ETC PS2933-1

DATA SHEET
PHOTOCOUPLER
PS2932-1,PS2933-1
HIGH COLLECTOR TO EMITTER VOLTAGE
4-PIN ULTRA SMALL FLAT-LEAD
PHOTOCOUPLER
−NEPOC Series−
DESCRIPTION
The PS2932-1, PS2933-1 are optically coupled isolator containing a GaAs light emitting diode and an NPN silicon
phototransistor in one package for high density mounting applications.
An ultra small flat-lead package has been provided which realizes a reduction in mounting area of about 30%
compared with the PS28xx series.
FEATURES
• Small and thin package (4.6 (L) × 2.5 (W) × 2.1 (H) mm)
• Isolation distance (0.4 mm MIN.)
• High collector to emitter voltage (VCEO = 300 V: PS2932-1)
(VCEO = 350 V: PS2933-1)
• High isolation voltage (BV = 2 500 Vr.m.s.)
• Ordering number of taping product: PS2932-1-F3, F4: 3 500 pcs/reel
PS2933-1-F3, F4: 3 500 pcs/reel
APPLICATIONS
• Hybrid IC
• Telephone, Exchange equipment, FAX
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PN10050EJ01V0DS (1st edition)
(Previous No. P15066EJ1V0DS00)
Date Published November 2001 CP(K)
Printed in Japan
The mark • shows major revised points.
 NEC Corporation 2000
 NEC Compound Semiconductor Devices 2001
PS2932-1,PS2933-1
PACKAGE DIMENSIONS (UNIT: mm)
TOP VIEW
2.5±0.3
3
4
4.6±0.2
N
2
5.0±0.2
0.15 +0.1
–0.05
2.1 MAX.
1
4.1 MIN.
4
0.4±0.1
0.2±0.1
1.27
MARKING (example: PS2932-1)
32
Last number of
type No. : 32
N
An initial of "NEC"
001
No. 1 pin
mark
(knicked
corner)
Assembly lot
0 01
Week assembled
Year assembled
PHOTOCOUPLER CONSTRUCTION
Parameter
Unit (MIN.)
Air Distance
4 mm
Creepage Distance
4 mm
Isolation Distance
2
0.4 mm
Data Sheet PN10050EJ01V0DS
3
1. Anode
2. Cathode
3. Emitter
4. Collector
1
2
PS2932-1,PS2933-1
ORDERING INFORMATION
Part Number
Package
PS2932-1-F3
4-pin ultra
PS2932-1-F4
small flat-lead
*1
Application Part Number
Packing Style
Embossed Tape 3 500 pcs/reel
PS2933-1-F3
PS2932-1
PS2933-1
PS2933-1-F4
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°°C, unless otherwise specified)
Parameter
Symbol
Ratings
PS2932-1
Diode
Forward Current
PS2933-1
IF
50
mA
∆IF/°C
0.5
mA/°C
IFP
0.5
A
Power Dissipation
PD
60
mW
Reverse Voltage
VR
6
V
Forward Current Derating
Peak Forward Current
Transistor
Unit
*1
Collector to Emitter Voltage
VCEO
Emitter to Collector Voltage
VECO
0.3
V
IC
60
mA
∆PC/°C
1.2
mW/°C
PC
120
mW
Isolation Voltage
BV
2 500
Vr.m.s.
Total Power Dissipation
PT
160
mW
Operating Ambient Temperature
TA
−55 to +100
°C
Storage Temperature
Tstg
−55 to +150
°C
Collector Current
Power Dissipation Derating
Power Dissipation
*2
300
350
V
*1 PW = 100 µs, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
Data Sheet PN10050EJ01V0DS
3
PS2932-1,PS2933-1
ELECTRICAL CHARACTERISTICS (TA = 25°°C)
Parameter
Diode
Symbol
Conditions
Forward Voltage
VF
IF = 1 mA
Reverse Current
IR
VR = 5 V
Terminal Capacitance
Ct
V = 0 V, f = 1 MHz
Transistor
Collector to Emitter Current
ICEO
VCE = 300 V (350 V)
Coupled
Current Transfer Ratio (IC/IF)
CTR
IF = 1 mA, VCE = 2 V
Collector Saturation Voltage
VCE (sat)
IF = 1 mA, IC = 2 mA
MIN.
TYP.
MAX.
Unit
0.9
1.1
1.3
V
5
µA
15
*1
400
pF
400
nA
2 000
4 500
%
0.8
1
V
Ω
11
Isolation Resistance
RI-O
VI-O = 1 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1 MHz
0.4
pF
VCC = 5 V, IC = 10 mA, RL = 100 Ω
20
µs
*2
Rise Time
*2
Fall Time
tr
tf
10
5
*1 ICEO condition; PS2932-1: VCE = 300 V, PS2933-1: VCE = 350 V
*2 Test circuit for switching time
Pulse Input
VCC
PW = 1 ms
Duty cycle = 1/10
IF
VOUT
50 Ω
RL = 100 Ω
CAUTIONS REGARDING NOISE
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
corrector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute
maximum ratings.
