INCH POUND The documentation and process conversion measures necessary to comply with this revision shall be completed by 15 September 1997 MIL-PRF-19500/539B 15 June 1997 SUPERSEDING MIL-S-19500/539A 20 October 1993 PERFORMANCE SPECIFICATION SEMICONDUCTOR DEVICE, DARLINGTON TRANSISTOR, NPN, SILICON, POWER TYPES 2N6300, 2N6301 JANTX AND JANTXV This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for NPN, Darlington, silicon, power transistors. Two levels of product assurance are provided for each device type as specified in MIL-PRF-19500. For JAN quality assurance level (see 6.3). 1.2 Physical dimensions. See figure 1. 1.3 Maximum ratings. VCBO PT 1/ TC = 100°C TC = 0°C W W V dc 2N6300 75 32 60 2N6301 75 32 80 1/ Derate linearly at 0.428 W/°C above TC > 0°C. VCEO V dc 60 80 VEBO V dc 5 5 IC A dc 8 8 IB mA dc 120 120 TOP and TSTG °C -55 TO +200 -55 TO +200 1.4 Primary electrical characteristics. Min Max hFE2 1/ VCE = 3 V dc IC = 4 A dc 750 18000 hFE3 1/ VCE = 3 V dc IC = 8 A dc 100 hfe VCE = 3 V dc IC = 3 A dc f = 1 MHz 25 350 Cobo 100 kHz ≤ f ≤ 1 MHz/ VCB = 10 V dc IE = 0 pF 200 Pulse response ton toff µs µs 2.0 8.0 See footnote at end of table. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad Street, Columbus, OH 43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. FSC 5961 MIL-PRF-19500/539B 1.4 Primary electrical characteristics. Continued. VBE(sat) IC = 8 A dc IB = 80 mA dc 1/ V dc Min Max 4.0 1/ Pulsed see 4.5.1 VCE(sat) IC = 8 A dc IB = 80 mA dc 1/ V dc 3.0 hfe VCE = 3 V dc IC = 3 A dc f = 1 kHz 300 RθJC °C/W 2.33 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing on the applicable qualified products list before contract award (see 4.2 and 6.4). 3,2 Associated performance specification. The individual item performance requirements shall be in accordance with MIL-PRF19500, and as specified herein. 3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF-19500. 3.4 Design, construction, and physical dimensions. The design, construction, and physical dimensions for the purpose of interchangeability shall be as specified on figure 1 herein. 2 MIL-PRF-19500/539B FIGURE 1. Physical dimensions. 3 MIL-PRF-19500/539B | | Ltr | | | | | | CH | | | LD | | | CD | | | PS | | | PS1 | | | HT | | | LL | | | Dimensions | | | Inches | Millimeters | | | | Min | Max | Min | | | | .250 | .340 | 6.35 | | | | | | | .028 | .034 | 0.71 | | | | | | | | .620 | | | | | | | | .190 | .210 | 4.83 | | | | | | | .0095 | .0105 | 2.41 | | | | | | | .050 | .075 | 1.27 | | | | | | | .360 | .500 | 9.14 | | | | Notes | | Max | | 8.64 | | | .86 | | | 15.75 | | | 5.33 | | | 2.66 | | | 1.91 | | |12.70 | | | | || | | | | | | | 4, 9 | | |3 | | |4 | | |3 | | |3 | | |5 | || | || Ltr | || | | Inches || | || | Min || | || L1 | || | || | || MHD | .142 || | || | || MHS | .958 || | || | || HR | || | || | || HR1 | .115 || | || | || S1 | .570 || | | | | Dimensions | | Millimeters | | | Max | Min | | | .050 | | | | | | .152 | 3.61 | | | | | .962 | 24.33 | | | | | .350 | | | | | | .145 | 2.92 | | | | | .590 |14.48 | | | Notes | | Max | | 1.27 | | | 3.86 | | |24.43 | | | 8.89 | | | 3.68 | | | 14.99 | | | | | | | | | 5, 9 | | |7 | | | | | | | | |6 | | |4 | | | | | | | | | | | | | | | | | | | | | | | | NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Body contour is optional within zone defined by CD. 4. Measured at points .050 (1.27 mm) - .055 (1.4 mm) below the seating plane. When gauge is not used, measurement will be made at the seating plane. 5. Both terminals. 6. At both ends. 7. Two holes. 