The documentation and process conversion measures necessary to comply with this revision shall be completed by 23 October 1999. INCH-POUND MIL-PRF-19500/528A 23 July 1999 SUPERSEDING MIL-S-19500/528(USAF) 16 September 1977 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, POWER, TYPES 2N6032 AND 2N6033 JAN, JANTX, AND JANTXV, This Specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for NPN, silicon, power transistors. Three levels of product assurance are provided for each device type as specified in MIL-PRF-19500. 1.2 Physical dimensions. See figure 1 (similar to T0-3). 1.3 Maximum ratings. Types 2N6032 2N6033 PT 1/ TC = +25°C RθJC VCBO VCEO VEBO IB IC TOP and TSTG W °C/W V dc V dc V dc A dc A dc °C 140 140 1.25 1.25 120 150 90 120 7.0 7.0 10 10 50 40 -65 to +200 -65 to +200 1/ Between TC = +25°C and TC = +200, linear derating factor (average) = 800 mW/°C. 1.4 Primary electrical characteristics at TA = +25°C. hFE1 Types 2N6032 2N6033 IC = 50 A dc VCE = 2.6 V dc Min Max 10 50 IC = 40 A dc VCE = 2.0 V dc Cobo |hfe| .1 MHz ≤ f ≤ 1 MHz IE = 0 A dc VCB = 10 V dc pF f = 5 MHz IC = 2.0 A dc VCE = 10 V dc Min Max Min Max Min Max 10 50 ----- 1,000 1,000 10 10 40 40 Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAC, 3990 East Broad St., Columbus, OH 43216-5000, by using the addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A Distribution Statement A. Approved for public release; distribution is unlimited. FSC 5961 MIL-PRF-19500/528A 1.4 Primary electrical characteristics at TA = +25°C. VBE(sat) switching VCE(sat) IC = 50 A dc IB = 5 A dc IC = 50 A dc IB = 5 A dc IC = 40 A dc IB = 4 A dc V dc V dc V dc ton toff Type 2N6032 2N6033 (see table I and figure 4) µs Min Max Min Max Min Max Min Max Min Max --- 2.0 --- 1.3 --- -1.0 --- 0.5 0.5 --- 2.0 2.0 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Defense Automated Printing Service, Building 4D (NPM-DODSSP), 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 2 MIL-PRF-19500/528A Dimensions Ltr CD CH HR HR1 HT L1 LD LL MHD MHS PS PS1 S Notes Inches Min Max .875 .250 .450 .495 .525 .131 .188 .050 .135 .050 .059 .061 .312 --.151 .161 1.177 1.197 .420 .440 .205 .225 .655 .675 Millimeters Min Max 22.22 .635 11.43 12.57 13.34 3.33 4.78 1.27 3.43 1.27 1.50 1.55 7.92 --3.84 4.09 29.90 30.40 10.67 11.18 5.21 5.72 16.64 17.14 3 5, 9 5, 9 5 7 4 4, 5 4 Notes: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Body contour is optional within zone defined by CD 4. These dimensions shall be measured at points .050 (1.27 mm) to .055 (1.40 mm) below seating plane. When gauge is not used , measurement shall be made at seating plane. 5. Both terminals. 6. At both ends. 7. Two holes. 8. Terminal 1 is the emitter, terminal 2 is base. The collector shall be electrically connected to the case. 9. LD applies between L1 and LL. Diameter is uncontrolled in L1. 10. In accordance with ANSI Y14.5M, diameters are equivalent to φx symbology. FIGURE 1. Physical dimensions (similar to T0-3). 3 MIL-PRF-19500/528A 3. REQUIREMENTS 3.1 Associated specification. The individual item requirements shall be in accordance with MIL-PRF-19500, and as specified herein. 3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF19500. 3.3 Interface requirements and physical dimensions. The Interface requirements and physical dimensions shall be as specified in MIL-PRF-19500 and herein. 3.3.1 Lead finish. Lead finish shall be solderable as defined in MIL-PRF-19500. 3.4 Marking. Marking shall be in accordance with MIL-PRF-19500. 3.5 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing on the applicable qualified products list before contract award (see 4.2 and 6.4). 