AD ADG787BRMZ

2.5 Ω CMOS Low Power
Dual 2:1 Mux/Demux USB 1.1 Switch
ADG787
FEATURES
FUNCTIONAL BLOCK DIAGRAM
USB 1.1 signal switching compliant
−3 dB bandwidth, 150 MHz
Tiny 10-lead LFCSP and MSOP packages, 10-ball WLCSP
package
Single-supply 1.8 V to 5.5 V operation
Low on resistance
2.5 Ω typical
3.45 Ω maximum at 85°C
Typical power consumption: <0.1 μW
ADG787
S1A
D1
S1B
IN1
IN2
S2A
D2
SWITCHES SHOWN
FOR A LOGIC 0 INPUT
APPLICATIONS
05250-001
S2B
Figure 1.
USB 1.1 signal switching circuits
Cellular phones
PDAs
MP3 players
Battery-powered systems
Headphone switching
Audio and video signal routing
Communications systems
GENERAL DESCRIPTION
The ADG787 is a low voltage, CMOS device that contains two
independently selectable single-pole, double-throw (SPDT)
switches. It is designed as a general analog-to-digital switch and
can also be used for routing USB 1.1 signals.
MASK: FS (12Mbps)
This device offers low on resistance of typically 2.5 Ω, making
the part an attractive solution for applications that require low
distortion through the switch.
Each switch conducts equally well in both directions when on
and has an input signal range that extends to the supplies. The
ADG787 exhibits break-before-make switching action.
1
05250-032
The ADG787 comes in a 10-ball WLCSP, a tiny 10-lead LFCSP,
and a tiny 10-lead MSOP. These packages make the ADG787
the ideal solution for space-constrained applications.
20.0ns/DIV
VIN = 3V p-p
TA = 25°C
Figure 2. Eye Pattern; 12 Mbps, VDD = 4.2 V, PRBS 31
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2006 Analog Devices, Inc. All rights reserved.
ADG787
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configurations and Function Descriptions ............................6
Applications....................................................................................... 1
Truth Table .....................................................................................6
Functional Block Diagram .............................................................. 1
Typical Performance Characteristics ..............................................7
General Description ......................................................................... 1
Test Circuits ................................................................................ 11
Specifications..................................................................................... 3
Terminology .................................................................................... 13
Absolute Maximum Ratings............................................................ 5
Outline Dimensions ....................................................................... 14
ESD Caution.................................................................................. 5
Ordering Guide .......................................................................... 15
REVISION HISTORY
5/06—Rev. 0 to Rev. A
Updated Formatting ...........................................................Universal
Changes to Table 1............................................................................ 3
Changes to Table 3............................................................................ 5
Changes to Ordering Guide .......................................................... 15
1/05—Revision 0: Initial Version
Rev. A | Page 2 of 16
ADG787
SPECIFICATIONS
VDD = 4.2 V to 5.5 V, GND = 0 V, unless otherwise noted.
