of
UWE and LWE active edge and reset by the latest of UWE and LWE inactive edge.) However
write OPERATION and output High-Z control are done independently by each UWE, LWE.
4
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HM511667C Series
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Voltage on any pin relative to V SS
VT
–1.0 to +7.0
V
Supply voltage relative to VSS
VCC
–1.0 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
1.0
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
–55 to +125
°C
Recommended DC Operating Conditions (Ta = 0 to +70°C)
Parameter
Symbol
Min
Typ
Max
Unit
Notes
Supply voltage
VSS
0
0
0
V
2
VCC
4.5
5.0
5.5
V
1, 2
VIH
2.4
—
6.5
V
1
(I/O pin)
VIL
–0.5
—
0.8
V
1
(Others)
VIL
–1.0
—
0.8
V
1
Input high voltage
Input low voltage
Notes: 1. All voltage referred to VSS .
2. The supply voltage with all VCC pins must be on the same level.
The supply voltage with all VSS pins must be on the same level.
5
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HM511667C Series
DC Characteristics (Ta = 0 to +70°C, VCC = 5 V ±10%, VSS = 0 V) *4
HM511667C
-6
Parameter
Operating current*
*2
1,
Standby current
-7
-8
Symbol Min
Max
Min
Max
Min
Max
Unit
Test conditions
I CC1
—
120
—
115
—
90
mA
RAS cycling
CAS cycling, t RC = min
I CC2
—
2
—
2
—
2
mA
TTL interface
RAS, CAS = VIH
Dout = High-Z
—
1
—
1
—
1
mA
CMOS interface
RAS, CAS, UWE, LWE,
OE ≥ V CC – 0.2 V
Dout = High-Z
RAS-only refresh
current* 2
I CC3
—
120
—
115
—
90
mA
t RC = min
Standby current*1
I CC5
—
5
—
5
—
5
mA
RAS = VIH, CAS = VIL,
Dout = enable
CAS-before-RAS
refresh current*2
I CC6
—
120
—
115
—
90
mA
t RC = min
EDO page mode
current* 1, * 3
I CC4
—
150
—
120
—
115
mA
t HPC = min
Input leakage
current
I LI
–10
10
–10
10
–10
10
µA
0 V ≤ Vin ≤ 6.5 V
Output leakage
current
I LO
–10
10
–10
10
–10
10
µA
0 V ≤ Vout ≤ 6.5 V
Dout = disable
Output high voltage VOH
2.4
VCC
2.4
VCC
2.4
VCC
V
High Iout = –2 mA
Output low voltage
0
0.4
0
0.4
0
0.4
V
Low Iout = 2 mA
VOL
Notes: 1. I CC depends on output load condition when the device is selected. ICC max is specified at the
output open condition.
2. Address can be changed twice or less while RAS = VIL.
3. Address can be changed once or less within one EDO page cycle.
4. All the V CC pins should be supplied with the same voltage. And all the VSS pins should be
supplied with the same voltage.
6
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HM511667C Series
Capacitance (Ta = +25°C, VCC = 5 V ±10%)
Parameter
Symbol
Typ
Max
Unit
Notes
Input capacitance (Address)
CI1
—
5
pF
1
Input capacitance (Clocks)
CI2
—
7
pF
1
Output capacitance (Data-in, Data-out)
CI/O
—
10
pF
1, 2
Notes: 1. Capacitance measured with Boonton Meter or effective capacitance measuring method.