3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in paragraph 1.3, 1.4, and table I. 3.7 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I. 4. VERIFICATION 4.1 Classification of Inspections. The inspection requirements specified herein are classified as follows: a. Qualification inspection (see 4.2). b. Screening (see 4.3) c. Conformance inspection (see 4.4). 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500. 4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with MIL-PRF-19500 (table IV), and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein shall not be acceptable. Screen (see tableIV of MIL-PRF-19500) Measurement JANTX and JANTXV levels 9 Not applicable 10 24 hours minimum 11 ICEX1 ,hFE1 12 See 4.3.1; 168 hours minimum 13 Subgroup 2 of table I herein; ∆ICEX1 = ±100% of initial value or 3 mA dc, whichever is greater; ∆hFE1 = +25% 4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: TJ = +187.5°C ±12.5°C, TA ≤ 35°C JANTX and JANTXV levels 2N6032 -----------------------------------------VCB = 60 V dc. 2N6033 -----------------------------------------VCB = 100 V dc. 4 MIL-PRF-19500/528A 4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as specified herein. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I herein. 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in tables VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and paragraphs 4.4.2.1 herein. Electrical measurements (end-points) shall be in accordance with table I, group A, subgroup 2 herein. 4.4.2.1 Group B inspection, table VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500. Subgroup B3 Method Condition 1037 For solder die attach: VCB ≥ 10 V dc, 2000 cycles, TA ≤ 35°C. For eutectic die attach: VCB ≥ 10 V dc, TA ≤ 35°C, adjust PT to achieve TJ = 175°C min. B5 3151 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) shall be in accordance with table I, group A, subgroup 2 herein. Subgroup C6 Method Condition 1037 For solder die attach: VCB ≥ 10 V dc, 6000 cycles, TA ≤ 35°C. For eutectic die attach: VCB ≥ 10 V dc, TA ≤ 35°C, adjust PT to achieve TJ = 175°C min. 4.5 Method of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows. 4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750. 4.5.2 Input capacitance. This test shall be conducted in accordance with method 3240 of MIL-STD-750, except the output capacitor shall be omitted. 4.5.3 Coil selection for safe operating area tests. In selecting coils for use in clamped and unclamped inductive SOAR tests, prime consideration should be given to the recommended commercially available coil. However, due to the extreme critical nature of the coil in these circuits and wide tolerance of some commercially available coils (+100, -50 percent), it shall be the semiconductor manufacturer's responsibility, to prove upon request, compliance or equivalency of any coil used (commercial or inplant designed) to be within (+20, -10 percent) of the specified inductance at the rated current and dc resistance. 5 MIL-PRF-19500/528A TABLE I. Group A inspection . Inspection 1/ MIL-STD-750 Limit Unit Symbol Method Conditions Min Max Subgroup 1 Visual and mechanical examination 2071 Subgroup 2 Breakdown voltage, collector to emitter 2N6032 2N6033 ---- Breakdown voltage, collector to emitter 2N6032 2N6033 ---- Breakdown voltage, collector to emitter 2N6032 2N6033 ---- Emitter to base cutoff current 3061 Collector to emitter cutoff Current 3041 Collector to emitter cutoff Current 2N6032 2N6033 3041 Collector to base cutoff Current 2N6032 2N6033 3036 Forward-current transfer ratio 3076 IC = 200 mA dc; f = 30 - 60 Hz; L = 15 mH (see figure 2) IC = 200 mA dc; f = 30 - 60 Hz; L = 15 mH (see figure 2) IC = 200 mA dc; f = 30 - 60 Hz; L = 2 mH (see figure 2) Bias condition D VEB = 7 V dc Bias condition D VCE = 80 V dc Bias condition A; VBE = -1.5 V dc V(BR)CEO V dc V dc 110 140 V dc V dc 120 150 V dc V dc V(BR)CER V(BR)CEX IEBO 10 mA dc ICEO 10 mA dc 12 10 mA dc mA dc 25 25 mA dc mA dc ICEX1 VCE = 110 V dc VCE = 135 V dc Bias condition D; ICBO VCB = 120 V dc VCB = 150 V dc VCE = 2.6 V dc; IC = 50 A dc (pulsed see 4.5.1) hFE1 2N6032 Forward-current transfer ratio 90 120 3076 VCE = 2.0 V dc; IC = 40 A dc (pulsed see 4.5.1) 2N6033 See footnote at end of table. 