Table 1.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On Resistance Match Between Channels (ΔRON)
+25°C
2.5
3
0.02
B Version 1
Unit
0 to VDD
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
3.45
0.1
On Resistance Flatness (RFLAT (ON))
LEAKAGE CURRENTS
Source Off Leakage, IS (OFF)
Channel On Leakage, ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
CIN, Digital Input Capacitance
DYNAMIC CHARACTERISTICS 2
tON
0.65
0.8
±0.05
±0.05
nA typ
nA typ
μA typ
μA max
pF typ
VIN = VINL or VINH
±0.1
RL = 50 Ω, CL = 35 pF
VS = 3 V; see Figure 31
RL = 50 Ω, CL = 35 pF
VS = 3 V; see Figure 31
CL = 50 pF; VS = 3 V
14
−63
−110
ns typ
ns max
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
dB typ
dB typ
−63
dB typ
0.03
−0.2
145
16
40
%
dB typ
MHz typ
pF typ
pF typ
0.005
μA typ
μA max
0.005
2.5
Break-Before-Make Time Delay (tBBM)
10
22
6
0.15
5
Total Harmonic Distortion (THD + N)
Insertion Loss
−3 dB Bandwidth
CS (OFF)
CD, CS (ON)
POWER REQUIREMENTS
IDD
1
1
2
VDD = 4.2 V, VS = 0 V to VDD
IS = 10 mA
VDD = 5.5 V
VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 29
VS = VD = 1 V or 4.5 V; see Figure 30
V min
V max
Propagation Delay Skew, tSKEW
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
VDD = 4.2 V, VS = 0 V to VDD, IS = 10 mA
See Figure 28
VDD = 4.2 V, VS = 3.5 V, IS = 10 mA
2.0
0.8
13
19
3
5
0.06
tOFF
0.95
Test Conditions/Comments
RL = 50 Ω, CL = 35 pF
VS1 = VS2 = 3 V; see Figure 32
VD = 1 V, RS = 0 Ω, CL = 1 nF; see Figure 33
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 34
S1A to S2A/S1B to S2B; RL = 50 Ω, CL = 5 pF,
f = 1 MHz; see Figure 37
S1A to S1B/S2A to S2B; RL = 50 Ω, CL = 5 pF,
f = 1 MHz; see Figure 36
RL = 32 Ω, f = 20 Hz to 20 kHz, VS = 2 V p-p
RL = 50 Ω, CL = 5 pF; see Figure 36
RL = 50 Ω, CL = 5 pF; see Figure 36
VDD = 5.5 V
Digital inputs = 0 V or 5.5 V
Temperature ranges: B version: −40°C to +85°C for the MSOP and LFCSP packages, and −25°C to +85°C for the WLCSP package.
Guaranteed by design, not production tested.
Rev. A | Page 3 of 16
ADG787
VDD = 2.7 V to 3.6 V, GND = 0 V, unless otherwise noted.
Table 2.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On Resistance Match Between Channels (ΔRON)
On Resistance Flatness (RFLAT (ON))
LEAKAGE CURRENTS
Source Off Leakage, IS (OFF)
Channel On Leakage, ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
CIN, Digital Input Capacitance
DYNAMIC CHARACTERISTICS 2
tON
+25°C
4
5.75
0.07
0.3
1.6
2.3
6
0.35
2.6
±0.01
±0.01
nA typ
nA typ
μA typ
μA max
pF typ
VIN = VINL or VINH
RL = 50 Ω, CL = 35 pF
VS = 1.5 V; see Figure 31
RL = 50 Ω, CL = 35 pF
VS = 1.5 V; see Figure 31
CL = 50 pF; VS = 1.5 V
10
−63
−110
ns typ
ns max
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
dB typ
dB typ
−63
dB typ
0.07
−0.24
145
16
40
%
dB typ
MHz typ
pF typ
pF typ
0.005
μA typ
μA max
2
15
35
7
0.12
5
1
1
2
VDD = 2.7 V, VS = 0 V to VDD
IS = 10 mA; see Figure 28
VDD = 2.7 V, VS = 1.5 V
IS = 10 mA
VDD = 2.7 V, VS = 0 V to VDD
IS = 10 mA
VDD = 3.6 V
VS = 0.6 V/3.3 V, VD = 3.3 V/0.6 V; see Figure 29
VS = VD = 0.6 V or 3.3 V; see Figure 30
±0.1
0.005
Break-Before-Make Time Delay (tBBM)
Total Harmonic Distortion (THD + N)
Insertion Loss
−3 dB Bandwidth
CS (OFF)
CD, CS (ON)
POWER REQUIREMENTS
IDD
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
Test Conditions/Comments
V min
V max
Propagation Delay Skew, tSKEW
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Unit
1.3
0.8
18
30
4
6
0.04
tOFF
B Version 1
RL = 50 Ω, CL = 35 pF
VS1 = VS2 = 1.5 V; see Figure 32
VD = 1.25 V, RS = 0 Ω, CL = 1 nF; see Figure 33
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 34
S1A to S2A/S1B to S2B; RL = 50 Ω, CL = 5 pF,
f = 1 MHz; see Figure 37
S1A to S1B/S2A to S2B; RL = 50 Ω, CL = 5 pF,
f = 1 MHz; see Figure 35
RL = 32 Ω, f = 20 Hz to 20 kHz, VS = 1.5 V p-p
RL = 50 Ω, CL = 5 pF; see Figure 36
RL = 50 Ω, CL = 5 pF; see Figure 36
VDD = 3.6 V
Digital inputs = 0 V or 3.6 V
Temperature range: B version: −40°C to +85°C for the MSOP and LFCSP packages, and −25°C to +85°C for the WLCSP package.