2. RAS, CAS = VIH to disable Dout.
AC Characteristics (Ta = 0 to +70°C, VCC = 5 V ±10%, VSS = 0 V)*1, *14, *15, *17, *18
Test Conditions
•
•
•
•
•
Input rise and fall time : 2 ns
Input levels: VIL = 0 V, V IH = 3.0 V
Input timing reference levels : 0.8 V, 2.4 V
Output timing reference levels : 0.8 V, 2.0 V·
Output load : 1 TTL gate + CL (50 pF) (Including scope and jig)
7
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HM511667C Series
Read, Write, Read-Modify-Write and Refresh Cycles (Common parameters)
HM511667C
-6
-7
-8
Parameter
Symbol
Min
Max
Min
Max
Min
Max
Unit
Random read or write cycle time
t RC
105
—
125
—
145
—
ns
RAS precharge time
t RP
40
—
50
—
60
—
ns
RAS pulse width
t RAS
60
10000 70
10000 80
10000 ns
26
CAS pulse width
t CAS
10
10000 13
10000 15
10000 ns
27
Row address setup time
t ASR
0
—
0
—
0
—
ns
Row address hold time
t RAH
10
—
10
—
10
—
ns
Column address setup time
t ASC
0
—
0
—
0
—
ns
Column address hold time
t CAH
10
—
13
—
15
—
ns
RAS to CAS delay time
t RCD
20
45
20
50
20
60
ns
8
RAS to column address delay time
t RAD
15
30
15
35
15
40
ns
9
RAS hold time
t RSH
20
—
20
—
20
—
ns
CAS hold time
t CSH
48
—
58
—
68
—
ns
CAS to RAS precharge time
t CRP
10
—
10
—
10
—
ns
OE to Din delay time
t ODD
15
—
15
—
15
—
ns
OE delay time from Din
t DZO
0
—
0
—
0
—
ns
CAS setup time from Din
t DZC
0
—
0
—
0
—
ns
Transition time (rise and fall)
tT
2
50
2
50
2
50
ns
Refresh period
t REF
—
4
—
4
—
4
ms
8
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Notes
28
7
HM511667C Series
Read Cycle
HM511667C
-6
-7
-8
Parameter
Symbol Min
Max
Min
Max
Min
Max
Unit Notes
Access time from RAS
t RAC
—
60
—
70
—
80
ns
2, 3
Access time from CAS
t CAC
—
15
—
20
—
20
ns
3, 4, 13
Access time from address
t AA
—
30
—
35
—
40
ns
3, 5, 13
Access time from OE
t OAC
—
15
—
20
—
20
ns
22
Read command setup time
t RCS
0
—
0
—
0
—
ns
20
Read command hold time to CAS
t RCH
0
—
0
—
0
—
ns
16, 19
Read command hold time to RAS
t RRH
0
—
0
—
0
—
ns
16, 19
Column address to RAS lead time
t RAL
30
—
35
—
40
—
ns
Column address to CAS lead time
t CAL
18
—
23
—
28
—
ns
Output buffer turn-off time
t OFF1
0
15
0
15
0
15
ns
6, 24
Output buffer turn-off time to OE
t OFF2
0
15
0
15
0
15
ns
6
CAS to Din delay time
t CDD
15
—
18
—
20
—
ns
RAS to Din delay time
t RDD
15
—
18
—
20
—
ns
WE to Din delay time
t WDD
15
—
18
—
20
—
ns
OE pulse width
t OEP
15
—
20
—
20
—
ns
22
Turn-off to RAS
t OFR
0
15
0
15
0
15
ns
6, 24
Turn-off to WE
t WEZ
0
15
0
15
0
15
ns
6
Output data hold time
t OH
5
—
5
—
5
—
ns
24
Output data hold time from RAS
t OHR
5
—
5
—
5
—
ns
24
Read command hold time from RAS t RCHR
60
—
70
—
80
—
ns
Read command hold time from CAS t RCHC
15
—
18
—
20
—
ns
Read command hold time from
column address
30
—
35
—
40
—
ns
t RCHA
9
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HM511667C Series
Write Cycle
HM511667C
-6
-7
-8
Parameter
Symbol Min
Max
Min
Max
Min
Max
Unit Notes
Write command setup time
t WCS
0
—
0
—
0
—
ns
10, 19
Write command hold time
t WCH
10
—
13
—
15
—
ns
20
Write command pulse width