6 10 50 10 50 hFE1 MIL-PRF-19500/528A TABLE I. Group A inspection - continued. Inspection 1/ MIL-STD-750 Limit Unit Symbol Method Conditions Min Max Subgroup 2 - Continued Collector-emitter saturation voltage 2N6032 3071 IC = 50 A dc; IB = 5.0 A dc; pulsed (see 4.5.1) VCE(sat) 1.3 V dc Collector-emitter saturation voltage 2N6033 3071 IC = 40 A dc; IB = 4.0 A dc pulsed (see 4.5.1) VCE(sat) 1.0 V dc Base-emitter saturation voltage 3306 Test condition A; IB = 5.0 A dc; IC = 50 A dc; pulsed (see 4.5.1) VBE(sat) 2.0 V dc 3306 Test condition A; IB = 4.0 A dc; IC = 40 A dc; pulsed (see 4.5.1) VBE(sat) 2.0 V dc 15 10 mA dc mA dc 2N6032 Base-emitter saturation voltage 2N6033 Subgroup 3 High temperature operation Collector to emitter cutoff current TA = +150°C 3041 Bias condition D;VBE = 1.5 V dc; VCE = 100 V dc ICEX2 2N6032 2N6033 Low temperature operation Forward-current transfer ratio TA = -55°C 3076 2N6032 2N6033 pulsed (see 4.5.1) hFE2 5 5 VCE = 2.6 V dc; IC = 50 A dc VCE = 2.0 V dc; IC = 40 A dc Subgroup 4 Magnitude of small-signal short- circuit forward current transfer ratio 3306 VCE = 10 V dc; IC = 2.0 A dc; f = 5.0 MHz /hfe/ Open circuit Output capacitance 3236 VCB = 10 V dc; IE = 0; 100 kHz < f < 1 MHz Cobo See footnote at end of table. 7 10 40 1,000 pF MIL-PRF-19500/528A TABLE I. Group A inspection - continued. Inspection 1/ MIL-STD-750 Limit Unit Symbol Method Conditions Min Max Subgroup 4 - Continued Pulse response: 3251 Turn-on time 2N6032 Test condition A except test circuit and pulse requirements in accordance with figure 3. VCC = 30 V dc ±2; IC = 50 A dc; IB1 = 5.0 A dc VCC = 30 V dc ±2; IC = 40 A dc; IB1 = 4.0 A dc 2N6033 Turn-off time 2N6032 VCC = 30 V dc ±2; IC = 50 A dc; IB2 = 5.0 A dc, IB2 = -5.0 A dc VCC = 30 V dc ±2; IC = 40 A dc; IB1 = 4.0 A dc, IB2 = -4.0 A dc 2N6033 Subgroup 5 Safe operating area (continuous dc) 3051 TC = +25°C; t = 1 s; 1 cycle; (see figure 4) Test 1 2N6032 only IC = 50 A dc; VCE = 2.8 V dc Test 2 2N6033 only IC = 40 A dc; VCE = 3.5 V dc Test 3 IC = 5.8 A dc; VCE = 24 V dc Test 4 IC = 0.9 A dc; VCE = 40 V dc Test 5 2N6032 only IC = 0.18 A dc; VCE = 90 V dc Test 6 2N6033 only IC = 0.1 A dc; VCE = 120 V dc See footnote at end of table. 8 ton 0.5 µs toff 2.0 µs MIL-PRF-19500/528A TABLE I. Group A inspection - Continued. Inspection 1/ MIL-STD-750 Method Symbol Conditions Subgroup 5 - Continued Safe operating area (switching) 3053 tp ≈ 10 ms; RBB1 = 1Ω; VBB1 = 10 V dc max; RBB2 = 20Ω; VBB2 = 4 V dc; Test 1 2N6032 2N6033 IC = 50 A dc; IC = 40 A dc; VCC = 10 V dc L = 50 µH, 0.1 Ω; tp ≈ 10 ms; RBB1 = 10Ω; VBB1 = 10 V dc max; RBB2 = 20Ω; VBB2 = 4 V dc; IC = 10 A dc; VCC = 10 V dc L = 500 µH, 0.1 Ω Test 2 Electrical measurements Safe operating area (switching) Load condition C; (unclamped inductive lead) (see figure 5); TC = +25°C; Duty cycle ≤ 10 percent; RS = 0.1 ohm; See table I, group A, subgroup 2 ---- 2N6032 2N6033 2N6032 2N6033 Electrical measurements TA = +25°C; duty cycle ≤ 10 percent. tp ≈ 10 ms (vary to obtain IC); RS ≤ 1 Ω; VCC ≥ 50 V dc; L = 50 µH, 0.1 Ω IC = 50 A dc; IC = 40 A dc; clamp voltage = 90 V dc; clamp voltage = 120 V dc; (see figure 6) See table I, group A, subgroup 2 Subgroups 6 and 7 Not applicable 1/ For sampling plan see MIL-PRF-19500. 9 Limits Min Unit Max MIL-PRF-19500/528A NOTE: V(BR)CEO, V(BR)CER, V(BR)CEX is acceptable when the trace falls to the right and above point "A" for type 2N6032. The trace shall fall to the right and above point "B" for type 2N6033 FIGURE 2. V(BR)CEO, V(BR)CER, V(BR)CEX measurement circuit. 