Guaranteed by design, not production tested.
Rev. A | Page 4 of 16
ADG787
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
VDD to GND
Analog Inputs 1 , Digital Inputs
Peak Current, S or D
5 V Operation
3.3 V Operation
Continuous Current, S or D
5 V Operation
3.3 V Operation
Operating Temperature Range
Extended Industrial (B Version)
MSOP and LFCSP packages
Industrial (B version)
WLCSP package
Storage Temperature Range
Junction Temperature
WLCSP Package (4-Layer Board)
θJA Thermal Impedance
LFCSP Package (4-Layer Board)
θJA Thermal Impedance
MSOP Package (4-Layer Board)
θJA Thermal Impedance
θJC Thermal Impedance
Lead-Free Temperature Soldering
IR Reflow, Peak Temperature
Peak Temperature
Time at Peak Temperature
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rating
−0.3 V to +6 V
−0.3 V to VDD + 0.3 V or
30 mA (whichever
occurs first)
300 mA
200 mA (pulsed at 1 ms,
10% duty cycle max)
Only one absolute maximum rating may be applied at any one
time.
100 mA
80 mA
−40°C to +85°C
−25°C to +85°C
−65°C to +150°C
150°C
120°C/W
61°C/W
142°C/W
43.7°C/W
260(+0/−5)°C
10 sec to 40 sec
Overvoltages at the IN, S, or D pins are clamped by internal diodes. Current
should be limited to the maximum ratings given.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. A | Page 5 of 16
ADG787
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
a
b
c
1
S1B GND S2B
ADG787
S2A
9
D2
D1 3
8 IN2
TOP VIEW
IN1 4 (Not to Scale) 7 S2B
S1B 5
6
GND
2
IN1
IN2
D1
D2
3
4
S1A VDD
S2A
05250-003
S1A 2
10
05250-002
VDD 1
TOP VIEW
(BALLS AT THE BOTTOM)
Figure 3. 10-Lead LFCSP and 10-lead MSOP Pin Configuration
Figure 4. 10-Ball WLCSP Pin Configuration
Table 4. 10-Lead LFCSP/MSOP Pin Function Descriptions
Table 5. 10-Lead WLCSP Pin Function Descriptions
Pin
No.
1
2
Mnemonic
VDD
S1A
Ball
Location
1a
Mnemonic
S1B
3
D1
1b
1c
GND
S2B
4
5
IN1
S1B
2a
IN1
6
7
GND
S2B
2c
3a
IN2
D1
3c
D2
8
9
IN2
D2
10
S2A
4a
4b
4c
S1A
VDD
S2A
Description
Most Positive Power Supply Potential.
Source Terminal. May be an input or
output.
Drain Terminal. May be an input or
output.
Logic Control Input.
Source Terminal. May be an input or
output.
Ground (0 V) Reference.
Source Terminal. May be an input or
output.
Logic Control Input.
Drain Terminal. May be an input or
output.
Source Terminal. May be an input or
output.
Description
Source Terminal. May be an input or
output.
Ground (0 V) Reference.
Source Terminal. May be an input or
output.
Source Terminal. May be an input or
output.
Logic Control Input.
Drain Terminal. May be an input or
output.
Drain Terminal. May be an input or
output.
Logic Control Input.
Most Positive Power Supply Potential.
Source Terminal. May be an input or
output.