8. The collector shall be electrically connected to the case. 9. LD applies between L1 and LL. Diameter is uncontrolled within L1. FIGURE 1. Physical dimensions - Continued. 4 MIL-PRF-19500/539B 3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD 750, and as specified herein. 3.4 Marking. Devices shall be marked as specified in MIL-PRF-19500. 4. QUALITY ASSURANCE PROVISIONS 4.1 Classification of inspections. The inspection requirements specified herein are classified as follows: a. Qualification inspection (see 4.2). b. Screening (see 4.3) c. Conformance inspection (see 4.4). 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500. 4.3 Screening. Screening shall be in accordance with appendix E, table IV of MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein shall not be acceptable. Screen (see appendix E, table IV of MIL-PRF-19500) 11 12 13 Measurements JANTX AND JANTXV levels ICEX1 and hFE2 See 4.3.1 Subgroup 2 of table I herein; ∆hFE2 = ± 40 percent ICEX1 = 100 percent of initial value or 100 nA dc whichever is greater. 4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: VCE ≥ 10 V dc; TJ = 162.5°C ± 12.5°C NOTE: No heat sink or forced air cooling on the devices shall be permitted. 4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with appendix E, table V of MIL-PRF-19500 and table I herein. Electrical measurements (end-points) and delta requirements shall be in accordance with the applicable steps of table II herein. 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in appendix E, table VIb (JANTX and JANTXV) of MIL-PRF-19500. Electrical measurements (end-points) and delta requirements shall be in accordance with the applicable steps of table II herein. 4.4.2.1 Group B inspection, appendix E, table VIb (JANTX and JANTXV) of MIL-PRF-19500. Subgroup Method Conditions B3 1037 VCE ≥ 10 V dc, 2,000 cycles. B5 3151 RθJC = 2.33°C/W. 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in appendix E, table VII of MIL-PRF-19500. Electrical measurements (end points) and delta requirements shall be in accordance with the applicable steps of table II herein. 5 MIL-PRF-19500/539B 4.4.3.1. Group C inspection, appendix E, table VII of MIL-PRF-19500. Subgroup Method Conditions C2 2036 Test condition A, weight = 10 lbs, t = 15 s. C6 1037 VCE ≥ 10 V dc, 6,000 cycles. 4.5 Method of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows. 4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750. 6 MIL-PRF-19500/539B TABLE I. Group A inspection. Inspection 1/ Subgroup 1 Visual and mechanical examination Subgroup 2 Breakdown voltage, collector - emitter 2N6300 2N6301 Collector - emitter cutoff current 2N6300 2N6301 Collector - emitter cutoff current 2N6300 2N6301 Emitter - base cutoff current Forward - current transfer ratio Forward - current transfer ratio Forward - current transfer ratio Base - emitter voltage (nonsaturated) Base - emitter voltage (saturated) Collector - emitter voltage (saturated) Collector - emitter voltage (saturated) See footnote at end of table. Method 2071 3011 3041 3041 3061 3076 3076 3076 3066 3066 3071 3071 MIL-STD-750 Conditions Bias condition. D, IC = 100 mA dc; pulsed (see 4.5.1) Bias condition A, VBE = -1.5 V dc; VCE = 60 V dc VCE = 80 V dc Bias condition D, VCE = 30 V dc VCE = 40 V dc Bias condition D, VEB = 5 V dc VCE = 3 V dc, IC = 1 A dc pulsed (see 4.5.1) VCE = 3 V dc, IC = 4 A dc pulsed (see 4.5.1) VCE = 3 V dc; IC = 8 A dc pulsed (see 4.5.1) Test condition B; VCE = 3 V dc; IC = 4 A dc; pulsed (see 4.5.1) Test condition A; IC = 8 A dc; IB = 80 mA dc; pulsed (see 4.5.1) IC = 4 A dc; IB = 16 mA dc; pulsed (see 4.5.1) IC = 8 A dc; IB = 80 mA dc; pulsed (see 4.5.1) 7 Symbol V(BR)CEO ICEX1 ICEO IEBO hFE1 hFE2 hFE3 VBE(on) VBE(sat) VCE(sat)1 VCE(sat)2 Limits Min 60 80 500 750 100 Max 0.5 0.5 0.5 0.5 2.0 18000 2.8 4.0 2.0 3.0 Unit V dc V dc mA dc mA dc mA dc mA dc mA dc V dc V dc V dc V dc MIL-PRF-19500/539B TABLE I. Group A inspection. Inspection 1/ Subgroup 3 High temperature operation Collector - emitter cutoff current 2N6300 2N6301 Low temperature operation Forward - current transfer ratio Subgroup 4 Small signal short circuit forward current transfer ratio Magnitude of small signal short - circuit forward - current transfer ratio Pulse response Turn-on time Turn-off time Open circuit output capacitance See footnote at end of table. Method 3041 3076 3206 3306 3236 MIL-STD-750 Conditions TA = +150°C Bias condition A; VBE = -1.5 V dc, VCE = 60 V dc VCE = 80 V dc TA = -55°C VCE = 3 V dc; IC = 4 A dc; pulsed (see 4.5.1) VCE = 3 V dc; IC = 3 A dc; f = 1 kHz VCE = 3 V dc; IC = 3 A dc; f = 1.0 MHz (See figure 2); VCC = 30 V dc; IC = 4 A dc; IB1 = 16 mA dc (See figure 3) VCC = 30 V dc; IC = 4 A dc; IB1 = IB2 = 16 mA dc VCB = 10 V dc; IE = 0; 100 kHz ≤ f ≤ 1 MHz 8 Symbol ICEX2 hFE4 hfe hfe ton toff Cobo Limits Min Max 5.0 5.0 200 300 25 350 2.0 8.0 200 Unit mA dc mA dc µs µs pF MIL-PRF-19500/539B TABLE I. Group A inspection. MIL-STD-750 Inspection 1/ Method Conditions Subgroup 5 Safe operating area (DC) 3051 TC = 25°C +10°C; t = 1s; 1 cycle; (see figure 4) Test 1 VCE = 8 V dc; IC = 8 A dc Test 2 VCE = 20 V dc; IC = 2.0 A dc; Test 3 IC = 100 mA dc; 2N6300 VCE = 60 V dc 2N6301 VCE = 80 V dc Safe operating area 3053 Load condition B; (clamped inductive (switching) load); TA = 25°C; tr + tf ≤ 1.0 µs duty cycle ≤ 10%; tp = 1 ms; (vary to obtain IC); Rs = 0.1 ohms; RBB1 = 80 ohms; VBB1 = 16 V dc; RBB2 = 100 ohms; VBB2 = 1.5 V dc; VCC = 50 V dc; IC = 8 A dc; RL ≤ 2 ohms; L = 1 mH; clamp voltage = 2N6300 60 V dc 2N6301 80 V dc Safe operating area 3053 Load condition C; (unclamped (switching) inductive load) (see figure 5) TA = 25°C; duty cycle ≤ 10%; RS ≤ 0.1 ohm Test 1 tp = 1 ms (vary to obtain IC); RBB1 = 80 ohms; VBB1 ≥ 12 V dc; RBB2 = ∞; VCC ≥ 30 V dc; IC = 8 A dc; RL ≤ 0.5 ohms; L = 1 mH at 8 A dc Test 2 tp = 1 ms (vary to obtain IC); RBB1 = 80 ohms; VBB1 ≥ 12 V dc; RBB2 = ∞; VBB2 = 0 V dc; VCC ≥ 30 V dc; IC = 0.2 A dc; RL ≤ 0.5 ohms; L = 100 mH at 0.2 A dc End point electrical See table II steps 1 and 3 measurements Subgroups 6 & 7 Not applicable 1/ For sampling plan see MIL-PRF-19500 9 Symbol Limits Min Max Unit MIL-PRF-19500/539B TABLE II. Groups B and C electrical measurements. Step 1. 2. 3. 4. Inspection Collector - emitter cutoff current 2N6300 2N6301 Collector - emitter cutoff current 2N6300 2N6301 Forward - current transfer ratio Forward - current transfer ratio Method 3041 3041 3076 3076 MIL-STD-750 Conditions Bias condition A; VBE = 1.5 V dc; VCE = 60 V dc VCE = 80 V dc Bias condition A; VBE = 1.5 V dc; VCE = 60 V dc VCE = 80 V dc VCE = 3 V dc; IC = 4 A dc pulsed (see 4.5.1) VCE = 3 V dc; IC = 4 A dc pulsed (see 4.5.1) Symbol ICEX1 ICEX2 hFE2 ∆hFE2 Min 750 ±40% Limits Max 0.5 1.0 18000 Unit mA dc mA dc 1/ The electrical measurements for appendix E, table VIb (JANTX and JANTXV) of MIL-PRF-19500 are as follows: a. Subgroup 2, see table II herein, steps 1 and 3. b. Subgroup 3, see table II herein, steps 2 and 4. c. Subgroup 6, see table II herein, steps 2 and 4. 