4
Data Sheet PN10050EJ01V0DS
PS2932-1,PS2933-1
TYPICAL CHARACTERISTICS (TA = 25°°C, unless otherwise specified)
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
Transistor Power Dissipation PC (mW)
Maximum Forward Current IF (mA)
80
60
40
0.5 mA/˚C
20
50
25
0
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
100
75
140
120
100
80
60
1.2 mW/˚C
40
20
125
0
25
50
75
100
125
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
FORWARD CURRENT vs.
FORWARD VOLTAGE
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
100
60
10
Collector Current IC (mA)
Forward Current IF (mA)
IF = 5 mA
TA = +100˚C
+60˚C
+25˚C
1
0˚C
–25˚C
–50˚C
0.1
50
2 mA
40
1 mA
30
20
10
0.5 mA
0.5
1.0
1.5
0
2.0
1
2
3
4
5
Forward Voltage VF (V)
Collector to Emitter Voltage VCE (V)
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
100
100 000
VCEO = 300 V
10 000
Collector Current IC (mA)
Collector to Emitter Dark Current ICEO (nA)
0.01
0.0
CTR = 1 068%
2 290%
4 360%
1 000
100
10
10
IF = 5 mA
2 mA
1 mA
0.5 mA
1
–50
–25
0
25
50
75
100
1
0.7
0.8
0.9
1.0
Collector Saturation Voltage VCE(sat) (V)
Ambient Temperature TA (˚C)
Data Sheet PN10050EJ01V0DS
5
#
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
1.4
4 000
Current Transfer Ratio CTR (%)
Normalized Current Transfer Ratio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
1.2
1.0
0.8
0.6
0.4
Normalized to 1.0
at TA = 25˚C,
IF = 1 mA, VCE = 2 V
0.2
0.0
–50
–25
0
25
50
75
VCE = 2 V
3 500
2 500
2 000
1 500
1 000
500
0
0.1
100
1
10
100
Ambient Temperature TA (˚C)
Forward Current IF (mA)
SWITCHING TIME vs.
LOAD RESISTANCE
LONG TERM CTR DEGRADATION
1.2
VCC = 5 V,
IC = 10 mA,
CTR = 2 840%
IF = 1 mA
tr
tf
ts
td
10
TA = 25˚C
1.0
1
CTR (Relative Value)
Switching Time t (µs)
Sample A
B
C
3 000
1 000
100
PS2932-1,PS2933-1
0.8
60˚C
0.6
0.4
0.2
0.1
100
1 000
0.0
10
Load Resistance RL (Ω)
Remark The graphs indicate nominal characteristics.
6
Data Sheet PN10050EJ01V0DS
102
103
104
Time (Hr)
105
106
PS2932-1,PS2933-1
TAPING SPECIFICATIONS (UNIT: mm)
1.5+0.1
–0
2.9 MAX.
12.0±0.2
5.5±0.05
4.0±0.1
5.3±0.1
2.0±0.05
1.75±0.1
Outline and Dimensions (Tape)
0.3
1.55±0.05
2.4±0.1
2.9±0.1
4.0±0.1
Tape Direction
PS2932-1-F4
PS2933-1-F4
PS2932-1-F3
PS2933-1-F3
N
N
N
N
N
N
N
N
Outline and Dimensions (Reel)
330±2.0
2.0±0.5
13.0±0.2
Packing: 3 500 pcs/reel
Data Sheet PN10050EJ01V0DS
100±1.0
21.0±0.8
2.0±0.5
13.5±1.0
11.9 to 15.4
Outer edge of
flange
7
PS2932-1,PS2933-1
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
1.27
5.7
4.14
0.6
4.7
(0.35)
0.8
( ) : Reference value
24-R0.1
Remark This drawing is considered to meet air and outer creepage distance 4.0 mm minimum. All dimensions in
this figure must be evaluated before use.
8
Data Sheet PN10050EJ01V0DS
PS2932-1,PS2933-1
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260°C or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One (Allowed to be dipped in solder including plastic mold portion.)
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10050EJ01V0DS
9
PS2932-1,PS2933-1
• The information in this document is current as of November, 2001. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
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The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
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(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4 - 0110
10
Data Sheet PN10050EJ01V0DS
PS2932-1,PS2933-1
SAFETY INFORMATION ON THIS PRODUCT
Caution
GaAs Products
The product contains gallium arsenide, GaAs.
GaAs vapor and powder are hazardous to human health if inhaled or ingested.
• Do not destroy or burn the product.
• Do not cut or cleave off any part of the product.
• Do not crush or chemically dissolve the product.
• Do not put the product in the mouth.
Follow related laws and ordinances for disposal. The product should be excluded from general
industrial waste or household garbage.
Business issue
NEC Compound Semiconductor Devices, Ltd.
5th Sales Group, Sales Division TEL: +81-3-3798-6372 FAX: +81-3-3798-6783 E-mail: [email protected]
NEC Compound Semiconductor Devices Hong Kong Limited
Hong Kong Head Office
FAX: +852-3107-7309
TEL: +852-3107-7303
Taipei Branch Office
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
Korea Branch Office
FAX: +82-2-528-0302
TEL: +82-2-528-0301
NEC Electron Devices European Operations
http://www.nec.de/
TEL: +49-211-6503-101 FAX: +49-211-6503-487
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
Technical issue
NEC Compound Semiconductor Devices, Ltd.
http://www.csd-nec.com/
Sales Engineering Group, Sales Division
E-mail: [email protected] FAX: +81-44-435-1918
0110