TRUTH TABLE
Table 6.
Logic (IN1/IN2)
0
1
Switch 1A/2A
Off
On
Rev. A | Page 6 of 16
Switch 1B/2B
On
Off
ADG787
TYPICAL PERFORMANCE CHARACTERISTICS
3.0
3.5
VDD = 4.2V
IDS = 10mA
TA = 25°C
IDS = 10mA
VDD = 4.5V
3.0
2.5
TA = +85°C
ON RESISTANCE (W)
2.0
VDD = 5V
VDD = 5.5V
1.5
1.0
0.5
0
1
2
3
SIGNAL RANGE
4
2.0
TA = +25°C
1.5
TA = –40°C
1.0
0.5
05250-004
0
2.5
05250-007
ON RESISTANCE (W)
VDD = 4.2V
0
5
0
Figure 5. On Resistance vs. VD (VS), VDD = 4.2 V to 5.5 V
0.5
1.0
1.5
5.0
TA = 25°C
4.5 IDS = 10mA
4.5
4.0
TA = +85°C
4.0
VDD = 3V
ON RESISTANCE (W)
3.0
2.5
VDD = 3.3V
VDD = 3.6V
1.5
3.0
2.5
TA = +25°C
TA = –40°C
2.0
1.5
1.0
05250-005
1.0
3.5
0.5
0
0
0.5
1.0
1.5
2.0
2.5
SIGNAL RANGE
3.0
3.5
05250-008
ON RESISTANCE (W)
3.5
VDD = 3V
IDS = 10mA
VDD = 2.7V
4.0
2.0
3.0
Figure 8. On Resistance vs. VD (VS) for Different Temperatures, VDD = 4.2 V
5.0
3.5
2.0
2.5
SIGNAL RANGE
0.5
0
4.0
0
Figure 6. On Resistance vs. VD (VS), VDD = 2.7 V to 3.6 V
0.5
1.0
1.5
2.0
SIGNAL RANGE
2.5
3.0
Figure 9. On Resistance vs. VD (VS) for Different Temperatures, VDD = 3 V
3.0
2.0
VDD = 5V
IDS = 10mA
1.5
2.5
1.0
IS, ID (ON)
2.0
CURRENT (nA)
ON RESISTANCE (W)
TA = +85°C
TA = +25°C
1.5
TA = –40°C
1.0
0.5
0
–0.5
IS (OFF)
–1.0
0.5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
SIGNAL RANGE
3.5
4.0
4.5
05250-040
05250-006
–1.5
–2.0
5.0
0
Figure 7. On Resistance vs. VD (VS) for Different Temperatures, VDD = 5 V
Rev. A | Page 7 of 16
10
20
30
40
50
60
TEMPERATURE (°C)
70
80
Figure 10. Leakage Current vs. Temperature, VDD = 5.5 V
ADG787
2.0
30
TA = 25°C
1.5
25
1.0
VDD = 3V
20
TIME (ns)
0
TON
15
VDD = 5V
–0.5
10
IS, ID (ON)
–1.0
TOFF
VDD = 3V
5
05250-041
–1.5
–2.0
0
10
20
30
40
50
60
TEMPERATURE (°C)
VDD = 5V
0
–40
80
70
Figure 11. Leakage Current vs. Temperature, VDD = 3.3 V
0
20
40
TEMPERATURE (°C)
60
80
0
1.8
–1
1.6
LOGIC THRESHOLD POINT (V)
–20
Figure 14. tON/tOFF Time vs. Temperature
2.0
–2
ATTENUATION (dB)
1.4
1.2
VIN RISING
VIN FALLING
1.0
0.8
0.6
VDD = 3V/4.2V/5V
TA = 25°C
–3
–4
–5
–6
0.4
2.0
2.5
3.0
3.5
4.0
4.5
SUPPLY VOLTAGE VDD (V)
5.0
–8
100
5.5
05250-014
0
1.5
–7
05250-011
0.2
1k
Figure 12. Threshold Voltage vs. Supply
10k
100k
1M
FREQUENCY (Hz)
10M
100M
1G
10M
100M
1G
Figure 15. Bandwidth
25
0
TA = 25°C
VDD = 3V/4.2V/5V
TA = 25°C
VDD = 5V
–20
ATTENUATION (dB)
20
15
VDD = 3V
10
5
–40
–60
–80
0
0
0.5
1.0
1.5
2.0
2.5
3.0
VD (V)
3.5