2/ The electrical measurements for appendix E, table VII of MIL-PRF-19500 are as follows: a. Subgroup 3, see table II herein, steps 1 and 3. b. Subgroup 6, see table II herein, steps 2 and 4. 10 MIL-PRF-19500/539B FIGURE 2. Turn on (ton) time test circuit. NOTE: tS + tf = toff FIGURE 3. Switching time test circuit. 11 MIL-PRF-19500/539B FIGURE 4. Maximum safe operating graph (dc). 12 MIL-PRF-19500/539B FIGURE 5. Safe operating area for switching between saturation and cutoff (unclamped inductive load). 13 MIL-PRF-19500/539B 5. PACKAGING 5.1 Packaging. Packaging shall prevent mechanical damage of the devices during shipping and handling and shall not be detrimental to the device. When actual packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points' packaging activity within the Military Department or Defense Agency, or within the Military Departments' System Command. Packaging data retrieval is available from the managing Military Departments' or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 5.2 Marking. Unless otherwise specified (see 6.2), marking shall be in accordance with MIL-STD-129. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-PRF-19500 are applicable to this specification. 6.2 Acquisition requirements. See MIL- PRF-19500. 6.3 Substitution of JAN devices. JANTX quality level devices are a oneway direct substitute for JAN quality level devices (example JANTX2N6300 for JAN2N6300). Manufacturers can no longer manufacture device types from this specification with a JAN assurance level. 6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Products List QPL No.19500 whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from : Commander, Defense Supply Center Columbus, ATTN: DSCC-VQE, 3990 East Broad Street, Columbus, OH 43216-5000. 6.5 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extent of the changes. CONCLUDING MATERIAL Custodians: Army - CR Navy - EC Air Force - 17 NASA -NA Preparing activity: DLA CC (Project 5961-1883) Review activities: Air Force - 19, 80, 85,99 14 MIL-PRF-19500/539B STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL INSTRUCTIONS 1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision letter should be given. 2. The submitter of this form must complete blocks 4, 5, 6, and 7. 3. The preparing activity must provide a reply within 30 days from receipt of the form. NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of requirements on current contracts. Comments submitted on this form do not constitute or imply authorization to waive any portion of the referenced document(s) or to amend contractual requirements. I RECOMMEND A CHANGE: 1. DOCUMENT NUMBER MIL-PRF-19500/539B 2. DOCUMENT DATE (YYMMDD) 970615 3. DOCUMENT TITLE SEMICONDUCTOR DEVICE, DARLINGTON TRANSISTOR, NPN, SILICON, POWER TYPES 2N6300, 2N6301 JANTX AND JANTXV 4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.) 5. REASON FOR RECOMMENDATION 6. SUBMITTER a. NAME (Last, First, Middle initial) b. ORGANIZATION c. ADDRESS (Include Zip Code) d. TELEPHONE (Include Area Code) 7. DATE SUBMITTED (YYMMDD) (1) Commercial (2) AUTOVON (If applicable) 8. PREPARING ACTIVITY a. NAME Alan Barone b. TELEPHONE (Include Area Code) (1) Commercial (2) AUTOVON (614) 692-0510 850-0510 c. ADDRESS (Include Zip Code) : Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad Street, Columbus, OH 43216-5000 IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT: Defense Quality and Standardization Office 5203 Leesburg Pike, Suite 1403, Falls Church, VA 22041-3466 Telephone (703) 756-2340 AUTOVON 289-2340 DD Form 1426, OCT 89 Previous editions are obsolete 15 198/290