t WP
10
—
13
—
15
—
ns
21
Write command to RAS lead time
t RWL
10
—
13
—
15
—
ns
21
Write command to CAS lead time
t CWL
10
—
13
—
15
—
ns
21
Data-in setup time
t DS
0
—
0
—
0
—
ns
11, 21
Data-in hold time
t DH
10
—
13
—
15
—
ns
11, 21
Read-Modify-Write Cycle
HM511667C
-6
-7
-8
Parameter
Symbol Min
Max
Min
Max
Min
Max
Unit Notes
Read-modify-write cycle time
t RWC
135
—
165
—
185
—
ns
RAS to WE delay time
t RWD
77
—
90
—
102
—
ns
10, 19
CAS to WE delay time
t CWD
32
—
38
—
42
—
ns
10, 19
Column address to WE delay time
t AWD
47
—
55
—
62
—
ns
10, 19
OE hold time from WE
t OEH
15
—
18
—
20
—
ns
21
Refresh Cycle
HM511667C
-6
Parameter
Symbol Min
-7
-8
Max
Min
Max
Min
Max
Unit Notes
CAS setup time (CBR refresh cycle) t CSR
10
—
10
—
10
—
ns
CAS hold time (CBR refresh cycle) t CHR
10
—
10
—
10
—
ns
RAS precharge to CAS hold time
t RPC
10
—
10
—
10
—
ns
CAS precharge time in normal
mode
t CPN
10
—
10
—
10
—
ns
10
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HM511667C Series
EDO Page Mode Cycle
HM511667C
-6
-7
-8
Parameter
Symbol Min
Max
Min
Max
Min
Max
Unit Notes
EDO page mode cycle time
t HPC
25
—
30
—
35
—
ns
EDO page mode CAS precharge
time
t CP
10
—
13
—
15
—
ns
EDO page mode RAS pulse width
t RASC
60
100000 70
100000 80
100000 ns
12
Access time from CAS precharge
t ACP
—
35
—
40
—
45
ns
3, 13
RAS hold time from CAS
precharge
t RHCP
35
—
40
—
45
—
ns
Output data hold time from
CAS low
t DOH
5
—
5
—
5
—
ns
CAS hold time referred OE
t COL
10
—
13
—
20
—
ns
CAS to OE setup time
t COP
5
—
5
—
5
—
ns
Read command hold time from
CAS precharge
t RCHP
35
—
40
—
45
—
ns
23
25
EDO Page Mode Read-Modify-Write Cycle
HM511667C
-6
Parameter
Symbol Min
-7
-8
Max
Min
Max
Min
Max
Unit Notes
EDO page mode read-modify-write t HPCM
cycle time
66
—
77
—
86
—
ns
EDO page mode read-modify-write t CPW
cycle CAS precharge to WE delay
time
52
—
60
—
67
—
ns
10, 21
Notes: 1. AC measurements assume t T = 2 ns.
2. Assumes that t RCD ≤ tRCD (max) and tRAD ≤ tRAD (max). If tRCD or tRAD is greater than the maximum
recommended value shown in this table, t RAC exceeds the value shown.
3. Measured with a load circuit equivalent to 1 TTL loads and 50 pF.
4. Assumes that t RCD ≥ tRCD (max) and tRAD ≤ tRAD (max).
5. Assumes that t RCD ≤ tRCD (max) and tRAD ≥ tRAD (max).
6. t OFF1 (max), tOFF2 (max), tOFR (max) and tWEZ (max) define the time at which the output achieves the
open circuit condition and is not referred to output voltage levels.
7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition
times are measured between V IH and VIL.
8. Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is specified as a
reference point only, if t RCD is greater than the specified tRCD (max) limit, then access time is
controlled exclusively by tCAC .
11
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HM511667C Series
9. Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is specified as a
reference point only, if t RAD is greater than the specified tRAD (max) limit, then access time is
controlled exclusively by tAA .