4.0
4.5
–120
100
5.0
05250-015
–100
05250-012
QINJ (pC)
05250-013
CURRENT (nA)
IS (OFF)
0.5
1k
10k
100k
1M
FREQUENCY (Hz)
Figure 16. Off Isolation vs. Frequency
Figure 13. Charge Injection vs. Source Voltage
Rev. A | Page 8 of 16
ADG787
0
3.0
VDD = 3V/4.2V/5V
TA = 25°C
INPUT RISE/FALL TIME = 15ns
TA = 25°C
2.5
–40
2.0
S1A TO S1B
DELAY (ns)
–60
S1A TO S2A
–80
1.5
1.0
RISE DELAY
–100
1k
10k
100k
1M
FREQUENCY (Hz)
10M
100M
FALL DELAY
0
2.7
1G
Figure 17. Crosstalk vs. Frequency
0
3.7
4.2
4.7
SUPPLY VOLTAGE (V)
5.2
2.0
1.8
INPUT RISE/FALL TIME = 15ns
VDD = 4.2V
1.6
1.4
DELAY (ns)
–40
PSRR (dB)
3.2
Figure 20. Rise/Fall Time Delay vs. Supply Voltage
VDD = 3V/4.2V/5V
TA = 25°C
NO SUPPLY DECOUPLING
–20
05250-044
–120
100
05250-030
0.5
–60
–80
1.2
1.0
RISE DELAY
0.8
0.6
FALL DELAY
0.4
–120
100
05250-031
–100
1k
10k
100k
1M
FREQUENCY (Hz)
10M
100M
05250-045
ATTENUATION (dB)
–20
0.2
0
–40
1G
Figure 18. AC Power Supply Rejection Ratio (PSRR)
–15
10
35
TEMPERATURE (°C)
60
85
Figure 21. Rise/Fall Time Delay vs. Temperature
0.10
2.0
INPUT RISE/FALL TIME = 15ns
TA = 25°C
0.09
0.08
MISMATCH (ns)
0.06
0.05
0.04
VDD = 5V, VS = 2V p-p
0.03
1.0
0.5
0.01
0
10
100
1k
FREQUENCY (Hz)
10k
0
2.5
100k
Figure 19. Total Harmonic Distortion + Noise
05250-046
0.02
05250-043
THD+N (%)
1.5
VDD = 3V, VS = 2V p-p
0.07
3.0
3.5
4.0
SUPPLY (V)
4.5
5.0
5.5
Figure 22. Rise-Time-to-Fall-Time Mismatch vs. Supply Voltage
Rev. A | Page 9 of 16
ADG787
1.2
INPUT RISE/FALL TIME = 15ns
VDD = 4.2V
MASK: FS (12Mbps)
MISMATCH (ns)
1.0
0.8
0.6
0.4
1
05250-047
0
–40
05250-033
0.2
–15
10
35
TEMPERATURE (°C)
60
20.0ns/DIV
2.5GS/s 400ps/pt
85
Figure 26. Eye Pattern, 12 Mbps, VDD = 4.2 V, TA = 85°C, PRBS 31
Figure 23. Rise-Time-to-Fall-Time Mismatch vs. Temperature
300
INPUT RISE/FALL TIME = 15ns
TA = 25°C
MASK: FS (12Mbps)
TPROP SKEW (ps)
250
200
150
100
1
05250-048
0
2.5
05250-034
50
3.0
3.5
4.0
SUPPLY (V)
4.5
5.0
20.0ns/DIV
2.5GS/s 400ps/pt
5.5
Figure 27. Eye Pattern, 12 Mbps, VDD = 4.2 V, TA = −40°C, PRBS 31
Figure 24. Propagation Delay Skew (tSKEW) vs. Supply Voltage
200
INPUT RISE/FALL TIME = 15ns
180 VDD = 4.2V
160
120
100
80
60
40
05250-049
TSKEW (ps)
140
20
0
–40
–15
10
35
TEMPERATURE (°C)
60
85
Figure 25. Propagation Delay Skew (tSKEW) vs. Temperature
Rev. A | Page 10 of 16
ADG787
TEST CIRCUITS
IS (OFF)
IDS
ID (OFF)
S
A
D
A
VS
S
05250-017
V1
VD
D
RON = V1/IDS