10 MIL-PRF-19500/528A NOTES: 1. The rise time (tr) and fall time (tf) of the applied pulse shall be each < 20 nanoseconds; duty cycle < 2%, generator source impedance shall be 50 Ω; pulse width : 20 ns. 2. Output sampling oscilloscope: Zin > 100 kΩ; Cin < 50 pF; rise time < 20 nanoseconds. FIGURE 3. Pulse response test circuit. 11 MIL-PRF-19500/528A FIGURE 4 Maximum safe operating area graph (continuous DC). 12 MIL-PRF-19500/528A FIGURE 5. Safe operating area for switching between saturation and cutoff (unclamped inductive load). 13 MIL-PRF-19500/528A NOTES: 1. Either a clamping circuit or clamping diode may be used. 2. The coil used shall provide a minimum inductance of 50 µH with a maximum dc resistance of .1 ohm. 3. RS ≤ .1 Ω, 12 W, 1% tolerance maximum (non-inductive). Procedure 1. With switch S1 closed, set the specified test conditions. 2. Open S1. Device fails if clamp voltage not reached and maintained until the current returns to zero. 3. Perform specified endpoint tests. FIGURE 6. Clamped inductive sweep test circuit. 14 MIL-PRF-19500/528A 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When actual packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points' packaging activity within the Military Department or Defense Agency, or within the Military Departments' System Command. Packaging data retrieval is available from the managing Military Departments' or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-PRF-19500 are applicable to this specification. 6.2 Acquisition requirements. Acquisition documents should specify the following: a. Lead formation and finish may be specified (see 3.3.1). b. Type designation and product assurance level. c. Packaging requirements (see 5.1). 6.3 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. 6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-19500 whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from Defense Supply Center Columbus, DSCC-VQE, Columbus, OH 43216. CONCLUDING MATERIAL Custodians: Air Force - 11 DLA - CC Preparing activity: DLA - CC (Project 5961-F161) Review activities: Air Force - 19 15 MIL-PRF-19500/528A This page intentionally left blank 16 MIL-PRF-19500/528A STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL INSTRUCTIONS 1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision letter should be given. 2. The submitter of this form must complete blocks 4, 5, 6, and 7. 3. The preparing activity must provide a reply within 30 days from receipt of the form. NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of requirements on current contracts. Comments submitted on this form do not constitute or imply authorization to waive any portion of the referenced document(s) or to amend contractual requirements. I RECOMMEND A CHANGE: 1. DOCUMENT NUMBER MIL-PRF-19500/528A 2. DOCUMENT DATE 99/07/23 3. DOCUMENT TITLE SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, POWER, TYPES 2N6032 AND 2N6033 JAN, JANTX, AND JANTXV, 4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.) 5. REASON FOR RECOMMENDATION 6. SUBMITTER a. NAME (Last, First, Middle initial) c. ADDRESS (Include Zip Code) b. ORGANIZATION d. TELEPHONE (Include Area Code) Commercial DSN FAX EMAIL 7. DATE SUBMITTED 8. PREPARING ACTIVITY a. Point of Contact Alan Barone c. ADDRESS Defense Supply Center Columbus ATTN: DSCC-VAC Columbus, OH 43216-5000 DD FORM 1426, FEB 99 (EG) b. TELEPHONE Commercial DSN 614-692-0510 850-0510 FAX 614-692-6939 EMAIL [email protected] IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT: Defense Standardization Program Office (DLSC -LM) 8725 John J. Kingman Road, Suite 2533 Fort Belvior, Virginia 22060-6221 Telephone (703) 767-6888 DSN 427-6888 PREVIOUS EDITIONS ARE OBSOLETE 17 WHS/DIOR, Feb 99