10. t WCS , t RWD, t CWD and t AWD are not restrictive operating parameters. They are included in the data
sheet as electrical characteristics only: if t WCS ≥ tWCS (min), the cycle is an early write cycle and the
data out pin will remain open circuit (high impedance) throughout the entire cycle; if t RWD ≥ tRWD
(min), tCWD ≥ tCWD (min), tAWD ≥ tAWD (min) and tCPW ≥ tCPW (min), the cycle is a read-modify-write and
the data output will contain data read from the selected cell; if neither of the above sets of
conditions is satisfied, the condition of the data out (at access time) is indeterminate.
11. These parameters are referred to CAS leading edge in an early write cycle and to WE leading
edge in a delayed write or a read-modify-write cycle.
12. t RASC defines RAS pulse width in EDO page mode cycles.
13. Access time is determined by the longest among t AA , t CAC and t ACP.
14. An initial pause of 100 µs is required after power up followed by a minimum of eight initialization
cycles (RAS-only refresh cycle or CAS-before-RAS refresh cycle). If the internal refresh counter
is used, a minimum of eight CAS-before-RAS refresh cycles is required.
15. In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying data
to the device.
16. Either t RCH or tRRH must be satisfied for a read cycle.
17. When both UWE and LWE go low at the same time, all 16-bits data are written into the device.
UWE and LWE cannot be staggered within the same write/read cycles.
18. All the V CC and VSS pins shall be supplied with the same voltages.
19. t RCH, t RRH, t WCS , t RWD, t CWD and t AWD are determined by the earlier falling edge of UWE and LWE.
20. t WCH and t RCS are determined by the later rising edge of UWE or LWE.
21. t WP, t RWL, t CWL, t OEH, t DS, t DH and tCPW should be satisfied by both UWE and LWE.
22. When output buffers are enabled once, sustain the low impedance state until valid data is
obtained. When output buffer is turned on and off within a very short time, generally it causes
large V CC/V SS line noise, which causes to degrade V IH min/VIL max level.
23. t HPC (min) can be achieved during a series of EDO page mode early write cycles or EDO page
mode read cycles. If both write and read operation are mixed in a EDO page mode RAS cycle
(EDO page mode mix cycle (1), (2)), minimum value of CAS cycle tHPC (tCAS + tCP + 2tT) becomes
greater than the specified t HPC (min) value.
24. Data output turns off and becomes high impedance from later rising edge of RAS and CAS.
Hold time and turn off time are specified by the timing specifications of later rising edge of RAS
and CAS between t OHR and t OH , and between t OFR and t OFF.
25. t DOH defines the time at which the output level satisfied the output timing reference levels.
Measured with the test conditions.
26. t RAS (min) = tRWD (min) + tRWL (min) + tT in read-modify-write cycle.
27. t CAS (min) = tCWD (min) + tCWL (min) + tT in read-modify-write cycle.
28. t CSH (min) can be achieved when tRCD ≤ tCSH (min) – tCAS (min).
29. XXX: H or L (H: VIH (min) ≤ VIN ≤ VIH (max), L: VIL (min) ≤ VIN ≤ VIL (max))
///////: Invalid Dout
When the address, clock and input pins are not described on timing waveforms, their pins must
be applied VIH or VIL.
12
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HM511667C Series
Notes concerning 2WE control
Please do not separate the UWE/LWE operation timing intentionally. However skew between UWE/LWE
are allowed under the following conditions.
(1) Each of the UWE/LWE should satisfy the timing specifications individually.
(2) Different operation mode for upper/lower byte is not allowed; such as following.