ID (ON)
Figure 28. On Resistance
S
NC
D
A
VD
Figure 30. On Leakage
VDD
0.1μF
VDD
S1B
S1A
VS
VOUT
D
CL
35pF
RL
50Ω
IN
50%
VIN
50%
90%
90%
GND
tON
tOFF
05250-019
VOUT
Figure 31. Switching Times, tON, tOFF
VDD
0.1μF
VIN
S1B
S1A
VS
50%
50%
0V
VDD
VOUT
D
VOUT
RL
IN
CL
35pF
80%
tBBM
tBBM
05250-020
50Ω
80%
GND
Figure 32. Break-Before-Make Time Delay, tBBM
VDD
SW ON
S1B
NC
D
S1A
VOUT
1nF
IN
VOUT
ΔVOUT
QINJ = CL ⋅ ΔVOUT
GND
Figure 33. Charge Injection
Rev. A | Page 11 of 16
05250-021
VS
SW OFF
VIN
05250-018
VS
05250-016
Figure 29. Off Leakage
ADG787
VDD
0.1μF
0.1μF
NETWORK
ANALYZER
VDD
S1A
50Ω
50Ω
NETWORK
ANALYZER
VDD
S1B
50Ω
S1A
VS
VS
D
D
VOUT
05250-022
RL
50Ω
GND
OFF ISOLATION = 20 LOG
RL
50Ω
GND
VOUT
INSERTION LOSS = 20 LOG
VS
Figure 34. Off Isolation
VOUT WITH SWITCH
VOUT WITHOUT SWITCH
Figure 36. Bandwidth
VDD
NETWORK
ANALYZER
0.1μF
VOUT
50Ω
VDD
S2A
D2
NC
S2B
S1A
RL
50Ω
D
S1B
50Ω
50Ω
RL
50Ω
VS
S1A
VS
GND
VOUT
VS
CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG
05250-023
CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG
D1
S1B
NC
VOUT
VS
Figure 37. Channel-to-Channel Crosstalk (S1A to S2A)
Figure 35. Channel-to-Channel Crosstalk (S1A to S1B)
Rev. A | Page 12 of 16
50Ω
05250-025
VOUT
VOUT
05250-024
S1B
NC
VDD
ADG787
TERMINOLOGY
IDD
Positive supply current.
tOFF
Delay time between the 50% and the 90% points of the digital
input and switch off condition.
VD (VS)
Analog voltage on Terminal D and Terminal S.
tBBM
On or off time measured between the 80% points of both
switches when switching from one to another.
RON
Ohmic resistance between D and S.
RFLAT (ON)
Flatness is defined as the difference between the maximum and
minimum value of on resistance as measured.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during on-off switching.
Off Isolation
A measure of unwanted signal coupling through an off switch.
ΔRON
On resistance match between any two channels.
IS (OFF)
Source leakage current with the switch off.
Crosstalk
A measure of unwanted signal that is coupled from one channel
to another as a result of parasitic capacitance.
ID (OFF)
Drain leakage current with the switch off.
−3 dB Bandwidth
The frequency at which the output is attenuated by 3 dB.
ID, IS (ON)
Channel leakage current with the switch on.
On Response
The frequency response of the on switch.
VINL
Maximum input voltage for Logic 0.