RAS
CAS
Delayed write
LWE
Early write
UWE
13
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HM511667C Series
Timing Waveforms*29
Read Cycle
t RC
t RAS
RAS
tT
t RP
t CRP
t RSH
t CAS
t CSH
t RCD
CAS
t RAD
t ASR
Address
t RAL
t CAH
t RAH t
ASC
Row
Column
t RCS
t RCHA
t CAL
t OHR
t RCHR
t RCHC
UWE
LWE
t RDD
t OH
t RCH
t RRH
t OFR
t CAC
t AA
t OFF1
Dout
Dout
t RAC
t OFF2
t DZC
t OAC
t WDD
t ODD
t DZO
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t WEZ
High-Z
Din
OE
t CDD
t OEP
HM511667C Series
Early Write Cycle
t RC
t RAS
t RP
RAS
tT
t RSH
t RCD
t CAS
t CRP
t CSH
CAS
t ASR
t RAH
Address
t ASC
Row
t CAH
Column
t WCH
t WCS
UWE
LWE
t DS
Din
Dout
t DH
Din
High-Z
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HM511667C Series
Delayed Write Cycle
t RC
t RAS
t RP
RAS
t CSH
t CRP
t RCD
t RSH
t CAS
tT
CAS
t ASR
Address
t ASC
t RAH
t CWL
t RWL
t CAH
Row
Column
t RCS
t WP
UWE
LWE
t DS
t DH
High-Z
Din
Din
t DZC
t ODD
t DZO
t OEH
Dout
Invalid Dout*
t OFF2
OE
*
* Do not enable Dout during delayed write cycle.
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HM511667C Series
Read-Modify-Write Cycle
t RWC
t RP
t RAS
RAS
tT
t CRP
t CAS
t RCD
CAS
t RAD
t ASR
t ASC
t RAH
Address
t CAH
Column
Row
t CWL
t RCS
t CWD
t RWL
t AWD
t WP
UWE
LWE
t AA
t RWD
t CAC
t RAC
t DS
t DZC
High-Z
Din
Dout
t DH
High-Z
Din
Dout
t OEH
t OAC
t OFF2
t DZO
OE
t ODD
t OEP
17
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HM511667C Series
RAS-Only Refresh Cycle
t RC
t RAS
t RP
RAS
tT
t CRP
tRPC
CAS
t RAH
t ASR
Address
Row
Dout
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High-Z
tCRP
HM511667C Series
CAS-Before-RAS Refresh Cycle
t RC
t RP
t RC
t RAS
t RP
t RAS
t RP
RAS
tT
t RPC
t CPN
t RPC
t CSR
t CHR
t CPN
t CRP
t CSR
t CHR
CAS
Address
t OFF1
Dout
High-Z
19
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HM511667C Series
EDO Page Mode Read Cycle (tHPC minimum cycle operation)
t RASC
t RHCP
t RP
RAS
tT
t CSH
t RCD
t HPC
t CAS
t CP
t CAS
t RSH
t CP
t CRP
t CAS
CAS
t ASR
t CAL
t RAD
t RAH
Address
t CAH
tASC
Row
Column 1
t CAL
t CAL
t ASC t CAH
Column 2
t RAL
t CAH
t ASC
Column 3
t RCHA
t RRH
t RCHP
t RCS
t RCH
t RCHC
UWE
LWE
t WEZ
t DZC
t CDD
High-Z
Din
t CAC
t CAC
t RAC
t AA
t AA
t ACP
t DOH
Dout 1
Dout
t CAC
t AA
t ACP
t DOH
Dout 2
t OFR
t OH
t ODD
t OHR
t OFF1
Dout 3
t OAC
t DZO
OE
20
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t OFF2
HM511667C Series
EDO Page Mode Read Cycle (High-Z control by WE and OE)
t RP
RAS
tT
t CSH
t CP
t HPC
t CAS
CAS
t RCS
t CP
t HPC
t CAS
tCAS
tCAS
t RCHP
t RCHC
t RCHA
tASR
tRAH t ASC tCAH
Row
tASC
t ASC t CAH
Column 2
tCAL
tDZC
t RRH
t RCH
t
t RAL RCHC
t ASC t CAH
Column 1
t CRP
t RHCP
t CP
t RCH t RCS
t RCHR
UWE
LWE
Address
t HPC
t RASC
Column 3
t CAL
t WDD
t CAH
Column 4
t CAL
tRDD
tCDD
t CAL
High-Z
Din
tCOL
tDZO
tCOP
tODD
OE
tAA
tCAC
tCAC
tAA
Dout
tOFF2
Dout 1
tACP
tAA
tCAC
tWEZ
tRAC
tOFR
tOHR
tOFF2
tACP
tACP
tOAC
tOAC
Dout 2
tAA
tOFF2
tDOH
Dout 2
tCAC
tOFF1
tOH
tOAC
Dout 3
Dout 4
21
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HM511667C Series
EDO Page Mode Early Write Cycle (tHPC minimum cycle operation)
t RASC
t RP
RAS
tT
t CSH
t RCD
t RSH
t HPC
t CAS
t CP
t CAS
t CAS
t CP
CAS
t ASR
Address
t RAH
Row
t ASC
t CAH
Column
t WCS
t WCH
t ASC
t CAH
Column
t WCS
t ASC
t CAH
Column
t WCH
t WCH
t WCS
UWE
LWE
t DS
Din
Din
Dout
22
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t DH
t DS
Din
High-Z
t DH
t DS
t DH
Din
t CRP
HM511667C Series
EDO Page Mode Delayed Write Cycle
t RP
t RASC
RAS
tT
t CSH
tRCD
t HPC
t CAS
t CP
t CAS
t RSH
t CAS
t CP
t CRP
CAS
t ASR
t RAH
Address
t ASC
t CAH
t ASC
t CAH
Row
t CAH
t ASC
Column
Column
Column
t CWL
t CWL
t RCS
t CWL
t WP
t WP
t WP
t RWL
UWE
LWE
t DH
t DS
Din
t RCS
t DH
t DS
t DH
t DS
Din
Din
t RCS
Din
t OEH
High-Z
Dout
t ODD
OE
23
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HM511667C Series
EDO Page Mode Read-Modify-Write Cycle
t RP
t RASC
RAS
t RCD
t HPCM
tT
t CAS
CAS
t CRP
t CP
t CP
t CAS
t CAS
t RAD
t RAH
t ASR
Address
t ACP
t CAH
t ASC
t ASC
Row
t ASC
Column
Column
t CWL
t AWD
t CWD
t RCS
t CAH
t CAH
t AWD
t CWL
t CWD
t RCS
t WP
t RWD
Column
t CPW
t WP
t RCS
t CPW
t CWL
t AWD
t RWL
t CWD
t WP
UWE
LWE
t CAC
t DZC
t DZC
t DH
High-Z
Din
Din
t AA
tOAC
t OEH
Dout
t OAC
t OEH
Dout
t OFF2
t DS
t DH
t DZC
High-Z
Din
t CAC
t DZO
t RAC
t DZO
t DH
t CAC
High-Z
Din
tAA
Dout
t ACP
t DS
t DS
t AA
t OAC
t OEH
Dout
t OFF2
t DZO
t OFF2
OE
t ODD
t ODD
t OEP
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t OEP
t ODD
tOEP
HM511667C Series
EDO Page Mode Mix Cycle (1)*23
t RP
t RASC
RAS
t CSH
tT
CAS
t CAS
t WCS
t CAS
tCAS
Address
t RCS
tCPW
tAWD
t ASC
tRAH
Row
tCAH
Column 1
tCAL
t DS
Din
tCAS
t WCH
WE
tASR
t ASC t CAH
tASC t CAH
Column 2
Column 3
tWP
tASC
t RCHP
t RCHC
t RRH
t RCH
t RCHA
t RAL
t CAH
Column 4
t CAL
t DH
Din 1
t CRP
t CP
t CP
t CP
t DH
t DS
High-Z
tRDD
tCDD
t CAL
Din 3
tODD
tWDD
OE
t ACP
tAA
tOAC
tCAC
tDZO
t ACP
tOFF2
tAA
tCAC
Dout 2
tAA
tOFF2
tCAC
tOAC
t DOH
Dout
tOFR
tWEZ
tACP
Dout 3
tOFF1
tOH
Dout 4
25
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HM511667C Series
EDO Page Mode Mix Cycle (2)*23
t RP
t RASC
RAS
tT
t CSH
t CAS
CAS
t RCS
t RCHR
t CAS
Address
tCAS
t RCH t WCS t WCH
tCAS
Row
tCAH
Column 1
t ASC t CAH
t ASC t CAH
Column 2
Column 3
tCAL
t DS
High-Z
Din
t DH
Column 4
Din 2
tODD
t RRH
t RCH
t RCHA
t RAL
t CAH
tASC
t CAL
t DS
t CAL
t RCHC
tWP
tCPW
t ASC
tRAH
t RCHP
tCWL
UWE
LWE
tASR
t CRP
t CP
t CP
t CP
tRDD
tCDD
t CAL
t DH
Din 3
tDZO
tODD
tWDD
tDZO
OE
tAA
tOAC
tCAC
tOFF2
Dout 1
26
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tOFR
tWEZ
tOFF2
tACP
tCAC
tRAC
Dout
t OAC
tACP
tAA
tOFF2
tAA
tCAC
tOAC
Dout 3
tOFF1
tOH
Dout 4
HM511667C Series
Package Dimension
HM511667CJ Series (CP-40D)
Unit: mm
25.80
26.16 Max
0.43 ± 0.10
0.41 ± 0.08
1.27
0.10