Insertion Loss
The loss due to the on resistance of the switch.
VINH
Minimum input voltage for Logic 1.
THD + N
The ratio of the harmonic amplitudes plus noise of a signal, to
the fundamental.
IINL (IINH)
Input current of the digital input.
TSKEW
The measure of the variation in propagation delay between each
channel.
CS (OFF)
Off switch source capacitance. Measured with reference to
ground.
Rise Time Delay
The rise time of a signal is a measure of the time for the signal
to rise from 10% of the ON level to 90% of the ON level. Rise
time delay is the difference between the rise time, measured at
the input, and the rise time, measured at the output.
CD (OFF)
Off switch drain capacitance. Measured with reference to
ground.
CD, CS (ON)
On switch capacitance. Measured with reference to ground.
CIN
Digital input capacitance.
tON
Delay time between the 50% and the 90% points of the digital
input and switch on condition.
Fall Time Delay
The fall time of a signal is a measure of the time for the signal to
fall from 90% of the ON level to 10% of the ON level. Fall time
delay is the difference between the fall time, measured at the
input, and the fall time, measured at the output.
Rise-Time-to-Fall-Time Mismatch
This is the absolute value between the variation in the fall time
and the rise time, measured at the output.
Rev. A | Page 13 of 16
ADG787
OUTLINE DIMENSIONS
INDEX
AREA
PIN 1
INDICATOR
3.00
BSC SQ
10
1.50
BCS SQ
0.50
BSC
1
TOP VIEW
(BOTTOM VIEW)
6
0.80 MAX
0.55 TYP
0.80
0.75
0.70
5
0.50
0.40
0.30
1.74
1.64
1.49
0.05 MAX
0.02 NOM
SIDE VIEW
SEATING
PLANE
2.48
2.38
2.23
EXPOSED
PAD
0.30
0.23
0.18
0.20 REF
Figure 38. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very, Very Thin, Dual Lead (CP-10-9)
Dimensions shown in millimeters
3.10
3.00
2.90
10
3.10
3.00
2.90
1
6
5.15
4.90
4.65
5
PIN 1
0.50 BSC
0.95
0.85
0.75
0.15
0.05
1.10 MAX
0.33
0.17
SEATING
PLANE
0.23
0.08
8°
0°
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-BA
Figure 39. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
Rev. A | Page 14 of 16
0.80
0.60
0.40
ADG787
0.63
0.57
0.51
SEATING
PLANE
1.56
1.50
1.44
C
B
A
1
0.36
0.32
0.28
BALL 1
IDENTIFIER
2.06
2.00
1.94
2
0.50 BSC
BALL PITCH
3
4
TOP VIEW
(BALL SIDE DOWN)
0.11
0.09
0.07
BOTTOM
VIEW
(BALL SIDE UP)
111105-0
0.26
0.22
0.18
Figure 40. 10-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADG787BRMZ 2
ADG787BRMZ-500RL72
ADG787BRMZ-REEL2
ADG787BCBZ-500RL72
ADG787BCBZ-REEL2
ADG787BCPZ-500RL72
ADG787BCPZ-REEL2
1
2
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–25°C to +85°C
–25°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
10-Lead Mini Small Outline Package (MSOP)
10-Lead Mini Small Outline Package (MSOP)
10-Lead Mini Small Outline Package (MSOP)
10-Ball Wafer Level Chip Scale Package (WLCSP)
10-Ball Wafer Level Chip Scale Package (WLCSP)
10-Lead Lead Frame Chip Scale Package (LFCSP_WD)
10-Lead Lead Frame Chip Scale Package (LFCSP_WD)
Due to space constraints, branding on this package is limited to three characters.
Z = Pb-free part.
Rev. A | Page 15 of 16
Package Option
RM-10
RM-10
RM-10
CB-10
CB-10
CP-10-9
CP-10-9
Branding 1
SM1
SM1
SM1
S04
S04
SM1
SM1
ADG787
NOTES
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05250-0-5/06(A)
Rev. A | Page 16 of 16