Dimension including the plating thickness
Base material dimension
0.31
2.30 +– 0.14
1.30 Max
20
0.25
0.80 +– 0.17
10.16 ± 0.13
0.74
3.50 ± 0.26
1
11.18 ± 0.13
21
40
9.40 ± 0.25
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
CP-40D
—
Conforms
1.73 g
27
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HM511667C Series
Package Dimension (cont.)
HM511667CTT Series (TTP-44/40DA)
Unit: mm
23
10.16
44
18.41
18.81 Max
35 32
1
10 13
0.80
22
0.80
0.30 ± 0.10
0.25 ± 0.05
0.13 M
11.76 ± 0.20
1.005 Max
0.10
Dimension including the plating thickness
Base material dimension
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0.13 ± 0.05
2.40
0.17 ± 0.05
0.125 ± 0.04
1.20 Max
0° – 5°
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TTP-44/40DA
Conforms
—
0.43 g
HM511667C Series
When using this document, keep the following in mind:
1. This document may, wholly or partially, be subject to change without notice.
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of
this document without Hitachi’s permission.
3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any
other reasons during operation of the user’s unit according to this document.
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and
performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any intellectual
property claims or other problems that may result from applications based on the examples described
herein.
5. No license is granted by implication or otherwise under any patents or other rights of any third party or
Hitachi, Ltd.
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company.
Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are
requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL
APPLICATIONS.
Hitachi, Ltd.
Semiconductor & IC Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan
Tel: Tokyo (03) 3270-2111
Fax: (03) 3270-5109
For further information write to:
Hitachi Semiconductor
(America) Inc.
2000 Sierra Point Parkway
Brisbane, CA. 94005-1897
USA
Tel: 800-285-1601
Fax:303-297-0447
Hitachi Europe GmbH
Continental Europe
Dornacher Straße 3
D-85622 Feldkirchen
München
Tel: 089-9 91 80-0
Fax: 089-9 29 30-00
Hitachi Europe Ltd.
Electronic Components Div.
Northern Europe Headquarters
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA
United Kingdom
Tel: 01628-585000
Fax: 01628-585160
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
Hitachi Asia (Hong Kong) Ltd.
Unit 706, North Tower,
World Finance Centre,
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon
Hong Kong
Tel: 27359218
Fax: 27306071
Copyright © Hitachi, Ltd., 1997. All rights reserved. Printed in Japan.
29
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HM511667C Series
Revision Record
Rev.
Date
Contents of Modification
Drawn by
Approved by
0.0
Aug. 30, 1996
Initial issue
I. Ogiwara
S. Suzuki
1.0
Dec. 20, 1997
Change of Subtitle
30
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